JPH06112381A - Method and device for non-condensible gas breathing in boil cooling system - Google Patents

Method and device for non-condensible gas breathing in boil cooling system

Info

Publication number
JPH06112381A
JPH06112381A JP9168892A JP9168892A JPH06112381A JP H06112381 A JPH06112381 A JP H06112381A JP 9168892 A JP9168892 A JP 9168892A JP 9168892 A JP9168892 A JP 9168892A JP H06112381 A JPH06112381 A JP H06112381A
Authority
JP
Japan
Prior art keywords
cooling device
boiling cooling
chamber
cooling system
refrigerant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9168892A
Other languages
Japanese (ja)
Inventor
Hironobu Sonoda
広信 園田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yaskawa Electric Corp
Original Assignee
Yaskawa Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaskawa Electric Corp filed Critical Yaskawa Electric Corp
Priority to JP9168892A priority Critical patent/JPH06112381A/en
Publication of JPH06112381A publication Critical patent/JPH06112381A/en
Pending legal-status Critical Current

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To enable the whole non-condensible gas such as air, etc., contained in a refrigerant inside the title boil cooling system to be exhausted at one time by a method wherein the refrigerant inside the boil cooling system is boiled so as to differentiate the pressure between the boil cooling system and a chamber. CONSTITUTION:Firstly, a valve 14 is closed and another valve 8 is opened to actuate a vacuum pump 6 for making the internal pressure of a chamber 11 lower than that of a boil cooling system 1 and then the valve 8 is closed. Next, the valve 14 is slowly opend to exhaust the air 16 above a refrigerant vapor 17 to the chamber 11 through a piping 13. With these procedures repeated, the internal pressure of the boil cooling system 1 is lowered to the boiling pressure of a refrigerant 4 at corresponding temperature. At this time, almost all of the non-con-densible gas such as air existing in the boil cooling system 1 can be exhausted. Next, the refrigerant 4 is heated to be boiled by a heater 15 for making the internal pressure of the boil cooling system 1 higher than that in the chamber 11. When the heating step is stopped in such a state to slowly open the valve 14, the non-condensible gas 16 concentrated in the upper part of the boil cooling system 1 can be exhausted to the chamber 11.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、沸騰冷却装置におい
て、冷却性能を阻害する装置内の不凝縮ガスを沸騰冷却
装置の外へ排出する沸騰冷却装置内の不凝縮ガス抜き方
法および装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for removing non-condensable gas in a boiling cooling device for discharging non-condensing gas in the device which impairs cooling performance to the outside of the boiling cooling device.

【0002】[0002]

【従来の技術】従来、沸騰冷却装置において不凝縮ガス
を排除するものとして、冷媒および半導体スタックを収
納する収納タンクと、この収納タンクに連通した凝縮器
と、凝縮器上部および収納タンクに温度検出を設け、こ
の両者の温度に規定値以上の温度差がある場合、凝縮器
とパイプを介し接続した真空ポンプを動作させ沸騰冷却
装置内の不凝縮ガスを抜くものはある(例えば、実開昭
61−188364号公報)。
2. Description of the Related Art Conventionally, as a means for eliminating non-condensable gas in a boiling cooling device, a storage tank for storing a refrigerant and a semiconductor stack, a condenser in communication with this storage tank, and a temperature detection on the upper part of the condenser and the storage tank. If a temperature difference between the two is greater than the specified value, a vacuum pump connected to the condenser via a pipe is operated to remove the non-condensable gas in the boiling cooling device (eg 61-188364).

【0003】[0003]

【発明が解決しようとする課題】ところが、従来技術で
は、沸騰冷却装置内に存在していた空気等の不凝縮ガス
は排出できるが、冷媒に含まれる空気や装置内面の吸着
空気までは排出することができないため、これらの不凝
縮ガスが装置使用時に徐々に排出されて凝縮器の冷却性
能が安定しない。そこで、本発明は、冷媒に含まれる空
気と沸騰冷却装置や半導体スタック等の発熱体の吸着空
気も含めた全ての不凝縮性ガスを一時に排出することを
目的とする。
However, in the prior art, the non-condensing gas such as air existing in the boiling cooling device can be discharged, but the air contained in the refrigerant and the adsorbed air on the inner surface of the device are also discharged. Therefore, these non-condensable gases are gradually discharged when the device is used, and the cooling performance of the condenser is not stable. Therefore, an object of the present invention is to discharge all non-condensable gas including air contained in a refrigerant and adsorbed air of a heating element such as a boiling cooling device or a semiconductor stack at one time.

【0004】[0004]

【課題を解決するための手段】上記課題を解決するた
め、沸騰冷却装置の不凝縮ガス抜き方法は、沸騰冷却装
置の内圧と配管によって接続したチャンバの内圧とを操
作して沸騰冷却装置内の不凝縮ガスを排出した後、外部
から熱を加えて沸騰冷却装置内の冷媒を沸騰させて沸騰
冷却装置の内圧を上げ、再度不凝縮ガスを排出するよう
にする。沸騰冷却装置の不凝縮ガス抜き装置は、真空ポ
ンプと、冷媒および半導体スタックを収納する収納タン
クとよりなる沸騰冷却装置内の不凝縮ガス抜き装置にお
いて、バルブを設けた配管を介して、真空ポンプと接続
したチャンバと、前記チャンバに設けた圧力計と、バル
ブを設けた配管を介し、前記チャンバと接続した沸騰冷
却装置と、前記沸騰冷却装置に設けた圧力計と、前記沸
騰冷却装置の外部にヒータ設けたものとする。
In order to solve the above-mentioned problems, a non-condensing degassing method for a boiling cooling device operates by controlling the internal pressure of the boiling cooling device and the internal pressure of a chamber connected by a pipe. After discharging the non-condensable gas, heat is applied from the outside to boil the refrigerant in the boiling cooling device to raise the internal pressure of the boiling cooling device, and the non-condensing gas is discharged again. The non-condensing degassing device of the boiling cooling device is a non-condensing degassing device in the boiling cooling device, which is composed of a vacuum pump and a storage tank for storing the refrigerant and the semiconductor stack, and a vacuum pump via a pipe provided with a valve. A chamber connected to the chamber, a pressure gauge provided to the chamber, a boiling cooling device connected to the chamber via a pipe provided with a valve, a pressure gauge provided to the boiling cooling device, and an outside of the boiling cooling device. It is assumed that a heater is provided in the.

【0005】[0005]

【作用】上記手段により、沸騰冷却装置内の冷媒を沸騰
させて冷媒の含有空気や壁面の吸着空気を引出し、さら
に沸騰冷却装置とチャンバ間に相対的な圧力差を作るこ
とによって沸騰冷却装置内の不凝縮性ガスを排出する。
With the above-mentioned means, the refrigerant in the boiling cooling device is boiled to draw out the air containing the refrigerant and the adsorbed air on the wall surface, and further create a relative pressure difference between the boiling cooling device and the chamber. The non-condensable gas of is discharged.

【0006】[0006]

【実施例】以下、本発明の実施例を図1に示して説明す
る。沸騰冷却装置1には圧力計10が設置してあり、そ
の内部には発熱体9と冷媒4が収納され、外部にヒータ
15が装着されている。チャンバ11には、圧力計12
が設けられており、バルブ8を持った配管7によって真
空ポンプ6が接続されている。沸騰冷却装置1の上部と
チャンバ11とは配管13で接続しており、その途中に
はバルブ14を設けてある。このような構成において、
まず、バルブ14を閉めてバルブ8を開き、真空ポンプ
6を作動させてチャンバ11の内圧を沸騰冷却装置1の
内圧よりも低くし、バルブ8を閉じる。沸騰冷却装置1
の内部では不凝縮ガス(例えば空気)16と冷媒蒸気1
7とが比重量の差で層を成している。バルブ14を徐々
に開いて冷媒蒸気17の上にある空気16を圧力差によ
って沸騰冷却装置1の上部にある配管13を通してチャ
ンバ11へ排出する。沸騰冷却装置1とチャンバ11の
内圧が平衡したところでバルブ14を閉じる。再度、バ
ルブ8を開いて真空ポンプ6を作動させてチャンバ11
の内圧を沸騰冷却装置1の内圧よりも低くする。この操
作を繰り返して、沸騰冷却装置1の内圧を冷媒4の当該
温度における沸騰圧力付近まで下げる。この時点で、当
初沸騰冷却装置1内に存在した不凝縮ガスはほぼ排出さ
れる。つぎに、ヒータ15で冷媒4を加熱して沸騰さ
せ、沸騰冷却装置1の内圧をチャンバ11の内圧よりも
高くする。沸騰冷却装置1の内圧は、すでに冷媒4の沸
騰圧力付近まで下がっているので、わずかな加熱によっ
て冷媒4をはげしく沸騰させることができる。冷媒4を
はげしく沸騰させることによって、十分にかくはんする
ことができるので冷媒4に含まれている不凝縮ガスや沸
騰冷却装置1の内壁、および発熱体9の表面に吸着して
いる不凝縮ガスを引出し、沸騰冷却装置1内の空間に集
めることができる。この状態で加熱を止めてバルブ14
を徐々に開くと、沸騰冷却装置1の上部に集まった不凝
縮ガス16が圧力差によってチャンバ11に排出され
る。沸騰冷却装置1とチャンバ11の内圧が平衡したと
ころでバルブ14を閉じる。バルブ8を開いて真空ポン
プ6を作動させてチャンバ11の内圧を下げた後、バル
ブ8を閉じる。冷媒4の加熱からチャンバ11の内圧を
下げるまでの操作を数回繰り返すことによって、沸騰冷
却装置内の不凝縮ガス16をほとんど排出することがで
きる。なお、沸騰冷却装置1とチャンバ11の圧力のモ
ニタは、それぞれの圧力計10、12によって行う。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG. A pressure gauge 10 is installed in the boiling cooling device 1, the heating element 9 and the refrigerant 4 are housed therein, and a heater 15 is mounted outside. The chamber 11 has a pressure gauge 12
And a vacuum pump 6 is connected by a pipe 7 having a valve 8. The upper part of the boiling cooling device 1 and the chamber 11 are connected by a pipe 13, and a valve 14 is provided in the middle thereof. In such a configuration,
First, the valve 14 is closed and the valve 8 is opened, the vacuum pump 6 is operated to make the internal pressure of the chamber 11 lower than the internal pressure of the boiling cooling device 1, and the valve 8 is closed. Boiling cooling device 1
Inside the room, non-condensable gas (eg air) 16 and refrigerant vapor 1
7 and 7 form a layer due to the difference in specific weight. The valve 14 is gradually opened and the air 16 above the refrigerant vapor 17 is discharged into the chamber 11 through the pipe 13 above the boiling cooling device 1 due to the pressure difference. The valve 14 is closed when the internal pressures of the boiling cooling device 1 and the chamber 11 are balanced. The valve 8 is opened again, the vacuum pump 6 is operated, and the chamber 11
The internal pressure of is lower than the internal pressure of the boiling cooling device 1. By repeating this operation, the internal pressure of the boiling cooling device 1 is lowered to near the boiling pressure of the refrigerant 4 at the temperature. At this point, the non-condensable gas originally present in the boiling cooling device 1 is almost discharged. Next, the refrigerant 15 is heated by the heater 15 to boil it, and the internal pressure of the boiling cooling device 1 is made higher than the internal pressure of the chamber 11. Since the internal pressure of the boiling cooling device 1 has already dropped to near the boiling pressure of the refrigerant 4, the refrigerant 4 can be boiled violently by a slight heating. Since the refrigerant 4 can be sufficiently stirred by being boiled vigorously, the noncondensable gas contained in the refrigerant 4 and the noncondensable gas adsorbed on the inner wall of the boiling cooling device 1 and the surface of the heating element 9 can be removed. It can be drawn out and collected in the space inside the boiling cooling device 1. In this state, stop heating and turn the valve 14
Is gradually opened, the non-condensable gas 16 collected in the upper portion of the boiling cooling device 1 is discharged into the chamber 11 due to the pressure difference. The valve 14 is closed when the internal pressures of the boiling cooling device 1 and the chamber 11 are balanced. After opening the valve 8 to operate the vacuum pump 6 to reduce the internal pressure of the chamber 11, the valve 8 is closed. By repeating the operation from heating the refrigerant 4 to lowering the internal pressure of the chamber 11 several times, most of the non-condensable gas 16 in the boiling cooling device can be discharged. The pressures of the boiling cooling device 1 and the chamber 11 are monitored by the pressure gauges 10 and 12, respectively.

【0007】[0007]

【発明の効果】以上述べたように、本発明によれば沸騰
冷却装置において冷媒を容易に沸騰させる事ができるの
で、冷媒中に含まれる不凝縮ガスや沸騰冷却装置内壁の
吸着ガスを排出することができるという効果がある。
As described above, according to the present invention, since the refrigerant can be easily boiled in the boiling cooling device, the non-condensable gas contained in the refrigerant and the adsorbed gas on the inner wall of the boiling cooling device are discharged. The effect is that you can.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例FIG. 1 Example of the present invention

【図2】従来例FIG. 2 Conventional example

【符号の説明】 1 沸騰冷却装置 2 冷媒タンク 3、7、13 配管 4 冷媒 5、8 バルブ 6 真空ポンプ 9 発熱体 10、12 圧力計 11 チャンバ 14 バルブ 15 ヒータ 16 不凝縮ガス(空気) 17 冷媒蒸気[Explanation of Codes] 1 Boiling Cooling Device 2 Refrigerant Tank 3, 7, 13 Piping 4 Refrigerant 5, 8 Valve 6 Vacuum Pump 9 Heating Element 10, 12 Pressure Gauge 11 Chamber 14 Valve 15 Heater 16 Non-condensing Gas (Air) 17 Refrigerant steam

─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成5年10月13日[Submission date] October 13, 1993

【手続補正1】[Procedure Amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】図面の簡単な説明[Name of item to be corrected] Brief description of the drawing

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の実施例の装置を示す構成図。FIG. 1 is a configuration diagram showing an apparatus according to an embodiment of the present invention.

【符号の説明】 1 沸騰冷却装置 2 冷媒タンク 3、7、13 配管 4 冷媒 5、8 バルブ 6 真空ポンプ 9 発熱体 10、12 圧力計 11 チャンバ 14 バルブ 15 ヒータ 16 不凝縮ガス(空気) 17 冷媒蒸気[Explanation of Codes] 1 Boiling Cooling Device 2 Refrigerant Tank 3, 7, 13 Piping 4 Refrigerant 5, 8 Valve 6 Vacuum Pump 9 Heating Element 10, 12 Pressure Gauge 11 Chamber 14 Valve 15 Heater 16 Non-condensing Gas (Air) 17 Refrigerant steam

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 沸騰冷却装置内の不凝縮ガス抜き方法に
おいて、沸騰冷却装置の内圧と配管によって接続したチ
ャンバの内圧とを操作して沸騰冷却装置内の不凝縮ガス
を排出した後、外部から熱を加えて沸騰冷却装置内の冷
媒を沸騰させて沸騰冷却装置の内圧を上げ、再度不凝縮
ガスを排出することを特徴とする沸騰冷却装置内の不凝
縮ガス抜き方法。
1. A method for venting non-condensable gas in a boiling cooling device, wherein the internal pressure of the boiling cooling device and the internal pressure of a chamber connected by a pipe are operated to discharge the non-condensing gas in the boiling cooling device, and then from the outside. A method for removing non-condensable gas in a boiling cooling device, characterized in that heat is applied to boil the refrigerant in the boiling cooling device to increase the internal pressure of the boiling cooling device and discharge the non-condensing gas again.
【請求項2】 真空ポンプと、冷媒および半導体スタッ
クを収納する収納タンクとよりなる沸騰冷却装置内の不
凝縮ガス抜き装置において、バルブを設けた配管を介し
て、真空ポンプと接続したチャンバと、前記チャンバに
設けた圧力計と、バルブを設けた配管を介して、前記チ
ャンバと接続した沸騰冷却装置と、前記沸騰冷却装置に
設けた圧力計と、前記沸騰冷却装置の外部に設けたヒー
タとよりなることを特徴とする沸騰冷却装置内の不凝縮
ガス抜き装置。
2. A non-condensing degassing apparatus in a boiling cooling apparatus comprising a vacuum pump and a storage tank for storing a refrigerant and a semiconductor stack, and a chamber connected to the vacuum pump via a pipe provided with a valve, A pressure gauge provided in the chamber, a boiling cooling device connected to the chamber through a pipe provided with a valve, a pressure gauge provided in the boiling cooling device, and a heater provided outside the boiling cooling device. A non-condensing degassing device in a boil cooling device.
JP9168892A 1992-03-16 1992-03-16 Method and device for non-condensible gas breathing in boil cooling system Pending JPH06112381A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9168892A JPH06112381A (en) 1992-03-16 1992-03-16 Method and device for non-condensible gas breathing in boil cooling system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9168892A JPH06112381A (en) 1992-03-16 1992-03-16 Method and device for non-condensible gas breathing in boil cooling system

Publications (1)

Publication Number Publication Date
JPH06112381A true JPH06112381A (en) 1994-04-22

Family

ID=14033449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9168892A Pending JPH06112381A (en) 1992-03-16 1992-03-16 Method and device for non-condensible gas breathing in boil cooling system

Country Status (1)

Country Link
JP (1) JPH06112381A (en)

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