JPH06112176A - Wafer holder for cleaning and etching - Google Patents
Wafer holder for cleaning and etchingInfo
- Publication number
- JPH06112176A JPH06112176A JP16925292A JP16925292A JPH06112176A JP H06112176 A JPH06112176 A JP H06112176A JP 16925292 A JP16925292 A JP 16925292A JP 16925292 A JP16925292 A JP 16925292A JP H06112176 A JPH06112176 A JP H06112176A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- etching
- cleaning
- holder
- wafer holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体製品の製造工程
において、半導体ウェハを洗浄またはエッチングする際
に用いられる洗浄・エッチング用ウェハ保持具に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning / etching wafer holder used for cleaning or etching a semiconductor wafer in a semiconductor product manufacturing process.
【０００２】[0002]
【従来の技術】半導体製品の製造工程においては半導体
ウェハを洗浄したり、エッチングしたりすることが行わ
れるが、そうした処理工程では半導体ウェハを多数収容
することができる樹脂製のウェハ保持具が利用される。
例えば、特開昭６１−１８９６４７号公報には、保持具
本体の内面側の対をなす細長いガイドが多数平行して設
けられていて溝を形成すると共に、本体下部にも前記ガ
イドに対応して溝がきられたサポート部が設けられてい
て、半導体ウェハが前記ガイドとサポート部の溝内に挿
入され、保持具下部に円筒面を有する台を設けて、ウェ
ハの保持具の揺動とともに、ウェハを押し上げる型式の
ものが開示されている。2. Description of the Related Art Semiconductor wafers are cleaned and etched in the manufacturing process of semiconductor products, and a resin-made wafer holder capable of accommodating a large number of semiconductor wafers is used in such processing processes. To be done.
For example, in Japanese Unexamined Patent Publication No. 61-189647, a large number of elongated guides forming a pair on the inner surface side of the holder main body are provided in parallel to form a groove, and the lower part of the main body corresponds to the guide. A grooved support part is provided, a semiconductor wafer is inserted into the groove of the guide and the support part, and a table having a cylindrical surface is provided under the holder to swing the wafer holder and A type of pushing up is disclosed.
【０００３】洗浄およびエッチングでは均一性を向上さ
せるためにウェハ保持具を回転あるいは揺動させること
が行われる。前記回転および揺動には、処理中に発生す
る気泡を速やかに除いたり、ウェハ近傍の液交換を容易
にする等の効果があり、それによって処理の均一性が増
すのである。しかし、前記公報に開示されているウェハ
保持具の場合、ウェハが脱落してしまうためにウェハ保
持具を回転することは事実上不可能である。したがっ
て、均一性を向上させるにはウェハ保持具の揺動を激し
くする必要があるが、被洗浄・エッチングウェハはウェ
ハ保持具内で振り子のように往復運動しており、反応が
激しい場合には処理中に発生する気泡の除去やウェハ近
傍の液交換が不十分にしか行われず、結果としてウェハ
面内、特にウェハ端部にいたる洗浄およびエッチング均
一性を確保できなくなることが起こる。In cleaning and etching, the wafer holder is rotated or swung to improve the uniformity. The rotation and rocking have effects such as promptly removing bubbles generated during processing and facilitating liquid exchange in the vicinity of the wafer, thereby increasing processing uniformity. However, in the case of the wafer holder disclosed in the above publication, it is practically impossible to rotate the wafer holder because the wafer falls off. Therefore, in order to improve the uniformity, it is necessary to vibrate the wafer holder vigorously, but the wafer to be cleaned / etched reciprocates like a pendulum in the wafer holder, and when the reaction is vigorous. Removal of bubbles generated during processing and liquid exchange in the vicinity of the wafer are insufficiently performed, and as a result, it may be impossible to ensure cleaning and etching uniformity within the wafer surface, particularly at the wafer edge.
【０００４】このような不都合はウェハ保持具を回転可
能な構造にすることである程度は緩和されるが、ウェハ
が前記保持具内でウェハ保持溝に引っかかって回転しな
くなったり、洗浄・エッチング中に発生する気泡が表面
に付着して被洗浄ウェハが上方へ押さえつけられてウェ
ハの回転が抑制されたりすることが散発する。Although such an inconvenience can be alleviated to some extent by making the wafer holder rotatable, the wafer is caught in the wafer holding groove in the holder and does not rotate, or during cleaning / etching. The generated bubbles adhere to the surface and the wafer to be cleaned is pressed upward, so that the rotation of the wafer is suppressed.
【０００５】[0005]
【発明が解決しようとする課題】本発明は被ウェハの浮
上を防止しかつ被処理ウェハを保持具内で確実に回転さ
せる機構をウェハ保持具に付与することで前記問題点を
解消し、均一な洗浄あるいはエッチングを安定して行う
ことができる洗浄・エッチング用ウェハ保持具を提供す
るものである。SUMMARY OF THE INVENTION The present invention solves the above problems by providing a wafer holder with a mechanism for preventing the wafer from floating and for reliably rotating the wafer to be processed in the holder. Provided is a wafer holder for cleaning / etching which can stably perform various cleaning or etching.
【０００６】[0006]
【課題を解決するための手段】本発明の洗浄・エッチン
グ用ウェハ保持具は、ウェハを保持するための少なくと
も２本以上の固定保持棒と１本以上の可動保持棒とを、
ウェハを脱落させないように互いの間隔を開けて、かつ
一対の対向する側板を離間させる用に取り付け、前記固
定保持棒あるいは可動保持棒のいづれか少なくとも１つ
を取り外し可能とし、固定保持棒のうち少なくとも２本
にはウェハを保持するための溝を設け、可動保持棒を前
記側板に対して平行な方向に可動したことを特徴とす
る。A cleaning / etching wafer holder according to the present invention comprises at least two or more fixed holding rods for holding a wafer and one or more movable holding rods.
At least one of the fixed holding rod or the movable holding rod is made detachable so that the wafer is not separated and the pair of side plates facing each other are attached so as to be spaced from each other. A groove for holding a wafer is provided in each of the two pieces, and the movable holding bar is movable in a direction parallel to the side plate.
【０００７】[0007]
【作用】以下、図を参照しながら、本発明の具体的構成
と作用を説明する。The specific construction and operation of the present invention will be described below with reference to the drawings.
【０００８】図１、２、および３は本発明のウェハ保持
具の一例で、その外観図と２つの断面図である。図２は
側断面図、そして、図３は、図２の紙面に垂直でかつＳ
Ｓ′線を通る断面を表した断面図である。図示されてい
るように、ウェハ保持具本体は一対の側板３からなる。
側板３には固定保持棒１と可動保持棒２が取り付けられ
ている。側板３には回転支持部４がある。固定保持棒１
にはウェハ５を保持するための溝が設けられている。可
動保持棒２の場合、側板３には前記棒の直径よりも大き
な孔６が設けてあり、この孔６で支持されると同時に、
孔６の中で自在に動くことができる。また、被洗浄ウェ
ハの出し入れを容易にするため、固定保持棒あるいは可
動保持棒のいづれか少なくとも１つは取り外し可能であ
る。FIGS. 1, 2 and 3 show an example of a wafer holder of the present invention, which is an external view and two sectional views. 2 is a side sectional view, and FIG. 3 is a view perpendicular to the plane of FIG.
It is a sectional view showing a section which passes along a S'line. As shown in the figure, the main body of the wafer holder comprises a pair of side plates 3.
A fixed holding rod 1 and a movable holding rod 2 are attached to the side plate 3. The side plate 3 has a rotation support portion 4. Fixed holding rod 1
Is provided with a groove for holding the wafer 5. In the case of the movable holding rod 2, the side plate 3 is provided with a hole 6 larger than the diameter of the rod, and at the same time it is supported by this hole 6,
It can move freely in the hole 6. Further, at least one of the fixed holding rod and the movable holding rod can be removed in order to facilitate loading and unloading of the wafer to be cleaned.
【０００９】図４はウェハ保持具を回転させた場合の被
洗浄ウェハ５の位置について示している。洗浄またはエ
ッチング前のウェハ５は図４においてＡで表される状態
になっている。溝にセットされたウェハ５は重力により
すべて下側に接している。ウェハ保持具を回転させる
と、ウェハ５は重力により図４のＢの状態になり、ウェ
ハと各保持棒間のクリアランス分だけウェハ５が回転す
る。更に、可動保持棒２もウェハ保持具の回転とともに
側板３の孔６の中で自在に移動してウェハ５を下部に押
し下げる。ウェハ保持具を更に回転させると、図４のＣ
およびＤで表すような状態になり、かくしてウェハ保持
具の回転にともないウェハ５を確実に回転させることが
できる。従来のウェハ保持具では洗浄あるいはエッチン
グ反応により発生する気泡が付着することによりウェハ
５が浮上して回転が妨げられ、洗浄やエッチングの均一
性が損なわれることがあったが、このような場合に、可
動保持棒２がウェハ５の周面を押し下げる本発明の洗浄
・エッチング用ウェハ保持具は極めて有効であり、ウェ
ハ５を確実に回転させることができる。また、従来のウ
ェハ保持具では固定保持棒１に設けられた溝部にウェハ
４が挾まって回転が妨げられて洗浄・エッチングむらが
生ずる場合があったが、ウェハ４を確実に回転できる本
発明の洗浄・エッチング用保持具ではこのようなことが
起こらず、むらを生じない。なお、可動保持棒の材料と
してはテフロン等の比重の大きな物質が好適である。FIG. 4 shows the position of the wafer 5 to be cleaned when the wafer holder is rotated. The wafer 5 before cleaning or etching is in a state represented by A in FIG. The wafers 5 set in the grooves are all in contact with the lower side by gravity. When the wafer holder is rotated, the wafer 5 is brought into the state of B in FIG. 4 due to gravity, and the wafer 5 is rotated by the clearance between the wafer and each holding rod. Further, the movable holding rod 2 also freely moves in the hole 6 of the side plate 3 with the rotation of the wafer holder to push the wafer 5 downward. When the wafer holder is further rotated, C in FIG.
Then, the state as represented by D and D is obtained, and thus the wafer 5 can be surely rotated with the rotation of the wafer holder. In the conventional wafer holder, the air bubbles generated by the cleaning or etching reaction adhere to the wafer 5 to hinder the rotation and impair the uniformity of cleaning or etching. In such a case, The wafer holder for cleaning / etching of the present invention in which the movable holding rod 2 pushes down the peripheral surface of the wafer 5 is extremely effective, and the wafer 5 can be reliably rotated. Further, in the conventional wafer holder, the wafer 4 may be caught in the groove provided in the fixed holding rod 1 and the rotation thereof may be hindered to cause uneven cleaning / etching. Such a phenomenon does not occur in the cleaning / etching holder described in 1 above, and unevenness does not occur. A material having a large specific gravity such as Teflon is suitable as the material of the movable holding rod.
【００１０】以上詳述したように、本発明の洗浄・エッ
チング用ウェハ保持具ではウェハ保持具を回転するだけ
でウェハが保持具内で常に安定に回転するため、洗浄や
エッチングの状況が不均一になったりすることがない。
これに対し、従来のウェハ保持具ではウェハの回転が不
可能または困難な場合があり、洗浄やエッチングの状況
が不均一になったりする。As described above in detail, in the wafer holder for cleaning / etching of the present invention, the wafer is always stably rotated in the holder by simply rotating the wafer holder, so that the cleaning and etching conditions are not uniform. It never becomes.
On the other hand, in the conventional wafer holder, the rotation of the wafer may be impossible or difficult, and the cleaning and etching conditions may not be uniform.
【００１１】[0011]
【実施例】ラッピング工程において荒研磨されたシリコ
ンウェハを洗浄した後、図１に示すウェハ保持具にセッ
トした。図１の保持具は本発明のウェハ保持具である。
次に、弗硝酸溶液（５０％弗酸：７０％硝酸：１００％
酢酸を３：５：３の容量比で混合した混酸）中に前記ウ
ェハがセットされた保持具を浸漬して、回転、揺動しな
がらエッチングを行った。比較のために可動保持棒のな
いウェハ保持具でも同様の試験を行った。超純水により
リンスした後、保持具から取り出して乾燥し、エッチン
グむらの有無を調べた。EXAMPLE After cleaning the silicon wafer that was roughly polished in the lapping process, it was set on the wafer holder shown in FIG. The holder of FIG. 1 is the wafer holder of the present invention.
Next, a nitric acid solution (50% hydrofluoric acid: 70% nitric acid: 100%
The holder on which the wafer was set was immersed in a mixed acid obtained by mixing acetic acid in a volume ratio of 3: 5: 3, and etching was performed while rotating and rocking. For comparison, the same test was performed on a wafer holder without a movable holding bar. After rinsing with ultrapure water, it was taken out from the holder and dried, and the presence or absence of etching unevenness was examined.
【００１２】本発明のウェハ保持具を利用した場合には
エッチングむらは全く発生しないが、比較例ではエッチ
ングむらが散発した。また、エッチング後の形状にも差
があり、本発明のウェハ保持具を用いた場合にはウェハ
毎の差はほとんどなかった。When the wafer holder of the present invention was used, etching unevenness did not occur at all, but in the comparative example, etching unevenness was scattered. Further, there is a difference in shape after etching, and when the wafer holder of the present invention is used, there is almost no difference between wafers.
【００１３】以上のように、本発明の洗浄・エッチング
用ウェハ保持具ではエッチングが均一に起こり、ウェハ
毎の差異が小さい。As described above, in the cleaning / etching wafer holder of the present invention, the etching occurs uniformly and the difference between the wafers is small.
【発明の効果】以上詳述したように、本発明の洗浄・エ
ッチング用ウェハ保持具によれば、洗浄またはエッチン
グ処理の均一性および安定性が増し、ウェハ処理後の表
面品質が安定する。As described in detail above, according to the wafer holder for cleaning / etching of the present invention, the uniformity and stability of the cleaning or etching process is increased, and the surface quality after the wafer process is stabilized.
【図１】 本発明の洗浄・エッチング用ウェハ保持具
（外観図）の一例。FIG. 1 is an example of a wafer holder for cleaning / etching (external view) of the present invention.
【図２】 図１の保持具の側断面図。FIG. 2 is a side sectional view of the holder shown in FIG.
【図３】 図１の保持の断面図。3 is a cross-sectional view of the retainer of FIG.
【図４】 本発明の洗浄・エッチング用ウェハ保持具を
用いた時の被処理ウェハの位置図。FIG. 4 is a position diagram of a processing target wafer when the cleaning / etching wafer holder of the present invention is used.
１…固定保持棒、 ２…可保持棒、 ３…側板、
４…回転支持部、５…ウェハ、 ６…孔。1 ... Fixed holding rod, 2 ... Holdable rod, 3 ... Side plate,
4 ... Rotation support part, 5 ... Wafer, 6 ... Hole.
Claims (1)
上の固定保持棒と１本以上の可動保持棒とを、ウェハを
脱落させないように互いの間隔を開けて、かつ一対の対
向する側板を離間させるように取り付け、前記固定保持
棒あるいは可動保持棒のいづれか少なくとも１つを取り
外し可能とし、固定保持棒のうち少なくとも２本にはウ
ェハを保持するための溝を設け、可動保持棒を前記側板
に対して平行な方向に可動としたことを特徴とする洗浄
・エッチング用ウェハ保持具。1. At least two or more fixed holding rods and one or more movable holding rods for holding a wafer are spaced apart from each other so as not to drop the wafer, and a pair of opposed side plates are provided. At least one of the fixed holding rods or the movable holding rods is detachably attached, and at least two of the fixed holding rods are provided with a groove for holding a wafer, and the movable holding rods are provided on the side plate. A cleaning / etching wafer holder characterized by being movable in a direction parallel to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16925292A JP2740594B2 (en) | 1992-06-26 | 1992-06-26 | Wafer holder for cleaning and etching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16925292A JP2740594B2 (en) | 1992-06-26 | 1992-06-26 | Wafer holder for cleaning and etching |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06112176A true JPH06112176A (en) | 1994-04-22 |
| JP2740594B2 JP2740594B2 (en) | 1998-04-15 |
Family
ID=15883068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16925292A Expired - Lifetime JP2740594B2 (en) | 1992-06-26 | 1992-06-26 | Wafer holder for cleaning and etching |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2740594B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016046504A (en) * | 2014-08-20 | 2016-04-04 | 力晶科技股▲ふん▼有限公司 | Housing jig and cleaning tank including housing jig |
| EP4113586A1 (en) * | 2021-07-02 | 2023-01-04 | Commissariat à l'énergie atomique et aux énergies alternatives | Wafer immersion device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5911338A (en) * | 1982-07-12 | 1984-01-20 | Hoechst Gosei Kk | Expandable composition |
-
1992
- 1992-06-26 JP JP16925292A patent/JP2740594B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5911338A (en) * | 1982-07-12 | 1984-01-20 | Hoechst Gosei Kk | Expandable composition |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016046504A (en) * | 2014-08-20 | 2016-04-04 | 力晶科技股▲ふん▼有限公司 | Housing jig and cleaning tank including housing jig |
| CN105463491A (en) * | 2014-08-20 | 2016-04-06 | 力晶科技股份有限公司 | Bearing jig |
| CN105463491B (en) * | 2014-08-20 | 2017-12-22 | 力晶科技股份有限公司 | Bearing jig |
| EP4113586A1 (en) * | 2021-07-02 | 2023-01-04 | Commissariat à l'énergie atomique et aux énergies alternatives | Wafer immersion device |
| FR3124887A1 (en) * | 2021-07-02 | 2023-01-06 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Platelet immersion device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2740594B2 (en) | 1998-04-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19980113 |