JPH06109918A - Patterned substrate and its production - Google Patents
Patterned substrate and its productionInfo
- Publication number
- JPH06109918A JPH06109918A JP25955692A JP25955692A JPH06109918A JP H06109918 A JPH06109918 A JP H06109918A JP 25955692 A JP25955692 A JP 25955692A JP 25955692 A JP25955692 A JP 25955692A JP H06109918 A JPH06109918 A JP H06109918A
- Authority
- JP
- Japan
- Prior art keywords
- alignment mark
- substrate
- accuracy
- alignment
- patterned substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Optical Filters (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Liquid Crystal (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電子装置等に用いられ
る、精密な位置合わせマークを要するパターン付き基板
及びその作成方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a patterned substrate which requires an accurate alignment mark and is used for electronic devices and the like, and a method for producing the patterned substrate.
【０００２】[0002]
【従来の技術】従来、平面上に寸法、形状、位置精度を
もってパターンを形成するためには、フォトマスクを使
用し、フォトマスクの寸法、形状、位置精度をそのまま
焼き付ける写真法あるいはフォトリソグラフィ法、スク
リーン版や凸版、凹版、平版を原版とした印刷法、流体
を噴出させる機構をもった描画点の位置移動により形成
するインクジェット、バブルジェット、吐出式描画法な
どがあり、それぞれの必要に応じた寸法、形状、位置精
度、コスト、作業効率等により使い分けされてきた。2. Description of the Related Art Conventionally, in order to form a pattern on a plane with accuracy in size, shape, and position, a photomask is used, and a photographic method or a photolithography method in which the size, shape, and position accuracy of the photomask are directly printed. There are printing methods such as screen printing, letterpress printing, intaglio printing, lithographic printing, and ink jet, bubble jet, and discharge drawing which are formed by moving the drawing points with a mechanism for ejecting fluid. It has been used properly according to the size, shape, position accuracy, cost, work efficiency, etc.
【０００３】[0003]
【発明が解決しようとする課題】前記した各法のうち、
写真法あるいはフォトリソグラフィ法によると、解像性
は１〜１０ミクロン程度が得られ、また距離精度は１５
０ミリメートル程度の距離で５〜１０ミクロン程度が得
られる。これらの方法を用いると、寸法精度の高い機能
パターンや充分に精密な位置合わせマークを作れるもの
の、塗布、プリベーク、露光、現像、リンス、アフター
ベークと工程が多く、処理時間がかかるなどのほか、材
料の有効利用がしにくいなどコスト面で過大となりがち
であった。このため、工業生産上特に必要とされる精度
の要求に対応する場合に用いられることが多かった。Among the above-mentioned methods,
According to the photographic method or the photolithography method, the resolution is about 1 to 10 microns and the distance accuracy is 15
With a distance of about 0 millimeter, about 5 to 10 microns can be obtained. Using these methods, although functional patterns with high dimensional accuracy and sufficiently precise alignment marks can be created, many processes such as coating, pre-baking, exposure, development, rinsing, and after-baking take time, and in addition to the processing time, Costs tended to be too large, such as the difficulty of effective use of materials. For this reason, it has often been used in the case of meeting the demand for accuracy particularly required in industrial production.
【０００４】印刷法は、コスト面では材料費、設備費、
生産工数等が小さく安価にすることが可能である。ま
た、機能パターンの寸法精度の面でも、凹版オフセット
法によれば１５〜２０ミクロン程度の細線が作成可能で
あり、高精細も限定的には可能である。しかし、位置合
わせマークの様に、離して作られた２点のマーク間の距
離精度は、原版の伸び等が累積されるために、１５０ミ
リメートル程度の距離で数十ミクロンとなり、位置合わ
せマークの位置が基板により異なるため、位置合わせが
できなかったり、位置合わせはできても、機能パターン
と位置合わせマークの相対位置がずれているために、目
的である機能パターンの位置合わせができない、などの
支障を生じていた。これを、（図５）で説明する。In terms of costs, the printing method requires material costs, equipment costs,
The number of production steps is small and it is possible to reduce the cost. Also in terms of the dimensional accuracy of the functional pattern, fine lines of about 15 to 20 microns can be formed by the intaglio offset method, and high definition can be limited. However, like the alignment mark, the distance accuracy between two marks that are made apart is several tens of microns at a distance of about 150 mm due to the accumulation of elongation of the original plate. Since the position differs depending on the substrate, it is not possible to perform the alignment, or the alignment is possible, but the relative alignment between the functional pattern and the alignment mark is incorrect, so the intended functional pattern cannot be aligned. There was a problem. This will be described in (FIG. 5).
【０００５】基板Ｃ９に凹版オフセット印刷法により作
成機能パターンＣ１０を形成する。このとき基板Ｃ９の
位置合わせマーク１１ａ，１１ｂ，１１ｃ，１１ｄも同
時に、基板内の４ケ所に形成する。この場合、印刷方向
に対する伸縮が生じるため、基板Ｃの位置合わせマーク
１１ａ，１１ｂは本来あるべき点１２ａ，１２ｂからｌ
だけずれて形成される。図では特に示してはないが、１
１ｃ，１１ｄについても同様の事態が発生する。この２
点間の距離精度が数十ミクロンにおよぶので、この方式
で作った基板では、複数枚の重ね合わせ等をする場合の
位置合わせマークとしては機能しないものとなった。A production function pattern C10 is formed on the substrate C9 by the intaglio offset printing method. At this time, the alignment marks 11a, 11b, 11c, 11d of the substrate C9 are also formed at four locations in the substrate at the same time. In this case, since the expansion and contraction with respect to the printing direction occurs, the alignment marks 11a and 11b of the substrate C are separated from the original points 12a and 12b by l.
It is formed by shifting only. Although not shown in the figure, 1
The same situation occurs for 1c and 11d. This 2
Since the distance accuracy between the points is several tens of microns, the substrate made by this method does not function as an alignment mark when superposing a plurality of sheets.
【０００６】また、流体を噴出させる機構をもった描画
点の位置移動によってのみ作成する方式は、解像性が１
５〜２０ミクロンであり、離れた２点間の距離精度も、
５〜１０ミクロンと比較的良好である。しかし、描画点
が移動してパターン形成をする「一筆書き」のため、基
板寸法やパターンによっては一枚の基板を作成する時間
が多大になるなど、生産性は劣るものがあり工業的には
余り使用されなかった。Further, the method of producing only by moving the position of the drawing point having a mechanism for ejecting fluid has a resolution of 1
It is 5 to 20 microns, and the accuracy of the distance between two distant points is
It is relatively good at 5 to 10 microns. However, since the drawing point moves to form a pattern by one-stroke writing, it takes a lot of time to create one board depending on the board size and the pattern. Not used much.
【０００７】以上のように、寸法、形状、位置精度、の
再現性が高くてかつ生産性が高く、コストが低い最良の
方法はなかった。材料費、設備費や工程が少なく、かつ
処理時間が短いなど工業生産性に富み、解像性がよく、
また位置精度が優れた方法が待望されていた。As described above, there is no best method which has high reproducibility of size, shape and positional accuracy, high productivity and low cost. Material cost, equipment cost and process are small, and processing time is short.
In addition, a method with excellent positional accuracy has been long sought.
【０００８】[0008]
【課題を解決するための手段】オフセット印刷により主
たる機能パターンを形成し、同時に形成したオフセット
印刷による第一の位置合わせマークを起点に、流体を噴
出させる機構をもった描画点の位置移動方式により、第
二の位置合わせマークを形成して基板を作成する。[Means for Solving the Problems] By a method of moving a drawing point having a mechanism for ejecting a fluid, a main functional pattern is formed by offset printing, and a first alignment mark formed simultaneously by offset printing is used as a starting point. , Forming a second alignment mark to create a substrate.
【０００９】[0009]
【作用】オフセット印刷により主たる機能パターンを形
成し、同時に形成したオフセット印刷による第一の位置
合わせマークを起点に、流体を噴出させる機構をもった
描画点の位置移動方式により、第二の位置合わせマーク
を形成する。この方法によれば、主な機能パターンの形
成は印刷に依るため、材料費、設備費、生産工程数が少
ない等、工業的にも生産性があり、コスト的にも有利で
ある。The main function pattern is formed by offset printing, and the second position adjustment is performed by the drawing point position movement method having a mechanism for ejecting fluid from the first position adjustment mark formed simultaneously by offset printing as a starting point. Form a mark. According to this method, since the main functional pattern is formed by printing, the material cost, the equipment cost, the number of production steps are small, and the like, which is industrially productive and advantageous in cost.
【００１０】また、位置合わせマークを描画点位置移動
により作成するが、作成箇所が基板一枚当りで少なく、
小形状でもあるので時間的にも不経済はない。Further, the alignment mark is created by moving the drawing point position, but the number of created places is small per substrate,
Since it is a small shape, there is no time uneconomical.
【００１１】解像性は１５〜２０ミクロン程度であり、
また離れた２点間の距離精度は５〜１５ミクロン程度と
比較的形状、寸法、位置精度の高いパターンが得られ
る。The resolution is about 15 to 20 μm,
Further, the distance accuracy between two distant points is about 5 to 15 microns, and a pattern having a relatively high shape, size, and positional accuracy can be obtained.
【００１２】[0012]
【実施例】本発明の実施例を（図１）により説明する。EXAMPLE An example of the present invention will be described with reference to FIG.
【００１３】厚さ１．１ミリでたてよこ３００×３００
ミリのガラスを材料とする、基板Ａ１上に凹版オフセッ
ト方式で、端面より各々５０ミリ内側の範囲内に、必要
な作成機能パターンＡ３をもち、かつその一辺の外側よ
り１０ミリ離れた二点に第１の位置合わせマーク５ａ，
５ｂを形成する。この状態を、本発明の実施例の工程進
行状況を説明する（図２）（ａ）に示す。Thickness of 1.1 mm and vertical length of 300 × 300
With the intaglio offset method on the substrate A1 made of millimeter glass, the required creation function pattern A3 is within 50 mm each from the end face, and at two points 10 mm apart from the outside of one side. The first alignment mark 5a,
5b is formed. This state is shown in (a) of FIG. 2 for explaining the process progress status of the embodiment of the present invention.
【００１４】次に（図２）（ｂ）のように、第１の位置
合わせマーク５ａの位置をＣＣＤ等で検知して原点と
し、ここから縦方向（ｙ方向）に７０ミリ離れた点に、
第２の位置合わせマーク６ａを、また第１の位置合わせ
マーク５ｂを原点として７０ミリ離れた点に第２の位置
合わせマーク６ｂを、流体を噴出させる機構をもった描
画点の位置移動方式のひとつであるインクジェットを用
いて形成した。次いで第１の位置合わせマーク５ａを原
点として縦方向（ｙ方向）に９０ミリ離れた点に、第２
の位置合わせマーク６ｃを、また第１の位置合わせマー
ク５ｂを原点として９０ミリ離れた点に、第２の位置合
わせマーク６ｄを形成した。Next, as shown in (FIG. 2) (b), the position of the first alignment mark 5a is detected by a CCD or the like to be the origin, and at a point 70 mm away from this in the vertical direction (y direction). ,
The second position alignment mark 6a is a moving position of a drawing point having a mechanism for ejecting the second position alignment mark 6a and the second position alignment mark 6b at a point 70 mm away from the first position alignment mark 5b as an origin. It was formed by using one ink jet. Next, at the point 90 mm apart in the vertical direction (y direction) with the first alignment mark 5a as the origin, the second
The second alignment mark 6d was formed at a point 90 mm apart from the alignment mark 6c of No. 1 and the origin of the first alignment mark 5b.
【００１５】以上のようにして、（図１）に示す第１の
位置合わせマーク５ａ，５ｂと第２の位置合わせマーク
６ａ，６ｂ，６ｃ，６ｄを持った基板Ａが形成される。As described above, the substrate A having the first alignment marks 5a, 5b and the second alignment marks 6a, 6b, 6c, 6d shown in FIG. 1 is formed.
【００１６】この基板Ａ１と組合せ使用する基板Ｂ２に
ついては、（図２）に示す。厚さ１．１ミリで縦横２５
０×２５０ミリのガラスを材料とする基板Ｂ２上にオフ
セット印刷により、必要な作成機能パターンＢ４および
第１の位置合わせマーク７ａ，７ｂのを形成する。次に
第１の位置合わせマーク７ａの位置を原点とし、縦方向
（ｙ方向）に７０ミリ離れた点に、第２の位置合わせマ
ーク８ａを、また第１の位置合わせマーク７ｂを原点と
して７０ミリ離れた点に、第２の位置合わせマーク８ｂ
を形成した。次いで第１の位置合わせマーク７ａを原点
として縦方向（ｙ方向）に９０ミリ離れた点に第２の位
置合わせマーク８ｃを、また第１の位置合わせマーク７
ｂを原点として９０ミリ離れた点に８ｄを形成した。The board B2 used in combination with the board A1 is shown in FIG. 25 mm long and 1.1 mm thick
The necessary creation function pattern B4 and the first alignment marks 7a and 7b are formed by offset printing on the substrate B2 made of 0 × 250 mm glass. Next, with the position of the first alignment mark 7a as the origin, the second alignment mark 8a and the first alignment mark 7b as the origin at a point 70 mm apart in the vertical direction (y direction). The second alignment mark 8b is provided at a point separated by a millimeter.
Was formed. Next, a second alignment mark 8c is formed at a point 90 mm apart in the vertical direction (y direction) with the first alignment mark 7a as the origin, and the first alignment mark 7 is formed.
8d was formed at a point 90 mm apart from b as the origin.
【００１７】これらの作成法により得られた基板Ａと基
板Ｂとの組合せ状態を、（図４）に示す。１例として示
した第２の位置合わせマーク８ａ−８ｂと６ａ−６ｂ
は、後述するように距離精度が高いので、位置合わせ作
業は容易に行われる。The combined state of the substrate A and the substrate B obtained by these manufacturing methods is shown in FIG. Second alignment marks 8a-8b and 6a-6b shown as an example
Since the distance accuracy is high as will be described later, the alignment work is easily performed.
【００１８】本発明による方法で作成した基板Ａの第２
の位置合わせマークの間の距離を測定した値を（表１）
に示す。Second substrate A prepared by the method according to the invention
Measure the distance between the alignment marks of (Table 1)
Shown in.
【００１９】[0019]
【表１】 [Table 1]
【００２０】また、基板Ａ１と同様に作成し、基板Ａ１
と組み合わせて用いる基板Ｂの第２の位置合わせマーク
の間の距離を測定した値を（表２）に示す。The substrate A1 is prepared in the same manner as the substrate A1.
The values obtained by measuring the distance between the second alignment marks of the substrate B used in combination with are shown in (Table 2).
【００２１】[0021]
【表２】 [Table 2]
【００２２】以上のように、基板Ａ１、基板Ｂ２におい
て、１６０ミリメートル離れた２つの位置合わせマーク
の間の距離精度は、５〜１５ミクロン程度になる。この
ように第２の位置合わせマークは、作成機能パターンの
形成時に、同時に形成された第１の位置合わせパターン
を原点としているので、第２の位置合わせマークと作成
機能パターンとの相対位置は正確であり、基板の組合せ
作業に支障はない。As described above, in the substrates A1 and B2, the distance accuracy between the two alignment marks 160 mm apart is about 5 to 15 microns. In this way, the second alignment mark has the first alignment pattern formed at the same time as the origin as the origin when the formation function pattern is formed, so that the relative position between the second alignment mark and the formation function pattern is accurate. Therefore, there is no hindrance to the assembly work of the substrates.
【００２３】本発明による方法は、これら位置、距離精
度が高いという特長のほか、塗布、プリベーク、露光、
現像、リンス、アフターベークなどの複雑な工程がな
く、処理時間が少なく、材料の有効利用が可能であるな
どコスト面でも有利である。The method according to the present invention has the advantages of high accuracy in position and distance, as well as coating, prebaking, exposure,
There are no complicated steps such as development, rinsing and after-baking, the processing time is short, and the materials can be effectively used, which is advantageous in terms of cost.
【００２４】また主要工程は印刷法であり、コスト面で
は材料費、設備費、生産工数等が小さく安価にすること
がが可能である。また、機能パターンの寸法精度の面で
も、凹版オフセット法によれば１５〜２０ミクロン程度
の細線が作成可能であり、高精細も実現できる。Further, the main process is a printing method, and in terms of cost, material cost, equipment cost, production man-hours, etc. are small and can be made inexpensive. Also in terms of dimensional accuracy of the functional pattern, fine lines of about 15 to 20 microns can be created by the intaglio offset method, and high definition can be realized.
【００２５】位置合わせマークの形成は、流体を噴出さ
せる機構をもった描画点の位置移動方式という、位置精
度は高いものの「一筆書き」であり、作成に時間を要す
る手段を用いている。しかし、小さな形状を数カ所作成
するのに留まるため作業時間が多大になるには至らな
い。The formation of the alignment mark is a one-stroke writing method with high positional accuracy, which is a method of moving the position of a drawing point having a mechanism for ejecting a fluid, and uses a means that requires time to create. However, the work time does not become long because it is only necessary to create a few small shapes.
【００２６】以上のように、本方法によれば寸法、形
状、位置精度、の再現性が高くてかつ生産性が高く、コ
ストが低い最良の精密パターン基板が得られる。As described above, according to this method, it is possible to obtain the best precision pattern substrate having high reproducibility of size, shape and position accuracy, high productivity and low cost.
【００２７】また、材料費、設備費や工程が少なく、か
つ処理時間が短いなど工業生産性に富み、解像性がよ
く、また位置精度が優れているなど利点が多い。In addition, there are many advantages such as low material cost, equipment cost and process, short processing time, high industrial productivity, good resolution, and excellent positional accuracy.
【００２８】これらに対して、（図５）に示す、位置合
わせマーク、作成機能パターンともに印刷法で形成する
従来例を用いた場合の、位置合わせマークの間の距離を
測定した値を（表３）に示す。On the other hand, when the conventional example in which both the alignment mark and the creation function pattern are formed by the printing method shown in FIG. 3).
【００２９】[0029]
【表３】 [Table 3]
【００３０】位置合わせマークの間の距離精度は、１６
０ミリメートルの距離で５０〜９０ミクロン程度にもな
り、位置合わせマークと作成機能パターンとの相対位置
も不正確であり、基板の組合せ作業にも支障が生ずる。The distance accuracy between the alignment marks is 16
At a distance of 0 mm, the distance is about 50 to 90 μm, the relative position between the alignment mark and the creation function pattern is inaccurate, and the work of assembling the substrates is also hindered.
【００３１】[0031]
【発明の効果】本発明によれば、材料費、設備費や工程
が少なく、かつ処理時間が短いなど工業生産性に富み、
解像性がよく、また位置精度が優れたパターン付基板及
びその作成方法が提供できる。EFFECTS OF THE INVENTION According to the present invention, material cost, equipment cost and process are low, and processing time is short.
It is possible to provide a patterned substrate having good resolution and excellent positional accuracy, and a method for producing the patterned substrate.
【図１】本発明の実施例のパターン付き基板Ａの平面図FIG. 1 is a plan view of a patterned substrate A according to an embodiment of the present invention.
【図２】本発明の実施例の工程進行状況を示す平面図 (a)は機能パターンおよび第１の位置合わせマークを作
成した状態 (b)は第２の位置合わせマークを２箇所作成した状態FIG. 2 is a plan view showing the progress of steps of the embodiment of the present invention (a) is a state in which a functional pattern and a first alignment mark are formed (b) is a state in which two second alignment marks are formed
【図３】本発明の実施例の、基板Ａと組み合わされる基
板Ｂの平面図FIG. 3 is a plan view of a substrate B combined with a substrate A according to an embodiment of the present invention.
【図４】本発明の実施例の、基板Ａと基板Ｂの組み合わ
せ状態を示す側面図FIG. 4 is a side view showing a combination state of the substrate A and the substrate B according to the embodiment of the present invention.
【図５】パターン付き基板の従来例を示す平面図FIG. 5 is a plan view showing a conventional example of a patterned substrate.
１ 基板Ａ ２ 基板Ｂ ３ 作成機能パターンＡ ４ 作成機能パターンＢ ５ａ，５ｂ 第１の位置合わせマーク ６ａ〜６ｄ 第２の位置合わせマーク ７ａ，７ｂ 第１の位置合わせマーク ８ａ〜８ｄ 第２の位置合わせマーク ９ 基板Ｃ １０ 作成機能パターンＣ １１ａ〜１１ｄ 基板Ｃの位置合わせマーク １２ａ，１２ｂ 本来位置合わせマーク１１ａ，１１ｂ
のあるべき点1 board | substrate A2 board | substrate B3 creation function pattern A4 creation function pattern B 5a, 5b 1st alignment mark 6a-6d 2nd alignment mark 7a, 7b 1st alignment mark 8a-8d 2nd position Alignment mark 9 Substrate C 10 Creation function pattern C 11a to 11d Alignment mark 12a, 12b of the substrate C Original alignment mark 11a, 11b
Should be
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 3/12 Ａ 7511−4Ｅ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H05K 3/12 A 7511-4E
Claims (4)
よび第一の位置合わせマークを作成し、組立作業を行う
ことを目的とした第二の位置合わせマークを、この第一
の位置合わせマークを起点として形成したパターン付基
板の作成方法。1. A second alignment mark for the purpose of performing an assembling operation by forming a functional pattern and a first alignment mark on a substrate by offset printing, and starting from this first alignment mark. Of forming a patterned substrate formed as.
位置を、第１の位置合わせマークの両側に配置したパタ
ーン付き基板の作成方法。2. A method for producing a patterned substrate in which the position of the second alignment mark according to claim 1 is arranged on both sides of the first alignment mark.
形成方法を流体噴出法としたパターン付き基板の作成方
法。3. A method for producing a patterned substrate, wherein the method for forming the second alignment mark according to claim 1 is a fluid ejection method.
の作成方法により得られた位置合わせマークをもったパ
ターン付基板。4. A patterned substrate having an alignment mark obtained by the method for producing a patterned substrate according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25955692A JP2943528B2 (en) | 1992-09-29 | 1992-09-29 | Patterned substrate and method of making the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25955692A JP2943528B2 (en) | 1992-09-29 | 1992-09-29 | Patterned substrate and method of making the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06109918A true JPH06109918A (en) | 1994-04-22 |
| JP2943528B2 JP2943528B2 (en) | 1999-08-30 |
Family
ID=17335764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25955692A Expired - Fee Related JP2943528B2 (en) | 1992-09-29 | 1992-09-29 | Patterned substrate and method of making the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2943528B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108973324A (en) * | 2018-08-17 | 2018-12-11 | 重庆宏劲印务有限责任公司 | A kind of method and system of cigarette frame paper impressing pattern |
-
1992
- 1992-09-29 JP JP25955692A patent/JP2943528B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108973324A (en) * | 2018-08-17 | 2018-12-11 | 重庆宏劲印务有限责任公司 | A kind of method and system of cigarette frame paper impressing pattern |
| CN108973324B (en) * | 2018-08-17 | 2023-09-19 | 重庆宏劲印务有限责任公司 | Method and system for printing patterns on cigarette frame paper |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2943528B2 (en) | 1999-08-30 |
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