JPH06107471A - Brazing filler metal for ceramics - Google Patents
Brazing filler metal for ceramicsInfo
- Publication number
- JPH06107471A JPH06107471A JP27941592A JP27941592A JPH06107471A JP H06107471 A JPH06107471 A JP H06107471A JP 27941592 A JP27941592 A JP 27941592A JP 27941592 A JP27941592 A JP 27941592A JP H06107471 A JPH06107471 A JP H06107471A
- Authority
- JP
- Japan
- Prior art keywords
- ceramics
- brazing
- filler metal
- brazing filler
- brazing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、セラミックス用ろう材
に係り、特に電子部品として用いられるセラミックス製
品の接合に適するろう材に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a brazing material for ceramics, and more particularly to a brazing material suitable for joining ceramic products used as electronic parts.
【０００２】[0002]
【従来の技術】従来のセラミックス用ろう材の１つに、
Ａｇ70.5％、Ｃｕ27.5％、Ｔｉ２％よりなるものがあ
る。このセラミックス用ろう材は、ＡｇＣｕ共晶のろう
材をＴｉの活性を利用してセラミックスと接合するもの
である。2. Description of the Related Art One of the conventional brazing filler metals for ceramics is
Some consist of Ag 70.5%, Cu 27.5%, and Ti 2%. This brazing material for ceramics is a brazing material of AgCu eutectic that is bonded to ceramics by utilizing the activity of Ti.
【０００３】ところで、このセラミックス用ろう材は、
ＣｕＴｉの硬い析出物が点在し、薄くテープ状に加工す
ると、切れたり、穴があいたりし、ろう付け強度も弱く
なる。またろう付け温度が高いので、セラミックスに対
する熱衝撃が大きく、接合の歪も大きい。従って、電子
部品として用いられるセラミックス製品の接合には不適
当である。By the way, this brazing material for ceramics is
CuTi hard precipitates are scattered, and when processed into a thin tape shape, the tape is cut, holes are formed, and the brazing strength is weakened. In addition, since the brazing temperature is high, the thermal shock on the ceramics is large and the distortion of the joint is large. Therefore, it is unsuitable for joining ceramic products used as electronic parts.
【０００４】[0004]
【発明が解決しようとする課題】そこで本発明は、硬い
ＣｕＴｉの析出の無い均一な組織で、加工性が良く、ろ
う付け強度も十分で、その上ろう付け温度が低くて、セ
ラミックスに対する熱衝撃が小さく、接合の歪が抑えら
れるセラミックス用ろう材を提供しようとするものであ
る。Therefore, the present invention has a uniform structure with no precipitation of hard CuTi, has good workability, has sufficient brazing strength, and has a low brazing temperature, which results in thermal shock to ceramics. The present invention intends to provide a brazing material for ceramics which has a small size and a distortion of bonding can be suppressed.
【０００５】[0005]
【課題を解決するための手段】上記課題を解決するため
の本発明のセラミックス用ろう材は、Ａｇ50〜85％、Ｔ
ｉ１〜５％、Ｉｎ 0.1〜 7.5％、残部Ｃｕよりなるもの
である。The brazing material for ceramics of the present invention for solving the above-mentioned problems is Ag 50 to 85%, T
i1 to 5%, In 0.1 to 7.5%, and the balance Cu.
【０００６】本発明のセラミックス用ろう材に於いて、
Ａｇ50〜85％とした理由は、ろう材として必要な加工性
とろう付け性を確保する為で、50％未満ではその効果が
なく、85％を超えると融点が高くなり過ぎるからであ
る。また、Ｔｉ１〜５％とした理由は、セラミックスと
の接合を可能にする為で、１％未満では接合できず、５
％を超えると加工性が悪くなるからである。In the brazing material for ceramics of the present invention,
The reason why Ag is set to 50 to 85% is to secure the workability and brazing property required as a brazing filler metal, and if it is less than 50%, its effect is not exerted, and if it exceeds 85%, the melting point becomes too high. Further, the reason for setting Ti1 to 5% is to enable bonding with ceramics.
This is because if it exceeds%, the workability deteriorates.
【０００７】さらにＩｎ 0.1〜 7.5％とした理由は、Ｃ
ｕＴｉの析出を抑える為で、 0.1％未満ではＣｕＴｉの
析出を抑えることができず、 7.5％を超えるとろう材の
融点が下がり過ぎ、且つＴｉの活性が抑えられるからで
ある。Further, the reason for setting In 0.1 to 7.5% is that C is
This is because, in order to suppress the precipitation of uTi, if it is less than 0.1%, the precipitation of CuTi cannot be suppressed, and if it exceeds 7.5%, the melting point of the brazing material is too low and the activity of Ti is suppressed.
【０００８】[0008]
【作用】上記構成の本発明のセラミックス用ろう材は、
Ｉｎ 0.1〜 7.5％の添加により、ＣｕＴｉの析出が抑え
られて均一な組織となり、加工性が向上し、薄くテープ
状に加工した際切れたり、穴があいたりすることがな
く、またろう付け強度は従来のＡｇ−Ｃｕ−Ｔｉのセラ
ミックス用ろう材と同等に高いものとなる。しかもろう
付け温度が低いので、セラミックスに対する熱衝撃が小
さく、接合の歪が抑えられる。The brazing filler metal for ceramics of the present invention having the above-mentioned constitution is
By adding In 0.1-7.5%, precipitation of CuTi is suppressed and a uniform structure is formed, workability is improved, there is no breakage or holes when processed into a thin tape shape, and brazing strength Is as high as the conventional brazing filler metal for ceramics of Ag—Cu—Ti. Moreover, since the brazing temperature is low, the thermal shock to the ceramics is small and the distortion of the joint can be suppressed.
【０００９】[0009]
【実施例】本発明のセラミックス用ろう材の実施例を従
来例と共に説明する。下記の表１の左欄に示す成分組成
の材料を真空溶解し、150l×200m×20t に鋳造し、これ
を圧延加工して厚さ0.03mm、幅30mmのテープを作り、こ
れをＮ2 ＋Ｈ2 雰囲気、650 ℃、１時間熱処理して、実
施例１〜４及び従来例のろう材テープを得た。EXAMPLE An example of the brazing material for ceramics of the present invention will be described together with a conventional example. The materials with the composition shown in the left column of Table 1 below are vacuum melted, cast into 150 l x 200 m x 20 t, and rolled into a tape with a thickness of 0.03 mm and a width of 30 mm, which is N 2 + H Heat treatment was performed for 1 hour at 650 ° C. in 2 atmospheres to obtain the brazing tapes of Examples 1 to 4 and the conventional example.
【００１０】これらろう材テープを検査し、圧延加工の
割れ、切断の有無を調べた処、下記の表１の中央欄に示
すような結果を得た。また、これらろう材テープを、長
さ30mmに切断して、縦30mm、横30mm、厚さ５mmのアルナ
ミ製品とジルコニア製品のろう付けに12個用い、そのろ
う付け強度を測定した処、下記の表１の右欄に示すよう
な結果を得た。When these brazing tapes were inspected and checked for cracks and cuts during rolling, the results shown in the center column of Table 1 below were obtained. In addition, these brazing tapes were cut into a length of 30 mm, and 12 pieces were used to braze Alnami products and zirconia products with a length of 30 mm, a width of 30 mm, and a thickness of 5 mm, and the brazing strength was measured. The results shown in the right column of Table 1 were obtained.
【００１１】[0011]
【表１】 [Table 1]
【００１２】上記の表１で明らかなように従来例のセラ
ミックス用ろう材は、圧延加工中に割れ、切断が生じた
が、実施例１〜４のセラミックス用ろう材は、圧延加工
中に割れ、切断が全く生じなかった。また、従来例のセ
ラミックス用ろう材はろう付け強度が低く、ばらつきが
大きくて不安定であったが、実施例のセラミックス用ろ
う材はろう付け強度が高く、ばらつきが小さくて安定し
ていた。As is clear from Table 1 above, the conventional brazing filler metal for ceramics was cracked and cut during rolling, but the brazing filler metals for ceramics of Examples 1 to 4 were cracked during rolling. , No disconnection occurred. Moreover, the brazing material for ceramics of the conventional example had low brazing strength and had a large variation and was unstable, whereas the brazing material for ceramics of the example had high brazing strength and had a small variation and stable.
【００１３】[0013]
【発明の効果】以上の通り本発明のセラミックス用ろう
材は、硬いＣｕＴｉの析出の無い均一な組織で、加工性
が良く、ろう付け強度も十分である。その上ろう付け温
度が低くて、セラミックスに対する熱衝撃が小さく、接
合の歪を抑えることができる。As described above, the brazing material for ceramics of the present invention has a uniform structure without precipitation of hard CuTi, has good workability, and has sufficient brazing strength. Moreover, the brazing temperature is low, the thermal shock to the ceramics is small, and the distortion of the joint can be suppressed.
Claims (1)
〜 7.5％、残部Ｃｕよりなるセラミックス用ろう材。1. Ag 50-85%, Ti 1-5%, In 0.1
~ 7.5% brazing filler metal for ceramics with the balance Cu.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27941592A JPH06107471A (en) | 1992-09-24 | 1992-09-24 | Brazing filler metal for ceramics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27941592A JPH06107471A (en) | 1992-09-24 | 1992-09-24 | Brazing filler metal for ceramics |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06107471A true JPH06107471A (en) | 1994-04-19 |
Family
ID=17610776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27941592A Pending JPH06107471A (en) | 1992-09-24 | 1992-09-24 | Brazing filler metal for ceramics |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06107471A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005112677A (en) * | 2003-10-09 | 2005-04-28 | Hitachi Metals Ltd | Braze for ceramic substrate and ceramic circuit board using the same |
| US7436058B2 (en) * | 2002-05-09 | 2008-10-14 | Intel Corporation | Reactive solder material |
| JP2009170930A (en) * | 2009-03-12 | 2009-07-30 | Hitachi Metals Ltd | Ceramic circuit board and power semiconductor module using the same |
| CN108155103A (en) * | 2017-12-26 | 2018-06-12 | 天津荣事顺发电子有限公司 | A kind of aluminium nitride ceramic copper-clad substrate and preparation method thereof |
-
1992
- 1992-09-24 JP JP27941592A patent/JPH06107471A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7436058B2 (en) * | 2002-05-09 | 2008-10-14 | Intel Corporation | Reactive solder material |
| JP2005112677A (en) * | 2003-10-09 | 2005-04-28 | Hitachi Metals Ltd | Braze for ceramic substrate and ceramic circuit board using the same |
| JP2009170930A (en) * | 2009-03-12 | 2009-07-30 | Hitachi Metals Ltd | Ceramic circuit board and power semiconductor module using the same |
| CN108155103A (en) * | 2017-12-26 | 2018-06-12 | 天津荣事顺发电子有限公司 | A kind of aluminium nitride ceramic copper-clad substrate and preparation method thereof |
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