JPH06106756A - Thermal head and manufacture thereof - Google Patents
Thermal head and manufacture thereofInfo
- Publication number
- JPH06106756A JPH06106756A JP25691092A JP25691092A JPH06106756A JP H06106756 A JPH06106756 A JP H06106756A JP 25691092 A JP25691092 A JP 25691092A JP 25691092 A JP25691092 A JP 25691092A JP H06106756 A JPH06106756 A JP H06106756A
- Authority
- JP
- Japan
- Prior art keywords
- scanning direction
- resistor
- common electrode
- strip
- overglaze
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、ワードプロセッサ、パ
ーソナルコンピュータ等の出力装置としてのサーマルプ
リンタやファクシミリ等に使用される熱記録装置用のサ
ーマルヘッド及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermal head for a thermal recording device used in a thermal printer, a facsimile or the like as an output device of a word processor, a personal computer or the like, and a manufacturing method thereof.
【0002】[0002]
【従来の技術】従来のこの種のサーマルヘッドを図9
A、図9Bにより説明する。図示しないプラテンロール
の外周に沿って搬送される感熱記録紙に熱記録を行うた
めのサーマルヘッド0Hは、アルミブロック等で形成さ
れた支持部材(図示せず)を備えている。この支持部材
の表面には、絶縁基板02が接着剤によって張付けられ
ており、この絶縁基板02は、絶縁基板本体02aと、
その表面に形成された断面が部分円状の部分アンダーグ
レーズ02bとを備えている。前記部分アンダ−グレ−
ズ02bは主走査方向Xに沿って帯状に形成されてい
る。前記絶縁基板02表面には共通電極03及び個別電
極04が形成されている。前記共通電極03は、共通電
極本体部03aとこの共通電極本体部03aから櫛歯状に
副走査方向Yに突出して前記部分アンダーグレーズ02
bの傾斜表面上に延びる多数の共通電極接続部03bを備
えている。また、前記個別電極04は、前記共通電極接
続部03bと交互に配置され、個別電極04の先端部0
4aと共通電極接続部03bとは主走査方向Xに延びる帯
状発熱抵抗体05により接続されている。前記個別電極
04の主走査方向両側の一対の共通電極接続部03bに
よって挟まれた帯状発熱抵抗体05部分により1個の発
熱素子05aが形成されている。したがって、前記帯状
発熱抵抗体05は多数の発熱素子05aにより構成され
ている。そして、1個の発熱素子05aを用いて1個の
印字ドットを印字するようになっている。前記共通電極
03、個別電極04及び帯状発熱抵抗体05が形成され
た前記絶縁基板02の表面はオ−バ−グレ−ズ06によ
って被覆されている。前記オ−バ−グレ−ズ06の前記
各発熱素子05aの表面を覆う部分によりそれぞれ印字
部06a(図9参照)が形成されている。2. Description of the Related Art A conventional thermal head of this type is shown in FIG.
A will be described with reference to FIG. 9B. The thermal head 0H for performing thermal recording on the thermal recording paper conveyed along the outer periphery of a platen roll (not shown) includes a support member (not shown) formed of an aluminum block or the like. An insulating substrate 02 is adhered to the surface of the supporting member with an adhesive, and the insulating substrate 02 includes an insulating substrate body 02a and an insulating substrate body 02a.
The surface is provided with a partial underglaze 02b having a partially circular cross section. Partial undergray
The gap 02b is formed in a strip shape along the main scanning direction X. A common electrode 03 and an individual electrode 04 are formed on the surface of the insulating substrate 02. The common electrode 03 protrudes in the sub-scanning direction Y like a comb from the common electrode main body 03a and the common electrode main body 03a, and the partial underglaze 02 is formed.
It has a large number of common electrode connection parts 03b extending on the inclined surface of b. Further, the individual electrodes 04 are alternately arranged with the common electrode connecting portions 03b, and the tip portions 0 of the individual electrodes 04 are arranged.
4a and the common electrode connecting portion 03b are connected by a strip heating resistor 05 extending in the main scanning direction X. One heating element 05a is formed by the strip-shaped heating resistor 05 portion sandwiched by the pair of common electrode connecting portions 03b on both sides of the individual electrode 04 in the main scanning direction. Therefore, the strip-shaped heating resistor 05 is composed of a large number of heating elements 05a. Then, one printing dot is printed using one heating element 05a. The surface of the insulating substrate 02 on which the common electrode 03, the individual electrode 04, and the strip heating resistor 05 are formed is covered with an overglaze 06. A printing portion 06a (see FIG. 9) is formed by the portion of the overglaze 06 that covers the surface of each heating element 05a.
【0003】なお、前記帯状発熱抵抗体05はたとえば
リフトオフ法と呼ばれる次に説明する方法を用いて形成
される。すなわち、前記共通電極03及び個別電極04
が形成された絶縁基板02表面にレジスト層を形成し、
そのレジスト層に発熱抵抗体05形成用の開口部を形成
し、前記開口部内に未焼成抵抗体を充填形成後、焼成す
ることにより帯状発熱抵抗体05を形成する。The strip-shaped heating resistor 05 is formed, for example, by using a method called a lift-off method described below. That is, the common electrode 03 and the individual electrode 04
A resist layer is formed on the surface of the insulating substrate 02 on which
An opening portion for forming the heating resistor 05 is formed in the resist layer, and a band-shaped heating resistor 05 is formed by filling the opening portion with an unfired resistor and then firing it.
【0004】前述の従来のサーマルヘッド0Hにおいて
は、各個別電極04に選択的に電圧が印加されると、こ
の個別電極04とその両側の共通電極接続部03bとの
間の発熱抵抗体05部分すなわち発熱素子05aに電流
が流れ、発熱素子05aが発熱する。従って、前記オ−
バ−グレ−ズ06の前記発熱素子05aの表面を覆う部
分すなわち印字部06aに感熱記録紙を圧接すると、前
記印字部06aと接触する感熱記録紙が発色して熱記録
が行われる。従来、前述のように発熱抵抗体05を部分
アンダーグレーズ02b上に形成するのは、前記印字部
06aと前記感熱記録紙との紙当たりを良好にするため
である。In the above-described conventional thermal head 0H, when a voltage is selectively applied to each individual electrode 04, the heating resistor 05 portion between the individual electrode 04 and the common electrode connecting portions 03b on both sides thereof is formed. That is, a current flows through the heating element 05a, and the heating element 05a generates heat. Therefore, the above-mentioned
When the thermosensitive recording paper is pressed against the portion of the bar glaze 06 covering the surface of the heating element 05a, that is, the printing portion 06a, the thermosensitive recording paper in contact with the printing portion 06a is colored to perform thermal recording. Conventionally, the heating resistor 05 is formed on the partial underglaze 02b as described above in order to improve the contact between the printing portion 06a and the thermal recording paper.
【0005】ところで、発熱抵抗体05上のオ−バ−グ
レ−ズ06は、発熱抵抗体05形成後に印刷、焼成によ
り発熱抵抗体05直上とその周りに同時に形成される。
この場合に、発熱抵抗体05やオ−バ−グレ−ズ06の
印刷の畝りによって発熱抵抗体05、オ−バ−グレ−ズ
06の印字部06aの副走査断面の形状が主走査方向の
各位置において均一にならないため、各印字ドットに対
応する発熱素子05a上のオーバーグレーズ06部分す
なわち印字部06aの熱容量にムラが生じて濃度ムラの
原因にもなる。またこの場合、発熱抵抗体05上の印字
部06aの平坦な表面の面積にもムラが生じて、印字の
際に、印字圧力にムラが生じるので、やはり濃度ムラの
原因になる。このような原因で発熱分布にムラが生じた
りヒ−トスポットが生じると、印字品質が低下したり、
発熱抵抗体05の寿命が短くなるなどの不都合が生じる
と考えられている。そこで、従来は特開昭63−149
166号公報に示すように、発熱抵抗体05の副走査断
面形状が主走査方向の各位置において均一な矩形となる
ような帯状発熱抵抗体05が考えられている。この公報
に記載されたものは、発熱抵抗体05の副走査断面形状
が均一な形状となり、発熱抵抗体05の副走査断面形状
も略均一となる。この場合主走査方向Xに沿って配置さ
れた各発熱素子05aでの発熱量も略均一となる。By the way, the overglaze 06 on the heating resistor 05 is formed immediately above and around the heating resistor 05 at the same time by printing and firing after forming the heating resistor 05.
In this case, the shape of the sub-scanning section of the printing portion 06a of the heating resistor 05 and the overglaze 06 is changed in the main scanning direction due to the printing ridges of the heating resistor 05 and the overglaze 06. However, the heat capacity of the overglaze 06 portion on the heating element 05a corresponding to each print dot, that is, the printing portion 06a becomes uneven, which causes density unevenness. Further, in this case, the area of the flat surface of the printing portion 06a on the heating resistor 05 also becomes uneven, and printing pressure becomes uneven during printing, which also causes density unevenness. If the heat distribution is uneven or a heat spot is generated due to such a cause, the print quality is deteriorated,
It is considered that a disadvantage such as a shortened life of the heating resistor 05 occurs. Therefore, conventionally, Japanese Patent Laid-Open No. 63-149
As disclosed in Japanese Patent No. 166, a band-shaped heating resistor 05 is considered in which the sub-scanning cross-sectional shape of the heating resistor 05 becomes a uniform rectangle at each position in the main scanning direction. In the device disclosed in this publication, the heating resistor 05 has a uniform sub-scan sectional shape, and the heating resistor 05 also has a substantially uniform sub-scan sectional shape. In this case, the amount of heat generated by each heating element 05a arranged along the main scanning direction X is also substantially uniform.
【0006】[0006]
【発明が解決しようとする課題】しかし、発熱抵抗体0
5の表面にオ−バ−グレ−ズ06を印刷により形成する
際の畝りによるオ−バ−グレ−ズ06の副走査断面形状
の前記主走査方向Xに沿う各位置での形状ムラは、依然
として避けられない。本発明は、前述の事情に鑑み、サ
ーマルヘッドにおいて、下記(A11)の記載内容を課
題とする。 (A11) 発熱素子及びその上側のオ−バ−グレ−ズ部
分(すなわち印字部)の表面形状、副走査断面形状、及
び熱容量を均一にすること。However, the heating resistor 0
The unevenness of the sub-scan sectional shape of the overglaze 06 at each position along the main scanning direction X due to the ridges when the overglaze 06 is formed on the surface of No. 5 by printing , Still unavoidable. In view of the above-mentioned circumstances, the present invention has an object of the following description (A11) in the thermal head. (A11) The surface shape, the sub-scanning cross-sectional shape, and the heat capacity of the heating element and the over-glaze portion (that is, the printing portion) above the heating element should be uniform.
【0007】[0007]
【課題を解決するための手段】次に、前記課題を解決す
るために案出した本出願の各発明の構成を説明するが、
本発明の構成要素には、後述の実施例の構成要素との対
応を明かにするため、実施例の構成要素の符号をカッコ
で囲んだものを付記している。なお、本発明を後述の実
施例の符号と対応させて説明する理由は、本発明の理解
を容易にするためであり、本発明の範囲を実施例に限定
するためではない。The constitution of each invention of the present application devised to solve the above problems will be described below.
To clarify the correspondence with the constituent elements of the embodiments described later, the constituent elements of the present invention are appended with the reference numerals of the constituent elements of the embodiment enclosed in parentheses. The reason why the present invention is described in association with the reference numerals of the embodiments described later is to facilitate the understanding of the present invention and not to limit the scope of the present invention to the embodiments.
【0008】前記課題を解決するために、本出願の第1
発明のサーマルヘッドは、主走査方向(X)に沿って延
びる帯状の共通電極本体部(3a)及びこの本体部(3
a)から櫛歯状に副走査方向(Y)に突出する多数の共
通電極接続部(3b)を有する共通電極(3)と、前記
共通電極接続部(3b)と交互に配置された多数の個別
電極先端部(4a)を有する個別電極(4)と、前記共
通電極接続部(3b)及び個別電極先端部(4a)を接続
する主走査方向(X)に沿って延びる帯状発熱抵抗体
(5)とが絶縁基板(2)の表面に形成され、前記帯状
発熱抵抗体(5)が部分アンダ−グレーズ(2b)上に
形成されたサーマルヘッドにおいて、下記の要件(A
1)〜(A2)を備えたことを特徴とする。(A1) 前記
帯状発熱抵抗体(5)の副走査方向(Y)に沿った断面
形状が主走査方向の各位置において均一な形状であるこ
と、(A2 )前記帯状発熱抵抗体(5)の上面に副走査
方向(Y)に沿った断面形状が主走査方向の各位置にお
いて均一な矩形状のオーバーグレーズ(6)が形成され
ていること。In order to solve the above problems, the first aspect of the present application
The thermal head of the invention comprises a strip-shaped common electrode main body (3a) extending in the main scanning direction (X) and the main body (3a).
a) a common electrode (3) having a large number of common electrode connecting portions (3b) protruding in a sub-scanning direction (Y) in a comb shape, and a large number of alternating common electrode connecting portions (3b). An individual electrode (4) having an individual electrode tip (4a), and a strip-shaped heating resistor () extending along the main scanning direction (X) connecting the common electrode connecting portion (3b) and the individual electrode tip (4a). And 5) are formed on the surface of the insulating substrate (2), and the strip-shaped heating resistor (5) is formed on the partial underglaze (2b).
1) to (A2) are provided. (A1) The cross-sectional shape of the strip-shaped heating resistor (5) along the sub-scanning direction (Y) is uniform at each position in the main scanning direction, (A2) the strip-shaped heating resistor (5) A rectangular overglaze (6) whose cross-sectional shape along the sub-scanning direction (Y) is uniform at each position in the main scanning direction is formed on the upper surface.
【0009】また、本出願の第2発明のサーマルヘッド
は、主走査方向(X)に沿って延びる帯状の共通電極本
体部(3a)及びこの本体部(3a)から櫛歯状に副走査
方(Y)に突出する多数の共通電極接続部(3b)を有
する共通電極(3)と、前記共通電極接続部(3b)と
交互に配置された多数の個別電極先端部(4a)を有す
る個別電極(4)と、前記共通電極接続部(3b)及び
個別電極先端部(4a)を接続する主走査方向(X)に
沿って延びる帯状発熱抵抗体(5)とが絶縁基板(2)
の表面に形成され、前記帯状発熱抵抗体(5)が部分ア
ンダ−グレーズ(2b)上に形成され、且つ下記の要件
(A1),(A2)を備えたサーマルヘッドの製造方法に
おいて、下記の要件(A3)〜(A8)を備えたことを特
徴とする、(A1) 前記帯状発熱抵抗体(5)の副走
査方向(Y)に沿った断面形状が主走査方向の各位置に
おいて均一な形状であること、(A2 )前記帯状発熱抵
抗体(5)の上面に副走査方向(Y)に沿った断面形状
が主走査方向の各位置において均一な矩形状のオーバー
グレーズ(6)が形成されていること。(A3) 絶縁
基板(2)表面に主走査方向(X)に伸びる帯状の部分
アンダーグレーズ(2b)を形成する部分アンダーグレ
ーズ形成工程、(A4) 前記共通電極接続部(3b)及
び個別電極先端部(4a)が前記部分アンダーグレーズ
(2b)上に配置されるように、前記共通電極(3)及
び個別電極(4)を絶縁基板(2)上に形成する電極形
成工程、(A5) 前記部分アンダーグレーズ(2b)上
の発熱抵抗体形成領域に帯状の抵抗体形成用開口部(R
a)を有するレジストパターン(Rp)を形成するレジス
トパターン形成工程、(A6)前記帯状の抵抗体形成用
開口部(Ra)内に前記レジストパターン(Rp)の厚さ
よりも薄く抵抗体ペーストを充填してから乾燥させて未
焼成抵抗体(5′)を形成する未焼成抵抗体形成工程、
(A7)前記未焼成抵抗体(5′)が形成された帯状の
抵抗体形成用開口部(Ra)内にオーバーグレーズペー
ストを充填してから乾燥させて未焼成オ−バ−グレ−ズ
(6′)を形成する未焼成オーバグレーズ層形成工程、
(A8)前記未焼成オーバグレーズ層形成工程の後に焼
成して発熱抵抗体(5)及びオ−バ−グレ−ズ(6)を
形成する工程。In the thermal head of the second invention of the present application, the strip-shaped common electrode main body portion (3a) extending along the main scanning direction (X) and the sub-scanning direction from the main body portion (3a) in a comb tooth shape. An individual having a common electrode (3) having a large number of common electrode connecting portions (3b) protruding to (Y) and a large number of individual electrode tips (4a) alternately arranged with the common electrode connecting portion (3b). The electrode (4) and the strip-shaped heating resistor (5) extending along the main scanning direction (X) connecting the common electrode connecting portion (3b) and the individual electrode tip portion (4a) are insulated substrates (2).
In the method for manufacturing a thermal head having the following requirements (A1) and (A2), the strip-shaped heating resistor (5) is formed on the surface of the above, and the strip-shaped heating resistor (5) is formed on the partial underglaze (2b). (A1) characterized in that it has requirements (A3) to (A8), and the cross-sectional shape of the strip heating resistor (5) along the sub-scanning direction (Y) is uniform at each position in the main scanning direction. (A2) A rectangular overglaze (6) having a uniform cross-section along the sub-scanning direction (Y) at each position in the main scanning direction is formed on the upper surface of the strip-shaped heating resistor (5). is being done. (A3) Partial underglaze forming step of forming a band-shaped partial underglaze (2b) extending in the main scanning direction (X) on the surface of the insulating substrate (2), (A4) The common electrode connection part (3b) and individual electrode tip An electrode forming step of forming the common electrode (3) and the individual electrode (4) on an insulating substrate (2) so that the portion (4a) is arranged on the partial underglaze (2b); (A5) A strip-shaped resistor forming opening (R) is formed in the heating resistor forming region on the partial underglaze (2b).
a) forming a resist pattern (Rp) having (a), (A6) filling the strip-shaped resistor forming opening (Ra) with a resistor paste thinner than the thickness of the resist pattern (Rp) And then drying to form a green resistor (5 ′), a green resistor forming step,
(A7) An overglaze paste is filled in the strip-shaped resistor forming opening (Ra) in which the unfired resistor (5 ') is formed and then dried to obtain the unfired overglaze ( 6 ') to form an unfired overglaze layer forming step,
(A8) A step of forming a heating resistor (5) and an overglaze (6) by firing after the unfired overglaze layer forming step.
【0010】[0010]
【作用】次に、前述の特徴を備えた本発明の作用を説明
する。前述の特徴を備えた本出願の第1発明のサーマル
ヘッドは、主走査方向(X)に沿って延びる帯状の共通
電極本体部(3a)及びこの本体部(3a)から櫛歯状に
副走査方向(Y)に突出する多数の共通電極接続部(3
b)を有する共通電極(3)と、前記共通電極接続部
(3b)と交互に配置された多数の個別電極先端部(4
a)を有する個別電極(4)と、前記共通電極接続部
(3b)及び個別電極先端部(4a)を接続する主走査方
向(X)に沿って延びる帯状発熱抵抗体(5)とが絶縁
基板(2)の表面に形成され、前記帯状発熱抵抗体
(5)が部分グレーズ(2b)上に形成されている。こ
のサーマルヘッドは、 前記帯状発熱抵抗体(5)及び
その上のオ−バ−グレ−ズ(6)の副走査方向(Y)に
沿った断面形状が主走査方向(X)の各位置において均
一な矩形であるので、発熱抵抗体(5)の主走査方向
(X)の各位置での発生熱量及び熱容量は均一となる。
したがって、オ−バ−グレ−ズ(6)表面の温度が主走
査方向(X)の各位置で一定となる。このため、1印字
ドット分のオ−バ−グレ−ズ(6)表面から感熱紙が受
ける熱量も均一であり、印字の際の濃度ムラが減少す
る。また、1印字ドット分の面積も均一となるので、印
字圧力も均一になる。Next, the operation of the present invention having the above features will be described. The thermal head of the first invention of the present application having the above-mentioned characteristics is provided with a strip-shaped common electrode body portion (3a) extending along the main scanning direction (X) and a sub-scanning sub-scanning from the body portion (3a). A large number of common electrode connecting portions (3
b) and a plurality of individual electrode tips (4) alternately arranged with the common electrode connection (3b).
The individual electrode (4) having a) is insulated from the strip-shaped heating resistor (5) extending along the main scanning direction (X) connecting the common electrode connecting portion (3b) and the individual electrode tip portion (4a). The strip-shaped heating resistor (5) is formed on the surface of the substrate (2) and is formed on the partial glaze (2b). In this thermal head, the sectional shape along the sub-scanning direction (Y) of the strip-shaped heating resistor (5) and the overglaze (6) thereon is at each position in the main scanning direction (X). Since it is a uniform rectangle, the amount of heat generated and the heat capacity at each position of the heating resistor (5) in the main scanning direction (X) are uniform.
Therefore, the temperature of the surface of the overglaze (6) becomes constant at each position in the main scanning direction (X). Therefore, the amount of heat received by the thermal paper from the surface of the overglaze (6) for one printing dot is uniform, and the unevenness in density during printing is reduced. Further, since the area for one print dot is also uniform, the printing pressure is also uniform.
【0011】前述の特徴を備えた本出願の第2発明のサ
ーマルヘッドの製造方法では、部分アンダーグレーズ形
成工程において、絶縁基板(2)表面上に主走査方向
(X)に沿って延びる帯状の部分アンダ−グレ−ズ(2
b)が形成される。次に、電極形成工程において、前記
部分アンダーグレーズ(2b)上に前記共通電極接続部
(3b)及び個別電極先端部(4a)が配置されるよう
に、前記共通電極(3)及び個別電極(4)を絶縁基板
(2)上に形成する。次に、レジストパターン形成工程
において、前記部分アンダーグレーズ(2b)上の発熱
抵抗体(5)の形成領域に帯状の抵抗体形成用開口部
(Ra)を有するレジストパターン(Rp)が形成され
る。次に、未焼成抵抗体形成工程において、前記帯状の
抵抗体形成用開口部(Ra)内に前記レジストパターン
(Rp)の厚さよりも薄く抵抗体ペーストを充填してか
ら乾燥させて未焼成抵抗体(5′)を形成する。この未
焼成抵抗体(5′)は前記発熱抵抗体形成用開口部(R
a)の形状に倣って副走査断面が主走査方向(X)の各
位置において均一な形状になっている。次に未焼成オー
バグレーズ層形成工程において、前記未焼成抵抗体
(5′)が形成された帯状の抵抗体形成用開口部(R
a)内に未焼成オ−バ−グレ−ズ(6′)が形成され
る。この未焼成オ−バ−グレ−ズ(6′)も前記発熱抵
抗体形成用開口部(Ra)の形状に倣って副走査断面が
主走査方向(X)の各位置において均一な矩形状になっ
ている。次に前記未焼成抵抗体(5′)及び未焼成オ−
バ−グレ−ズ(6′)が形成された絶縁基板(2)を焼
成すると、副走査断面が主走査方向(X)の各位置にお
いて均一な形状の発熱抵抗体(5)及びオ−バ−グレ−
ズ(6)が形成される。In the method for manufacturing a thermal head of the second invention of the present application having the above-mentioned features, in the partial underglaze forming step, a strip-like shape extending along the main scanning direction (X) is formed on the surface of the insulating substrate (2). Partial Underglades (2
b) is formed. Next, in an electrode forming step, the common electrode (3) and the individual electrode (3) are arranged so that the common electrode connecting portion (3b) and the individual electrode tip portion (4a) are arranged on the partial underglaze (2b). 4) is formed on the insulating substrate (2). Next, in a resist pattern forming step, a resist pattern (Rp) having a strip-shaped resistor forming opening (Ra) is formed in a region where the heating resistor (5) is formed on the partial underglaze (2b). . Next, in the unfired resistor forming step, the resistor paste is filled into the strip-shaped resistor forming opening (Ra) to be thinner than the resist pattern (Rp), and then dried to obtain the unfired resistor. Form body (5 '). The unfired resistor (5 ') is provided with the heating resistor forming opening (R).
Following the shape of a), the sub-scan section has a uniform shape at each position in the main scanning direction (X). Next, in the unbaked overglaze layer forming step, a strip-shaped resistor forming opening (R) in which the unbaked resistor (5 ') is formed is formed.
Unburned overglaze (6 ') is formed in a). This unsintered overglaze (6 ') also follows the shape of the heating resistor forming opening (Ra) so that the sub-scan section has a uniform rectangular shape at each position in the main scanning direction (X). Has become. Next, the green resistor (5 ') and the green electrode are
When the insulating substrate (2) on which the bar glaze (6 ') is formed is fired, the sub-scan section has a uniform shape at each position in the main scanning direction (X) and the heating resistor (5) and the over resistor. -Gray-
(6) are formed.
【0012】[0012]
(実施例1)以下、図面により本発明の実施例について
説明する。なお、各実施例において対応する構成要素に
は同一の符号を付している。図1A、図1Bは、本発明
のサ−マルヘッドの実施例1を示し、図1Aは平面図、
図1Bは図1のA−A線断面図である。まず、図1A、
図1Bにより本発明の実施例1を説明する。この実施例
1のドット密度は例えば12ドット/mmである。図1
Bにおいて、サ−マルヘッドは支持板(図示せず)表面
に接着された絶縁基板2を有している。この絶縁基板2
はセラミック製の基板本体2a及びその上面に形成され
た副走査方向Yの断面が部分円状で主走査方向に延びる
帯状の部分アンダ−グレ−ズ2bを有している。前記絶
縁基板2上にはMOD金により形成された共通電極3及
び多数の個別電極4が形成されている。共通電極3は共
通電極本体部3aと多数の共通電極接続部3bとからな
り、共通電極本体部3aは絶縁基板2の表面に形成され
主走査方向Xに延びている。前記多数の共通電極接続部
3bは共通電極本体部3aから副走査方向Yに突出してお
り、部分アンダ−グレ−ズ2bの表面に延びている。ま
た、前記各共通電極接続部3bは、主走査方向Xに並ん
で配置されている。前記多数の個別電極4はそれぞれ副
走査方向Yに延びており、その先端部(個別電極先端
部)4aは前記部分アンダ−グレ−ズ2b表面に延びてい
る。また各個別電極先端部4aは、前記多数の共通電極
接続部3bと交互に配置されている。(Embodiment 1) An embodiment of the present invention will be described below with reference to the drawings. Note that the same reference numerals are given to corresponding components in each embodiment. 1A and 1B show a first embodiment of a thermal head of the present invention, FIG. 1A being a plan view,
1B is a cross-sectional view taken along the line AA of FIG. First, in FIG. 1A,
Example 1 of the present invention will be described with reference to FIG. 1B. The dot density of Example 1 is 12 dots / mm, for example. Figure 1
In B, the thermal head has an insulating substrate 2 bonded to the surface of a support plate (not shown). This insulating substrate 2
Has a ceramic substrate main body 2a and a band-shaped partial underglaze 2b formed on the upper surface of the substrate main body 2a and having a partial circular cross section in the sub-scanning direction Y and extending in the main scanning direction. A common electrode 3 and a large number of individual electrodes 4 made of MOD gold are formed on the insulating substrate 2. The common electrode 3 is composed of a common electrode body 3a and a large number of common electrode connecting portions 3b. The common electrode body 3a is formed on the surface of the insulating substrate 2 and extends in the main scanning direction X. The large number of common electrode connection portions 3b project from the common electrode body portion 3a in the sub-scanning direction Y and extend to the surface of the partial underglaze 2b. The common electrode connecting portions 3b are arranged side by side in the main scanning direction X. Each of the plurality of individual electrodes 4 extends in the sub-scanning direction Y, and a tip portion (individual electrode tip portion) 4a thereof extends to the surface of the partial underglaze 2b. The individual electrode tip portions 4a are arranged alternately with the large number of common electrode connecting portions 3b.
【0013】前記部分アンダ−グレ−ズ2bの表面に、
前記共通電極接続部3bと前記個別電極先端部4a間を接
続するように帯状発熱抵抗体5が形成されている。この
帯状発熱抵抗体5は主走査方向Xに延びていて、部分ア
ンダ−グレ−ズ2bの表面から約4ミクロンの高さに形
成されている。この帯状発熱抵抗体5の、副走査方向Y
に沿う断面形状は、主走査方向Xの全ての位置で均一で
ある。前記1個の個別電極4の主走査方向Xの両側に配
置された1対の共通電極接続部3b間に配置された前記
帯状発熱抵抗体5部分によって1ドット印字用の発熱素
子5aが形成されている。したがって、帯状発熱抵抗体
5は、多数の発熱素子5aから構成されている。前記帯
状発熱抵抗体5上には、副走査方向Yに沿う断面が矩形
状で且つ副走査方向Yの幅が主走査方向Xの全ての位置
で一定の第1のオ−バ−グレ−ズ6が帯状に約4ミクロ
ンの高さで形成されている。前記第1オ−バ−グレ−ズ
6の前記各発熱素子5aの上に配置された部分がそれぞ
れ印字部6aを形成している。したがって、第1オ−バ
−グレ−ズ6は多数の印字部6aから構成されている。
また、絶縁基板2上には、第1オ−バ−グレ−ズ6が形
成された領域を除いて第2オ−バ−グレ−ズ7が約6ミ
クロンの高さで形成されている。したがって、帯状発熱
抵抗体5及び第1オ−バ−グレ−ズ6の高さ(厚さ)の
合計は、第2オ−バ−グレ−ズ7よりも約2ミクロン高
い。すなわち、第1オ−バ−グレ−ズ6の前記各印字部
6aは、第2オ−バ−グレ−ズ7よりも約2ミクロン上
方に突出している。On the surface of the partial underglaze 2b,
A strip-shaped heat generating resistor 5 is formed so as to connect the common electrode connecting portion 3b and the individual electrode tip portion 4a. The strip-shaped heating resistor 5 extends in the main scanning direction X and is formed at a height of about 4 microns from the surface of the partial underglaze 2b. The sub-scanning direction Y of the strip-shaped heating resistor 5
The cross-sectional shape along is uniform at all positions in the main scanning direction X. A heating element 5a for 1-dot printing is formed by the strip-shaped heating resistor 5 portions arranged between a pair of common electrode connecting portions 3b arranged on both sides of the individual electrode 4 in the main scanning direction X. ing. Therefore, the strip-shaped heat generating resistor 5 is composed of a large number of heat generating elements 5a. On the strip-shaped heating resistor 5, there is a first overglaze having a rectangular cross section along the sub-scanning direction Y and having a constant width in the sub-scanning direction Y at all positions in the main scanning direction X. 6 is formed in a strip shape with a height of about 4 microns. The portions of the first overglaze 6 arranged above the respective heating elements 5a form the printing portions 6a. Therefore, the first overglaze 6 is composed of a large number of printing portions 6a.
On the insulating substrate 2, a second overglaze 7 is formed with a height of about 6 μm except the region where the first overglaze 6 is formed. Therefore, the total height (thickness) of the strip heating resistor 5 and the first overglaze 6 is higher than that of the second overglaze 7 by about 2 microns. That is, each printing portion 6a of the first overglaze 6 is projected above the second overglaze 7 by about 2 microns.
【0014】次に図2〜7を参照して、前記図1に示す
構造を備えたサーマルヘッドHの製造方法について説明
する。絶縁基板本体2a上に断面が部分円状の部分アン
ダ−グレ−ズ2bを主走査方向Xに沿って帯状に形成す
る。この部分アンダ−グレ−ズ2bの副走査方向Yの幅
を例えば1.2mmとする。この部分アンダ−グレ−ズ
2bが形成された絶縁基板2上にMOD金ペ−ストをス
クリ−ン印刷して焼成し、電極層(図示せず)を形成す
る。次にフォトリソエッチング法により 、電極パタ−
ンを形成する。この電極パタ−ンの形成により、共通電
極3及び個別電極4が形成される(図2A,B参照)。Next, a method of manufacturing the thermal head H having the structure shown in FIG. 1 will be described with reference to FIGS. A partial underglaze 2b having a partially circular cross section is formed in a strip shape along the main scanning direction X on the insulating substrate body 2a. The width of the partial underglaze 2b in the sub-scanning direction Y is set to, for example, 1.2 mm. An MOD gold paste is screen-printed and baked on the insulating substrate 2 on which the partial underglaze 2b is formed to form an electrode layer (not shown). Next, the electrode pattern is formed by the photolithography etching method.
Form By forming this electrode pattern, the common electrode 3 and the individual electrode 4 are formed (see FIGS. 2A and 2B).
【0015】次に、スピンコ−ト法によりネガレジスト
(PMERHC−600)膜Rを図3A、図3Bに示す
ように形成する。このネガレジスト膜Rは厚さを14ミ
クロンにする。次に、フォトリソエッチング法により、
帯状発熱抵抗体5を形成する位置に発熱抵抗体形成用開
口部Ra(図4A、図4B)を有するレジストパターン
Rpを形成する。次に、発熱抵抗体形成用開口部Raに抵
抗体ペ−ストを注入し、乾燥させて未焼成抵抗体5′を
形成する。前記抵抗体ペーストの注入には直接描画装置
を用いる。この直接描画装置は、ディスペンサ−の移動
速度とディスペンサ−内の圧力で、吐出する抵抗体ペ−
ストの量を調節することができる。この直接描画装置に
より抵抗体ペ−ストを8ミクロンの高さまで前記発熱抵
抗体形成用開口部Raに満たすように調節する(図5B
参照)。次にこの抵抗体ペ−ストを乾燥すると、前記未
焼成抵抗体5′が形成される。Next, a negative resist (PMERHC-600) film R is formed by a spin coat method as shown in FIGS. 3A and 3B. The negative resist film R has a thickness of 14 μm. Next, by photolithographic etching method,
A resist pattern Rp having a heating resistor forming opening Ra (FIGS. 4A and 4B) is formed at a position where the strip heating resistor 5 is formed. Next, a resistor paste is injected into the heating resistor forming opening Ra and dried to form an unfired resistor 5 '. A direct drawing device is used to inject the resistor paste. This direct drawing device uses a moving resistor and a pressure inside the dispenser to discharge the resistive element.
The amount of strike can be adjusted. With this direct writing device, the resistance paste is adjusted so as to fill the heating resistor forming opening Ra up to a height of 8 microns (FIG. 5B).
reference). Then, the resistor paste is dried to form the unfired resistor 5 '.
【0016】次いで、発熱抵抗体形成用開口部Ra中の
前記未焼成抵抗体5′の上に、前述した直接描画装置に
より、第1オ−バ−グレ−ズペ−スト(GZC8K、田
中貴金属)を注入し、乾燥させて図6Bに示すように未
焼成オ−バ−グレ−ズ6′を形成する。前記第1オ−バ
−グレ−ズペ−ストの注入量は、発熱抵抗体形成用開口
部Raにほぼ充満するが溢れ出ない程度とする。この場
合、ネガレジスト膜Rの厚さが14ミクロン、前記抵抗
体ペ−ストの厚さが8ミクロンであるから、未焼成オ−
バ−グレ−ズ6′の厚さは約7ミクロン弱とする。Next, on the unbaked resistor 5'in the heating resistor forming opening Ra, the first over-paste paste (GZC8K, Tanaka Kikinzoku) is applied by the above-mentioned direct drawing device. ) Is injected and dried to form an unfired overglaze 6'as shown in FIG. 6B. The injection amount of the first over-graze paste is set so as to almost fill the heating resistor forming opening Ra but not to overflow. In this case, the thickness of the negative resist film R is 14 μm, and the thickness of the resistor paste is 8 μm.
The thickness of the bag glaze 6'is about 7 microns or less.
【0017】この後、未焼成抵抗体5′及び未焼成オ−
バ−グレ−ズ6′を焼成温度820゜Cで同時焼成し
て、図7A、図7Bに示すように帯状発熱抵抗体5及び
第1オ−バ−グレ−ズ6を形成する。この焼成時、同時
にレジストパターンRpが焼成気化する。このようにし
て形成された帯状発熱抵抗体5及び焼成後、帯状発熱抵
抗体5の膜厚は約4ミクロン、第1オ−バ−グレ−ズ6
の膜厚は約4ミクロンに高さが減少している。After that, the unfired resistor 5'and the unfired resistor are
The bar glaze 6'is simultaneously fired at a firing temperature of 820 DEG C to form the strip heating resistor 5 and the first overglaze 6 as shown in FIGS. 7A and 7B. At the same time as this baking, the resist pattern Rp is baked and vaporized. The belt-shaped heating resistor 5 thus formed and the film-shaped heating resistor 5 after firing have a film thickness of about 4 μm and a first over-grade 6
The film thickness is reduced to about 4 microns.
【0018】次に絶縁基板2上面に、帯状発熱抵抗体5
及び第1オ−バ−グレ−ズ6の形成領域を除いて第2の
オ−バ−グレ−ズペ−ストで印刷し、焼成して膜厚約6
ミクロンの第2オ−バ−グレ−ズ7を形成する。そうす
ると、前記図1A、図1Bに示す構成を備えたサ−マル
ヘッドHが得られる。この第2オ−バ−グレ−ズ7用の
オ−バ−グレ−ズペ−ストとしては第1のオ−バ−グレ
−ズペ−ストよりも軟化点が100゜C以上低い材料で
あるNP7204A(ノリタケカンパニ−)を用いる。
このような軟化点が低いペ−スト材料を第2オ−バ−グ
レ−ズ7として用いると、第2オ−バ−グレ−ズ7を形
成する焼成工程で第1オ−バ−グレ−ズ6がだれること
がない。Next, on the upper surface of the insulating substrate 2, the strip heating resistor 5 is formed.
And, except for the formation region of the first overglaze 6, the printing is performed by the second overglaze paste, and the baking is performed to obtain a film thickness of about 6
A second overglaze 7 of micron is formed. Then, the thermal head H having the structure shown in FIGS. 1A and 1B is obtained. The overglaze paste for the second overglaze 7 is made of a material having a softening point lower than that of the first overglaze paste by 100 ° C. or more. A certain NP7204A (Noritake company) is used.
When such a paste material having a low softening point is used as the second overglaze 7, the first overglaze is used in the firing process for forming the second overglaze 7. The 6s never dribble.
【0019】上記実施例1では、第1オ−バ−グレ−ズ
6が第2オ−バ−グレ−ズ7よりやや突出しており、各
印字部6aは副走査方向Yに沿う断面が主走査方向の各
位置で均一な矩形状に形成されているので、各印字部6
aとの感熱紙の接触面積は一定となる。さらに、各印字
部6aの熱容量は均一であるので、均一な印字ドットが
得られる。In the first embodiment, the first overglaze 6 is slightly projected from the second overglaze 7, and each printing portion 6a has a cross section along the sub-scanning direction Y. Since it is formed in a uniform rectangular shape at each position in the scanning direction, each printing unit 6
The contact area of the thermal paper with a is constant. Furthermore, since the heat capacity of each printing portion 6a is uniform, uniform printed dots can be obtained.
【0020】(実施例2)図8A、図8Bは本発明のサ
−マルヘッドの実施例2を示し、図8Aは平面図、図8
Bは図8AのVIIIB−VIIIB線断面図である。図8A、
図8Bに示すように、絶縁基板2、共通電極3、個別電
極4、帯状発熱抵抗体5、第1オ−バ−グレ−ズ6の構
成は前記実施例1に同じである。第2オ−バ−グレ−ズ
7の形成領域は実施例1と相違しており、第1オ−バ−
グレ−ズ6を覆うように形成されている。この実施例2
の場合、各発熱素子5aの上面には第1及び第2オーバ
ーグレーズ6,7が形成されており、各オーバーグレー
ズ6,7の前記各発熱素子5a上部に配置された部分6a
及び7aを合わせたものにより各印字部が形成されてい
る。この実施例2の第2オ−バ−グレ−ズ7の材料には
前記実施例1の第2オ−バ−グレ−ズ7と同様のNP7
204A(ノリタケカンパニー社製)を使用している。
前記NP7204A(ノリタケカンパニー社製)は、非
常に表面性がよいので平滑層として有効であり、印刷の
畝りも拾い難い。このため、第2オーバグレーズ層7が
前記第1オ−バ−グレ−ズ6上に形成しても、それらを
足し合わせたものの副走査断面が主走査方向Xの各位置
で均一となり、また、その上面も平坦になる。したがっ
て、前記各部分6a,7aを合わせた印字部の熱容量は一
定となる。そして、それらの各印字部との感熱紙の接触
面積も一定となるので、均一な印字ドットが得られる。(Embodiment 2) FIGS. 8A and 8B show Embodiment 2 of the thermal head of the present invention, FIG. 8A being a plan view and FIG.
8B is a sectional view taken along line VIIIB-VIIIB of FIG. 8A. 8A,
As shown in FIG. 8B, the configurations of the insulating substrate 2, the common electrode 3, the individual electrode 4, the strip heating resistor 5, and the first overglaze 6 are the same as those in the first embodiment. The formation region of the second over-grade 7 is different from that of the first embodiment, and the first over-region is formed.
It is formed so as to cover the glaze 6. This Example 2
In this case, the first and second overglazes 6, 7 are formed on the upper surface of each heating element 5a, and the portion 6a of each overglaze 6, 7 disposed above the heating element 5a is formed.
And 7a are combined to form each printing portion. The material of the second overglaze 7 of the second embodiment is the same as that of the second overglaze 7 of the first embodiment.
204A (manufactured by Noritake Company) is used.
The NP7204A (manufactured by Noritake Company) has a very good surface property and is therefore effective as a smooth layer, and it is difficult to pick up print ridges. Therefore, even if the second overglaze layer 7 is formed on the first overglaze 6, the sub-scanning cross section of the sum of them is uniform at each position in the main scanning direction X, and , Its top surface is also flat. Therefore, the heat capacity of the printing unit, which is a combination of the portions 6a and 7a, is constant. Further, since the contact area of the thermal paper with each of the printing portions is also constant, uniform printed dots can be obtained.
【0021】以上、本発明の実施例を詳述したが、本発
明は、前記実施例に限定されるものではなく、特許請求
の範囲に記載された本発明を逸脱することなく、種々の
小設計変更を行うことが可能であるAlthough the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments, and various small modifications can be made without departing from the present invention described in the claims. It is possible to make design changes
【0022】[0022]
【発明の効果】前述の本出願の第1発明のサーマルヘッ
ドは、発熱抵抗体及びオ−バ−グレ−ズの副走査方向Y
に沿う断面形状が主走査方向の各位置において均一に形
成されているので、発熱素子とその上のオ−バ−グレ−
ズ部分(印字部)とで構成する1ドット印字部分の熱容
量が均一になり、印字の際、濃度ムラが減少する。ま
た、各発熱素子のすぐ上のオ−バ−グレ−ズにより形成
される各印字部の表面積が均一になっているので、印字
圧力がより均一になり、より高い画質が得られる。ま
た、前述の本出願の第2発明のサーマルヘッドの製造方
法は、ラッピング工程を経ることなく、断面が均一な矩
形形状の発熱抵抗体及びオ−バ−グレ−ズを得ることが
できるThe thermal head according to the first aspect of the present invention described above has a heating resistor and an overglaze in the sub-scanning direction Y.
Since the cross-sectional shape along the line is uniformly formed at each position in the main scanning direction, the heating element and the over-gray on it are formed.
The heat capacity of the 1-dot printing portion constituted by the spot portion (printing portion) becomes uniform, and density unevenness is reduced during printing. Further, since the surface area of each printing portion formed by the overglaze immediately above each heating element is made uniform, the printing pressure becomes more uniform and higher image quality can be obtained. In the method of manufacturing the thermal head according to the second invention of the present application, a rectangular heating resistor having a uniform cross section and an overglaze can be obtained without a lapping step.
【図1】 図1は本発明のサーマルヘッドの実施例1の
説明図で、図1Aは平面図、図1Bは図1AのIB−IB
線における断面図である。1A and 1B are explanatory views of a first embodiment of a thermal head of the present invention, FIG. 1A is a plan view, and FIG. 1B is IB-IB in FIG. 1A.
It is sectional drawing in a line.
【図2】 図2は本発明のサーマルヘッドの実施例1の
製造工程を順に説明するための説明図で、図2Aは平面
図、図2Bは図2AのIIB−IIB線における断面図であ
る。2A and 2B are explanatory views for sequentially explaining a manufacturing process of Embodiment 1 of the thermal head of the present invention, FIG. 2A is a plan view, and FIG. 2B is a sectional view taken along line IIB-IIB of FIG. 2A. .
【図3】 図3は本発明のサーマルヘッドの実施例1の
製造工程を順に説明するための説明図で、図3Aは平面
図、図3Bは図3AのIIIB−IIIB線における断面図で
ある3A and 3B are explanatory views for sequentially explaining a manufacturing process of Embodiment 1 of the thermal head of the present invention, FIG. 3A is a plan view, and FIG. 3B is a sectional view taken along line IIIB-IIIB of FIG. 3A.
【図4】 図4は本発明のサーマルヘッドの実施例1の
製造工程を順に説明するための説明図で、図4Aは平面
図、図4Bは図4AのIVB−IVB線における断面図であ
る。4A and 4B are explanatory views for sequentially explaining a manufacturing process of a thermal head according to a first embodiment of the present invention, FIG. 4A is a plan view, and FIG. 4B is a sectional view taken along line IVB-IVB in FIG. 4A. .
【図5】 図5は本発明のサーマルヘッドの実施例1の
製造工程を順に説明するための説明図で、図5Aは平面
図、図5Bは図5AのVB−VB線における断面図であ
る。5A and 5B are explanatory views for sequentially explaining a manufacturing process of Embodiment 1 of the thermal head of the present invention, FIG. 5A is a plan view, and FIG. 5B is a sectional view taken along line VB-VB of FIG. 5A. .
【図6】 図6は本発明のサーマルヘッドの実施例1の
製造工程を順に説明するための説明図で、図6Aは平面
図、図6Bは図6AのVIB−VIB線における断面図であ
る。6A and 6B are explanatory views for sequentially explaining a manufacturing process of the thermal head according to the first embodiment of the present invention, FIG. 6A is a plan view, and FIG. 6B is a sectional view taken along line VIB-VIB in FIG. 6A. .
【図7】 図7は本発明のサーマルヘッドの実施例1の
製造工程を順に説明するための説明図で、図7Aは平面
図、図7Bは図7AのVIIB−VIIB線における断面図で
ある。7A and 7B are explanatory views for sequentially explaining a manufacturing process of Embodiment 1 of the thermal head of the present invention, FIG. 7A is a plan view, and FIG. 7B is a sectional view taken along line VIIB-VIIB of FIG. 7A. .
【図8】 図8は本発明のサーマルヘッドの実施例2の
説明図で、図8Aは平面図、図8Bは図8AのVIIIB−
VIIIB線における断面図である。8A and 8B are explanatory views of a second embodiment of the thermal head of the present invention, FIG. 8A is a plan view, and FIG. 8B is VIIIB- of FIG. 8A.
It is sectional drawing in the VIIIB line.
【図9】 図9は従来のサ−マルヘッドを示し、図9A
は平面図、図9Bは図9AのA−A線における断面図で
ある。FIG. 9 shows a conventional thermal head, and FIG.
Is a plan view and FIG. 9B is a sectional view taken along the line AA of FIG. 9A.
X…主走査方向、Y…副走査方向、H… サ−マルヘッ
ド、Ra… 抵抗体形成用開口部、Rp… レジストパタ−
ン、2…絶縁基板、3…共通電極、3a…共通電極本体
部、3b…共通電極接続部、4…個別電極、4a…個別電
極先端部、5…発熱抵抗体、5′…未焼成抵抗体、6…
オ−バ−グレ−ズ、6′…未焼成オ−バ−グレ−ズX ... Main scanning direction, Y ... Sub scanning direction, H ... Thermal head, Ra ... Resistor forming opening, Rp ... Resist pattern
2 ... Insulating substrate, 3 ... Common electrode, 3a ... Common electrode body part, 3b ... Common electrode connection part, 4 ... Individual electrode, 4a ... Individual electrode tip part, 5 ... Heating resistor, 5 '... Unfired resistor Body, 6 ...
Overglaze, 6 '... unbaked overglaze
Claims (2)
共通電極本体部及びこの本体部から櫛歯状に副走査方向
(Y)に突出する多数の共通電極接続部を有する共通電
極と、前記共通電極接続部と交互に配置された多数の個
別電極先端部を有する個別電極と、前記共通電極接続部
及び個別電極先端部を接続する主走査方向(X)に沿っ
て延びる帯状発熱抵抗体とが絶縁基板の表面に形成さ
れ、前記帯状発熱抵抗体が部分アンダ−グレ−ズ上に形
成されたサーマルヘッドにおいて、下記の要件(A1)
〜(A2)を備えたことを特徴とするサーマルヘッド、
(A1) 前記帯状発熱抵抗体の副走査方向(Y)に沿
った断面形状が主走査方向の各位置において均一な形状
であること、(A2 )前記帯状発熱抵抗体の上面に副走
査方向(Y)に沿った断面形状が主走査方向の各位置に
おいて均一な矩形状のオーバーグレーズが形成されてい
ること。1. A common electrode having a strip-shaped common electrode body extending along the main scanning direction (X) and a plurality of common electrode connecting portions protruding in the sub-scanning direction (Y) in a comb shape from the body. An individual electrode having a large number of individual electrode tips alternately arranged with the common electrode connection section, and a strip-shaped heat generating resistor extending in the main scanning direction (X) connecting the common electrode connection section and the individual electrode tip section A thermal head having a body formed on the surface of an insulating substrate and the strip-shaped heating resistor formed on a partial underglaze, the following requirement (A1):
~ (A2) equipped with a thermal head,
(A1) The sectional shape of the strip-shaped heating resistor along the sub-scanning direction (Y) is uniform at each position in the main scanning direction, (A2) the sub-scanning direction ( A rectangular overglaze whose cross-sectional shape along Y) is uniform at each position in the main scanning direction is formed.
共通電極本体部及びこの本体部から櫛歯状に副走査方向
(Y)に突出する多数の共通電極接続部を有する共通電
極と、前記共通電極接続部と交互に配置された多数の個
別電極先端部を有する個別電極と、前記共通電極接続部
及び個別電極先端部を接続する主走査方向(X)に沿っ
て延びる帯状発熱抵抗体とが絶縁基板の表面に形成さ
れ、前記帯状発熱抵抗体が部分アンダ−グレーズ上に形
成され、且つ、下記の要件(A1),(A2)を備えたサ
ーマルヘッドの製造方法において、下記の要件(A3)
〜(A8)を備えたことを特徴とするサーマルヘッドの
製造方法、(A1) 前記帯状発熱抵抗体の副走査方向
(Y)に沿った断面形状が主走査方向の各位置において
均一な形状であること、(A2 )前記帯状発熱抵抗体の
上面に副走査方向(Y)に沿った断面形状が主走査方向
の各位置において均一な矩形状のオーバーグレーズが形
成されていること。(A3) 絶縁基板表面に主走査方向
(X)に伸びる帯状の部分アンダーグレーズを形成する
部分アンダーグレーズ形成工程、(A4) 前記共通電
極接続部及び個別電極先端部が前記部分アンダーグレー
ズ(2b)上に配置されるように、前記共通電極及び個
別電極を絶縁基板上に形成する電極形成工程、(A5)
前記部分アンダーグレーズ上の発熱抵抗体形成領域に
帯状の抵抗体形成用開口部を有するレジストパターンを
形成するレジストパターン形成工程、(A6) 前記帯状
の抵抗体形成用開口部内に前記レジストパターンの厚さ
よりも薄く抵抗体ペーストを充填してから乾燥させて未
焼成抵抗体を形成する未焼成抵抗体形成工程、(A7)
前記未焼成抵抗体が形成された帯状の抵抗体形成用開口
部内にオーバーグレーズペーストを充填してから乾燥さ
せて未焼成オ−バ−グレ−ズを形成する未焼成オーバグ
レーズ層形成工程、(A8) 前記未焼成オーバグレーズ
形成工程の後に焼成して発熱抵抗体及びオ−バ−グレイ
ズを形成する工程。2. A common electrode having a strip-shaped common electrode body extending along the main scanning direction (X) and a plurality of common electrode connecting portions protruding in the sub-scanning direction (Y) in a comb shape from the body. An individual electrode having a large number of individual electrode tips alternately arranged with the common electrode connection section, and a strip-shaped heat generating resistor extending in the main scanning direction (X) connecting the common electrode connection section and the individual electrode tip section A body is formed on the surface of an insulating substrate, the strip-shaped heating resistor is formed on a partial underglaze, and the following method (A1), (A2) is provided in the method of manufacturing a thermal head, wherein: Requirements (A3)
To (A8) are provided, (A1) The sectional shape of the strip-shaped heating resistor along the sub-scanning direction (Y) is uniform at each position in the main scanning direction. (A2) A rectangular overglaze having a uniform cross-sectional shape along the sub-scanning direction (Y) at each position in the main scanning direction is formed on the upper surface of the band-shaped heating resistor. (A3) Partial underglaze forming step of forming a band-shaped partial underglaze extending in the main scanning direction (X) on the surface of the insulating substrate, (A4) The common electrode connecting part and the individual electrode tip part are the partial underglaze (2b) An electrode forming step of forming the common electrode and the individual electrode on an insulating substrate so as to be arranged above (A5)
A resist pattern forming step of forming a resist pattern having a strip-shaped resistor forming opening in the heating resistor forming region on the partial underglaze; (A6) a thickness of the resist pattern in the strip-shaped resistor forming opening. A non-fired resistor forming step of forming a non-fired resistor by thinly filling the resistor paste and then drying (A7)
An unsintered overglaze layer forming step of forming an unsintered overglaze by filling an overglaze paste into the strip-shaped resistor forming opening in which the unsintered resistor is formed and then drying the unsintered overglaze layer, ( A8) A step of firing after the unfired overglaze forming step to form a heating resistor and an overglaze.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25691092A JPH06106756A (en) | 1992-09-25 | 1992-09-25 | Thermal head and manufacture thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25691092A JPH06106756A (en) | 1992-09-25 | 1992-09-25 | Thermal head and manufacture thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06106756A true JPH06106756A (en) | 1994-04-19 |
Family
ID=17299087
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25691092A Pending JPH06106756A (en) | 1992-09-25 | 1992-09-25 | Thermal head and manufacture thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH06106756A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009242764A (en) * | 2008-04-01 | 2009-10-22 | Topcon Corp | Coating liquid reduced in adhesion of dactylogram, method for producing the same, and article coated with the same |
KR20200001441A (en) | 2018-06-27 | 2020-01-06 | 록 기켄 고교 가부시키가이샤 | Ito film and transparent conductive film |
-
1992
- 1992-09-25 JP JP25691092A patent/JPH06106756A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009242764A (en) * | 2008-04-01 | 2009-10-22 | Topcon Corp | Coating liquid reduced in adhesion of dactylogram, method for producing the same, and article coated with the same |
KR20200001441A (en) | 2018-06-27 | 2020-01-06 | 록 기켄 고교 가부시키가이샤 | Ito film and transparent conductive film |
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