JPH06106557A - Molding device for thermosetting resin molding material - Google Patents
Molding device for thermosetting resin molding materialInfo
- Publication number
- JPH06106557A JPH06106557A JP25491892A JP25491892A JPH06106557A JP H06106557 A JPH06106557 A JP H06106557A JP 25491892 A JP25491892 A JP 25491892A JP 25491892 A JP25491892 A JP 25491892A JP H06106557 A JPH06106557 A JP H06106557A
- Authority
- JP
- Japan
- Prior art keywords
- molding material
- nozzle
- molding
- thermosetting resin
- gate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012778 molding material Substances 0.000 title claims abstract description 59
- 229920005989 resin Polymers 0.000 title claims abstract description 34
- 239000011347 resin Substances 0.000 title claims abstract description 34
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 29
- 238000000465 moulding Methods 0.000 title claims abstract description 23
- 238000001746 injection moulding Methods 0.000 claims abstract description 8
- 238000001721 transfer moulding Methods 0.000 claims abstract description 8
- 238000002844 melting Methods 0.000 claims abstract description 5
- 230000008018 melting Effects 0.000 claims abstract description 5
- 230000002349 favourable effect Effects 0.000 abstract 1
- 208000015181 infectious disease Diseases 0.000 abstract 1
- 239000000463 material Substances 0.000 description 6
- 239000000155 melt Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 229920006337 unsaturated polyester resin Polymers 0.000 description 3
- 208000015943 Coeliac disease Diseases 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/28—Closure devices therefor
- B29C45/2806—Closure devices therefor consisting of needle valve systems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、熱硬化性樹脂成形材料
をランナーレスでゲートカット成形できる成形装置に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molding apparatus capable of gate-cut molding a thermosetting resin molding material without a runner.
【０００２】[0002]
【従来の技術】従来、熱硬化性樹脂成形材料の成形にお
いて、省資源や材料の有効利用の観点から発生するスプ
ルー、ランナーを少なくする方法や無くする方法が、実
公昭52-34865、実公昭53-77975、実公昭54-1501 などで
種々提案されている。しかし、熱硬化性樹脂成形材料の
トランスファ成形や射出成形において、低い溶融粘度で
安定して成形するためには、さらに、金型に至るまでの
流路で溶融した前記成形材料の粘度が移送、滞留中に上
昇するのを阻止する必要がある。また、成形品の外観向
上と耐湿性向上のためにゲートカット部を他の部分と同
様金型で仕上げられたようなスキン層を有する成形品と
する必要がある。これらを同時に満足するような熱硬化
性樹脂成形材料用の成形装置が期待されていた。2. Description of the Related Art Conventionally, in the molding of thermosetting resin molding materials, methods for reducing or eliminating sprues and runners generated from the viewpoint of resource saving and effective use of materials have been disclosed in JP-A-52-34865 and JP-A-KOKAI. Various proposals have been made in 53-77975 and Jitsuko Sho 54-1501. However, in transfer molding or injection molding of thermosetting resin molding material, in order to stably mold with a low melt viscosity, further, the viscosity of the molding material melted in the flow path to the mold is transferred, It is necessary to prevent it from rising during residence. In addition, in order to improve the appearance and moisture resistance of the molded product, it is necessary to make the gate cut part into a molded product having a skin layer that is finished with a mold like other parts. A molding apparatus for a thermosetting resin molding material that satisfies these requirements at the same time has been expected.
【０００３】[0003]
【発明が解決しようとする課題】そこで本発明は、熱硬
化性樹脂成形材料のトランスファ成形や射出成形がより
安定して行え、さらに、成形品のゲートカット部の外観
を他の部分と同様金型で成形されたようなスキン層を有
する外観良好で耐湿性に優れた成形品が得られる熱硬化
性樹脂成形材料用の成形装置を提供するものである。SUMMARY OF THE INVENTION Therefore, according to the present invention, transfer molding and injection molding of a thermosetting resin molding material can be performed more stably, and the appearance of the gate cut portion of the molded product is the same as that of other portions. Provided is a molding device for a thermosetting resin molding material, which has a skin layer like a mold and has a good appearance and excellent moisture resistance.
【０００４】[0004]
【課題を解決するための手段】本発明は前記の問題点に
鑑みなされた熱硬化性樹脂成形材料用の成形装置であ
り、その特徴は、熱硬化性樹脂成形材料を溶融し押し出
す手段を有する供給部と、この供給部に接続して配設さ
れ温調されたマニホールドと、このマニホールドに連続
して取り付けられ温調されたノズル内にノズル先端の開
口部と金型のゲート口を開閉できるゲートシャットピン
を有するノズルとを含むことにある。The present invention is a molding apparatus for a thermosetting resin molding material, which has been made in view of the above problems, and is characterized by having a means for melting and extruding the thermosetting resin molding material. It is possible to open and close an opening at the tip of the nozzle and a gate opening of the mold in a supply unit, a manifold that is connected to the supply unit and has a temperature adjusted, and a nozzle that is continuously attached to the manifold and has a temperature adjusted. And a nozzle having a gate shut pin.
【０００５】[0005]
【作用】熱硬化性樹脂成形材料を溶融し押し出す手段を
有する供給部から金型ゲート口に至るマニホールドやノ
ズルの流路が温調されているために、溶融した前記成形
材料の粘度が、更に反応して上昇するのを阻止できるの
で一層安定して成形を続けることができる。かつ、溶融
した前記成形材料を金型キャビティ内に注入した後、ノ
ズル内のゲートシャットピンを前進させノズル先端のノ
ズル開口部を閉じると同時に金型の開口部分であるゲー
ト口を閉鎖するので、ゲートからキャビティに注入した
成形材料に十分な圧力と温度をかけて成形することがで
きる。この結果、スプルー、ランナー無しで十分に充填
した成形品のゲートカット部の外観を他の部分と同様金
型で仕上げられたようなスキン層を有する成形品とする
ことができる。成形品の外面がすべてスキン層で形成さ
れるので、外観が良好で耐湿性に優れた成形品となる。
しかも、ゲートシャットピンによって溶融した低粘度の
成形材料がノズル開口部付近から漏れるのを阻止するこ
ともできる。The temperature of the flow path of the manifold or nozzle from the supply unit having the means for melting and extruding the thermosetting resin molding material to the die gate port is controlled, so that the viscosity of the molten molding material is further increased. Since the reaction can be prevented from rising, molding can be continued more stably. And, after injecting the molten molding material into the mold cavity, since the gate shut pin in the nozzle is advanced to close the nozzle opening at the tip of the nozzle and at the same time close the gate opening, which is the opening of the mold, The molding material injected from the gate into the cavity can be molded by applying sufficient pressure and temperature. As a result, the appearance of the gate cut portion of the molded product that is sufficiently filled without sprue and runner can be a molded product having a skin layer that is finished with a mold like other parts. Since the outer surface of the molded product is entirely formed of the skin layer, the molded product has a good appearance and excellent moisture resistance.
Moreover, it is possible to prevent the low-viscosity molding material melted by the gate shut pin from leaking from the vicinity of the nozzle opening.
【０００６】[0006]
【実施例】以下、本発明を図面に基づいて説明する。な
お、本発明はこれら実施例に限定されるものではない。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings. The present invention is not limited to these examples.
【０００７】図１（ａ）は本発明の一実施例のトランス
ファランナーレスでゲートカットできる成形装置の断面
図でありその構成は、供給部１が上下するプランジャ８
を内部に有する円筒形のポット９と、このポット９に接
続して配設され温調されたマニホールド２と、このマニ
ホールド２の先端に取り付けられた断熱と温調されたノ
ズル内にノズル先端の開口部と金型６のゲート口を開閉
できるゲートシャットピン４を有するノズル３を含む。FIG. 1 (a) is a sectional view of a transfer runner-less gate cutting molding apparatus according to an embodiment of the present invention.
A cylindrical pot 9 having therein, a manifold 2 which is connected to the pot 9 and whose temperature is controlled, and a heat-insulated and temperature-controlled nozzle attached to the tip of this manifold 2 It includes a nozzle 3 having a gate shut pin 4 capable of opening and closing the opening and the gate opening of the mold 6.
【０００８】内部においてプランジャ８が上下する円筒
形のポット９は熱硬化性樹脂成形材料１２が溶融する温
度、40〜120 ℃、好ましくは60〜100 ℃程度に加熱され
ており、ポットに投入された前記成形材料は直ちに溶融
する。この溶融した前記成形材料１２はプランジャ８の
加圧によって、ポット９からマニホールド２内に設けら
れた前記成形材料１２の流路５へ移送される。この流路
５は溶融した前記成形材料１２の通り道となると同時に
一時的には滞留場所にもなる。したがって、マニホール
ド２は前記の溶融した成形材料１２の粘度をできるだけ
低く保持するように30〜110 ℃、好ましくは35〜80℃の
温度に温調されている。生産性を高める目的と成形のバ
ランス取りの観点から、前記マニホールド２の流路５は
途中で二つに分岐して二つのノズル３に接続している。
この分岐数は特に限定するものではなく、所望数を適宜
選択することができる。The cylindrical pot 9 in which the plunger 8 moves up and down is heated to a temperature at which the thermosetting resin molding material 12 melts, 40 to 120 ° C., preferably about 60 to 100 ° C., and put into the pot. The molding material melts immediately. The molten molding material 12 is transferred from the pot 9 to the flow path 5 of the molding material 12 provided in the manifold 2 by pressing the plunger 8. The flow path 5 serves as a passage for the molten molding material 12 and at the same time serves as a residence site. Therefore, the manifold 2 is temperature-controlled to 30 to 110 ° C., preferably 35 to 80 ° C. so as to keep the viscosity of the molten molding material 12 as low as possible. From the viewpoint of improving productivity and balancing molding, the flow path 5 of the manifold 2 is branched into two and connected to the two nozzles 3.
The number of branches is not particularly limited, and a desired number can be appropriately selected.
【０００９】マニホールド２の各流路５の先端にはノズ
ル３が取り付けられており、ノズル内の中央にはノズル
先端の開口部１６を開閉するとともに、金型６のゲート
口１７を開閉するゲートシャットピン４が配設されてい
る。図２（ａ）のノズルと金型ゲート部の拡大断面図に
示したようにゲートシャットピン４の周りはマニホール
ド２の流路５から移送されて来た溶融した熱硬化性成形
材料１２の流路兼滞留場所となる空間が円柱状にシリン
ダー１３によって確保されており、ノズル３の外郭層の
内部または、表面には温調部１４が配設され30〜110
℃、好ましくは35〜80℃の温度に温調され、ノズル３で
の成形材料１２の粘度変化をできるだけ起こさないよう
にしている。なお、図１の状態は、図２（ｂ）と同じ状
態であり、ゲートシャットピン４が金型６のゲート口１
７をシャットしたところである。又、ノズル先端近傍に
は、加熱された金型６の熱をノズル３に伝えないために
断熱部１５が形成されており、さらに加熱された金型６
の熱がノズル３に伝わるのを最小限に止めるために、ノ
ズル３と金型６の当接する面をできるだけ少なくなるよ
うにノズル先端近傍の断熱部１５からノズル外郭層表面
とノズル３が挿入される金型６の凹部７の壁面と接触す
る部分を可能な限り小部分にとどめている。A nozzle 3 is attached to the tip of each flow path 5 of the manifold 2, and a gate that opens and closes an opening 16 at the tip of the nozzle and a gate opening 17 of a mold 6 is provided in the center of the nozzle. A shut pin 4 is provided. As shown in the enlarged cross-sectional view of the nozzle and the mold gate portion in FIG. 2A, the flow of the molten thermosetting molding material 12 transferred from the flow path 5 of the manifold 2 around the gate shut pin 4 is shown. A space that serves as a passage and a staying place is secured by a cylinder 13 in a cylindrical shape, and a temperature control unit 14 is provided inside or on the surface of the outer layer of the nozzle 3 and has a temperature of 30 to 110.
The temperature is adjusted to a temperature of 35 ° C., preferably 35 to 80 ° C., so that the viscosity change of the molding material 12 in the nozzle 3 is prevented as much as possible. The state of FIG. 1 is the same as that of FIG. 2B, and the gate shut pin 4 is used for the gate opening 1 of the mold 6.
I just shut 7. In addition, a heat insulating portion 15 is formed near the tip of the nozzle to prevent the heat of the heated die 6 from being transmitted to the nozzle 3, and the heated die 6 is heated.
In order to minimize the heat transfer to the nozzle 3, the nozzle outer shell layer surface and the nozzle 3 are inserted from the heat insulating portion 15 near the nozzle tip so that the contact surface between the nozzle 3 and the mold 6 is minimized. The portion of the mold 6 that comes into contact with the wall surface of the recess 7 is kept as small as possible.
【００１０】供給部１がプランジャ８とポット９からな
るトランスファ成形機の成形材料供給手段を有するもの
の場合には、熱硬化性樹脂成形材料１２を成形の都度ま
たは、数回の成形ごとに投入することができるので成形
材料交換や色替えが材料ロスなく容易に行うことができ
る。また、図１（ｂ）は成形材料供給手段がシリンダー
とスクリュウからなる射出成形の場合を示す部分断面図
であり、供給部１が、シリンダー１０とスクリュウ１１
からなる射出成形機の成形材料供給手段を有するものの
場合には、熱硬化性樹脂成形材料を連続的に供給し易い
ので自動連続成形が行い易い。In the case where the supply unit 1 has a molding material supply means of a transfer molding machine composed of a plunger 8 and a pot 9, the thermosetting resin molding material 12 is charged every molding or every several moldings. Therefore, it is possible to easily replace the molding material and change the color without material loss. FIG. 1B is a partial cross-sectional view showing a case where the molding material supply means is injection molding including a cylinder and a screw, and the supply unit 1 includes a cylinder 10 and a screw 11.
In the case of the injection molding machine having the molding material supply means, it is easy to continuously supply the thermosetting resin molding material, and therefore automatic continuous molding is easy.
【００１１】図２（ａ）、（ｂ）、（ｃ）、（ｄ）は、
供給部に連続して配設されたマニホールドの先端に取り
付けられたノズルと金型ゲート部の拡大断面図であり、
図２（ａ）〜（ｄ）は、溶融した熱硬化性樹脂成形材料
の注入からゲートカット、硬化、取り出し、次の準備の
作動順序を示したものである。2 (a), (b), (c) and (d),
FIG. 6 is an enlarged cross-sectional view of a nozzle and a mold gate unit attached to the tip of a manifold continuously arranged in the supply unit,
2 (a) to 2 (d) show the operation sequence of injection, gate cutting, curing, and removal of the molten thermosetting resin molding material, and the next preparation.
【００１２】図２（ａ）注入では、ノズル３を金型６の
ゲート口１７にタッチさせると同時にノズル３内のゲー
トカットピン４を引上げ、ノズル開口部１６を開放し、
ポット９で溶融化され、その溶融粘度が余り変化しない
ように温調したマニホールド２及びノズル３内の流路５
を通じて移送されて来た熱硬化性樹脂成形材料１２を金
型６内に注入する。ノズル３の金型６への接触は成形材
料１２の注入の約１〜30秒の極短時間のみであり、ノズ
ル３の先端には断熱部１５が設けられ、外郭層に設けら
れた温調部１４でノズル３は温調されているので溶融し
た前記成形材料１２の溶融粘度の上昇は阻止される。さ
らに、ノズル３が挿入される金型６の凹部７の壁面とノ
ズル外層面との接触する部分をできるだけ小さくし、ゲ
ートカットピンの熱容量が小さいのでノズル内の溶融し
た前記成形材料の粘度上昇はほとんどなくランナーレ
ス、ゲートカットの連続成形が可能となる。In the injection shown in FIG. 2A, the nozzle 3 is brought into contact with the gate port 17 of the mold 6, and at the same time, the gate cut pin 4 in the nozzle 3 is pulled up to open the nozzle opening 16.
The flow path 5 in the manifold 2 and the nozzle 3 which is melted in the pot 9 and whose temperature is adjusted so that its melt viscosity does not change so much.
The thermosetting resin molding material 12 transferred through the mold is injected into the mold 6. The nozzle 3 is brought into contact with the mold 6 only for a very short time of about 1 to 30 seconds when the molding material 12 is injected, and the heat insulating portion 15 is provided at the tip of the nozzle 3 and the temperature control provided in the outer layer. Since the temperature of the nozzle 3 is controlled in the portion 14, the melt viscosity of the molten molding material 12 is prevented from increasing. Further, the contact portion between the wall surface of the concave portion 7 of the mold 6 into which the nozzle 3 is inserted and the outer surface of the nozzle is made as small as possible, and the heat capacity of the gate cut pin is small, so that the viscosity of the molten molding material in the nozzle is not increased. With almost no runners, continuous gate cut molding is possible.
【００１３】図２（ｂ）ゲートカットでは、前記成形材
料１２の金型６への注入完了後、ゲートカットピン４で
金型６のゲート口１７を閉め、注入した前記成形材料１
２の逆流を防止する。In FIG. 2B, in the gate cutting, after the injection of the molding material 12 into the mold 6, the gate opening 17 of the mold 6 is closed by the gate cut pin 4 and the molding material 1 injected.
Prevent backflow of 2.
【００１４】図２（ｃ）硬化では、金型６のゲート口１
７を閉めると同時にノズル３を金型６より離し、ノズル
３の温度上昇を防止する。但し、ゲートカットピン４
は、注入した前記成形材料１２が硬化するまで金型６の
ゲート口１７を閉めたまま保持する。In the curing of FIG. 2C, the gate opening 1 of the mold 6 is used.
At the same time when 7 is closed, the nozzle 3 is separated from the mold 6 to prevent the temperature rise of the nozzle 3. However, gate cut pin 4
Holds the gate opening 17 of the mold 6 closed until the injected molding material 12 is cured.
【００１５】図２（ｄ）取り出し、準備では、金型６内
の前記成形材料１２が硬化し、ゲート口１７より成形材
料１２が逆流しなくなればゲートカットピン４を金型６
から離す。As shown in FIG. 2D, in the preparation and preparation, when the molding material 12 in the mold 6 is hardened and the molding material 12 does not flow back through the gate port 17, the gate cut pin 4 is moved to the mold 6.
Keep away from.
【００１６】本発明の熱硬化性樹脂成形材料の樹脂とし
ては、不飽和ポリエステル樹脂、エポキシ樹脂、フェノ
−ル樹脂、メラミン樹脂、ユリア樹脂、シリコーン樹
脂、イミド樹脂などの単独、これらをベース樹脂とした
変性樹脂、及びこれらの樹脂の組み合わせ樹脂などを用
いることができる。不飽和ポリエステル樹脂、エポキシ
樹脂、シリコーン樹脂が溶融粘度が低い点で好ましく、
不飽和ポリエステル樹脂はコスト安の点でより好まし
く、エポキシ樹脂は電気特性、機械特性などに優れる点
でより好ましい。As the resin of the thermosetting resin molding material of the present invention, an unsaturated polyester resin, an epoxy resin, a phenol resin, a melamine resin, a urea resin, a silicone resin, an imide resin or the like may be used alone. The modified resin described above and a combination resin of these resins can be used. Unsaturated polyester resin, epoxy resin, and silicone resin are preferable in that the melt viscosity is low,
The unsaturated polyester resin is more preferable from the viewpoint of cost reduction, and the epoxy resin is more preferable from the viewpoint of excellent electrical properties and mechanical properties.
【００１７】供給部のポット、プランジャ、シリンダ
ー、スクリュウや、マニホールドやノズルやゲートシャ
ットピンの材質についても特に限定するものではなく、
通常これらの分野において使用されるものをそのまま用
いることができる。The materials of the pot, the plunger, the cylinder, the screw, the manifold, the nozzle, and the gate shut pin of the supply unit are not particularly limited.
What is usually used in these fields can be used as it is.
【００１８】マニホールドやノズルの温調は、たとえ
ば、管状の温調部に水、油、有機溶媒などの熱媒体を流
す方法や電熱ヒーターなど電気的方法によって行うこと
ができる。The temperature of the manifold and the nozzle can be adjusted by, for example, a method of flowing a heat medium such as water, oil or an organic solvent through a tubular temperature adjusting section, or an electric method such as an electric heater.
【００１９】断熱部は断熱板などに通常用いられる無機
質からなる材料、気泡を有する材料、シリコーンなど樹
脂材料などで形成されたものを用いることができる。The heat insulating portion may be made of an inorganic material, a material having bubbles, or a resin material such as silicone which is usually used for a heat insulating plate.
【００２０】[0020]
【発明の効果】本発明によって、熱硬化性樹脂成形材料
の成形をランナーレスでより安定して行うことができ、
成形品のゲート口の外観を他の成形品の表面と同じ美麗
なスキン層に仕上げることができる。また、熱硬化性樹
脂成形材料を溶融し押し出す供給部が、プランジャとポ
ットからなるトランスファ成形機の成形材料供給手段を
有するものの場合には、熱硬化性樹脂成形材料をその都
度または、数回の成形ごとに投入することができるので
成形材料交換や色替えが材料ロスなく容易に行うことが
でき、供給部がスクリュウとシリンダーとからなる射出
成形機の成形材料供給手段を有するものの場合には、熱
硬化性樹脂成形材料を連続的に供給し易いので自動連続
成形が行い易い。According to the present invention, a thermosetting resin molding material can be molded more stably without a runner,
The appearance of the gate opening of a molded product can be finished with the same beautiful skin layer as the surface of other molded products. Further, in the case where the supply unit for melting and extruding the thermosetting resin molding material has a molding material supply means of a transfer molding machine consisting of a plunger and a pot, the thermosetting resin molding material is supplied each time or several times. Since it can be input for each molding, the molding material exchange and color change can be easily performed without material loss, and in the case where the supply unit has the molding material supply means of the injection molding machine consisting of the screw and the cylinder, Since it is easy to continuously supply the thermosetting resin molding material, automatic continuous molding is easy.
【図１】本発明の一実施例の熱硬化性樹脂成形材料用の
成形装置の断面図を示すものであり、（ａ）はトランス
ファ成形装置を示す断面図であり、（ｂ）は射出成形装
置の供給部を示す部分断面図である。FIG. 1 is a sectional view of a molding apparatus for a thermosetting resin molding material according to an embodiment of the present invention, (a) is a sectional view showing a transfer molding apparatus, and (b) is injection molding. It is a fragmentary sectional view which shows the supply part of an apparatus.
【図２】本発明の一実施例のノズルと金型部分の拡大断
面図であり、（ａ）〜（ｄ）は作動順序を示すものであ
る。FIG. 2 is an enlarged cross-sectional view of a nozzle and a mold part according to an embodiment of the present invention, in which (a) to (d) show an operation sequence.
１ 供給部 ２ マニホールド ３ ノズル ４ ゲートシャットピン ５ 流路 ６ 金型 ７ 凹部 ８ プランジャ ９ ポット １０ シリンダー １１ スクリュー １２ 成形材料 １３ シリンダー １４ 温調部 １５ 断熱部 １６ ノズル開口部 １７ 金型ゲート口 1 Supply Part 2 Manifold 3 Nozzle 4 Gate Shut Pin 5 Flow Path 6 Mold 7 Recess 8 Plunger 9 Pot 10 Cylinder 11 Screw 12 Molding Material 13 Cylinder 14 Temperature Control Section 15 Heat Insulation Section 16 Nozzle Opening 17 Mold Gate Port
Claims (3)
手段を有する供給部と、この供給部に接続して配設され
温調されたマニホールドと、このマニホールドに連続し
て取り付けられ温調されたノズル内にノズル先端の開口
部と金型のゲート口を開閉できるゲートシャットピンを
有するノズルとを含むことを特徴とする熱硬化性樹脂成
形材料用の成形装置。1. A supply part having a means for melting and extruding a thermosetting resin molding material, a temperature-controlled manifold arranged so as to be connected to the supply part, and a temperature-controlled manifold continuously attached to the manifold. A molding apparatus for a thermosetting resin molding material, characterized in that the nozzle includes an opening at the tip of the nozzle and a nozzle having a gate shut pin that can open and close the gate opening of the mold.
ポットからなるトランスファ成形機の成形材料供給手段
を有するものである請求項１記載の熱硬化性樹脂成形材
料用の成形装置。2. The molding apparatus for thermosetting resin molding material according to claim 1, wherein the supply section according to claim 1 has a molding material supply means of a transfer molding machine including a plunger and a pot.
シリンダーからなる射出成形機の成形材料供給手段を有
するものである請求項１記載の熱硬化性樹脂成形材料用
の成形装置。3. The molding apparatus for thermosetting resin molding material according to claim 1, wherein the supply section according to claim 1 has a molding material supply means of an injection molding machine including a screw and a cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25491892A JPH06106557A (en) | 1992-09-24 | 1992-09-24 | Molding device for thermosetting resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25491892A JPH06106557A (en) | 1992-09-24 | 1992-09-24 | Molding device for thermosetting resin molding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06106557A true JPH06106557A (en) | 1994-04-19 |
Family
ID=17271671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25491892A Pending JPH06106557A (en) | 1992-09-24 | 1992-09-24 | Molding device for thermosetting resin molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06106557A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003101703A1 (en) * | 2002-06-04 | 2003-12-11 | Seiki Corporation | Device and method for runner-less molding of thermosetting resin and rubber |
| KR100462637B1 (en) * | 2002-04-19 | 2004-12-20 | 주식회사대웅알티 | Wasteless equipment for rubber correction of deformities |
| KR100504956B1 (en) * | 2002-05-21 | 2005-08-01 | 주식회사대웅알티 | Wasteless manufacture method for rubber correction of deformities |
| KR100723030B1 (en) * | 2002-06-04 | 2007-05-29 | 세이키 코포레이션 | Device and method for runner-less molding of thermosetting resin and rubber |
| JP2008516797A (en) * | 2004-10-15 | 2008-05-22 | ドゥラショー、ソシエテ、アノニム | Distributed support injection molding equipment |
| WO2014156917A1 (en) * | 2013-03-26 | 2014-10-02 | Nok株式会社 | Molding apparatus |
| WO2018043037A1 (en) * | 2016-09-05 | 2018-03-08 | パナソニックＩｐマネジメント株式会社 | Runnerless injection molding device |
-
1992
- 1992-09-24 JP JP25491892A patent/JPH06106557A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100462637B1 (en) * | 2002-04-19 | 2004-12-20 | 주식회사대웅알티 | Wasteless equipment for rubber correction of deformities |
| KR100504956B1 (en) * | 2002-05-21 | 2005-08-01 | 주식회사대웅알티 | Wasteless manufacture method for rubber correction of deformities |
| KR100723030B1 (en) * | 2002-06-04 | 2007-05-29 | 세이키 코포레이션 | Device and method for runner-less molding of thermosetting resin and rubber |
| GB2394689A (en) * | 2002-06-04 | 2004-05-05 | Seiki Corp | Device and method for runner-less molding of thermosetting resin and rubber |
| GB2394689B (en) * | 2002-06-04 | 2005-08-17 | Seiki Corp | Device and method for runner-less molding of thermosetting resin and rubber |
| US7217384B2 (en) | 2002-06-04 | 2007-05-15 | Seiki Corporation | Device and method for runner-less molding of thermosetting resin and rubber |
| WO2003101703A1 (en) * | 2002-06-04 | 2003-12-11 | Seiki Corporation | Device and method for runner-less molding of thermosetting resin and rubber |
| CN100358703C (en) * | 2002-06-04 | 2008-01-02 | 世纪株式会社 | Device and method for runner-less molding of thermosetting resin and rubber |
| DE10297634B4 (en) * | 2002-06-04 | 2010-01-21 | Seiki Corp., Yonezawa | Non-gating injector for crosslinkable resins and gums and method of operation |
| JP2008516797A (en) * | 2004-10-15 | 2008-05-22 | ドゥラショー、ソシエテ、アノニム | Distributed support injection molding equipment |
| WO2014156917A1 (en) * | 2013-03-26 | 2014-10-02 | Nok株式会社 | Molding apparatus |
| US9895835B2 (en) | 2013-03-26 | 2018-02-20 | Nok Corporation | Molding apparatus |
| WO2018043037A1 (en) * | 2016-09-05 | 2018-03-08 | パナソニックＩｐマネジメント株式会社 | Runnerless injection molding device |
| CN109641378A (en) * | 2016-09-05 | 2019-04-16 | 松下知识产权经营株式会社 | Without runnerless injection forming device |
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