JPH06106478A - Supply of polishing agent to polishing device and supply device thereof - Google Patents
Supply of polishing agent to polishing device and supply device thereofInfo
- Publication number
- JPH06106478A JPH06106478A JP28090692A JP28090692A JPH06106478A JP H06106478 A JPH06106478 A JP H06106478A JP 28090692 A JP28090692 A JP 28090692A JP 28090692 A JP28090692 A JP 28090692A JP H06106478 A JPH06106478 A JP H06106478A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- abrasive
- polishing agent
- supplying
- abrasive grains
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、例えば、半導体ウエ
ーハのラッピング装置の如く、上定盤と下定盤との間に
加工物を挟み、被研磨材と定盤との間に研磨剤を供給し
ながら定盤を回転させて加工物を研磨する研磨装置への
研磨剤の供給方法の改良に係り、被研磨材と定盤との間
に研磨剤を供給する前に、超音波振動などの加振手段で
研磨砥粒を分散させてから供給し、研磨傷を発生させる
ことなく精密な研磨を実現した研磨装置への研磨剤の供
給方法とその供給装置に関する。[Field of the Invention The present invention is, for example, semiconductor c d
Like the lapping device of Ha, the work piece is sandwiched between the upper surface plate and the lower surface plate, and the surface plate is rotated while supplying the polishing agent between the material to be polished and the surface plate to polish the work piece. Regarding the improvement of the method of supplying the polishing agent to the polishing equipment, before supplying the polishing agent between the material to be polished and the surface plate, supply it after dispersing the polishing abrasive grains by vibrating means such as ultrasonic vibration. However, the present invention relates to a method of supplying an abrasive to a polishing apparatus that realizes precise polishing without generating polishing scratches, and a supply apparatus therefor.
【０００２】[0002]
【従来の技術】半導体ウエーハの研磨装置は、例えば両
面研磨の場合、昇降自在の上定盤と該上定盤に対向する
固定の下定盤を有し、上下定盤間にウエーハを保持する
複数のキャリアを配置し、各キャリアが外側のインター
ナルギヤと中心側の太陽ギヤと噛合して自転公転可能と
なし、また、上下の定盤も所要回転数で回転し、キャリ
ア内のウエーハは所要圧で減圧される上定盤と下定盤間
で、所要砥粒の懸濁液からなる研磨剤にてラッピングす
る構成からなる。The polishing apparatus of semiconductor c d Doha, for example, in the case of double-side polishing, has a lower platen fixed opposite the platen and upper platen on the vertically movable, c d between the upper and lower surface plates A plurality of carriers that hold the chassis are arranged, and each carrier meshes with the external internal gear and the central sun gear to allow rotation and revolution, and the upper and lower surface plates also rotate at the required number of revolutions. c d Doha in the carrier than between upper surface plate and Shitajo board to be vacuum at the required pressure, consists configured to wrap at polishing agent comprising a suspension of the required grains.
【０００３】従来、複数機の研磨装置への研磨剤供給方
法は、図４並びに図２に示すごとく集中タンク１からポ
ンプ３により主配管４を通り枝配管５から研磨装置６へ
供給されるものであった。また、主配管４には必要に応
じ研磨剤を分散させるためのフィルター２を設けてあ
る。Conventionally, as shown in FIGS. 4 and 2, a method of supplying an abrasive to a plurality of polishing apparatuses is one in which a central tank 1 is supplied by a pump 3 through a main pipe 4 to a branch pipe 5 to a polishing device 6. Met. Further, the main pipe 4 is provided with a filter 2 for dispersing an abrasive as required.
【０００４】一般的に使用される研磨剤は、分散効果、
防錆効果、キレート効果、乾き防止効果が必要とされ、
それぞれについて、その性能をもつ薬液等を添加してい
る。また、砥粒を分散させる研磨液の表面張力を低下さ
せたり、所定のアルカリ領域で使用するためにｐＨ調整
を行っている。The commonly used abrasives have a dispersing effect,
Rust prevention effect, chelating effect, dryness prevention effect is required,
For each of them, a chemical solution or the like having the performance is added. Further, the surface tension of the polishing liquid in which the abrasive grains are dispersed is lowered, and the pH is adjusted for use in a predetermined alkaline region.
【０００５】[0005]
【発明が解決しようとする課題】かかる研磨剤を用いた
研磨に際し、ラップ疵の発生が見られることが有り、種
々検討したところ、分散剤による化学的な分散効果だけ
では、研磨剤中の砥粒の１つ１つを確実に分散させた状
態で研磨装置へ供給できていないことが分かった。When polishing with such an abrasive, lapping flaws are sometimes observed, and various investigations have revealed that the chemical dispersant effect of the dispersant alone is sufficient for polishing in the abrasive. It was found that the particles could not be supplied to the polishing apparatus in a state in which they were surely dispersed.
【０００６】すなわち、図３のＡに上定盤１０と下定盤
間１１でラッピングされるキャリア１２内のウエーハ１
３と砥粒１４との関係を示す説明図に明らかなように、
正常な状態でラッピングされる場合は、砥粒１４同士は
完全に分散して砥粒１４の回転が自在であるが、同図Ｂ
に示す場合は、研磨剤の使用方法や配管内の圧力、流
量、流下状態、滞留などの諸条件により、分散剤による
化学的分散効果だけでは不十分で、砥粒同士が離反せず
凝集しやすく、砥粒１４の回転が困難になる。よって、
かかる凝集した研磨剤で研磨を行うと砥粒同士のペース
ト状の固まりにより、研磨時にウエーハにラップ疵が生
じ、さらにはウエーハへの集中的な荷重によるクラック
の発生にもつながる。Namely, c d Doha 1 in the carrier 12 to be lapped by upper platen 10 and lower platen 11 between the A of FIG. 3
As is clear from the explanatory view showing the relationship between 3 and the abrasive grains 14,
When lapping in a normal state, the abrasive grains 14 are completely dispersed and the abrasive grains 14 can rotate freely.
In the case of, the chemical dispersion effect of the dispersant is not sufficient, and the agglomerates do not aggregate and agglomerate due to various conditions such as the method of using the abrasive, the pressure in the pipe, the flow rate, the flowing state, and the retention. It is easy and the rotation of the abrasive grains 14 becomes difficult. Therefore,
The pasty mass of abrasive grains when performing the polishing in such agglomerated abrasive, resulting lap flaws in c d over wafer during polishing, and even the generation of cracks due to intensive load to c d Doha Connect
【０００７】この発明は、研磨装置への研磨剤の供給方
法において、砥粒の１つ１つを確実に分散させた状態で
研磨装置へ供給できる供給方法とその装置の提供を目的
としている。An object of the present invention is to provide a method of supplying a polishing agent to a polishing apparatus, which can supply the polishing agent to the polishing apparatus in a state in which each of the abrasive grains is reliably dispersed.
【０００８】[0008]
【課題を解決するための手段】この発明は、被研磨材と
研磨定盤との間に研磨剤を供給して研磨を行う研磨装置
への研磨剤の供給方法において、研磨装置の近傍に配設
された研磨剤供給管に超音波振動器または機械的加振器
を付設し、研磨装置に供給直前の研磨剤に直接あるいは
ネットまたはフィルターを介して振動を与え、研磨砥粒
を分散させて供給することを特徴とする研磨装置への研
磨剤の供給方法である。According to the present invention, there is provided a method of supplying an abrasive to a polishing apparatus for supplying the abrasive between a material to be polished and a polishing platen to perform polishing. An ultrasonic vibrator or mechanical shaker is attached to the installed abrasive supply pipe, and the abrasive just before being supplied to the polishing device is vibrated directly or through a net or a filter to disperse the abrasive grains. And a method of supplying an abrasive to a polishing apparatus.
【０００９】また、この発明は、被研磨材と研磨定盤と
の間に研磨剤を供給して研磨を行う研磨装置の研磨剤分
配器に接続された研磨剤供給管に超音波振動器を付設し
たことを特徴とする研磨装置への研磨剤の供給装置であ
る。Further, according to the present invention, an ultrasonic vibrator is attached to a polishing agent supply pipe connected to a polishing agent distributor of a polishing apparatus for supplying a polishing agent between a material to be polished and a polishing platen for polishing. It is an apparatus for supplying an abrasive to a polishing apparatus characterized by being attached.
【００１０】[0010]
【作用】この発明による研磨剤の供給方法の作用を供給
装置の図面に基づいて詳述する。図１はこの発明による
研磨剤の供給装置の説明図である。供給装置において、
研磨剤は集中タンクから主配管４を通り枝配管５から研
磨装置６へ供給されるが、枝配管５の下方部、すなわち
研磨装置６の分配皿７の近傍の枝配管５に超音波振動器
８を付設してある。超音波振動器８を作動させることに
より、枝配管５内を通過する研磨剤に所定の振動が加え
られ、研磨剤中の砥粒が相互に離反分散して分配皿７に
落下し、さらに分配管９より上定盤１０を通して上下定
盤間に供給され、前述した図３のＡの如く、研磨剤中の
砥粒を相互に離反分散して供給することができる。The operation of the method for supplying an abrasive according to the present invention will be described in detail with reference to the drawings of the supplying device. FIG. 1 is an explanatory view of a polishing agent supply device according to the present invention. In the feeding device,
The polishing agent is supplied from the centralized tank through the main pipe 4 to the polishing device 6 from the branch pipe 5, and the ultrasonic vibrator is provided in the lower portion of the branch pipe 5, that is, in the branch pipe 5 near the distribution tray 7 of the polishing device 6. 8 is attached. By operating the ultrasonic vibrator 8, a predetermined vibration is applied to the abrasive passing through the branch pipe 5, and the abrasive grains in the abrasive disperse and disperse from each other and fall on the distribution tray 7. It is supplied from the pipe 9 through the upper platen 10 to the space between the upper and lower platens, and the abrasive grains in the abrasive can be separated and dispersed from each other and supplied as shown in FIG.
【００１１】研磨剤を常に図３のＡの状態で研磨装置へ
供給するには、研磨装置６になるべく近い位置で、研磨
剤に超音波振動をかけることが必要であり、枝配管５に
超音波振動器８を付設することが好ましく、また、主配
管４の所要箇所に超音波振動器を付設することにより、
さらに砥粒の分散性を高め、より安定的に研磨剤を研磨
装置に供給することができる。In order to constantly supply the polishing agent to the polishing apparatus in the state shown in FIG. 3A, it is necessary to apply ultrasonic vibration to the polishing agent at a position as close to the polishing apparatus 6 as possible. It is preferable to attach an ultrasonic vibrator 8, and by attaching an ultrasonic vibrator to a required portion of the main pipe 4,
Furthermore, the dispersibility of the abrasive grains can be increased, and the polishing agent can be more stably supplied to the polishing apparatus.
【００１２】超音波振動器には、公知のいずれの構成の
ものも適用でき、振動数は振動子の構成、研磨剤種、配
管及び流下条件等を考慮して適宜選定すればよい。機械
的加振器には、打撃型、発振型などの公知のいずれの構
成も使用でき、ネットを回転させたり、ボールを運動さ
せて、研磨剤に振動を加える構成であっても利用でき
る。また、超音波振動器、機械的加振器のいずれの場合
も、供給管内に配置したフィルターやネットを介在させ
て、研磨剤に振動を加えることができ、振動をより有効
に作用させることができる。Any known structure may be applied to the ultrasonic vibrator, and the frequency may be appropriately selected in consideration of the structure of the vibrator, the type of abrasive, the piping, the flow-down conditions and the like. For the mechanical shaker, any known structure such as a hitting type or an oscillation type can be used, and a structure in which a net is rotated or a ball is moved to vibrate the abrasive can also be used. Further, in both of the ultrasonic vibrator and the mechanical vibrator, the abrasive can be vibrated by interposing a filter or a net arranged in the supply pipe, and the vibration can be more effectively acted. it can.
【００１３】[0013]
【実施例】図１に示すこの発明による研磨剤の供給装置
において、超音波振動器にフェライト振動子を用い、２
０ｋＨｚ〜３０ｋＨｚの超音波振動を発生させて、半導
体ウェーハの研磨を実施した。研磨剤には、アルミナ系
砥粒を使用した懸濁液に分散効果、防錆効果、キレート
効果、乾き防止効果のそれぞれの効果を有する薬液を添
加したものを使用した。また、図２に示すタンクよりポ
ンプにて主配管４に送り枝配管５を介して研磨装置６に
供給する従来の研磨剤の供給装置にて、上記の研磨剤を
供給し半導体ウェーハの研磨を実施した。EXAMPLE A ferrite vibrator was used as an ultrasonic vibrator in the abrasive supply device according to the present invention shown in FIG.
Polishing of the semiconductor wafer was carried out by generating ultrasonic vibration of 0 kHz to 30 kHz. As the polishing agent, a suspension obtained by adding a chemical liquid having a dispersion effect, a rust preventive effect, a chelate effect, and a dry preventive effect to a suspension using alumina abrasive grains was used. Further, the above-mentioned polishing agent is supplied by the conventional polishing agent supply device that supplies the polishing agent from the tank shown in FIG. Carried out.
【００１４】半導体ウェーハの研磨後、ラップ疵の発生
状況を調べたところ、従来の研磨剤の供給装置の場合と
比較して、この発明による研磨剤の供給装置の場合は従
来より大きく低減できた。After the polishing of the semiconductor wafer, the state of occurrence of lap flaws was examined. As a result, the polishing agent supply device according to the present invention was able to reduce the number significantly compared with the conventional polishing agent supply device. .
【００１５】[0015]
【発明の効果】従来、研磨剤を研磨装置へ供給する際、
使用方法又は配管内圧力、流量、滞留など使用条件によ
り、常に安定に砥粒を分散した研磨剤を供給し難くラッ
プ疵やクラックの原因となっていたが、この発明による
研磨剤の供給方法では、研磨装置の近傍に配設された研
磨剤供給管に超音波振動器または機械的加振器を付設
し、研磨装置に供給直前の研磨剤に直接あるいはネット
またはフィルターを介して振動を与え、使用方法やは条
件にかかわらず研磨砥粒を分散させ、常に安定に分散し
た砥粒を分散した研磨剤を供給することができ、研磨剤
によるラップ疵またはクラックを減少させることができ
る。EFFECT OF THE INVENTION Conventionally, when supplying an abrasive to a polishing apparatus,
Depending on the method of use or the pressure in the pipe, the flow rate, the use conditions such as residence, it was difficult to always supply the abrasive in which the abrasive particles were dispersed stably, which was a cause of lap flaws and cracks. , An ultrasonic vibrator or a mechanical shaker is attached to the polishing agent supply pipe arranged in the vicinity of the polishing apparatus, and the polishing agent immediately before being supplied to the polishing apparatus is vibrated directly or through a net or a filter, Irrespective of the method of use and the conditions, the polishing abrasive grains can be dispersed, and the polishing agent in which the dispersed abrasive grains are dispersed can be always supplied, and the lap defects or cracks due to the polishing agent can be reduced.
【図１】この発明による研磨剤の供給装置の説明図であ
る。FIG. 1 is an explanatory view of a polishing agent supply device according to the present invention.
【図２】従来の研磨剤の供給装置の説明図である。FIG. 2 is an explanatory diagram of a conventional polishing agent supply device.
【図３】上定盤と下定盤間でラッピングされるキャリア
内のウエーハと砥粒との関係を示す説明図であり、Ａは
砥粒が分散した場合、Ｂは砥粒が凝集した場合を示す。[Figure 3] is an explanatory view showing the relationship between the c d Doha and abrasive in the carrier to be lapped between the upper platen and Shitajo Edition, if A is the abrasive grains are dispersed, B is abrasive grains agglomerated The case is shown.
【図４】研磨剤を研磨装置へ供給する経路を示す説明図
である。FIG. 4 is an explanatory diagram showing a path for supplying an abrasive to a polishing apparatus.
１ 集中タンク ２ フィルター ３ ポンプ ４ 主配管 ５ 枝配管 ６ 研磨装置 ７ 分配皿 ８ 超音波振動器 ９ 分配管 １０ 上定盤 １１ 下定盤 １２ キャリア１ １３ ウエーハ １４ 砥粒1 concentrate tank 2 filter 3 pump 4 main pipe 5 branch pipe 6 polishing device 7 distributed dish 8 ultrasonic vibrator 9 minutes pipe 10 the upper polishing plate 11 the lower platen 12 carrier 1 13 c d Doha 14 abrasive
Claims (2)
給して研磨を行う研磨装置への研磨剤の供給方法におい
て、研磨装置の近傍に配設された研磨剤供給管に超音波
振動器または機械的加振器を付設し、研磨装置に供給直
前の研磨剤に直接あるいはネットまたはフィルターを介
して振動を与え、研磨砥粒を分散させて供給することを
特徴とする研磨装置への研磨剤の供給方法。1. A method of supplying an abrasive to a polishing apparatus for supplying an abrasive between a material to be polished and a polishing platen to perform polishing, wherein a polishing agent supply pipe arranged near the polishing apparatus is used. Polishing characterized by attaching an ultrasonic vibrator or mechanical shaker to the polishing device to vibrate the polishing agent immediately before feeding it directly or via a net or filter to disperse and feed abrasive grains A method for supplying an abrasive to an apparatus.
給して研磨を行う研磨装置の研磨剤分配器に接続された
研磨剤供給管に超音波振動器を付設したことを特徴とす
る研磨装置への研磨剤の供給装置。2. An ultrasonic vibrator is attached to a polishing agent supply pipe connected to a polishing agent distributor of a polishing apparatus for supplying a polishing agent between a material to be polished and a polishing platen for polishing. A device for supplying an abrasive to a characteristic polishing device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28090692A JPH06106478A (en) | 1992-09-25 | 1992-09-25 | Supply of polishing agent to polishing device and supply device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28090692A JPH06106478A (en) | 1992-09-25 | 1992-09-25 | Supply of polishing agent to polishing device and supply device thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06106478A true JPH06106478A (en) | 1994-04-19 |
Family
ID=17631595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28090692A Pending JPH06106478A (en) | 1992-09-25 | 1992-09-25 | Supply of polishing agent to polishing device and supply device thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06106478A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998055263A1 (en) * | 1997-06-04 | 1998-12-10 | Speedfam-Ipec Corporation | Method and apparatus for distributing a polishing agent onto a polishing element |
| JP2000031100A (en) * | 1998-06-23 | 2000-01-28 | Samsung Electron Co Ltd | Slurry supply system for semiconductor cmp process |
| EP0990486A1 (en) * | 1997-12-08 | 2000-04-05 | Ebara Corporation | Polishing solution feeder |
| JP2000288914A (en) * | 1999-04-01 | 2000-10-17 | Tama Kagaku Kogyo Kk | Feeding device and feeding method of semiconductor manufacturing abrasive |
| JP2000343418A (en) * | 1999-06-07 | 2000-12-12 | Promos Technol Inc | Slurry feeder and method thereof |
| EP0947291A3 (en) * | 1998-03-30 | 2002-06-05 | SpeedFam-IPEC Inc. | Slurry recycling system of CMP apparatus and method of same |
| WO2003007360A1 (en) * | 2001-07-09 | 2003-01-23 | Motorola, Inc. | Method for chemical mechanical polishing (cmp) with altering the concentration of oxidizing agent in slurry |
| CN1305547C (en) * | 1999-09-28 | 2007-03-21 | 自由度半导体公司 | Filter device and method of use |
| US8801496B2 (en) | 2006-04-28 | 2014-08-12 | HGST Netherlands B.V. | Reducing agglomeration of particles while manufacturing a lapping plate using oil-based slurry |
| CN111531450A (en) * | 2020-06-19 | 2020-08-14 | 湘潭大学 | Take chip-breaker carbide blade chemical mechanical polishing equipment |
-
1992
- 1992-09-25 JP JP28090692A patent/JPH06106478A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998055263A1 (en) * | 1997-06-04 | 1998-12-10 | Speedfam-Ipec Corporation | Method and apparatus for distributing a polishing agent onto a polishing element |
| US6406364B1 (en) | 1997-08-12 | 2002-06-18 | Ebara Corporation | Polishing solution feeder |
| EP0990486A1 (en) * | 1997-12-08 | 2000-04-05 | Ebara Corporation | Polishing solution feeder |
| EP0990486A4 (en) * | 1997-12-08 | 2001-02-28 | Ebara Corp | Polishing solution feeder |
| EP0947291A3 (en) * | 1998-03-30 | 2002-06-05 | SpeedFam-IPEC Inc. | Slurry recycling system of CMP apparatus and method of same |
| JP2000031100A (en) * | 1998-06-23 | 2000-01-28 | Samsung Electron Co Ltd | Slurry supply system for semiconductor cmp process |
| JP2000288914A (en) * | 1999-04-01 | 2000-10-17 | Tama Kagaku Kogyo Kk | Feeding device and feeding method of semiconductor manufacturing abrasive |
| JP2000343418A (en) * | 1999-06-07 | 2000-12-12 | Promos Technol Inc | Slurry feeder and method thereof |
| CN1305547C (en) * | 1999-09-28 | 2007-03-21 | 自由度半导体公司 | Filter device and method of use |
| WO2003007360A1 (en) * | 2001-07-09 | 2003-01-23 | Motorola, Inc. | Method for chemical mechanical polishing (cmp) with altering the concentration of oxidizing agent in slurry |
| US6589099B2 (en) | 2001-07-09 | 2003-07-08 | Motorola, Inc. | Method for chemical mechanical polishing (CMP) with altering the concentration of oxidizing agent in slurry |
| US8801496B2 (en) | 2006-04-28 | 2014-08-12 | HGST Netherlands B.V. | Reducing agglomeration of particles while manufacturing a lapping plate using oil-based slurry |
| CN111531450A (en) * | 2020-06-19 | 2020-08-14 | 湘潭大学 | Take chip-breaker carbide blade chemical mechanical polishing equipment |
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