JPH06104300A - Equipment and method for attaching bonding tape - Google Patents
Equipment and method for attaching bonding tapeInfo
- Publication number
- JPH06104300A JPH06104300A JP4253356A JP25335692A JPH06104300A JP H06104300 A JPH06104300 A JP H06104300A JP 4253356 A JP4253356 A JP 4253356A JP 25335692 A JP25335692 A JP 25335692A JP H06104300 A JPH06104300 A JP H06104300A
- Authority
- JP
- Japan
- Prior art keywords
- suction
- die bond
- substrate
- die
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はダイボンドテープ貼付け
装置及びダイボンドテープ貼付け方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bond tape attaching apparatus and a die bond tape attaching method.
【０００２】半導体デバイスの製造工程において、半導
体チップをリードフレーム等にボンディングする際に
は、通常、先ずリードフレーム等にペースト状の導電性
接着剤を塗布し、この上に半導体チップを押し付けなが
らスクラブして接着している。ところがＩＣカード等の
場合には、スクラブのための充分なスペースがないこと
が多い、半導体チップが薄肉のために接着剤がチップの
上面に這い上がることがある、等の理由で、ペースト状
の接着剤の代わりに接着剤をリボン状にしたダイボンド
テープ（ダイボンドリボンとも言う）を使用し、その切
断片を加熱したカード基板に貼り付ける方法を採ること
が多くなっている。In the process of manufacturing a semiconductor device, when a semiconductor chip is bonded to a lead frame or the like, usually, a paste-like conductive adhesive is first applied to the lead frame or the like, and a scrub is performed while pressing the semiconductor chip thereon. Then glued. However, in the case of an IC card or the like, there is often not enough space for scrubbing, and because the semiconductor chip is thin, the adhesive may crawl onto the upper surface of the chip, and so on. In many cases, a die-bonding tape (also referred to as a die-bonding ribbon) in which the adhesive is formed into a ribbon is used instead of the adhesive and the cut piece is attached to a heated card substrate.
【０００３】[0003]
【従来の技術】従来のダイボンドテープ貼付け装置及び
ダイボンドテープ貼付け方法を図３を参照しながら説明
する。2. Description of the Related Art A conventional die bond tape attaching apparatus and die bond tape attaching method will be described with reference to FIG.
【０００４】図３ (a)〜(c) は従来例の説明図である。
同図において、１はダイボンドテープ、２はカード基
板、13はダイボンドテープ貼付け装置の吸着ヘッドであ
る。吸着ヘッド13の吸着面は平面であり、この吸着面に
は数個の吸引孔の一端が開口している。FIGS. 3A to 3C are explanatory views of a conventional example.
In the figure, 1 is a die bond tape, 2 is a card substrate, and 13 is a suction head of a die bond tape attaching apparatus. The suction surface of the suction head 13 is a flat surface, and one end of several suction holes is opened in this suction surface.
【０００５】ダイボンドテープ貼付け装置は先ずダイボ
ンドテープ１を所定の寸法に切断し、これを吸着ヘッド
13の吸着面に真空吸着してカード基板２上に搬送し、こ
れをカード基板２に押圧した後、真空吸着を解除して元
の位置に戻る。カード基板２は加熱されており、ダイボ
ンドテープ１はカード基板２に貼り付く。In the die bond tape sticking apparatus, first, the die bond tape 1 is cut into a predetermined size, which is then sucked by a suction head.
The suction surface of 13 is vacuum-sucked and conveyed onto the card substrate 2, pressed against the card substrate 2, and then the vacuum suction is released to return to the original position. The card substrate 2 is heated and the die bond tape 1 is attached to the card substrate 2.
【０００６】[0006]
【発明が解決しようとする課題】ところが、このような
ダイボンドテープ貼付け装置では、吸着ヘッドの吸着面
が平面であるから、吸着面とカード基板とが完全に平行
となるように調整することが困難である、という問題が
あった。吸着面とカード基板との平行性が良くなければ
ダイボンドテープとカード基板との密着は局部的とな
り、密着していない部分ではダイボンドテープにシワが
発生する等して、半導体チップのボンディングに支障を
来すことになる。However, in such a die bond tape sticking apparatus, since the suction surface of the suction head is a flat surface, it is difficult to adjust the suction surface and the card substrate so as to be completely parallel to each other. There was a problem that was. If the suction surface and the card substrate are not parallel to each other well, the die bond tape and the card substrate will adhere locally, and wrinkles will occur on the die bond tape in the areas where they do not adhere, which hinders the bonding of the semiconductor chip. Will come.
【０００７】本発明は、このような問題を解決して、吸
着ヘッドの吸着面とカード基板との平行性調整が容易で
あり、しかもダイボンドテープをカード基板に常に密着
させることが可能なダイボンドテープ貼付け装置及びダ
イボンドテープ貼付け方法を提供することを目的とす
る。The present invention solves such a problem and makes it easy to adjust the parallelism between the suction surface of the suction head and the card substrate, and moreover, the die bond tape can be always brought into close contact with the card substrate. It is an object to provide a sticking device and a die bond tape sticking method.
【０００８】[0008]
【課題を解決するための手段】この目的は本発明によれ
ば、〔１〕吸着面が円柱面をなす吸着ヘッドを有し、該
吸着ヘッドがその吸着面に真空吸着して基板上に搬送し
たダイボンドテープを該基板に押圧した後、該吸着面か
ら圧気を噴射するように構成したことを特徴とするダイ
ボンドテープ貼付け装置とすることで、〔２〕前記
〔１〕において、真空源と圧気源とに連通する管路切替
え手段を有し、前記吸着ヘッドの吸着面に開口する吸引
孔が該管路切替え手段を介して該真空源と該圧気源の一
方に連通するように構成することで、〔３〕吸着ヘッド
がその吸着面にダイボンドテープを真空吸着して基板上
に搬送した後、真空吸着を解除すると共に該吸着面から
圧気を噴射して該ダイボンドテープを基板上に密着させ
ることを特徴とするダイボンドテープ貼付け方法とする
ことで、達成される。According to the present invention, there is provided [1] a suction head having a cylindrical surface as a suction surface, the suction head vacuum suctioning the suction surface and transporting the suction head onto a substrate. The die-bonding tape sticking device is characterized in that the die-bonding tape is pressed against the substrate, and then pressured air is ejected from the suction surface. [2] In the above [1], the vacuum source and the pressured air are used. A suction passage opening to the suction surface of the suction head so as to communicate with one of the vacuum source and the compressed air source via the passage switching means. [3] After the suction head vacuum-sucks the die bond tape on the suction surface and conveys the die bond tape onto the substrate, the vacuum suction is released, and compressed air is jetted from the suction surface to bring the die bond tape into close contact with the substrate. Characterized by With bond tape joining method is achieved.
【０００９】[0009]
【作用】吸着ヘッドの吸着面が平面である場合、ダイボ
ンドテープを全面でカード基板に密着させるためには、
吸着ヘッドがカード基板に面接触するように装置を調整
しておく必要があるが、これはかなり困難な作業であ
り、不完全な調整がなされることが多い。[Function] When the suction surface of the suction head is flat, in order to bring the die bond tape into close contact with the card substrate over the entire surface,
It is necessary to adjust the device so that the suction head comes into surface contact with the card substrate, but this is a fairly difficult task, and incomplete adjustment is often made.
【００１０】これに対して本発明では、吸着ヘッドの吸
着面を円柱面状の曲面としたから、吸着ヘッドがカード
基板に線接触するように装置を調整すればよく、作業は
容易となり、完全な調整が期待出来る。但し、このよう
な吸着ヘッドによりダイボンドテープをカード基板に押
圧すると密着するのは押圧された帯状の狭い部分だけで
ある。そこで残りの部分は吸着面に開口する噴気孔から
圧気を噴射させてその風圧により密着させる。吸着ヘッ
ドがダイボンドテープの中央を帯状に押圧した状態でそ
の両側に圧気を吹き付けるから、ダイボンドテープはシ
ワを発生することなく密着する。On the other hand, in the present invention, since the suction surface of the suction head is a cylindrical curved surface, it is sufficient to adjust the device so that the suction head comes into line contact with the card substrate. Can be expected to be adjusted. However, when the die bond tape is pressed against the card substrate by such a suction head, only the narrow band-shaped portion that is pressed is brought into close contact. Therefore, the remaining portion is made to inject pressured air from the air vent opening on the adsorption surface and is brought into close contact with the air pressure. Since the suction head presses the center of the die bond tape in a strip shape and blows pressure air to both sides of the die bond tape, the die bond tape adheres without wrinkles.
【００１１】更に、吸着のための真空の管路とこの圧気
の管路との切替え手段を設けることにより、吸着ヘッド
に特に噴気孔を設けず、吸引孔を利用して圧気を噴射す
ることが出来る。Further, by providing a means for switching between a vacuum pipe line for adsorption and this compressed air pipe, it is possible to inject compressed air using the suction hole without providing a special ejection hole in the adsorption head. I can.
【００１２】[0012]
【実施例】本発明に係るダイボンドテープ貼付け装置及
びダイボンドテープ貼付け方法の実施例を図１及び図２
を参照しながら説明する。EXAMPLES Examples of a die bond tape attaching apparatus and a die bond tape attaching method according to the present invention are shown in FIGS.
Will be described with reference to.
【００１３】このダイボンドテープ貼付け装置は、テー
プ供給部、テープ切断部、テープ搬送部、基板装着部等
からなり、テープ供給部の送り機構（例えばグリップフ
ィーダ）がダイボンドテープをリールから所定の寸法だ
け引出し、これをテープ切断部のカッタが切断し、これ
をテープ搬送部の吸着ヘッドが真空吸着して搬送し、基
板装着部に装着したカード基板上に貼り付けるように構
成されている。This die bond tape sticking apparatus comprises a tape supply section, a tape cutting section, a tape transport section, a substrate mounting section, etc., and a feeding mechanism (eg, a grip feeder) of the tape supply section moves the die bond tape from the reel to a predetermined size. It is configured such that it is pulled out and cut by a cutter of a tape cutting unit, and a suction head of a tape transport unit suctions it by vacuum and transports it, and affixes it on a card substrate mounted in a substrate mounting unit.
【００１４】この送り機構、カッタ、吸着ヘッド等は、
一個のモータによって回転するカムにより動作する。
又、このモータによって回転するスリット円板が数枚あ
り、それぞれモータの回転に同期した光のパルスを光セ
ンサに送り、光センサはこれを電気信号に変えてタイミ
ング信号として出力する。The feeding mechanism, cutter, suction head, etc.,
It is operated by a cam that is rotated by a single motor.
Further, there are several slit disks rotated by this motor, and each sends a pulse of light synchronized with the rotation of the motor to the optical sensor, and the optical sensor converts this into an electric signal and outputs it as a timing signal.
【００１５】図１は本発明の実施例の装置要部の説明図
である。吸着ヘッド３の吸着面3aは円柱面状の曲面をな
している。この吸着面3aには、数個の吸引孔3bの一端が
開口している。これらの吸引孔3bは他端では一個に統合
されて電磁切替え弁（管路切替え手段）４に連通してお
り、この電磁切替え弁４は真空源（図示は省略）及びN
2 等の圧気供給源（図示は省略）に連通している。電磁
切替え弁４から圧気供給源に至る管路には電磁開閉弁５
が挿入されている。この電磁切替え弁４と電磁開閉弁５
の作動は上記光センサからのタイミング信号により制御
される。FIG. 1 is an explanatory view of the main part of the apparatus according to the embodiment of the present invention. The suction surface 3a of the suction head 3 has a cylindrical curved surface. One end of several suction holes 3b is opened in this suction surface 3a. These suction holes 3b are integrated into one at the other end and communicate with an electromagnetic switching valve (pipe switching means) 4, which is connected to a vacuum source (not shown) and N.
It communicates with a compressed air supply source (not shown) such as 2 . An electromagnetic opening / closing valve 5 is provided in the conduit from the electromagnetic switching valve 4 to the compressed air supply source.
Has been inserted. This solenoid switching valve 4 and solenoid on-off valve 5
Is controlled by a timing signal from the optical sensor.
【００１６】図２(a) 〜(d) は本発明の実施例の方法の
説明図である。先ず所定の寸法に切断されたダイボンド
テープ１を吸着ヘッド３の吸着面3a（図１参照）に真空
吸着する。次に吸着ヘッド３がカード基板２直上に移動
し（図２(a) 参照）、更に降下してダイボンドテープ１
をカード基板２に押圧する（図２(b) 参照）。その直
後、光センサからの信号により電磁切替え弁４（図１参
照）が管路を切り替えると共に電磁開閉弁５（図１参
照）が開いて、真空吸着が解除されると共に吸引孔3b
（図１参照）から圧気（ N2 ）が噴射する。その後、吸
着ヘッド３が上昇を開始し（図２(c) 参照）、間もなく
電磁開閉弁５が閉じて圧気の噴射が終了する。この圧気
噴射によりダイボンドテープ１は全面にわたりカード基
板２に密着する（図２(d) 参照）。2 (a) to 2 (d) are explanatory views of the method according to the embodiment of the present invention. First, the die bond tape 1 cut into a predetermined size is vacuum-sucked to the suction surface 3a (see FIG. 1) of the suction head 3. Next, the suction head 3 moves directly above the card substrate 2 (see FIG. 2 (a)), and further descends to die bond tape 1
Is pressed against the card substrate 2 (see FIG. 2 (b)). Immediately after that, the electromagnetic switching valve 4 (see FIG. 1) switches the conduit and the electromagnetic on-off valve 5 (see FIG. 1) is opened by the signal from the optical sensor, the vacuum suction is released, and the suction hole 3b is released.
(Refer to FIG. 1) The compressed air (N 2 ) is injected. After that, the suction head 3 starts to rise (see FIG. 2 (c)), and soon the electromagnetic opening / closing valve 5 is closed and the injection of compressed air is completed. By this air pressure injection, the die bond tape 1 is brought into close contact with the card substrate 2 over the entire surface (see FIG. 2 (d)).
【００１７】尚、ダイボンドテープ１の厚さ、カード基
板１の温度等の条件によっては、圧気噴射開始のタイミ
ングを吸着解除から若干遅らせた方が良い場合がある。
圧気噴射の開始及び停止のタイミングを変えるには、ス
リット円板のスリットの位置を移動する。Depending on the conditions such as the thickness of the die bond tape 1 and the temperature of the card substrate 1, it may be better to slightly delay the pressure injection start timing from the adsorption release.
To change the timing of starting and stopping the pressure injection, the position of the slit of the slit disk is moved.
【００１８】本発明は以上の実施例に限定されることな
く、更に種々変形して実施することが出来る。例えば、
電磁開閉弁５を電磁切替え弁４から圧気供給源ではなく
真空源に至る管路側に挿入してもよく、電磁切替え弁４
を使用せずに二個の電磁開閉弁５で分岐した管路を別々
に開閉してもよい。又、タイミングの調整にタイマーを
使用してもよい。The present invention is not limited to the above embodiments, but can be implemented with various modifications. For example,
The electromagnetic on-off valve 5 may be inserted from the electromagnetic switching valve 4 to the side of the conduit from the air pressure supply source to the vacuum source.
It is also possible to separately open and close the pipes branched by the two electromagnetic opening / closing valves 5 without using. A timer may be used to adjust the timing.
【００１９】[0019]
【発明の効果】以上説明したように、本発明によれば、
吸着ヘッドの吸着面とカード基板との平行性調整が容易
であり、しかもダイボンドテープをカード基板に常に密
着させることが可能なダイボンドテープ貼付け装置及び
ダイボンドテープ貼付け方法を提供することが出来、Ｉ
Ｃカード等の製造の歩留り向上等に寄与する。As described above, according to the present invention,
It is possible to provide a die bond tape sticking device and a die bond tape sticking method which can easily adjust the parallelism between the suction surface of the suction head and the card board and can always bring the die bond tape into close contact with the card board.
It contributes to the improvement of the production yield of C cards and the like.
【図１】 本発明の実施例の装置要部の説明図である。FIG. 1 is an explanatory diagram of a main part of an apparatus according to an embodiment of the present invention.
【図２】 本発明の実施例の方法の説明図である。FIG. 2 is an explanatory diagram of a method according to an embodiment of the present invention.
【図３】 従来例の説明図である。FIG. 3 is an explanatory diagram of a conventional example.
１ ダイボンドテープ ２ カード基板（基板） ３，13 吸着ヘッド 3a 吸着面 3b 吸引孔 ４ 電磁切替え弁（管路切替え手段） ５ 電磁開閉弁 1 Die bond tape 2 Card substrate (substrate) 3,13 Suction head 3a Suction surface 3b Suction hole 4 Electromagnetic switching valve (pipe switching means) 5 Electromagnetic on-off valve
Claims (3)
(3) を有し、 該吸着ヘッド(3) がその吸着面(3a)に真空吸着して基板
(2) 上に搬送したダイボンドテープ(1) を該基板(2) に
押圧した後、該吸着面(3a)から圧気を噴射するように構
成したことを特徴とするダイボンドテープ貼付け装置。1. A suction head in which the suction surface (3a) is a cylindrical surface.
(3), and the suction head (3) vacuum-sucks the suction surface (3a) of the substrate.
(2) A die bond tape sticking device characterized in that after the die bond tape (1) conveyed above is pressed against the substrate (2), compressed air is jetted from the suction surface (3a).
手段(4) を有し、 前記吸着ヘッド(3) の吸着面(3a)に開口する吸引孔(3b)
が該管路切替え手段(4) を介して該真空源と該圧気源の
一方に連通するように構成したことを特徴とする請求項
１記載のダイボンドテープ貼付け装置。2. A suction hole (3b) having a conduit switching means (4) communicating with a vacuum source and a pressure air source and opening on a suction surface (3a) of the suction head (3).
2. The die bond tape sticking device according to claim 1, wherein said device is configured so as to communicate with one of said vacuum source and said compressed air source through said conduit switching means (4).
ボンドテープ(1) を真空吸着して基板(2) 上に搬送した
後、真空吸着を解除すると共に該吸着面(3a)から圧気を
噴射して該ダイボンドテープ(1) を基板(2) 上に密着さ
せることを特徴とするダイボンドテープ貼付け方法。3. The suction head (3) vacuum-sucks the die bond tape (1) onto the suction surface (3a) of the die-bonding tape (1) and conveys it onto the substrate (2), and then the vacuum suction is released and the suction surface (3a) is released. A method for applying a die bond tape, characterized in that the die bond tape (1) is brought into close contact with the substrate (2) by injecting compressed air from the die.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4253356A JPH06104300A (en) | 1992-09-24 | 1992-09-24 | Equipment and method for attaching bonding tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4253356A JPH06104300A (en) | 1992-09-24 | 1992-09-24 | Equipment and method for attaching bonding tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06104300A true JPH06104300A (en) | 1994-04-15 |
Family
ID=17250203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4253356A Pending JPH06104300A (en) | 1992-09-24 | 1992-09-24 | Equipment and method for attaching bonding tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06104300A (en) |
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| JP2002280398A (en) * | 2001-03-22 | 2002-09-27 | Rohm Co Ltd | Apparatus and method of manufacturing semiconductor device |
| JP2002368023A (en) * | 2001-06-06 | 2002-12-20 | Hitachi Ltd | Method of manufacturing semiconductor device |
| EP1321966A1 (en) * | 2001-12-21 | 2003-06-25 | Esec Trading S.A. | Gripping tool for mounting semiconductor chips |
| KR20030052986A (en) * | 2001-12-21 | 2003-06-27 | 에섹 트레이딩 에스에이 | Pick-up tool for mounting semiconductor chips |
| JP2003318204A (en) * | 2002-04-23 | 2003-11-07 | Matsushita Electric Ind Co Ltd | Nozzle for chip suction, chip mounter and chip mounting method |
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| US6825249B1 (en) | 1994-12-26 | 2004-11-30 | Hitachi Chemical Co., Ltd. | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device |
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| US6855579B2 (en) | 1995-07-06 | 2005-02-15 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
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1992
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| US6825249B1 (en) | 1994-12-26 | 2004-11-30 | Hitachi Chemical Co., Ltd. | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device |
| US7387914B2 (en) | 1995-07-06 | 2008-06-17 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
| US6717242B2 (en) | 1995-07-06 | 2004-04-06 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
| US6855579B2 (en) | 1995-07-06 | 2005-02-15 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
| US7057265B2 (en) | 1995-07-06 | 2006-06-06 | Hitachi Chemical Co., Ltd. | Semiconductor device and process for fabrication thereof |
| US7078094B2 (en) | 1995-07-06 | 2006-07-18 | Hitachi Chemical Co., Ltd. | Semiconductor device and process for fabrication thereof |
| US7781896B2 (en) | 1995-07-06 | 2010-08-24 | Hitachi Chemical Co., Ltd. | Semiconductor device and process for fabrication thereof |
| JP2002280398A (en) * | 2001-03-22 | 2002-09-27 | Rohm Co Ltd | Apparatus and method of manufacturing semiconductor device |
| JP4646426B2 (en) * | 2001-03-22 | 2011-03-09 | ローム株式会社 | Manufacturing method of semiconductor device |
| JP2002368023A (en) * | 2001-06-06 | 2002-12-20 | Hitachi Ltd | Method of manufacturing semiconductor device |
| EP1321966A1 (en) * | 2001-12-21 | 2003-06-25 | Esec Trading S.A. | Gripping tool for mounting semiconductor chips |
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