JPH06104027A - Sleeve material for crimping and connection body - Google Patents
Sleeve material for crimping and connection bodyInfo
- Publication number
- JPH06104027A JPH06104027A JP24755192A JP24755192A JPH06104027A JP H06104027 A JPH06104027 A JP H06104027A JP 24755192 A JP24755192 A JP 24755192A JP 24755192 A JP24755192 A JP 24755192A JP H06104027 A JPH06104027 A JP H06104027A
- Authority
- JP
- Japan
- Prior art keywords
- sleeve
- filament
- filaments
- connection
- crimping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、金属系の超電導線のフ
ィラメント同士を接続するための圧着用スリーブに関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a crimping sleeve for connecting filaments of metallic superconducting wires.
【０００２】[0002]
【従来の技術】接続用超電導線は多数の超電導素線（以
下、フィラメント）を銅（Ｃｕ）やアルミニウム（Ａ
ｌ）のような安定化材料中に埋設し、所望の外径まで伸
線加工を施したものを集積した超電導ファインマルチ線
が使用されている。従来から知られている接続にはんだ
付法，ろう付法，圧着法，溶接法等が試みられている
が、いずれも接続部の電気抵抗が大きく、かつ通電時の
発熱量が多くなるので、実用上問題があった。2. Description of the Related Art A superconducting wire for connection uses a large number of superconducting element wires (hereinafter referred to as filaments) made of copper (Cu) or aluminum (A).
There is used a superconducting fine multi-wire which is embedded in a stabilizing material such as 1) and is drawn and drawn to a desired outer diameter. Although the soldering method, the brazing method, the crimping method, the welding method and the like have been attempted for the conventionally known connection, all of them have a large electric resistance at the connection portion and generate a large amount of heat when energized. There was a problem in practice.
【０００３】超電導フィラメントの接続にはこれを改善
するため特開昭59−16207 号公報に記載のように露出さ
れたフィラメントが相互に重ねられて圧着用スリーブ内
に収納されると共に、圧着用スリーブを介して押し圧す
ることにより電気的導通状態にする方法が採られてい
る。この接続方法は、接続すべき超電導線の安定化材を
除去して露出させた超電導体フィラメントを、相互に重
ねて接続用のスリーブ内に収納すると共にスリーブを介
して圧着し、収納された超電導体フィラメントを相互に
圧着，接続するものである。In order to improve the connection of the superconducting filaments, the exposed filaments are stacked on top of each other and housed in the crimping sleeve as described in JP-A-59-16207. A method is adopted in which an electric conduction state is achieved by pressing pressure through. This connection method involves removing the stabilizer of the superconducting wire to be connected and exposing the exposed superconducting filaments, stacking them on top of each other and storing them in a sleeve for connection, and crimping through the sleeve to store the superconducting wires. The body filaments are crimped and connected to each other.
【０００４】しかし、この接続方法では、互いに接続し
ようとするフィラメントは、その外面の重なり合う部分
しか接触せず、高い臨界電流値を確保するのが難しい。
また、接続用のスリーブの硬さには考慮されておらず、
フィラメントがスリーブにより断線すると言う問題があ
った。However, in this connection method, the filaments to be connected to each other contact only the overlapping portions of the outer surfaces thereof, and it is difficult to secure a high critical current value.
Also, the hardness of the sleeve for connection is not considered,
There is a problem that the filament is broken by the sleeve.
【０００５】更に超電導体のフィラメントの充填率を向
上させるために特開昭62−234880号公報の超電導線の接
合方法が提案されている。この方法は露出された芯線の
それぞれに連結用超電導線の露出された複芯を挾み合わ
せ、挾み合わせ部を一体に金属リングにより覆い、この
金属リングを圧着して接合することを特徴とする。その
例は連結用超電導線のフィラメントの先端部を超電導線
の各安定化材の端部まで覆うように延材させ、この延材
したフィラメントの先端に金属リングの端部が位置する
ようにして圧着している。この例のように超電導素線
（フィラメント）が非常に少ない場合は、連結用超電導
フィラメントを適用することは充填率を向上させるため
に有効である。しかし、接続用のスリーブの硬さは考慮
されておらず、フィラメントがスリーブにより断線する
と言う欠点があった。また、硬いスリーブのためフィラ
メント同士の密着性はまだ十分とは言えなかった。この
ような原因から接続抵抗値がばらつく問題があり、永久
電流超電導線になっていない欠点があった。In order to further improve the filling rate of the filament of the superconductor, a method for joining superconducting wires has been proposed in Japanese Patent Laid-Open No. 234880/1987. This method is characterized in that the exposed multiple cores of the superconducting wire for connection are sandwiched with each exposed core wire, the sandwiched portion is integrally covered with a metal ring, and this metal ring is pressure-bonded and joined. To do. In that example, the tip of the filament of the connecting superconducting wire is extended to cover the end of each stabilizing material of the superconducting wire, and the end of the metal ring is positioned at the tip of the filament. It is crimped. When the number of superconducting element wires (filaments) is very small as in this example, applying a superconducting filament for connection is effective for improving the filling rate. However, the hardness of the connecting sleeve is not taken into consideration, and there is a drawback that the filament breaks due to the sleeve. In addition, because of the hard sleeve, the adhesion between filaments was not yet sufficient. Due to such a cause, there is a problem that the connection resistance value varies, and there is a defect that the permanent current superconducting wire is not formed.
【０００６】[0006]
【発明が解決しようとする課題】上記従来技術はフィラ
メントを押し圧する安定化材自身の硬さについて考慮さ
れておらず、そのため真の超電導線同士の接続が達成さ
れず、それに伴う永久的な電気特性にも問題があった。
つまり、フィラメントをスリーブで押し圧して固定して
いるが、フィラメント同士の近接効果や分流損失等の防
止を達成する接続までに至っていない。The above-mentioned prior art does not consider the hardness of the stabilizer itself which presses the filament, and therefore the true superconducting wires cannot be connected to each other, resulting in permanent electric conduction. There was also a problem with the characteristics.
That is, although the filaments are pressed and fixed by the sleeve, they have not yet been connected to achieve the proximity effect between filaments and the prevention of shunt loss.
【０００７】本発明の目的は、フィラメント同士を近接
させ、充填率を向上させた接続用安定化スリーブを提供
することであり、さらにそのスリーブを使用して電流減
衰率が著しく小さく長期安定した接続体等を提供するこ
とにある。An object of the present invention is to provide a stabilizing sleeve for connection in which filaments are brought close to each other and the filling rate is improved. Further, by using the sleeve, the current attenuation rate is remarkably small and a stable connection is achieved for a long period of time. To provide the body etc.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するた
め、本発明は、安定化材中に複数の超電導素線（フィラ
メント）が埋設されている超電導線を薬品で安定化材を
溶かし、その結果、露出されたフィラメント同士を圧着
用スリーブで圧着するスリーブ材において、フィラメン
トを包み込む前記スリーブ材の硬度Ｈｖ３０〜６０にあ
らかじめ処理した圧着用スリーブ材を提供する。In order to achieve the above-mentioned object, the present invention is to dissolve a superconducting wire in which a plurality of superconducting element wires (filaments) are embedded in a stabilizing material with a chemical, As a result, in the sleeve material in which the exposed filaments are crimped by the crimping sleeve, the crimping sleeve material that has been pretreated to the hardness Hv30 to 60 of the sleeve material that wraps the filaments is provided.
【０００９】前記圧着用スリーブ材は、フィラメントと
接触する部分の穴径の２倍の範囲を硬度Ｈｖ３０〜６０
にコントロールし、その周りがＨｖ６０より高い硬度に
なるように硬度勾配を有した圧着用スリーブ材である。The pressure-bonding sleeve material has a hardness Hv30 to 60 in a range of twice the hole diameter of the portion in contact with the filament.
The sleeve material for pressure bonding has a hardness gradient so that the hardness around it is higher than Hv60.
【００１０】また、本発明は、前記スリーブ材はフィラ
メントと接触する部分の穴径の２倍の範囲をアルミニウ
ム材とし、その外側を銅材で複合化した圧着用スリーブ
材を提供する。スリーブ材の形状としては、穴径の約３
倍以上を有することが必要である。その理由は、フィラ
メントの反発力を拘束するための必要量である。The present invention also provides a sleeve material for crimping, wherein the sleeve material is made of an aluminum material in the range of twice the hole diameter of the portion in contact with the filament, and the outside is compounded with a copper material. The sleeve material has a hole diameter of about 3
It is necessary to have more than double. The reason is the amount required to restrain the repulsive force of the filament.
【００１１】更に、本発明は、前述した本発明の圧着用
スリーブにより、前記フィラメント同士を圧着し接続し
た接続体を提供する。Furthermore, the present invention provides a connection body in which the filaments are pressure-bonded and connected by the pressure-bonding sleeve of the present invention described above.
【００１２】また、本発明の圧着用スリーブにより、前
記フィラメント同士と前記フィラメント同士を包み込む
他の接続補助用のフィラメントを同時に圧着し、接続し
た接続体を提供する。Further, by the crimping sleeve of the present invention, there is provided a connected body in which the filaments and another filament for wrapping the filaments for connection assistance are crimped and connected at the same time.
【００１３】そして本発明の圧着用スリーブで圧着し接
続した接続体は、１０-12Ω以下の接続抵抗を有し、か
つ前記超電導線の臨界電流値の８０％以上の臨界電流値
を有している接続体であることも本発明の特徴としてい
る。The connecting body crimped and connected by the crimping sleeve of the present invention has a connection resistance of 10 -12 Ω or less and a critical current value of 80% or more of the critical current value of the superconducting wire. It is also a feature of the present invention that it is a connected body.
【００１４】[0014]
【作用】本発明の超電導線の接続部分は、軟らかい圧着
用スリーブにより超電導フィラメント同士が安定化材の
中心部に集まり、フィラメント同士の接触と充填率が向
上して密に接続されているため、フィラメント同士の近
接効果が十分に得られる。圧着用スリーブとはどう言う
作用をするか考えて見る。接続したいフィラメントとフ
ィラメント、それを包み込む接続補助のフィラメントを
圧着スリーブ中に挿入する。いま上下方向からの押し圧
で圧着する方法を試みる。圧着用スリーブの中には安定
化材中に複数の超電導素線が埋設されている超電導線が
数mmは入り、フィラメントと一緒に押し圧され接続され
る。In the connecting portion of the superconducting wire of the present invention, since the superconducting filaments are gathered in the central portion of the stabilizing material by the soft crimping sleeve, the filaments are contacted with each other and the filling rate is improved so that the filaments are closely connected. Sufficient proximity effect between filaments is obtained. Consider how the crimping sleeve works. Insert the filament to be connected, the filament, and the connection-enhancing filament that wraps the filament into the crimp sleeve. Now try the method of crimping with pressing pressure from the vertical direction. A few millimeters of superconducting wire, in which a plurality of superconducting element wires are embedded in a stabilizing material, is inserted into the crimping sleeve, and is pressed and connected together with the filament.
【００１５】超電導線の線径は種々あるが¢１.０mm、
フィラメントは¢０.０６mm、圧着用安定化材としてＣ
ｕスリーブ（穴径：２.２mm ）と仮定して考える。硬さ
の高い順序はフィラメント，超電導線，Ｃｕスリーブと
なる。Ｃｕスリーブは線引き加工されており硬さは約１
１０Ｈｖである。硬度Ｈｖ１１０を有するＣｕスリーブ
が押し圧され、まず¢１.０mm の超電導線に接触する。
超電導線は安定化Ｃｕの中に超電導素線が埋設されてお
り、なかなか潰れ難い。しかし、押し圧の増加と共に僅
かに潰れ、Ｃｕスリーブはこの系では最も軟らかいため
横方向に延びながら次にフィラメントに接触し、フィラ
メント同士を押圧する。There are various diameters of superconducting wires, but they are 1.0 mm,
Filament is 0.06 mm, and C is used as a stabilizing material for pressure bonding.
Consider the u-sleeve (hole diameter: 2.2 mm). The order of high hardness is filament, superconducting wire, and Cu sleeve. The Cu sleeve is drawn and has a hardness of about 1
It is 10 Hv. A Cu sleeve having a hardness of Hv110 is pressed and first contacts a superconducting wire of 1.0 mm.
The superconducting wire has a superconducting element wire embedded in stabilized Cu and is difficult to be crushed. However, as the pressing pressure increases slightly, the Cu sleeve is the softest in this system, so that the Cu sleeve contacts the filaments while extending in the lateral direction and presses the filaments together.
【００１６】Ｃｕスリーブの内面はフィラメントを押し
圧しながら塑性変形し段々に硬さは増加する。硬さが高
くなったＣｕはフィラメントをスリーブの中心に向かっ
て押圧する。そして押圧の進行と共に数mm入っている¢
１.０mm の超電導線と近傍のフィラメントに大きな剪断
応力が作用することになる。フィラメントの線径は０.
０６mm と小さく、硬くなったＣｕにより断線に追い込
まれる現象が現われる。かと言ってフィラメントが断線
しないように押圧を少なくするとフィラメントの充填率
の低下及び部品として使用中にフィラメントが動き、接
続抵抗を発生する原因となる。The inner surface of the Cu sleeve is plastically deformed while pressing the filament, and the hardness gradually increases. The increased hardness pushes the filament toward the center of the sleeve. And as the pressing progresses, a few mm are entered.
A large shear stress will be applied to the 1.0 mm superconducting wire and the nearby filament. The filament diameter is 0.
As a result of the hardened Cu, which is as small as 06 mm, the phenomenon of being driven into a wire breakage appears. On the other hand, if the pressure is reduced so that the filament is not broken, the filling rate of the filament may decrease and the filament may move during use as a component, causing connection resistance.
【００１７】そこでフィラメントを断線しないように、
かつフィラメント同士の接触を向上させ、Ｃｕスリーブ
中のフィラメントの充填率を向上させるためには、Ｃｕ
スリーブの硬さを制御することが必要であると考えた。
ダイスにより線引きされて作製するＣｕスリーブは加工
のため硬化している。Ｃｕは３００℃以上で再結晶を生
じ、軟化して硬さを低下させる。熱処理温度により硬さ
を変化させ、種々の硬さのものについて圧着を試みた結
果、Ｃｕスリーブ内面の硬さはＨｖ３０〜６０の範囲が
良いことが判明した。硬さが従来硬さの約半分になると
安定化Ｃｕの伸び率は２倍以上になることも分かり、こ
の伸びの増加により超電導フィラメントの剪断応力を緩
和し、圧着端子自らが変形しながらフィラメント同士の
接触を推し進めていく現象が明らかになった。Therefore, in order not to break the filament,
In addition, in order to improve the contact between filaments and the filling rate of the filaments in the Cu sleeve, Cu is used.
We thought that it was necessary to control the hardness of the sleeve.
The Cu sleeve drawn by drawing with a die is hardened for processing. Cu recrystallizes at 300 ° C. or higher and softens to lower the hardness. As a result of changing the hardness according to the heat treatment temperature and attempting pressure bonding with various hardnesses, it was found that the hardness of the inner surface of the Cu sleeve is preferably Hv30 to 60. It was also found that the elongation rate of stabilized Cu becomes more than double when the hardness becomes about half of the conventional hardness, and the shear stress of the superconducting filament is relieved by this increase in the elongation, and the crimp terminal deforms itself and the filaments The phenomenon that promotes the contact of
【００１８】Ｃｕスリーブの硬さは全体がＨｖ３０〜６
０になっている必要は無く、むしろフィラメントと接触
する範囲だけが軟らかく、その外周は硬い方がより好ま
しい。すなわち、軟らかい内面でフィラメントを押圧し
てフィラメントを包み込み、外周の硬いＣｕでフィラメ
ントの反発力を拘束するようにする。このようにスリー
ブの内面と外周の硬さを変えるには、Ｃｕ材の場合は、
あなの開いた内面にレーザ，高周波，電子ビーム等によ
り集中加熱して熱処理することにより達成される。ま
た、内面にＨｖ３０〜５０硬度のＡｌ等を内面クラッド
（外面はＣｕ等）した複合材を適用しても、本発明は達
成できる。The hardness of the Cu sleeve is Hv30-6 as a whole.
It is not necessary that it be 0, rather, it is more preferable that only the area in contact with the filament is soft and the outer circumference is hard. That is, the filament is wrapped by pressing the filament with a soft inner surface, and the repulsive force of the filament is constrained by the hard Cu on the outer periphery. In this way, in order to change the hardness of the inner surface and outer circumference of the sleeve, in the case of Cu material,
This is achieved by subjecting the open inner surface to concentrated heating with a laser, a high frequency wave, an electron beam, or the like and heat treatment. The present invention can also be achieved by applying a composite material in which Al or the like having an Hv of 30 to 50 hardness is clad on the inner surface (Cu or the like on the outer surface) on the inner surface.
【００１９】内面の軟らかい範囲は、挿入するフィラメ
ントの量によるが実験の結果、穴径の約２倍の範囲相当
が適当であることが分かった。すなわち、例えば、¢
２.２mmの穴径の場合は、¢４.４mm の範囲を軟化させ
ておけば良いことになる。その外周の径はスリーブ内径
の約３倍以上が必要で、良好な拘束力が得られる。更に
安定化させるためには４倍程の形状を適用した方がより
好ましい。The soft range of the inner surface depends on the amount of filaments to be inserted, but as a result of experiments, it has been found that a range corresponding to about twice the hole diameter is suitable. That is, for example,
For a hole diameter of 2.2 mm, it is sufficient to soften the area of 4.4 mm. The diameter of the outer circumference needs to be about three times or more the inner diameter of the sleeve, and good restraining force can be obtained. In order to further stabilize, it is more preferable to apply a shape of about 4 times.
【００２０】低抵抗接続を達成するためには、フィラメ
ント同士の密着性を密にする必要がある。安定化材の中
空部にフィラメントを挿入して、二つ割りの金型等を用
いて上下から加圧し、加圧力と充填率の関係を調査し
た。そして得られた継手を４端子法による臨界電流値を
測定したところ、フィラメントの充填率は８０％以上に
なっていれば臨界電流値の高い値が得られることが分か
った。より安定した臨界電流値を得たい場合は充填率を
９０％程度とするのが良い。In order to achieve a low resistance connection, it is necessary to make the adhesion between filaments tight. The filament was inserted into the hollow portion of the stabilizing material, and pressure was applied from above and below using a mold that halved, and the relationship between the applied pressure and the filling rate was investigated. Then, when the critical current value of the obtained joint was measured by the 4-terminal method, it was found that a high critical current value could be obtained if the filling rate of the filament was 80% or more. In order to obtain a more stable critical current value, the filling rate is preferably about 90%.
【００２１】以上の本発明で作製した接続部の電流減衰
試験を実施したところ、３００００ｓ経過後にも電流の
減衰は殆んどみられず、計算結果から１０-13Ω 以下を
示した。When a current decay test was conducted on the connection portion produced by the present invention as described above, almost no current decay was observed even after 30,000 s, and the calculation result showed 10 -13 Ω or less.
【００２２】このようにフィラメントの充填率を向上さ
せ、低抵抗接続を達成するためには接続用安定化スリー
ブの材質が重要である。今までにＣｕ及びＡｌについて
述べたが、その他にＡｕ，Ａｇ等も適用出来、その純度
は９９.９％ 以上の高純度である必要がある。As described above, the material of the connecting stabilizing sleeve is important in order to improve the filling rate of the filament and achieve the low resistance connection. Although Cu and Al have been described so far, Au, Ag and the like can also be applied, and the purity thereof needs to be as high as 99.9% or higher.
【００２３】[0023]
【実施例】以下、本発明の圧着用スリーブ材及び接続体
について実施例を示す。EXAMPLES Examples of the pressure-bonding sleeve material and the connecting body of the present invention will be described below.
【００２４】圧着用スリーブ材の基本的な構造を示す。
図１はスリーブ１の全面をＨｖ４０〜５０（軟化）に調
整したスリーブ２で、その中心に超電導線を挿入する穴
３が設けてある。図２はスリーブ１の軟化層２とその外
周４によって構成されている。図３はスリーブ１の軟化
層にＨｖ３０〜６０に相当するＡｌ材５をＣｕ材６にク
ラッドしたスリーブからなる。The basic structure of the sleeve material for crimping is shown.
FIG. 1 shows a sleeve 2 in which the entire surface of the sleeve 1 is adjusted to Hv 40 to 50 (softening), and a hole 3 for inserting a superconducting wire is provided at the center thereof. FIG. 2 is composed of the softening layer 2 of the sleeve 1 and its outer circumference 4. FIG. 3 shows a sleeve in which the soft material of the sleeve 1 is obtained by clad an Al material 5 corresponding to Hv 30 to 60 with a Cu material 6.
【００２５】図４は軟化したＣｕスリーブを用いた基本
的な接続体を示す。図４（ａ）は接続前の断面状態を表
わす。被接続の超電導線７及び８を軟化したＣｕスリー
ブ２の穴３に３mm程挿入する。その先は硝酸中で安定化
Ｃｕを除去したフィラメント（超電導素線）であり、超
電導線７のフィラメント９及び超電導線８のフィラメン
ト１０が設置されている。その周りに包み込むように接
続補助フィラメント１１を配列させる。図４（ｂ）は押
圧後の断面状態を表わす。すなわち、超電導線７，８は
軟化したスリーブ２で固定され、フィラメントの９，１
０および接続補助フィラメントの１１も軟化安定化スリ
ーブ２によって中心部に接続・固定される。FIG. 4 shows a basic connecting body using a softened Cu sleeve. FIG. 4A shows a sectional state before connection. The superconducting wires 7 and 8 to be connected are inserted into the hole 3 of the softened Cu sleeve 2 by about 3 mm. Beyond that is a filament (superconducting element wire) from which stabilized Cu has been removed in nitric acid, and the filament 9 of the superconducting wire 7 and the filament 10 of the superconducting wire 8 are installed. The connection auxiliary filaments 11 are arranged so as to be wrapped around them. FIG. 4B shows a cross-sectional state after pressing. That is, the superconducting wires 7 and 8 are fixed by the softened sleeve 2 and the filaments 9 and 1
0 and 11 of the auxiliary connecting filaments are also connected and fixed to the center by the softening and stabilizing sleeve 2.
【００２６】（実施例１）接続用安定化材のＣｕは外径
¢９mmで、穴径¢２.２mm の、全体のＨｖを約４０に調
整したスリーブ材を用いた。被接続の超電導線はＮｂ−
Ｔｉ系で直径１.０mmのもので、フィラメントは直径０.
０７５mmが２４本、接続補助フィラメント１１は、直径
０.０３５mm の１０６０本を用いた。図４（ａ）のよう
に配置した後押圧を加え、Ｃｕスリーブの板厚を６.４m
m に成型した。(Example 1) Cu used as the stabilizing material for connection had a diameter of 9 mm and a hole diameter of 2.2 mm, and a sleeve material having a total Hv of about 40 was used. The connected superconducting wire is Nb-
It is a Ti-based material with a diameter of 1.0 mm, and the filament has a diameter of 0.
The number of 075 mm was 24, and the number of connecting auxiliary filaments 11 was 1060 having a diameter of 0.035 mm. After arranging it as shown in Fig. 4 (a), press it to increase the thickness of the Cu sleeve to 6.4m.
Molded into m.
【００２７】（実施例２）接続用安定化材のＣｕは外径
¢９.０，肉厚４.４mm，その内側の軟化層にＨｖ４０の
Ａｌをクラッドし、穴径２.２mm のものを用いた。被接
続の超電導線並びにフィラメントの条件及び成型厚は実
施例１と同様である。(Example 2) Cu for the stabilizing material for connection has an outer diameter of 9.0 mm and a wall thickness of 4.4 mm, and a softening layer inside thereof is clad with Al of Hv40 and has a hole diameter of 2.2 mm. Using. The conditions and molding thickness of the superconducting wire and filament to be connected are the same as in Example 1.
【００２８】（実施例３）接続用安定化材のＣｕは外径
¢９mm，穴径¢２.２mm で、全体のＨｖを約４０に調整
したスリーブ材を用いた。被接続の超電導線は安定化銅
中のＮｂ−Ｔｉ系で直径１.０mmのもの（フィラメント
は直径０.０７５mmが２４本）と安定化Ｃｕ−Ｎｉ系中
のＮｂ−Ｔｉ系で直径１.０mmのもの（フィラメントは
直径０.０３０mmの６００本）を、接続補助フィラメン
ト（直径０.０３５mmの１０６０本)１１で包み込み、接
続用スリーブ中に挿入して接続した。接続は図４（ａ）
のように配置した後押圧を加え、Ｃｕスリーブの板厚を
６.４mm に成型した。(Embodiment 3) A sleeve material having an outer diameter of 9 mm, a hole diameter of 2.2 mm, and a total Hv of about 40 was used as the stabilizing material for connection. The superconducting wire to be connected is a Nb-Ti system in stabilized copper with a diameter of 1.0 mm (24 filaments have a diameter of 0.075 mm) and a stabilized Cu-Ni system with a Nb-Ti system with a diameter of 1. A 0 mm filament (600 filaments having a diameter of 0.030 mm) was wrapped with a connecting auxiliary filament (1060 filaments having a diameter of 0.035 mm) 11 and inserted into a connecting sleeve for connection. Connection is shown in Figure 4 (a)
After arranging as described above, pressure was applied to mold the plate thickness of the Cu sleeve to 6.4 mm.
【００２９】（比較例）接続用安定化材はＣｕで外径¢
９.０mm，穴径２.４mmで全体のスリーブのＨｖは約１１
０のものを用いた。被接続の超電導線並びにフィラメン
トの条件及び成型厚は実施例１と同様である。(Comparative Example) The stabilizing material for connection is Cu and has an outer diameter of
9.0 mm, hole diameter 2.4 mm, Hv of the whole sleeve is about 11
0 was used. The conditions and molding thickness of the superconducting wire and filament to be connected are the same as in Example 1.
【００３０】以上の実施例及び比較例で用いた接続用ス
リーブ材と被接続の超電導線を組合わせ、押圧によって
成型した接続体を断面顕微鏡組織観察した。実施例１で
作製した接続体の断面を図５に示す。図５（ａ）は超電
導線材７，８がスリーブに入ってる部分を、図５（ｂ）
はスリーブの中央部の接続状態を示す。The connecting sleeve materials used in the above-mentioned Examples and Comparative Examples were combined with the superconducting wires to be connected, and the connecting bodies molded by pressing were observed under a microscopic cross-section. A cross section of the connector produced in Example 1 is shown in FIG. FIG. 5 (a) shows a portion where the superconducting wires 7 and 8 are contained in the sleeve, and FIG.
Shows the connection state of the central part of the sleeve.
【００３１】（ａ）に見られるように超電導線材７，８
の周りに本発明のスリーブの安定化Ｃｕ１が周り込んで
いる。超電導線同士もより近接し、空隙部分１２は非常
に少なくなっている。また外周部の接続補助フィラメン
ト１１はスリーブの内面に入り込み、より固定されてい
ることが分かる。（ｂ）ではフィラメント同士９及び１
０が近接し、その周りに接続補助フィラメント１１が良
好に近接しており空隙部分は非常に少なくフィラメント
９とフィラメント１０が良好に接続しているようすが明
らかである。ここでも外周の接続補助のフィラメント１
１は軟化した安定化スリーブの内面に入り込み、固定化
されていることも分かる。また、接続部のフィラメント
の充填率は約９０％であった。図５（ａ）近くのフィラ
メントは押圧により断線する様子は見られず、良好な接
続をしていた。As shown in (a), the superconducting wires 7, 8
Stabilizing Cu1 of the sleeve of the present invention surrounds around the. The superconducting wires are also closer to each other, and the void portion 12 is very small. Further, it can be seen that the connection auxiliary filament 11 on the outer peripheral portion enters the inner surface of the sleeve and is more fixed. In (b) filaments 9 and 1
It is clear that 0 is in close proximity, the connection auxiliary filament 11 is in good proximity around it, and there are very few voids so that filament 9 and filament 10 are well connected. Here too, the filament 1 to help connect the outer circumference
It can also be seen that 1 enters the inner surface of the softened stabilizing sleeve and is fixed. In addition, the filling rate of the filament in the connection portion was about 90%. The filament in the vicinity of FIG. 5 (a) did not show any disconnection due to pressing, and had a good connection.
【００３２】図６に比較例で作製した接続体の断面を示
す。図６（ａ）は超電導線材７及び８が安定化スリーブ
に入っている部分を、図６（ｂ）はスリーブの中央部の
接続状態を示す。（ａ）において超電導線７と８の周り
に空隙部分１２が見られ、フィラメントとフィラメント
の間にも空隙１２が形成されている。（ｂ）でもフィラ
メント９とフィラメント１０の間に実施例１と比べると
空隙部分１２が多く存在していることが明らかである。
外周部の接続補助フィラメント１１はスリーブの内面に
は余り入り込んではいない。すなわち、接続用安定化ス
リーブが硬く、かつ押圧により更に硬さが増加し、スリ
ーブへの入り込みが少ないと考える。また、接続部のフ
ィラメントの充填率は約７０％であり、本発明と比較し
て大きく劣った。またフィラメントの充填率を向上させ
るために押圧を増したものは、図６（ａ）近くのフィラ
メント（接続用フィラメントと接続補助用フィラメント
を含む）に剪断応力が作用し、断線しているフィラメン
トも観察され、十分な接続とは言えなかった。FIG. 6 shows a cross section of the connector produced in the comparative example. FIG. 6 (a) shows a portion where the superconducting wires 7 and 8 are contained in the stabilizing sleeve, and FIG. 6 (b) shows a connection state of the central portion of the sleeve. In (a), void portions 12 are seen around the superconducting wires 7 and 8, and voids 12 are also formed between the filaments. Also in (b), it is apparent that a large number of voids 12 are present between the filament 9 and the filament 10 as compared with Example 1.
The connection auxiliary filament 11 on the outer peripheral portion does not penetrate much into the inner surface of the sleeve. That is, it is considered that the stabilizing sleeve for connection is hard, and the hardness is further increased by pressing, so that there is little intrusion into the sleeve. Further, the filling rate of the filament in the connecting portion was about 70%, which was significantly inferior to the present invention. Further, in the case where the pressure is increased in order to improve the filling rate of the filaments, shear stress acts on the filaments (including the connecting filaments and the connecting auxiliary filaments) in the vicinity of FIG. Observed and not fully connected.
【００３３】以上の実施例及び比較例で接続した接続体
について液体Ｈｅ中で無磁界(０Ｔ)及び磁界中（１.０
Ｔ ）の時の臨界電流値を測定した。その結果を図７に
示す。測定はホルダーをＵ型とし、電圧端子間距離を１
５mmで測定した。図７から分かるように本発明の実施例
で臨界電流値は夫々異なるが、超電導線の製造のばらつ
きから来るものである。また同じ実施例の中でもばらつ
きが若干見られるが、これは同じ磁界中の中で測定を繰
り返して行ったことによる。いずれにしても比較例と比
べいずれも臨界電流は高く、また、ばらつきの程度も小
さい。これらの結果から本発明の接続用安定化スリーブ
材を用い、そして圧着して接続した接続体は、著しく優
れていることが分かる。The connection bodies connected in the above Examples and Comparative Examples were subjected to no magnetic field (0T) and no magnetic field (1.0T) in liquid He.
The critical current value at the time of T) was measured. The result is shown in FIG. 7. For measurement, the holder is U-shaped and the distance between the voltage terminals is 1
It was measured at 5 mm. As can be seen from FIG. 7, although the critical current values are different in the examples of the present invention, this is due to variations in manufacturing superconducting wires. Although there are some variations in the same example, this is because the measurement was repeated in the same magnetic field. In any case, compared to the comparative example, the critical current is high and the degree of variation is small. From these results, it can be seen that the connection body using the stabilizing sleeve material for connection of the present invention and connecting by crimping is remarkably excellent.
【００３４】また、接続体の永久電流スイッチを設置し
た永久電流回路を作成し、接続部の減衰試験を行った。
結果を図８に示す。図８から実施例の中でも電流の減衰
がほとんど見られないのは実施例１及び２のものであ
り、実施例３のものは実施例１，２に比べ僅かに減衰し
ているが、永久電流モードを示していることから本発明
の目標を達成している。本発明の電流減衰傾向から式に
代入し計算すると、実施例１及び２の継手は＜１０-13
Ωで、実施例３のものは＜１０-12Ωでありいずれも低
抵抗継手であることが明らかになった。Further, a permanent current circuit in which a permanent current switch of the connection body was installed was prepared, and an attenuation test of the connection portion was conducted.
The results are shown in Fig. 8. From FIG. 8, it is in Examples 1 and 2 that almost no current attenuation is observed among the Examples, and in Example 3, the permanent current is slightly attenuated as compared with Examples 1 and 2. The goal of the present invention is achieved by showing the modes. Substituting into the formula from the current attenuation tendency of the present invention and calculating, the joints of Examples 1 and 2 were <10 −13.
Ω, that of Example 3 was <10 −12 Ω, and it was revealed that all of them were low resistance joints.
【００３５】その他の接続用安定化スリーブ材として、
図２に示したようにＣｕ材の中心部分をＨｖ４０程度
に、その外周をＨｖ９０程度に調整した安定化スリーブ
材を用いても、その接続体はフィラメントの接触を良く
し、充填率が向上し、接続部分は＜１０-12 Ωであるこ
とを確認している。As other stabilizing sleeve materials for connection,
As shown in FIG. 2, even if a stabilizing sleeve material in which the central portion of the Cu material is adjusted to about Hv40 and the outer periphery thereof is adjusted to about Hv90, the connecting body improves the contact of the filaments and improves the filling rate. , The connection part has been confirmed to be <10 −12 Ω.
【００３６】更に、フィラメント同士を軟らかく接触さ
せるにはフィラメントとフィラメントの間に安定化材を
配置（芯材）して圧着することも本発明の範疇である。
なお芯材としてはＡｌ，Ｃｕ，Ａｇ，Ａｕ，Ｐｂ−Ｓ
ｎ，Ｉｎ，Ｂｉ系等も適用できる。Further, in order to bring the filaments into soft contact with each other, it is also within the scope of the present invention to dispose a stabilizing material (core material) between the filaments and press them together.
The core material is Al, Cu, Ag, Au, Pb-S.
An n, In, Bi system or the like can also be applied.
【００３７】[0037]
【発明の効果】本発明の圧着用スリーブ及び接続体によ
れば、超電導フィラメント同士をより密に接触させて充
填率を向上させるため、接続部は臨界電流値も大きく、
永久電流モードになるので長時間安定して製品に適用す
ることができる。According to the pressure-bonding sleeve and the connecting body of the present invention, since the superconducting filaments are brought into closer contact with each other to improve the filling rate, the connecting portion has a large critical current value.
Since it is in the permanent current mode, it can be stably applied to products for a long time.
【図１】本発明に係る圧着用スリーブで、全体を軟化し
たスリーブの断面図。FIG. 1 is a cross-sectional view of a pressure-bonding sleeve according to the present invention, which is an overall softened sleeve.
【図２】中心部分のみを軟化させ、他は硬い層よりなる
硬度勾配の安定化スリーブ材の断面図。FIG. 2 is a cross-sectional view of a stabilizing sleeve material having a hardness gradient formed by softening only the central portion and hardening the others.
【図３】中心部分に硬さの軟らかいアルミニウムを、そ
の周りを銅からなる複合安定化スリーブの断面図。FIG. 3 is a cross-sectional view of a composite stabilizing sleeve in which a center portion is made of soft aluminum and the periphery thereof is made of copper.
【図４】本発明の圧着用安定化材で超電導線及びフィラ
メントを接続した状態を示した断面図。FIG. 4 is a cross-sectional view showing a state in which a superconducting wire and a filament are connected by the crimping stabilizer of the present invention.
【図５】従来の比較例の圧着用安定化材を用い、超電導
線及びフィラメントを接続した状態を示した断面図。FIG. 5 is a cross-sectional view showing a state in which a superconducting wire and a filament are connected to each other by using the conventional stabilizing material for pressure bonding.
【図６】従来の比較例の圧着用安定化材を用い、超電導
線及びフィラメントを接続した状態を示した断面図。FIG. 6 is a cross-sectional view showing a state in which a superconducting wire and a filament are connected using a conventional crimping stabilizer of a comparative example.
【図７】本発明による接続体及び比較例による接続部の
臨界電流特性を示すグラフ。FIG. 7 is a graph showing the critical current characteristics of the connector according to the present invention and the connector according to the comparative example.
【図８】本発明による接続体及び比較例による接続部の
ループ電流の減衰特性を示すグラフ。FIG. 8 is a graph showing attenuation characteristics of loop current of the connection body according to the present invention and the connection portion according to the comparative example.
１…圧着用スリーブ材、２…軟化層、３…穴、４…高硬
度層、５…軟化材、６…硬化材、７，８…超電導線、
９，１０…フィラメント、１１…接続補助フィラメン
ト、１２…空隙部分。DESCRIPTION OF SYMBOLS 1 ... Crimping sleeve material, 2 ... Softening layer, 3 ... Hole, 4 ... High hardness layer, 5 ... Softening material, 6 ... Hardening material, 7, 8 ... Superconducting wire,
9, 10 ... Filament, 11 ... Connection auxiliary filament, 12 ... Void portion.
フロントページの続き (72)発明者 中村 満夫 茨城県日立市久慈町4026番地 株式会社日 立製作所日立研究所内 (72)発明者 斉藤 利幸 茨城県日立市幸町三丁目１番１号 株式会 社日立製作所日立工場内Front page continuation (72) Inventor Mitsuo Nakamura 4026 Kujimachi, Hitachi City, Ibaraki Prefecture Hitachi Research Laboratory, Hitachi Ltd. (72) Inventor Toshiyuki Saito 3-1-1, Saiwaicho, Hitachi City, Ibaraki Hitachi Factory Hitachi Factory
Claims (7)
れている超電導線を薬品で安定化材を溶かし、その結
果、露出された前記フィラメント同士を圧着用スリーブ
で圧着するスリーブ材において、前記フィラメントを包
み込む前記スリーブ材の硬度Ｈｖ３０〜６０にあらかじ
め処理したことを特徴とする圧着用スリーブ材。1. A sleeve material in which a superconducting wire in which a plurality of filaments are embedded in a stabilizing material is melted with a chemical agent, and as a result, the exposed filaments are crimped by a crimping sleeve. A sleeve material for crimping, wherein the sleeve material for wrapping the filament is pre-treated to have a hardness Hv of 30 to 60.
記フィラメントと接触する部分の穴径の２倍の範囲を硬
度Ｈｖ３０〜６０にコントロールし、その周りが硬度Ｈ
ｖ60より高い硬度の硬度勾配を有する圧着用スリーブ
材。2. The hardness of the sleeve material according to claim 1, wherein the range of twice the hole diameter of the portion in contact with the filament is controlled to have a hardness Hv of 30 to 60, and the circumference thereof has a hardness H.
Crimping sleeve material with hardness gradient higher than v60.
フィラメントと接触する部分の穴径の２倍の範囲をアル
ミニウム材とし、その外側を銅材で複合化した圧着用ス
リーブ材。3. The crimping sleeve material according to claim 1, wherein the sleeve material is made of an aluminum material in a range of twice the hole diameter of a portion in contact with the filament, and the outside thereof is compounded with a copper material.
の３倍以上の外径形状を有する圧着用スリーブ材。4. The sleeve material for crimping according to claim 1, wherein the sleeve material has an outer diameter shape three times or more the hole diameter.
用スリーブにより、前記フィラメントを圧着し接続した
接続体。5. The connection body according to claim 1, 2 or 3, wherein the filament is pressure-bonded and connected by the pressure-bonding sleeve.
スリーブにより、前記フィラメントと前記フィラメント
を包み込む他の接続補助用のフィラメントを同時に圧着
し、接続した接続体。6. A connection body in which the filament and another connection-aiding filament that wraps the filament are simultaneously crimped and connected by the crimping sleeve according to claim 1, 2, or 3.
リーブで圧着し接続した接続体は、１０-12Ω以下の接
続抵抗を有し、前記超電導線の臨界電流値の８０％以上
の臨界電流値を有する接続体。7. The connection body crimped and connected by the crimping sleeve according to claim 4 or 5, has a connection resistance of 10 −12 Ω or less, and a critical current value of 80% or more of a critical current value of the superconducting wire. A connector having a current value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24755192A JPH06104027A (en) | 1992-09-17 | 1992-09-17 | Sleeve material for crimping and connection body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24755192A JPH06104027A (en) | 1992-09-17 | 1992-09-17 | Sleeve material for crimping and connection body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06104027A true JPH06104027A (en) | 1994-04-15 |
Family
ID=17165183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24755192A Pending JPH06104027A (en) | 1992-09-17 | 1992-09-17 | Sleeve material for crimping and connection body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06104027A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101794655A (en) * | 2010-03-12 | 2010-08-04 | 中国科学院电工研究所 | Method for manufacturing low-resistance superconducting joint with high shielding characteristic |
| CN102738603A (en) * | 2011-04-02 | 2012-10-17 | 中国科学院高能物理研究所 | Preparation method of NbTi superconducting wire joint |
| JP2020161282A (en) * | 2019-03-26 | 2020-10-01 | 三菱電機株式会社 | Superconducting wire connection structure and superconducting wire connection method |
-
1992
- 1992-09-17 JP JP24755192A patent/JPH06104027A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101794655A (en) * | 2010-03-12 | 2010-08-04 | 中国科学院电工研究所 | Method for manufacturing low-resistance superconducting joint with high shielding characteristic |
| CN102738603A (en) * | 2011-04-02 | 2012-10-17 | 中国科学院高能物理研究所 | Preparation method of NbTi superconducting wire joint |
| JP2020161282A (en) * | 2019-03-26 | 2020-10-01 | 三菱電機株式会社 | Superconducting wire connection structure and superconducting wire connection method |
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