JPH0598455A - Electroless plating tank - Google Patents
Electroless plating tankInfo
- Publication number
- JPH0598455A JPH0598455A JP25912291A JP25912291A JPH0598455A JP H0598455 A JPH0598455 A JP H0598455A JP 25912291 A JP25912291 A JP 25912291A JP 25912291 A JP25912291 A JP 25912291A JP H0598455 A JPH0598455 A JP H0598455A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plated
- plating solution
- liquid
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、均一なめっき皮膜を
得るためのめっき液攪拌機構を備えた無電解めっき層に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroless plating layer having a plating solution stirring mechanism for obtaining a uniform plating film.
【０００２】[0002]
【従来の技術】液攪拌の果たす役割は、めっき槽内にお
けるめっき浴の温度や濃度を均一化すること、また被め
っき物表面に強い対流を起こしてイオン拡散を増強する
ことなどである。前者の場合、めっき槽内に緩慢な対流
を生じさせれば良いため、液の流れ方向やその強さはさ
ほど問題とはならない。しかし、後者の場合では、液攪
拌はめっきの反応速度やめっき皮膜物性（組成）に大き
く影響する。図９は、例えば「表面技術総覧」（鵜飼義
一編，６０６ページ，広信社発行，１９８３／６／１
５）に記載された従来の空気攪拌方法をあらわすめっき
槽の構成図である。空気攪拌は攪拌効率の高い方法であ
るが、空気酸化を嫌うめっき液の場合、一般に空気の代
わりにめっき液を循環ポンプによって吹き出させること
によってめっき液の攪拌を行っている。例えば、めっき
液１内に垂直に浸漬した平板状の被めっき物２に対し
て、ノズル３からめっき液を図中矢印で示すように噴出
させながらめっきを行う場合、従来の装置ではノズル３
が被めっき物２の上側または下側に設けてあり、ノズル
３からのめっき液１噴流が被めっき物２の表面に沿って
上方または下方に流れるようになっている。2. Description of the Related Art The role of liquid agitation is to make the temperature and concentration of a plating bath in a plating tank uniform, and to cause strong convection on the surface of an object to be plated to enhance ion diffusion. In the former case, since it is sufficient to generate slow convection in the plating tank, the flow direction of the liquid and its strength do not matter so much. However, in the latter case, the liquid stirring greatly affects the reaction rate of plating and the physical properties (composition) of the plating film. FIG. 9 shows, for example, “Surface Technology Guide” (edited by Ukai Yoshikazu, 606 pages, published by Koushinsha, 1983/6/1).
It is a block diagram of the plating tank showing the conventional air stirring method described in 5). Air agitation is a method with high agitation efficiency, but in the case of a plating solution that does not like air oxidation, generally, the plating solution is agitated by blowing out the plating solution with a circulation pump instead of air. For example, when plating is performed on the flat plate-shaped object 2 vertically dipped in the plating solution 1 while ejecting the plating solution from the nozzle 3 as shown by the arrow in the figure, the nozzle 3 is used in the conventional apparatus.
Is provided on the upper side or the lower side of the object to be plated 2, and the jet of the plating solution 1 from the nozzle 3 flows upward or downward along the surface of the object to be plated 2.
【０００３】[0003]
【発明が解決しようとする課題】従来のめっき槽では液
攪拌が以上のようになされており、めっき液の流れ方向
が一定であるため、被めっき物の上部と下部ではめっき
液の液流速が異なり、被めっき物表面における液攪拌効
果が不均一であった。このため、液攪拌がめっきの反応
速度やめっき皮膜物性に大きく影響する無電解めっきの
場合、被めっき物表面での液流速に差がある場合では、
めっき皮膜の厚さや組成や物性が不均一になるという問
題点があった。In the conventional plating tank, the liquid stirring is performed as described above, and since the flow direction of the plating liquid is constant, the liquid flow velocity of the plating liquid is higher in the upper and lower parts of the object to be plated. Differently, the liquid stirring effect on the surface of the object to be plated was not uniform. Therefore, in the case of electroless plating in which liquid stirring greatly affects the reaction rate of plating and the physical properties of the plating film, when there is a difference in the liquid flow rate on the surface of the object to be plated,
There is a problem that the thickness, composition and physical properties of the plating film become non-uniform.
【０００４】この発明は上記のような問題点を解決する
ために成されたものであり、平板状の被めっき物表面に
均一な液流動を生じさせることができるめっき液攪拌機
構を備えた無電解めっき槽を得ることを目的とする。The present invention was made in order to solve the above problems, and is provided with a plating solution stirring mechanism capable of producing a uniform solution flow on the surface of a flat object to be plated. The purpose is to obtain an electrolytic plating bath.
【０００５】[0005]
【課題を解決するための手段】この発明に係る無電解め
っき槽は、貯溜されためっき液内に平板状の被めっき物
が吊持されるめっき液槽と、被めっき物の両側に対向し
て設けられめっき液を噴出、吸入することにより被めっ
き物の両面に沿ってほぼ平行に且つ均一なめっき液の流
れを形成する複数対の噴出口および吸入口と、噴出口お
よび吸入口と配管を介して接続されめっき液をその流れ
の方向を周期的に反転して送出する送液手段とを備えた
ものである。An electroless plating tank according to the present invention is provided with a plating solution tank in which a flat plate-like object to be plated is suspended in a stored plating solution, and is opposed to both sides of the object to be plated. A plurality of pairs of jet ports and suction ports that form a uniform flow of the plating liquid along both sides of the object to be plated by jetting and sucking the plating liquid, and jet ports, suction ports, and piping And a liquid sending means that is connected via the above-mentioned means and sends out the plating solution by periodically inverting the flow direction of the plating solution.
【０００６】[0006]
【作用】この発明における無電解めっき槽の噴出口から
噴出され吸入口に吸入されるめっき液は、被めっき物の
両面に沿ってほぼ平行に且つ均一に流れ、その流れの方
向は周期的に反転する。The plating solution jetted from the jet port of the electroless plating tank and sucked into the suction port according to the present invention flows substantially parallel and evenly along both sides of the object to be plated, and the direction of the flow is periodic. Invert.
【０００７】[0007]
実施例１．以下、この発明の実施例を図について説明す
る。図１はこの発明の実施例１における無電解めっき槽
の構成を示す図であり、図２は図１における線II-IIに
沿う断面を示す断面図である。図において、４は樹脂ま
たは不活性金属製のめっき槽、５はこのめっき槽４に貯
溜されるめっき液、６は吊治具７によって吊持され、め
っき液５内に浸漬される例えばプリント配線基板などの
ような平板状の被めっき物、８はこの被めっき物６の両
側に対向してめっき槽４の壁面にそれぞれ２列に配列さ
れる複数対の開口で、ピッチは１０〜１５０ｍｍの範囲
内で望ましくは５０〜１００ｍｍに、又、口径は１〜
２．５ｍｍにそれぞれ設定されており、個数はめっき槽
４の容積や被めっき物６の寸法によって適宜送定されて
いる。Example 1. Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing a configuration of an electroless plating bath in Example 1 of the present invention, and FIG. 2 is a sectional view showing a section taken along line II-II in FIG. In the figure, 4 is a plating tank made of resin or an inert metal, 5 is a plating solution stored in this plating tank 4, 6 is suspended by a hanging jig 7 and immersed in the plating solution 5, for example, printed wiring. A plate-shaped object to be plated such as a substrate, and the like 8 are a plurality of pairs of openings arranged in two rows on the wall surface of the plating tank 4 facing both sides of the object to be plated 6 and having a pitch of 10 to 150 mm. Within the range, preferably 50 to 100 mm, and the caliber is 1 to
The number is set to 2.5 mm, and the number is appropriately set depending on the volume of the plating tank 4 and the size of the object 6 to be plated.
【０００８】９はめっき液５を循環させるための送液ポ
ンプ、１０ａ〜１０ｈはめっき液５の循環路を形成する
各配管、１１は送液ポンプ９の一方に配管１０ａを介し
て接続され、配管１０ａと配管１０ｅおよび配管１０ｇ
との接続切り替えを行う第１の切り替えバルブ、１２は
第１の切り替えバルブ１１に連動するとともに送液ポン
プ９の他方に配管１０ｄを介して接続され、配管１０ｄ
と配管１０ｆおよび配管１０ｈとの接続切り替えを行う
第２の切り替えバルブ、１３は被めっき物６の両側開口
８の中心部に突設される仕切板で、開口８から噴出され
るめっき液５をその流れを乱すことなく被めっき物６の
表面に導くためのものであり、仕切板１３の先端と被め
っき物６の側面との間隔はできるだけ小さい方がよく、
５〜３０ｍｍ程度に設定されている。そして、送液ポン
プ９、各配管１０ａ〜１０ｈ、第１の切り替えバルブ１
１および第２の切り替えバルブ１２で送液手段２０を構
成する。Reference numeral 9 is a liquid feed pump for circulating the plating solution 5, 10a to 10h are respective pipes forming a circulation path of the plating liquid 5, 11 is one of the liquid feed pumps 9 and is connected via a pipe 10a, Pipe 10a, pipe 10e, and pipe 10g
The first switching valve 12 for switching connection with the first switching valve 11 is linked to the first switching valve 11 and is connected to the other side of the liquid feed pump 9 via the pipe 10d.
Is a second switching valve for switching the connection between the pipe 10f and the pipe 10h, and 13 is a partition plate projecting at the center of the openings 8 on both sides of the object 6 to be plated, and the plating solution 5 jetted from the opening 8 This is for guiding the flow to the surface of the object to be plated 6 without disturbing the flow, and it is better that the distance between the tip of the partition plate 13 and the side surface of the object to be plated 6 is as small as possible.
It is set to about 5 to 30 mm. Then, the liquid feed pump 9, the pipes 10a to 10h, and the first switching valve 1
The first and second switching valves 12 constitute the liquid feeding means 20.
【０００９】次に、上記のように構成された実施例１に
おける無電解めっき槽の動作について説明する。まず、
送液ポンプ９が始動すると、めっき液５は一方の開口８
から吸入され、図中矢印で示すように配管１０ｃ→１０
ｈ→１０ｄ→１０ａ→１０ｇ→１０ｂの順に循環して他
方の開口８から噴出される。そして、めっき槽４内では
仕切板１３によってその流れが整えられ、図２に示すよ
うに被めっき物６の表面に沿って平行に且つ均一に流れ
て再び一方の開口８に吸入される。以下このような動作
が順次繰り返される。Next, the operation of the electroless plating bath in the embodiment 1 constructed as described above will be explained. First,
When the liquid feed pump 9 is started, the plating liquid 5 is opened on one side 8
Inhaled from the pipe 10c → 10 as shown by the arrow in the figure
It circulates in the order of h → 10d → 10a → 10g → 10b and is ejected from the other opening 8. Then, the flow is regulated by the partition plate 13 in the plating tank 4, flows in parallel and evenly along the surface of the object to be plated 6 as shown in FIG. 2, and is sucked into the opening 8 again. Hereinafter, such an operation is sequentially repeated.
【００１０】そして、所定の時間が経過すると、送液ポ
ンプ９が停止しその間に、第１および第２の切り替えバ
ルブ１１、１２が切り替り配管１０ａは配管１０ｅ側
に、又、配管１０ｄは配管１０ｆ側に切り替え接続され
る。この状態で送液ポンプ９が再始動すると、めっき液
５は今度は上記とは逆に他方の開口８から吸入され、配
管１０ｂ→１０ｆ→１０ｄ→１０ａ→１０ｅ→１０ｃの
順に循環して一方の開口８からめっき槽４内に噴出さ
れ、仕切板１３によってその流れが整えられ、被めっき
物６の表面に沿って平行に且つ均一に流れて再び他方の
開口８に吸入される。After a lapse of a predetermined time, the liquid feed pump 9 is stopped, and during that time, the first and second switching valves 11 and 12 are switched and the pipe 10a is on the pipe 10e side, and the pipe 10d is on the pipe. It is switched and connected to the 10f side. When the liquid delivery pump 9 is restarted in this state, the plating solution 5 is sucked from the other opening 8 contrary to the above, and is circulated in the order of the pipes 10b → 10f → 10d → 10a → 10e → 10c. It is jetted from the opening 8 into the plating tank 4, its flow is regulated by the partition plate 13, flows in parallel and uniformly along the surface of the object to be plated 6, and is sucked into the other opening 8 again.
【００１１】図３はこの発明の実施例１における無電解
めっき槽を用い、めっき液５として、スズ（０．１モ
ル）、鉛（０．０１モル）、有機スルホン酸（０．２モ
ル）、チオ尿素（２モル）を主成分とする無電解はんだ
めっき液を使用し、被めっき物６としては２４０×１８
０ｍｍのプリント配線基板を適用し、めっき浴温７０
℃、めっき時間２０分でめっきを行った後、０．５ｍｍ
□のパタン部分のめっき厚さを測定した場合の結果を示
すものであり、又、図４は被めっき物２の下部に設けた
ノズル３からめっき液１を噴出させて攪拌を行う図８に
示したような従来の無電解めっき槽を用い、上記同様の
条件でめっきを行った場合の結果を示すものである。FIG. 3 shows the electroless plating bath used in Example 1 of the present invention. As a plating solution 5, tin (0.1 mol), lead (0.01 mol) and organic sulfonic acid (0.2 mol) are used. , An electroless solder plating solution containing thiourea (2 mol) as a main component is used, and the plated object 6 is 240 × 18.
Applying 0mm printed wiring board, plating bath temperature 70
0.5 mm after plating at ℃ for 20 minutes
Fig. 4 shows the results when the plating thickness of the pattern portion of □ was measured, and Fig. 4 shows that the plating solution 1 is jetted from the nozzle 3 provided in the lower portion of the object to be plated 2 to perform stirring. The results obtained when plating is performed under the same conditions as above using a conventional electroless plating bath as shown are shown.
【００１２】両図を比較すると明らかなように、図４に
示す無電解めっき厚さ分布では、被めっき物６の下部分
では上部分に比べ厚く析出しており、全体に不均一なめ
っき厚さ分布を示している。これに対し、図４に示す実
施例１における無電解めっき厚さ分布では、ほぼ被めっ
き物６全面で均一な厚さの皮膜が形成されていることが
わかる。図７に使用しためっき液５におけるめっき厚さ
と攪拌強度の関係を示す。図７に示すように、本めっき
液５は攪拌の有無や強弱によってめっき速度が大きく影
響を受けることがわかる。このことからも実施例１にお
けるめっき液攪拌機構を備えた無電解めっき槽では、従
来のめっき液噴流式攪拌機構を備えた無電解めっき槽に
比べ、均一な攪拌効果が得られることは明かである。As is clear from a comparison between the two figures, in the electroless plating thickness distribution shown in FIG. 4, the lower part of the object to be plated 6 is deposited thicker than the upper part, resulting in an uneven plating thickness on the whole. It shows the distribution. On the other hand, in the electroless plating thickness distribution in Example 1 shown in FIG. 4, it can be seen that a film having a uniform thickness is formed on the entire surface of the object 6 to be plated. FIG. 7 shows the relationship between the plating thickness and the stirring strength of the plating solution 5 used. As shown in FIG. 7, it can be seen that the plating rate of the present plating solution 5 is greatly affected by the presence or absence of stirring and the strength. From this, it is clear that the electroless plating tank having the plating solution stirring mechanism in Example 1 can obtain a uniform stirring effect as compared with the conventional electroless plating tank having the plating solution jet stirring mechanism. is there.
【００１３】実施例２．図５および図６はこの発明の実
施例２における無電解めっき槽のめっき槽部の構成をそ
れぞれ示す断面図および一部破断斜視図である。図から
明らかなように、上記実施例１においては、めっき槽４
の壁面に開口８を設け、めっき液５を排出、吸入してい
るのに対して、図１における配管１０ｂおよび配管１０
ｃに一端がそれぞれ接続され、他端は二股に分岐して閉
塞し、この分岐部に複数の開口１４ａを有する一対の導
管１４の、他端側分岐部を仕切板１３を挟むようにめっ
き液５内に浸漬し、開口１４ａからめっき液５を排出、
吸入するようにしても、上記実施例１同様の効果を奏す
ることは勿論のこと、開口１４ａが目詰まりをした場合
等に、導管１４全体をめっき槽４外に取り出して目詰ま
り除去作業ができるので、保守が容易になる等の効果も
ある。Embodiment 2. FIG. 5 and FIG. 6 are a sectional view and a partially broken perspective view, respectively, showing the configuration of the plating tank portion of the electroless plating tank according to the second embodiment of the present invention. As is clear from the figure, in Example 1 described above, the plating bath 4
While the opening 8 is provided on the wall surface of the pipe to discharge and suck the plating solution 5, the pipe 10b and the pipe 10 in FIG.
One end is connected to c and the other end is bifurcated to be closed, and the plating solution is formed so as to sandwich the partition plate 13 at the other end side branch part of the pair of conduits 14 having a plurality of openings 14a at this branch part. 5 and discharge the plating solution 5 from the opening 14a,
Even if the air is sucked, the same effects as those of the first embodiment can be obtained, and when the opening 14a is clogged, the entire conduit 14 can be taken out of the plating tank 4 to remove the clogging. Therefore, there is an effect that maintenance is easy.
【００１４】実施例３．図８はこの発明の実施例３にお
ける無電解めっき槽の構成を示す図である。図から明ら
かなように、図１に示す実施例１と異なる点は、送液ポ
ンプ１５を反転送液可能としたことである。このように
反転送液が可能な送液ポンプ１５を用いることにより、
図１に示す第１および第２の切り替えバルブ１１、１２
が不要になるばかりでなく、開口８と送液ポンプ１５と
を接続する配管１６が非常に簡略され、装置全体として
安価になるという効果もある。Example 3. FIG. 8 is a diagram showing the configuration of the electroless plating bath in Embodiment 3 of the present invention. As is apparent from the figure, the point different from the first embodiment shown in FIG. 1 is that the liquid feed pump 15 is capable of anti-transfer liquid. By using the liquid feed pump 15 capable of anti-transfer liquid as described above,
The first and second switching valves 11 and 12 shown in FIG.
Not only is it unnecessary, but the piping 16 for connecting the opening 8 and the liquid feed pump 15 is also very simple, and the overall cost of the device is reduced.
【００１５】[0015]
【発明の効果】以上のように、この発明によれば貯溜さ
れためっき液内に平板状の被めっき物が吊持されるめっ
き液槽と、被めっき物の両側に対向して設けられめっき
液を噴出、吸入することにより被めっき物の両面に沿っ
てほぼ平行に且つ均一なめっき液の流れを形成する複数
対の噴出口および吸入口と、噴出口および吸入口と配管
を介して接続されめっき液をその流れの方向を周期的に
反転して送出する送液手段とを備えたので、平板状の被
めっき物表面に均一な液流動を生じさせることができる
無電解めっき槽を提供することができる。As described above, according to the present invention, a plating solution tank in which a flat plate-like object to be plated is suspended in a stored plating solution, and plating provided on both sides of the object to be plated are provided. A plurality of pairs of spouts and suction ports that form a uniform flow of plating solution on both sides of the object to be plated by spouting and sucking the solution, and connecting the spouts and suction ports via piping The electroless plating tank capable of producing a uniform liquid flow on the flat surface of the object to be plated is provided, since it is provided with a liquid feeding means for periodically inverting the flow direction of the plating liquid and sending it out. can do.
【図１】この発明の実施例１における無電解めっき槽の
構成を示す図である。FIG. 1 is a diagram showing a configuration of an electroless plating bath according to a first embodiment of the present invention.
【図２】図１における線II-IIに沿う断面を示す断面図
である。FIG. 2 is a sectional view showing a section taken along line II-II in FIG.
【図３】図１における無電解めっき槽でめっきを行った
プリント配線基板上のめっき厚さの分布状態を示す図で
ある。3 is a diagram showing a distribution state of plating thickness on a printed wiring board plated in the electroless plating bath in FIG.
【図４】従来の無電解めっき槽でめっきを行ったプリン
ト配線基板上のめっき厚さの分布状態を示す図である。FIG. 4 is a diagram showing a distribution state of plating thickness on a printed wiring board plated in a conventional electroless plating bath.
【図５】この発明の実施例２における無電解めっき槽の
めっき槽部の構成を示す断面図である。FIG. 5 is a cross-sectional view showing a configuration of a plating tank portion of an electroless plating tank according to a second embodiment of the present invention.
【図６】図５におけるめっき槽部の構成を示す一部破断
斜視図である。FIG. 6 is a partially cutaway perspective view showing a configuration of a plating tank section in FIG.
【図７】攪拌の有無や強度によってめっき速度に大きな
影響を与えることを説明するための図である。FIG. 7 is a diagram for explaining that the presence or absence of stirring and the strength have a great influence on the plating rate.
【図８】この発明の実施例３における無電解めっき槽の
構成を示す図である。FIG. 8 is a diagram showing a configuration of an electroless plating bath according to a third embodiment of the present invention.
【図９】従来の無電解めっき槽のめっき槽部の構成を示
す図である。FIG. 9 is a diagram showing a configuration of a plating tank portion of a conventional electroless plating tank.
４ めっき槽 ５ めっき液 ６ 被めっき物 ７ 吊持具 ８、１４ａ 開口 ９、１５ 送液ポンプ １０ａ〜１０ｈ 配管 １１ 第１の切り替えバルブ １２ 第２の切り替えバルブ １３ 仕切板 １４ 導管 4 plating tank 5 plating solution 6 object to be plated 7 lifting tool 8, 14a opening 9, 15 liquid feed pump 10a to 10h piping 11 first switching valve 12 second switching valve 13 partition plate 14 conduit
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成４年５月６日[Submission date] May 6, 1992
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００１[Correction target item name] 0001
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【０００１】[0001]
【産業上の利用分野】この発明は、均一なめっき皮膜を
得るためのめっき液攪拌機構を備えた無電解めっき槽に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroless plating tank provided with a plating solution stirring mechanism for obtaining a uniform plating film.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 森田 毅 尼崎市塚口本町８丁目１番１号 三菱電機 株式会社生産技術研究所内 (72)発明者 高浜 ▲隆▼ 尼崎市塚口本町８丁目１番１号 三菱電機 株式会社生産技術研究所内 (72)発明者 林 修 尼崎市塚口本町８丁目１番１号 三菱電機 株式会社生産技術研究所内 (72)発明者 宇崎 俊介 相模原市宮下一丁目１番57号 三菱電機株 式会社相模製作所内 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Takeshi Morita 8-1-1 Tsukaguchihonmachi, Amagasaki City Mitsubishi Electric Co., Ltd. Production Technology Laboratory (72) Inventor Takahama ▲ Takaguchi 8-1-1 Tsukaguchihonmachi, Amagasaki-shi No. Mitsubishi Electric Co., Ltd. Production Technology Laboratory (72) Inventor Osamu Hayashi 8-1-1 Tsukaguchi Honcho, Amagasaki City Mitsubishi Electric Co., Ltd. Production Technology Laboratory (72) Inventor Shunsuke Uzaki 1-57 Miyashita, Sagamihara City Mitsubishi Electric Corporation Sagami Factory
Claims (2)
き物が吊持されるめっき液槽と、上記被めっき物の両側
に対向して設けられ上記めっき液を噴出、吸入すること
により上記被めっき物の両面に沿ってほぼ平行に且つ均
一な上記めっき液の流れを形成する複数対の噴出口およ
び吸入口と、上記噴出口および吸入口と配管を介して接
続され上記めっき液をその流れの方向を周期的に反転し
て送出する送液手段とを備えたことを特徴とする無電解
めっき槽。1. A plating solution tank in which a flat plate-shaped object to be plated is suspended in a stored plating solution, and the plating solution is jetted and sucked to face both sides of the object to be plated. A plurality of pairs of jet ports and suction ports that form a uniform flow of the plating solution substantially parallel to both sides of the object to be plated, and the jet solution and the suction port are connected through a pipe to connect the plating solution. An electroless plating tank comprising: a liquid feeding means for periodically reversing the flow direction and sending the liquid.
とを特徴とする請求項１記載の無電解めっき槽。2. The electroless plating bath according to claim 1, wherein the object to be plated is a printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25912291A JPH0598455A (en) | 1991-10-07 | 1991-10-07 | Electroless plating tank |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25912291A JPH0598455A (en) | 1991-10-07 | 1991-10-07 | Electroless plating tank |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0598455A true JPH0598455A (en) | 1993-04-20 |
Family
ID=17329624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25912291A Pending JPH0598455A (en) | 1991-10-07 | 1991-10-07 | Electroless plating tank |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0598455A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013040395A (en) * | 2011-08-19 | 2013-02-28 | Ebara Corp | Substrate processing device and substrate processing method |
-
1991
- 1991-10-07 JP JP25912291A patent/JPH0598455A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013040395A (en) * | 2011-08-19 | 2013-02-28 | Ebara Corp | Substrate processing device and substrate processing method |
| US9556533B2 (en) | 2011-08-19 | 2017-01-31 | Ebara Corporation | Substrate processing apparatus and substrate processing method |
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