JPH0593827A - Optical reception module - Google Patents
Optical reception moduleInfo
- Publication number
- JPH0593827A JPH0593827A JP3256525A JP25652591A JPH0593827A JP H0593827 A JPH0593827 A JP H0593827A JP 3256525 A JP3256525 A JP 3256525A JP 25652591 A JP25652591 A JP 25652591A JP H0593827 A JPH0593827 A JP H0593827A
- Authority
- JP
- Japan
- Prior art keywords
- light receiving
- optical
- semiconductor substrate
- optical fiber
- receiving element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、光ファイバ通信に用い
られる光受信モジュールに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical receiver module used for optical fiber communication.
【０００２】[0002]
【従来の技術】光受信モジュールとして、信学技報Ｖｏ
ｌ．９１，Ｎｏ．２０１（ＯＱＥ ９１−６０〜６８）
に開示されたものが知られている。従来、かかる光受信
モジュールは、図６や図７に示す構造となっていた。2. Description of the Related Art As an optical receiving module,
l. 91, No. 201 (OQE 91-60 to 68)
The one disclosed in is known. Conventionally, such an optical receiver module has a structure shown in FIGS. 6 and 7.
【０００３】図６に示す光受信モジュールは、下側パッ
ケージ２の内部に受光素子４とプリアンプ回路を形成し
たＩＣチップ６を固着し、光ファイバー８をその終端部
が受光素子４の受光面に対向するようにして上側パッケ
ージ１０に垂直に固定すると共に、下側パッケージ２と
上側パッケージ１０を密封して外部からの光の漏れ入射
を阻止する構造となっている。In the optical receiving module shown in FIG. 6, a light receiving element 4 and an IC chip 6 on which a preamplifier circuit is formed are fixed inside a lower package 2, and an optical fiber 8 has its terminal end facing the light receiving surface of the light receiving element 4. As described above, the structure is fixed vertically to the upper package 10, and the lower package 2 and the upper package 10 are hermetically sealed to prevent leakage of light from the outside.
【０００４】そして、光ファイバー８を伝送して来た光
信号を受光素子４で受光して電気信号に変換し、更に電
気信号をＩＣチップ６のプリアンプ回路で増幅して、リ
ード端子１２を介して出力する。Then, the optical signal transmitted through the optical fiber 8 is received by the light receiving element 4 and converted into an electric signal, and the electric signal is further amplified by the preamplifier circuit of the IC chip 6 and passed through the lead terminal 12. Output.
【０００５】一方、図７に示す光受信モジュールは、外
部からの光の漏れ入射を阻止するための密封構造を有す
るパッケージ１４の内部に、受光素子１６とプリアンプ
回路を形成したＩＣチップ１８を固着し、受光素子１６
の受光面に対して光ファイバー２０の終端部を平行に配
置した構造となっている。更に、光ファイバー２０の終
端部は斜めに研磨され、光ファイバー２０を伝送して来
た光を該研磨面２２で反射して受光素子１６の受光面に
入射させる形状となっている。On the other hand, in the light receiving module shown in FIG. 7, a light receiving element 16 and an IC chip 18 in which a preamplifier circuit is formed are fixed inside a package 14 having a sealed structure for preventing light from leaking from the outside. The light receiving element 16
The end portion of the optical fiber 20 is arranged in parallel with the light receiving surface of the. Further, the end portion of the optical fiber 20 is obliquely polished so that the light transmitted through the optical fiber 20 is reflected by the polishing surface 22 and is incident on the light receiving surface of the light receiving element 16.
【０００６】そして、受光素子１６で光電変換した電気
信号をＩＣチップ１８のプリアンプ回路で増幅して、リ
ード端子（図示せず）を介して出力する。Then, the electric signal photoelectrically converted by the light receiving element 16 is amplified by the preamplifier circuit of the IC chip 18 and output through a lead terminal (not shown).
【０００７】[0007]
【発明が解決しようとする課題】しかしながら、このよ
うな構造を有する従来の光受信モジュールにあっては、
パッケージにＩＣチップ、受光素子及び光ファイバーを
個々独立に配置して固着することで一体化する構造とな
っており、夫々の部品の位置決め精度が光ファイバーと
受光素子との対向精度を決定するので、受光感度のばら
つきを招来したり、規定通りの受光感度を得るようにひ
とつひとつ位置決め調整しながら製造する必要があるこ
とから製造が煩雑となり、生産性の向上が図れないとい
う問題があった。However, in the conventional optical receiver module having such a structure,
The IC chip, the light receiving element, and the optical fiber are separately arranged and fixed to the package to be integrated, and the positioning accuracy of each component determines the facing accuracy between the optical fiber and the light receiving element. There is a problem in that the manufacturing is complicated and the productivity cannot be improved because the manufacturing process becomes complicated because the manufacturing process is complicated because it causes the variation of the sensitivity and it is necessary to adjust the positioning one by one so as to obtain the light receiving sensitivity as specified.
【０００８】特に、複数の光ファイバーとそれに対応す
る複数の受光素子をアレー状に配列して並列通信を行う
ようにした光受信モジュールにあっては、光ファイバー
と受光素子との光結合を全ての組合せについて良好且つ
均一にしなければならないことから、極めて高い機械精
度が必要となり、歩止まり等の点で十分な生産性が得ら
れない問題があった。Particularly, in an optical receiver module in which a plurality of optical fibers and a plurality of corresponding light receiving elements are arranged in an array for parallel communication, all combinations of optical coupling between the optical fibers and the light receiving elements are provided. Therefore, there is a problem that extremely high mechanical accuracy is required and sufficient productivity cannot be obtained in terms of yield and the like.
【０００９】本発明はこのような従来の課題に鑑みて成
されたものであり、光ファイバーと受光素子との光結合
を良好且つ均一に設定することができると共に、生産性
向上を図るのに優れた構造を有する光受信モジュールを
提供することを目的とする。The present invention has been made in view of such conventional problems, and it is possible to set the optical coupling between the optical fiber and the light receiving element satisfactorily and uniformly and is excellent in improving productivity. It is an object of the present invention to provide an optical receiver module having a different structure.
【００１０】[0010]
【課題を解決するための手段】このような目的を達成す
るために本発明は、半導体基板の一面に設けられた受光
素子と、該受光素子に対向する該半導体基板の裏面に形
成されると共に、終端部に該受光素子の受光面と鋭角度
をもって対向する傾斜面を有する溝と、終端面を該傾斜
面に対向して該溝内に固着された光ファイバーとを具備
する構造とした。In order to achieve such an object, the present invention provides a light-receiving element provided on one surface of a semiconductor substrate and a back surface of the semiconductor substrate facing the light-receiving element. The structure is provided with a groove having an inclined surface facing the light receiving surface of the light receiving element at an acute angle at the terminal end portion, and an optical fiber fixed in the groove with the terminal surface facing the inclined surface.
【００１１】又、半導体基板の一面に設けられた複数の
受光素子と、これらの受光素子に対向する該半導体基板
の裏面に形成されると共に、夫々の終端部に上記夫々の
受光素子の各受光面と鋭角度をもって対向する傾斜面を
有する複数の溝と、終端面を上記傾斜面に対向して上記
夫々の溝内に個々独立に固着された複数の光ファイバー
とを具備することで、複数の光通信を行う光受信モジュ
ールを構成した。Further, a plurality of light receiving elements provided on one surface of the semiconductor substrate and a back surface of the semiconductor substrate facing the light receiving elements are formed, and the respective light receiving elements of the respective light receiving elements are formed at their respective end portions. By providing a plurality of grooves each having an inclined surface facing the surface at an acute angle, and a plurality of optical fibers individually fixed in the respective grooves with their end surfaces facing the inclined surface, An optical receiver module for optical communication was constructed.
【００１２】更に、上記溝を、フォト・マスク及び食刻
処理によって形成することとした。Further, the groove is formed by a photo mask and an etching process.
【００１３】[0013]
【作用】このような構成によれば、上記溝に固着された
光ファイバーを伝送してきた光信号を上記傾斜面で反射
して半導体基板の裏面側から受光素子に入射させ、光フ
ァイバーと受光素子との間での極めて高精度の光結合を
実現することができ、更に、機械的な可動部分を排除す
ることができることから耐久性に優れている。According to this structure, the optical signal transmitted from the optical fiber fixed to the groove is reflected by the inclined surface and is incident on the light receiving element from the back surface side of the semiconductor substrate, and the optical fiber and the light receiving element are combined. It is possible to realize extremely high precision optical coupling between the two parts, and further, it is possible to eliminate mechanical moving parts, so that it is excellent in durability.
【００１４】又、周知のプレーナ・プロセス等を適用し
て製造することにより、高い位置決め精度で上記溝を形
成することができるので、特性の向上及び均一化を容易
に実現でき、生産性の向上を図ることができる。Further, since the groove can be formed with high positioning accuracy by manufacturing by applying a well-known planar process or the like, it is possible to easily realize improvement of characteristics and uniformity, and improvement of productivity. Can be planned.
【００１５】[0015]
【実施例】以下、本発明による光受信モジュールの一実
施例を図面と共に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an optical receiver module according to the present invention will be described below with reference to the drawings.
【００１６】図１は、１本の光ファイバーで伝送されて
くる光信号を１個の受光素子で受信する基本的な光受信
モジュールを示す。図１において、インジウム・リン結
晶の半導体基板２４の上面に受光素子２６を設け、半導
体基板２４の裏面に形成された長溝２８内に光ファイバ
ー３０を嵌め込んで固着し、光ファイバー３０で伝送さ
れてくる光信号を半導体基板２４の裏面側から上面の受
光素子２６に入射させる構造となっている。FIG. 1 shows a basic optical receiving module in which an optical signal transmitted by one optical fiber is received by one light receiving element. In FIG. 1, a light receiving element 26 is provided on the upper surface of a semiconductor substrate 24 of indium phosphide crystal, an optical fiber 30 is fitted and fixed in a long groove 28 formed on the back surface of the semiconductor substrate 24, and transmitted by the optical fiber 30. The structure is such that an optical signal is incident on the light receiving element 26 on the upper surface from the back surface side of the semiconductor substrate 24.
【００１７】ここで、受光素子２６は、基本的にはガリ
ウム・インジウム・砒素層にｐｎ接合を形成したｐｉｎ
型フォトダイオード、又はアバランシェフォトダイオー
ドが適用され、受光径が３０μｍないし８０μｍ程度に
設定されている。Here, the light receiving element 26 is basically a pin in which a pn junction is formed in a gallium / indium / arsenic layer.
Type photodiode or avalanche photodiode is applied, and the light receiving diameter is set to about 30 μm to 80 μm.
【００１８】長溝２８は、半導体基板２４の裏面に化学
的ウェットエッチングによる食刻で約１００μｍ程度の
深さに形成され、長溝２８の終端部が受光素子２６の受
光面と対向する位置関係に設定し、更に、その終端部は
受光素子２６の受光面に対して鋭角度θをもって傾斜す
る傾斜面３２となっている。The long groove 28 is formed on the back surface of the semiconductor substrate 24 by etching by chemical wet etching so as to have a depth of about 100 μm, and the end portion of the long groove 28 is set in such a positional relationship that it faces the light receiving surface of the light receiving element 26. Further, the terminal end thereof is an inclined surface 32 which is inclined with respect to the light receiving surface of the light receiving element 26 at an acute angle θ.
【００１９】光ファイバー３０の終端面は長手方向に対
して垂直にカットされており、該終端面と傾斜面３２が
対向して長溝２８内に固着している。したがって、光フ
ァイバー３０を伝送して該終端面から出力した光信号
は、傾斜面３２で反射し、更に、半導体基板２４中を透
過して受光素子２６の受光面に裏面側から入射する。The end surface of the optical fiber 30 is cut perpendicularly to the longitudinal direction, and the end surface and the inclined surface 32 face each other and are fixed in the long groove 28. Therefore, the optical signal transmitted through the optical fiber 30 and output from the terminal surface is reflected by the inclined surface 32, further transmitted through the semiconductor substrate 24, and incident on the light receiving surface of the light receiving element 26 from the back surface side.
【００２０】図２は、図１のＸ−Ｘ線矢視断面図、図３
は、半導体基板２４の裏面側から見た背面図であり、光
ファイバー３０を熱硬化性接着剤や半田３４によって長
溝２８内に固着している。FIG. 2 is a sectional view taken along the line X--X in FIG.
6 is a rear view of the semiconductor substrate 24 as viewed from the rear surface side, and the optical fiber 30 is fixed in the long groove 28 with a thermosetting adhesive or solder 34.
【００２１】そして、受光素子２６と光ファイバー３０
を一体に固着した半導体基板２４全体を、外部からの光
の侵入を阻止するように密封した構造のパッケージ（図
示せず）内に収納し、更に、受光素子２６が光電変換し
た電気信号を増幅するためのプリアンプ回路を形成した
ＩＣチップ（図示せず）等も同時に該パッケージ内に設
けられる。Then, the light receiving element 26 and the optical fiber 30
The entire semiconductor substrate 24, which is integrally fixed to the above, is housed in a package (not shown) having a sealed structure so as to prevent light from entering from the outside, and further the electric signal photoelectrically converted by the light receiving element 26 is amplified. An IC chip (not shown) or the like having a preamplifier circuit for doing so is also provided in the package at the same time.
【００２２】次に、かかる構造の光受信モジュールの製
造工程を図４のフローチャートに従って説明する。Next, the manufacturing process of the optical receiving module having the above structure will be described with reference to the flowchart of FIG.
【００２３】まず、第１の工程Ａでは、半導体基板２４
の裏面に両面マスクアライナを用いて、長溝３２を形成
すべき面を除く残余の面にフォトレジストを塗設する。
尚、長溝３２の終端部が受光素子２６の受光面と対向す
る位置となるように設計される。First, in the first step A, the semiconductor substrate 24
Using a double-sided mask aligner on the back surface of the photoresist, a photoresist is applied on the remaining surface except the surface where the long groove 32 is to be formed.
The end of the long groove 32 is designed to face the light receiving surface of the light receiving element 26.
【００２４】次の第２の工程Ｂでは、このフォトレジス
トをエッチングマスクトして、例えば、臭素とメタノー
ルから成るエッチング液を用いた化学的ウェットエッチ
ングにより、フォトレジスト以外の部分を約１００μｍ
程度の深さに食刻した後、フォトレジストを除去する。In the next second step B, this photoresist is used as an etching mask and, for example, by chemical wet etching using an etching solution composed of bromine and methanol, the portion other than the photoresist is exposed to about 100 μm.
After etching to a certain depth, the photoresist is removed.
【００２５】この第２の工程Ｂの処理により、〈０１
１〉及び〈０１１〉方向のエッチング面が半導体基板２
４の裏面（１００）に対して鋭角となる長溝２８が形成
され、同時に、長溝２８の受光素子２６と対向する終端
部には、半導体基板２４の結晶方位によって、裏面と鋭
角になる所謂逆メサ（内側に向けて凹状となる段部）が
形成されことで、約５４°の鋭角度の傾斜面３２が形成
される。By the processing of this second step B, <01
1 > and <0 1 1> direction etching surface is the semiconductor substrate 2
4, a long groove 28 having an acute angle with respect to the back surface (100) is formed, and at the same time, a so-called reverse mesa having an acute angle with the back surface is formed at the terminal end of the long groove 28 facing the light receiving element 26, depending on the crystal orientation of the semiconductor substrate 24. By forming the (step portion that is concave toward the inside), the inclined surface 32 having an acute angle of about 54 ° is formed.
【００２６】次の第３の工程Ｃでは、光ファイバー３０
の終端面を傾斜面３２に対向させるようにして、光ファ
イバー３０を長溝２８に嵌め込み、接着材等によって半
導体基板２４の裏面に固着し、パッケージ内に組み込む
ことで組立工程を完了する。この実施例の構造及びこれ
らの処理工程によれば、受光素子２６と傾斜面３２との
対向精度及び傾斜面３２と光ファイバー３０の終端部と
の対向精度を、周知の基本的なプレーナ・プロセス等に
よって、容易に１μｍ以内に設定することが可能である
ことから、光ファイバー３０と受光素子２６の間での極
めて高精度の光結合を実現することができ、更に、機械
的な可動部分を排除することができることから、耐久性
にも優れている。In the next third step C, the optical fiber 30
The assembly process is completed by fitting the optical fiber 30 into the long groove 28 so that the end surface of the optical fiber 30 faces the inclined surface 32, fixing the optical fiber 30 to the back surface of the semiconductor substrate 24 with an adhesive or the like, and assembling it in the package. According to the structure of this embodiment and the processing steps thereof, the facing accuracy between the light receiving element 26 and the inclined surface 32 and the facing accuracy between the inclined surface 32 and the end portion of the optical fiber 30 can be determined by a well-known basic planar process or the like. Since it can be easily set to 1 μm or less, it is possible to realize highly accurate optical coupling between the optical fiber 30 and the light receiving element 26, and further to eliminate mechanical moving parts. Because it is possible, it has excellent durability.
【００２７】次に、他の実施例を図５と共に説明する。
この実施例は、半導体基板３６の上面にアレー状に設け
られた複数の受光素子群３８の夫々の受光素子の受光面
に対向するように、前述の第１の実施例と同様に製造工
程を適用することによって、半導体基板３６の裏面に複
数の長溝を形成し、これらの長溝に複数の光ファイバー
群４０を固着している。Next, another embodiment will be described with reference to FIG.
In this embodiment, the manufacturing process is performed in the same manner as in the first embodiment described above so as to face the light receiving surface of each light receiving element of the plurality of light receiving element groups 38 provided in the array on the upper surface of the semiconductor substrate 36. By applying it, a plurality of long grooves are formed on the back surface of the semiconductor substrate 36, and a plurality of optical fiber groups 40 are fixed to these long grooves.
【００２８】ここで、各受光素子に対向する各長溝の終
端部は、図１に示したのと同様に、鋭角度θの傾斜面と
なっており、各長溝に固着された各光ファイバーを伝送
してきた光信号をこれらの傾斜面で反射して夫々所定の
受光素子に入射させる構造となっている。Here, the end portion of each long groove facing each light receiving element is an inclined surface having an acute angle θ as in the case shown in FIG. 1, and each optical fiber fixed to each long groove is transmitted. The optical signal thus received is reflected by these inclined surfaces and made incident on a predetermined light receiving element.
【００２９】そして、各受光素子で光電変換した電気信
号を、個々独立に設けられたプリアンプ回路で増幅し、
ボンディングワイヤーを介して所定のリード端子に出力
するように成っており、更に、全体を外部光の入射を阻
止する密閉パッケージ内に収納している。Then, the electric signal photoelectrically converted by each light receiving element is amplified by a preamplifier circuit provided independently.
It is configured to output to a predetermined lead terminal via a bonding wire, and is further housed in a hermetically sealed package that blocks incidence of external light.
【００３０】この実施例に示すように、本発明は、複数
の光通信を並列処理する光受信モジュールに適用でき、
優れた光結合と耐久性に優れた並列処理型の光受信モジ
ュールを実現する上で極めて優れた技術を提供するもの
である。As shown in this embodiment, the present invention can be applied to an optical receiving module for processing a plurality of optical communications in parallel,
The present invention provides an extremely excellent technique for realizing a parallel processing type optical receiving module having excellent optical coupling and durability.
【００３１】[0031]
【発明の効果】以上説明したように、本発明によれば、
半導体基板の一面に設けられた受光素子と、該受光素子
に対向する該半導体基板の裏面に形成されると共に、終
端部に該受光素子の受光面と鋭角度をもって対向する傾
斜面を有する溝と、終端面を該傾斜面に対向して該溝内
に固着された光ファイバーとを具備し、溝に固着された
光ファイバーを伝送してきた光信号を傾斜面で反射して
半導体基板の裏面側から受光素子に入射させる構造とし
たので、光ファイバーと受光素子との間での極めて高精
度の光結合を実現することができ、更に、機械的な可動
部分を排除することができることから耐久性に優れてい
る。As described above, according to the present invention,
A light-receiving element provided on one surface of the semiconductor substrate, and a groove formed on the back surface of the semiconductor substrate facing the light-receiving element and having an inclined surface at the terminal end that faces the light-receiving surface of the light-receiving element at an acute angle. , An optical fiber fixed in the groove with an end surface facing the inclined surface, and an optical signal transmitted from the optical fiber fixed in the groove is reflected by the inclined surface and received from the back surface side of the semiconductor substrate. Since the structure is made to enter the element, it is possible to realize extremely high-precision optical coupling between the optical fiber and the light receiving element, and further it is possible to eliminate mechanical moving parts, so that it has excellent durability. There is.
【００３２】又、周知のプレーナ・プロセス等を適用し
て製造することにより、高い位置決め精度で上記溝を形
成することができるので、特性の向上及び均一化を容易
に実現でき、生産性の向上を図ることができる。特に、
優れた光結合と耐久性が要求される並列処理型の光受信
モジュールに適用した場合に、極めて優れた技術を提供
することができる。Further, since the groove can be formed with high positioning accuracy by applying the well-known planer process or the like, it is possible to easily improve the characteristics and make the groove uniform and improve the productivity. Can be planned. In particular,
When applied to a parallel processing type optical receiver module that requires excellent optical coupling and durability, an extremely excellent technique can be provided.
【図面の簡単な説明】[Brief description of drawings]
【図１】一実施例の要部縦断面構造を示す縦断面図であ
る。FIG. 1 is a vertical cross-sectional view showing a main part vertical cross-section structure of one embodiment.
【図２】図１のＸ−Ｘ線矢視断面図である。FIG. 2 is a sectional view taken along line XX of FIG.
【図３】一実施例の背面図である。FIG. 3 is a rear view of the embodiment.
【図４】製造工程を説明するためのフローチャートであ
る。FIG. 4 is a flowchart for explaining a manufacturing process.
【図５】他の実施例の外観構造を示す斜視図である。FIG. 5 is a perspective view showing an external structure of another embodiment.
【図６】従来例の構造を概略的に示す断面図である。FIG. 6 is a sectional view schematically showing the structure of a conventional example.
【図７】他の従来例の構造を概略的に示す断面図であ
る。FIG. 7 is a sectional view schematically showing the structure of another conventional example.
２４，３６；半導体基板 ２６；受光素子 ２８；長溝 ３０；光ファイバー ３２；傾斜面 ３８；受光素子群 ４０；光ファイバー群 24, 36; semiconductor substrate 26; light receiving element 28; long groove 30; optical fiber 32; inclined surface 38; light receiving element group 40; optical fiber group
Claims (3)
と、 該受光素子に対向する該半導体基板の裏面に形成される
と共に、終端部に該受光素子の受光面と鋭角度をもって
対向する傾斜面を有する溝と、 終端面を該傾斜面に対向して該溝内に固着された光ファ
イバーと、を具備する光受信モジュール。1. A light-receiving element provided on one surface of a semiconductor substrate, and an inclination formed on the back surface of the semiconductor substrate facing the light-receiving element and facing the light-receiving surface of the light-receiving element at an end portion at an acute angle. An optical receiving module comprising: a groove having a surface; and an optical fiber fixed in the groove with an end surface facing the inclined surface.
光素子と、 これらの受光素子に対向する該半導体基板の裏面に形成
されると共に、夫々の終端部に上記夫々の受光素子の各
受光面と鋭角度をもって対向する傾斜面を有する複数の
溝と、 終端面を上記傾斜面に対向して上記夫々の溝内に個々独
立に固着された複数の光ファイバーと、を具備する光受
信モジュール。2. A plurality of light receiving elements provided on one surface of a semiconductor substrate, and a plurality of light receiving elements formed on the back surface of the semiconductor substrate facing these light receiving elements, and each of the light receiving elements of the respective light receiving elements at their respective end portions. An optical receiving module comprising: a plurality of grooves each having an inclined surface facing the surface at an acute angle; and a plurality of optical fibers individually fixed in the respective grooves with their end surfaces facing the inclined surface.
によって形成される請求項１又は請求項２の光受信モジ
ュール。3. The optical receiver module according to claim 1, wherein the groove is formed by a photo mask and an etching process.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3256525A JP3003324B2 (en) | 1991-10-03 | 1991-10-03 | Optical receiving module |
| US07/953,082 US5357103A (en) | 1991-10-02 | 1992-09-29 | Light receiving module with optical fiber coupling |
| DE69217795T DE69217795T2 (en) | 1991-10-02 | 1992-10-02 | Light receiver module |
| EP92116883A EP0535690B1 (en) | 1991-10-02 | 1992-10-02 | Light receiving module |
| US08/280,838 US5466558A (en) | 1991-10-02 | 1994-07-26 | Method of manufacturing a light receiving module with optical fiber coupling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3256525A JP3003324B2 (en) | 1991-10-03 | 1991-10-03 | Optical receiving module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0593827A true JPH0593827A (en) | 1993-04-16 |
| JP3003324B2 JP3003324B2 (en) | 2000-01-24 |
Family
ID=17293838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3256525A Expired - Fee Related JP3003324B2 (en) | 1991-10-02 | 1991-10-03 | Optical receiving module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3003324B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2734083A1 (en) * | 1995-05-12 | 1996-11-15 | Fujitsu Ltd | INTEGRATED OPTICAL MODULE COMPRISING A WAVEGUIDE AND A PHOTO-RECEPTION DEVICE, AND ITS MANUFACTURING METHOD |
| US6327407B1 (en) | 1997-11-07 | 2001-12-04 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light-receiving device, method of manufacturing the same, bidirectional optical semiconductor device, and optical transmission system |
| JP2012129390A (en) * | 2010-12-16 | 2012-07-05 | Opnext Japan Inc | Semiconductor light-emitting element, and method of manufacturing the same |
| JP2013500507A (en) * | 2009-07-28 | 2013-01-07 | タイコ・エレクトロニクス・コーポレイション | Fiber optic interconnect device |
-
1991
- 1991-10-03 JP JP3256525A patent/JP3003324B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2734083A1 (en) * | 1995-05-12 | 1996-11-15 | Fujitsu Ltd | INTEGRATED OPTICAL MODULE COMPRISING A WAVEGUIDE AND A PHOTO-RECEPTION DEVICE, AND ITS MANUFACTURING METHOD |
| US6327407B1 (en) | 1997-11-07 | 2001-12-04 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light-receiving device, method of manufacturing the same, bidirectional optical semiconductor device, and optical transmission system |
| JP2013500507A (en) * | 2009-07-28 | 2013-01-07 | タイコ・エレクトロニクス・コーポレイション | Fiber optic interconnect device |
| JP2012129390A (en) * | 2010-12-16 | 2012-07-05 | Opnext Japan Inc | Semiconductor light-emitting element, and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3003324B2 (en) | 2000-01-24 |
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