JPH0589529A - Production of optical disk - Google Patents
Production of optical diskInfo
- Publication number
- JPH0589529A JPH0589529A JP3276820A JP27682091A JPH0589529A JP H0589529 A JPH0589529 A JP H0589529A JP 3276820 A JP3276820 A JP 3276820A JP 27682091 A JP27682091 A JP 27682091A JP H0589529 A JPH0589529 A JP H0589529A
- Authority
- JP
- Japan
- Prior art keywords
- transparent substrate
- hub
- disk
- curable resin
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
- B29C66/472—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
- B29C65/083—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations using a rotary sonotrode or a rotary anvil
- B29C65/086—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations using a rotary sonotrode or a rotary anvil using a rotary anvil
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
- B29C65/1406—Ultraviolet [UV] radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
- B29C65/1435—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. transmission welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
- B29C65/1454—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface scanning at least one of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1477—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier
- B29C65/1483—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier coated on the article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
- B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
- B29C65/524—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by applying the adhesive from an outlet device in contact with, or almost in contact with, the surface of the part to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
- B29C65/54—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/72—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by combined operations or combined techniques, e.g. welding and stitching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/302—Particular design of joint configurations the area to be joined comprising melt initiators
- B29C66/3022—Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined
- B29C66/30223—Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined said melt initiators being rib-like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/832—Reciprocating joining or pressing tools
- B29C66/8322—Joining or pressing tools reciprocating along one axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
- B29K2995/0026—Transparent
- B29K2995/0027—Transparent for light outside the visible spectrum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2017/00—Carriers for sound or information
- B29L2017/001—Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
- B29L2017/003—Records or discs
- B29L2017/005—CD''s, DVD''s
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は光ディスクの製造方法に
関し、特に透明基板の中心部にハブを取付ける際の取付
け方法の改良に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an optical disk, and more particularly to an improvement in a mounting method for mounting a hub on the center of a transparent substrate.
【0002】[0002]
【従来の技術】いわゆるCD−ROMやディジタル・オ
ーディオ・ディスクあるいは光磁気ディスク等に代表さ
れる光ディスクは、一般にポリカーボネートやアクリル
樹脂等からなる透明基板上に信号記録層や反射膜を成膜
し、この上に硬質の保護膜を形成することで構成されて
いる。そして、この種の光ディスクにおいては、通常、
透明基板の中心部の円盤状のディスクハブが取付けら
れ、記録再生装置のスピンドル軸先端に固定されるディ
スクテーブル上に上記ディスクハブが磁気吸着されてこ
のディスクテーブルとともに回転操作されるようになっ
ている。2. Description of the Related Art Optical discs represented by so-called CD-ROMs, digital audio discs, magneto-optical discs, etc. generally have a signal recording layer and a reflective film formed on a transparent substrate made of polycarbonate, acrylic resin or the like. It is configured by forming a hard protective film on this. And in this kind of optical disc, normally,
A disk-shaped disk hub at the center of the transparent substrate is attached, and the disk hub is magnetically attracted onto a disk table fixed to the tip of the spindle shaft of the recording / reproducing device so that it can be rotated together with the disk table. There is.
【0003】上記ディスクハブは、光ディスクを上記デ
ィスクテーブルに磁気吸着させるとともに、光ディスク
の回転中心をスピンドル軸の回転中心に一致させる役目
をするものである。かかるディスクハブとしては、たと
えば、ディスクテーブルに磁気吸着される円盤状の金属
板と、透明基板である光ディスク基板に取付けられる円
盤状の固着部とからなる。上記固着部は、ハブの軽量
化,基板に対する接着性を考慮して、通常、樹脂等より
構成される。The disk hub serves to magnetically attract the optical disk to the disk table and to align the center of rotation of the optical disk with the center of rotation of the spindle shaft. Such a disc hub includes, for example, a disc-shaped metal plate magnetically attracted to a disc table and a disc-shaped fixed portion attached to an optical disc substrate which is a transparent substrate. The fixing portion is usually made of resin or the like in consideration of weight saving of the hub and adhesion to the substrate.
【0004】[0004]
【発明が解決しようとする課題】ところで、上述のよう
なディスクハブを透明基板の中心部に取り付ける方法と
しては、従来より、いくつかの方法が提案されている。By the way, several methods have been conventionally proposed as a method for attaching the above-mentioned disk hub to the central portion of the transparent substrate.
【0005】たとえば、そのひとつとして超音波による
溶着法が知られている。この超音波による溶着法では、
たとえば図12に示すように、取り付けるディスクハブ
71として、固着部72の基板取付け面72aの外周に
沿ってリブ74が設けられたものを使用する。そして、
溶着に際しては、このリブ74が透明基板75のディス
クハブ溶着部に接触するようにディスクハブ71を透明
基板75上に載置し、ディスクハブ71に超音波縦振動
を印加する。これにより、透明基板75とリブ74の接
触部分が溶融し、透明基板75に対してディスクハブ7
1が固定されることとなる。For example, a welding method using ultrasonic waves is known as one of them. In this ultrasonic welding method,
For example, as shown in FIG. 12, as the disc hub 71 to be attached, one having a rib 74 provided along the outer periphery of the substrate attaching surface 72a of the fixing portion 72 is used. And
At the time of welding, the disk hub 71 is placed on the transparent substrate 75 so that the rib 74 contacts the disk hub welding portion of the transparent substrate 75, and ultrasonic longitudinal vibration is applied to the disk hub 71. As a result, the contact portion between the transparent substrate 75 and the rib 74 is melted, and the disk hub 7 is removed from the transparent substrate 75.
1 will be fixed.
【0006】しかしながら、この方法には、接着面積が
小さいために、十分な接着強度が得られないといった欠
点がある。そこで、接着強度を上げるために、リブの大
きさを大きくする等により接着面積を確保することも考
えられているが、リブの大きさを大きくすると基板にス
トレスがかかり、ディスク基板自体の強度が低下すると
いった不都合が生じる。However, this method has a drawback in that sufficient adhesive strength cannot be obtained because the adhesive area is small. Therefore, in order to increase the adhesive strength, it has been considered to secure the adhesive area by increasing the size of the ribs, but increasing the size of the ribs stresses the substrate and reduces the strength of the disc substrate itself. It causes inconvenience such as decrease.
【0007】この他の取付け方法としては、紫外線硬化
樹脂を使用する方法も提案されている。この方法は、デ
ィスク基板のディスクハブが載置される部分全面に紫外
線硬化樹脂を塗布してディスクハブを接着させるもので
あり、接着面積が大きく、接着強度が十分得られること
となる。As another mounting method, a method using an ultraviolet curable resin has been proposed. In this method, an ultraviolet curable resin is applied to the entire surface of the disk substrate on which the disk hub is mounted to bond the disk hub, and the bonding area is large and sufficient bonding strength can be obtained.
【0008】ところが、紫外線硬化樹脂による接着で
は、一般に、接着する物同志を紫外線硬化樹脂を介して
重ねた後、仮硬化を行い、その後でさらに本硬化を行う
ため、超音波溶着法等に比べて時間がかかる。特に、デ
ィスクハブが載置される部分全面に紫外線硬化樹脂を塗
布して接着させると、硬化にかなりの時間を要し、生産
性が十分得られない。しかも、紫外線硬化樹脂は何らか
の不具合によって未硬化部分が生じ易いため、接着が不
十分となる可能性が高く、信頼性にも欠ける。However, in the case of bonding with an ultraviolet curable resin, generally, the objects to be adhered are superposed on each other via the ultraviolet curable resin, and then temporary curing is carried out, and then main curing is carried out. Takes time. In particular, if an ultraviolet curable resin is applied and adhered to the entire surface on which the disk hub is placed, it takes a considerable amount of time for curing and sufficient productivity cannot be obtained. In addition, since the uncured portion of the ultraviolet curable resin is likely to be generated due to some trouble, the adhesion is likely to be insufficient and the reliability is low.
【0009】さらに、この他の方法としては、たとえば
特開昭62−192946号公報に示すような熱溶着に
よって接着する方法も知られているが、ディスク基板の
光学的特性が劣化する虞れがあり、適当な方法とは言え
ない。Further, as another method, there is known a method of adhering by heat welding as shown in, for example, Japanese Patent Laid-Open No. 62-192946, but there is a concern that the optical characteristics of the disk substrate may deteriorate. There is no suitable method.
【0010】そこで、本発明はこのような従来の実情に
鑑みて提案されたものであり、ディスクハブを高い接着
強度で単時間に取付けることができ、機械強度の高い光
ディスクが製造できる光ディスクの製造方法を提供する
ことを目的とする。Therefore, the present invention has been proposed in view of such a conventional situation, and it is possible to mount an optical disk hub with high adhesive strength for a single time, and to manufacture an optical disk having high mechanical strength. The purpose is to provide a method.
【0011】[0011]
【課題を解決するための手段】上述の課題を達成するた
めに、本発明の光ディスクの製造方法は信号記録層が形
成された透明基板の中心部にディスクハブを取付けるに
際し、超音波による溶着と紫外線硬化樹脂による接着の
両方を行うことを特徴とする。In order to achieve the above-mentioned object, the method of manufacturing an optical disk of the present invention uses ultrasonic welding when attaching a disk hub to the center of a transparent substrate on which a signal recording layer is formed. It is characterized in that both the adhesion by the ultraviolet curing resin is performed.
【0012】[0012]
【作用】透明基板の中央部に、超音波溶着と紫外線硬化
樹脂による接着の両方によってディスクハブを取り付け
ると、超音波溶着のみによってディスクハブを取り付け
た場合に比べて、ディスクハブの取付け強度が向上す
る。また、この場合、紫外線硬化樹脂は、超音波溶着部
分よりも外側にのみ塗布すれば十分な取付け強度が得ら
れるので、接着面積が少なくてすみ、硬化に要する時間
が短縮される。しかも、超音波溶着と紫外線硬化樹脂に
よる接着を併用すれば、どちらかの取付け状態が不十分
であっても、十分な強度が確保でき、信頼性が向上す
る。[Operation] When the disk hub is attached to the center of the transparent substrate by both ultrasonic welding and adhesion with UV curable resin, the mounting strength of the disk hub is improved compared to the case where the disk hub is attached only by ultrasonic welding. To do. Further, in this case, the ultraviolet curable resin can provide sufficient attachment strength if it is applied only to the outside of the ultrasonically welded portion, so that the adhesive area can be reduced and the time required for curing can be shortened. Moreover, by using ultrasonic welding and adhesion using an ultraviolet curable resin together, sufficient strength can be secured and reliability is improved even if either mounting state is insufficient.
【0013】[0013]
【実施例】以下、本発明を適用した光ディスクの製造方
法について図面を参照しながら説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method of manufacturing an optical disk to which the present invention is applied will be described below with reference to the drawings.
【0014】光ディスクを製造するには、まず、透明基
板上に、スタンパ上に形成された凹凸パターンを転写す
る。転写方法としては、コンプレッション方式,インジ
ェクション方式,インジェクション・コンプレッション
方式,フォトポリマー方式(いわゆる2P法)等いずれ
であっても差し支えない。また、透明基板の材料につい
ても特に制限がなく、アクリル樹脂,ポリカーボネート
樹脂等,通常使用されている基板材料であればいずれで
もよい。To manufacture an optical disk, first, the concavo-convex pattern formed on the stamper is transferred onto the transparent substrate. The transfer method may be any of a compression method, an injection method, an injection compression method, a photopolymer method (so-called 2P method), and the like. Further, the material of the transparent substrate is not particularly limited, and any commonly used substrate material such as acrylic resin and polycarbonate resin may be used.
【0015】さらに、凹凸パターンが転写されたディス
ク基板は、信号記録層や反射膜を成膜したり、保護層等
が設けられるが、光ディスクの構成は任意であり、した
がってディスク基板上に成膜される反射膜,信号記録
層,保護膜等は用途に応じて任意選択することができ
る。例えば、デジタルオーディオディスクや、いわゆる
CD−ROM等においては、凹凸パターンが転写された
ディスク基板上にAl等の金属反射膜が成膜される。光
磁気ディスクでは、磁気光学特性(カー効果やファラデ
ー効果)を有する垂直磁化膜が成膜される。その他、低
融点金属薄膜,相変化膜,有機色素を含有する膜等を信
号記録層とする光ディスクにも適用可能である。Further, the disc substrate on which the concavo-convex pattern is transferred is provided with a signal recording layer, a reflection film, a protective layer and the like, but the optical disc may have any constitution, and therefore the film is formed on the disc substrate. The reflective film, the signal recording layer, the protective film, etc. to be formed can be arbitrarily selected according to the application. For example, in a digital audio disc, a so-called CD-ROM, or the like, a metal reflective film such as Al is formed on a disc substrate on which the concavo-convex pattern is transferred. In a magneto-optical disk, a perpendicular magnetization film having magneto-optical characteristics (Kerr effect and Faraday effect) is formed. In addition, it can be applied to an optical disk having a signal recording layer such as a low melting point metal thin film, a phase change film, and a film containing an organic dye.
【0016】このように、透明基板上に所望の信号記録
層,保護膜等を形成した後、透明基板の中央部にディス
クハブを取付ける。ここで、ディスクハブの取付けは、
取付け強度の確保、接着時間の短縮化および光ディスク
自体の機械的強度を得るために、超音波による溶着と紫
外線硬化樹脂による接着の両方を行う。このとき、工程
順序としては、はじめに超音波溶着を行った後、紫外線
硬化樹脂による接着を行ってもよく、あるいは、透明基
板のディスクハブ接着部分に予め紫外線硬化樹脂を塗布
しておき、その後で超音波溶着を行い、さらに超音波溶
着後に紫外線硬化樹脂の硬化を行って接着してもよい。After the desired signal recording layer, protective film, etc. are formed on the transparent substrate in this way, a disk hub is attached to the center of the transparent substrate. Here, the mounting of the disc hub is
In order to secure the mounting strength, shorten the bonding time, and obtain the mechanical strength of the optical disk itself, both welding by ultrasonic waves and bonding by an ultraviolet curable resin are performed. At this time, the process sequence may be such that ultrasonic bonding is first performed and then bonding with an ultraviolet curable resin is performed, or the ultraviolet curable resin is previously applied to the disk hub bonding portion of the transparent substrate and then the Ultrasonic welding may be performed, and after the ultrasonic welding, the ultraviolet curable resin may be cured for adhesion.
【0017】まず、前者の方法でディスクハブを取り付
けるには、図1に示すように、両面テープ等の吸着手段
が表面に設けられたターンテーブル1上に透明基板2を
載置して固定する。そして、上下動自在とされた溶着ホ
ーン3が備えられた超音波溶着装置の溶着ホーン3の先
端にディスクハブ5を取り付ける。上記ディスクハブ5
は、ディスクテーブル上に磁気吸着される円盤状の金属
板6と、透明基板2に溶着される樹脂よりなる円盤状の
固着部7とからなり、固着部7の透明基板2に溶着され
る基板取付け面7aの外周に沿ってリブ8が設けられて
いる。そして、上記溶着ホーン3の先端には、上記金属
板6が取り付けられる。First, in order to attach the disk hub by the former method, as shown in FIG. 1, the transparent substrate 2 is placed and fixed on the turntable 1 on the surface of which suction means such as a double-sided tape is provided. .. Then, the disc hub 5 is attached to the tip of the welding horn 3 of the ultrasonic welding device provided with the vertically movable welding horn 3. The disc hub 5
Is composed of a disk-shaped metal plate 6 magnetically adsorbed on the disk table, and a disk-shaped fixed portion 7 made of resin and welded to the transparent substrate 2, and the fixed portion 7 is a substrate welded to the transparent substrate 2. Ribs 8 are provided along the outer periphery of the mounting surface 7a. The metal plate 6 is attached to the tip of the welding horn 3.
【0018】このように、ディスクハブ5を溶着ホーン
3先端に取付けた後、上記溶着ホーン3を透明基板2に
対して位置調整し、図2に示すように、リブ8が透明基
板2に接触するまで下降させる。そして、リブ8が透明
基板2に接触したところで上記溶着ホーン3を作動させ
て、超音波縦振動をディスクハブ5に印加する。する
と、図3に示すように、透明基板2とリブ8の接触部分
が溶融するので、溶着前の基板取付け面7aの位置と、
溶着後の取付け面7aの位置との距離で規定される総合
溶着深さTDが所定の値となったところで超音波印加を
停止する。これにより、透明基板2に対して、ディスク
ハブ5は所定の高さを持って取付けられることとなる。
そして、溶着ホーン3の先端からディスクハブをはずし
て溶着ホーン3を上昇させる。After attaching the disk hub 5 to the tip of the welding horn 3 as described above, the position of the welding horn 3 is adjusted with respect to the transparent substrate 2, and the rib 8 contacts the transparent substrate 2 as shown in FIG. Lower until When the rib 8 contacts the transparent substrate 2, the welding horn 3 is operated to apply ultrasonic longitudinal vibration to the disk hub 5. Then, as shown in FIG. 3, since the contact portion between the transparent substrate 2 and the rib 8 is melted, the position of the substrate mounting surface 7a before welding,
The application of ultrasonic waves is stopped when the total welding depth TD, which is defined by the distance from the position of the mounting surface 7a after welding, reaches a predetermined value. As a result, the disc hub 5 is attached to the transparent substrate 2 with a predetermined height.
Then, the disc hub is removed from the tip of the welding horn 3 to raise the welding horn 3.
【0019】このようにして超音波溶着を行った後、さ
らに紫外線硬化樹脂による接着を行うことで、ディスク
ハブの取付けをさらに確実なものとする。ここで、紫外
線硬化樹脂によるハブの接着は、リブよりも内側を接着
してもほとんど意味がなく、リブよりも外側を接着する
ことで、取付け強度の格段の向上が得られる。したがっ
て、本実施例では、以下に記す如く、リブより外側にの
み紫外線硬化樹脂を塗布して硬化することにより、ハブ
の取付け強度を確保するとともに取付け時間の短縮を図
ることとする。After the ultrasonic welding is performed in this manner, the ultraviolet ray curable resin is further adhered to further secure the attachment of the disc hub. Here, it is almost meaningless to bond the hub with the ultraviolet curable resin even if the inside of the rib is bonded, and by bonding the outside of the rib, the mounting strength can be significantly improved. Therefore, in the present embodiment, as will be described below, the hub mounting strength is secured and the mounting time is shortened by applying and curing the ultraviolet curable resin only on the outer side of the rib.
【0020】すなわち、図4に示すように、透明基板2
が載置されたターンテーブル1を斜めに傾け、超音波溶
着されたディスクハブ5と透明基板2の間隙に紫外線硬
化樹脂が塗布されるように紫外線硬化樹脂供給口9をデ
ィスクハブ5の円周近傍に配置する。そして、ターンテ
ーブル1を一方向に回転させつつ紫外線硬化樹脂供給口
9より紫外線硬化樹脂11を供給する。これにより、紫
外線硬化樹脂11は、ディスクハブ5と透明基板2との
間隙に流れ込み、リブ8より外側部分に塗布される。そ
して、図5に示すように、透明基板2側に光源10を配
置して、紫外線硬化樹脂11が塗布された部分に紫外線
を照射することで、ディスクハブ5と透明基板2が接着
されることとなる。That is, as shown in FIG. 4, the transparent substrate 2
The turntable 1 on which is mounted is inclined, and the UV curable resin supply port 9 is set to the circumference of the disc hub 5 so that the UV curable resin is applied to the gap between the ultrasonically welded disc hub 5 and the transparent substrate 2. Place in the vicinity. Then, while rotating the turntable 1 in one direction, the ultraviolet curable resin 11 is supplied from the ultraviolet curable resin supply port 9. As a result, the ultraviolet curable resin 11 flows into the gap between the disk hub 5 and the transparent substrate 2 and is applied to the portion outside the rib 8. Then, as shown in FIG. 5, by arranging the light source 10 on the transparent substrate 2 side and irradiating the portion coated with the ultraviolet curable resin 11 with ultraviolet rays, the disc hub 5 and the transparent substrate 2 are bonded together. Becomes
【0021】次に、後者の方法,すなわち紫外線硬化樹
脂の塗布,超音波溶着,紫外線硬化樹脂の硬化の順でハ
ブの取付けを行う方法について説明する。Next, the latter method, that is, the method of mounting the hub in the order of application of the ultraviolet curable resin, ultrasonic welding, and curing of the ultraviolet curable resin will be described.
【0022】先ず、図6に示すように、上述の場合と同
様に吸着手段が表面に設けられたターンテーブル1に透
明基板2を載置して固定する。そして、この透明基板2
上のディスクハブ取付け部分の外周に沿って紫外線硬化
樹脂が塗布されるように、紫外線硬化樹脂供給口9を配
置し、ターンテーブル1を一方向に回転させつつ、紫外
線硬化樹脂11を塗布する。そして、図7に示すよう
に、超音波溶着装置の溶着ホーン3の先端にディスクハ
ブ5を取付け、溶着ホーン3を透明基板2に対して位置
調整した後、図8に示すように、リブ8が透明基板2に
接触するまで下降させる。リブ8が接触したところで、
上記溶着ホーン3を作動させて、超音波縦振動を印加
し、リブ8と透明基板2を、透明基板2に対してディス
クハブ5が所定の高さとなるように溶着させる。なお、
このとき超音波縦振動により、塗布した紫外線硬化樹脂
11が飛散する虞れがあるので、予め、紫外線硬化樹脂
塗布部分の外周にマスクを設ける等により、樹脂の飛散
を防止する。そして、超音波溶着後、図9に示すように
紫外線硬化樹脂11が塗布された部分に光源10を配置
して紫外線を照射することで、ディスクハブと透明基板
とを接着する。First, as shown in FIG. 6, the transparent substrate 2 is placed and fixed on the turntable 1 on the surface of which the suction means is provided as in the case described above. And this transparent substrate 2
The UV-curable resin supply port 9 is arranged so that the UV-curable resin is applied along the outer circumference of the upper disk hub mounting portion, and the UV-curable resin 11 is applied while rotating the turntable 1 in one direction. Then, as shown in FIG. 7, the disc hub 5 is attached to the tip of the welding horn 3 of the ultrasonic welding apparatus, and the position of the welding horn 3 is adjusted with respect to the transparent substrate 2. Then, as shown in FIG. Is lowered until it contacts the transparent substrate 2. Where the ribs 8 make contact,
The welding horn 3 is operated to apply ultrasonic longitudinal vibration, and the rib 8 and the transparent substrate 2 are welded to the transparent substrate 2 so that the disk hub 5 has a predetermined height. In addition,
At this time, since there is a possibility that the applied ultraviolet curable resin 11 may be scattered by the ultrasonic longitudinal vibration, the resin is prevented from being scattered by providing a mask in advance on the outer periphery of the portion to which the ultraviolet curable resin is applied. Then, after ultrasonic welding, the light source 10 is arranged on the portion coated with the ultraviolet curable resin 11 as shown in FIG. 9 and ultraviolet rays are irradiated to bond the disc hub and the transparent substrate.
【0023】このように超音波溶着と紫外線硬化樹脂に
よる接着とを併用すれば、超音波溶着のみの場合に比べ
て取付け強度が向上する。また、超音波溶着と紫外線硬
化樹脂による接着を併用する場合、紫外線硬化樹脂は、
上述の如くリブの外側にのみ塗布すればよく、接着面積
が少なくて済むので、硬化時間にそれほど時間を要さ
ず、取付け時間の増大が抑えられる。しかも、超音波溶
着、紫外線硬化樹脂による接着の両方によって取付けを
行うと、たとえば、どちらかの取付け状態が不十分であ
っても、十分な強度(10kg重以上)が確保できるの
で、信頼性の向上が望める。When the ultrasonic welding and the adhesion using the ultraviolet curable resin are used together in this way, the mounting strength is improved as compared with the case where only the ultrasonic welding is used. In addition, when the ultrasonic welding and the adhesion by the ultraviolet curable resin are used together, the ultraviolet curable resin is
As described above, it is sufficient to apply only to the outer side of the ribs, and the adhesion area is small, so that the curing time does not take so long, and the increase in attachment time can be suppressed. In addition, if the mounting is performed by both ultrasonic welding and bonding with an ultraviolet curable resin, sufficient strength (10 kg weight or more) can be secured even if either mounting state is insufficient, so that reliability is improved. Hope to improve.
【0024】なお、このような効果は、上記2法のいず
れを採用した場合でも同程度に得られるが、透明基板2
上に予め紫外線硬化樹脂11を塗布しておき、その後で
超音波溶着を行う場合には、上述の如く、超音波振動に
よって塗布した紫外線硬化樹脂11が漏出するため、こ
れを防止するために紫外線硬化樹脂11を塗布した部分
の外周にマスクを設けることが必要となり、それだけ操
作が煩雑となる。したがって、作業操作の簡易化、作業
時間の短縮化の点から、超音波溶着を行った後、紫外線
硬化樹脂による接着を行う方が有利である。It should be noted that such an effect can be obtained to the same degree when either of the above two methods is adopted, but the transparent substrate 2
When the ultraviolet curable resin 11 is previously applied on top and ultrasonic welding is performed thereafter, the applied ultraviolet curable resin 11 leaks due to ultrasonic vibration as described above. It is necessary to provide a mask on the outer periphery of the portion where the cured resin 11 is applied, and the operation becomes complicated accordingly. Therefore, from the viewpoint of simplifying the work operation and shortening the work time, it is more advantageous to carry out the adhesion by the ultraviolet curable resin after the ultrasonic welding.
【0025】次に、上述のようにして作製される光ディ
スクの機械的強度を検討するために、ディスクハブの取
付け方法として表1に示す方法を使用して各種光ディス
ク(ディスク1,ディスク2,比較ディスク1,比較デ
ィスク2)を作製し、ハブ破断強度を比較した。Next, in order to examine the mechanical strength of the optical discs manufactured as described above, various optical discs (disc 1, disc 2, comparison Disk 1 and comparative disk 2) were prepared and the hub breaking strengths were compared.
【0026】[0026]
【表1】 [Table 1]
【0027】なお、ハブ破断強度の測定は以下のように
して行った。ハブ破断強度の測定するには、先ず、図1
0に示すようなディスク受け台51に光ディスク52を
載置する。なお、上記ディスク受け台51は、ディスク
ハブ54の外径よりも一回り大きな外径を有する円筒体
であり、光ディスク52が載置される一端面に円筒の外
周に沿った円形状の凹部51aが設けられており、載置
された光ディスク52のハブ取付け部分の回りがリング
状に支持されるようになっている。そして、このような
ディスク受け台51に光ディスク52を載置し、ハブ取
付け部分に向かって上部から各種重量でロードセル53
を下降させる。そして、光ディスク52を破断するのに
要したロードセル53の重量を測定することによってハ
ブ破断強度を評価した。なお、測定を行ったサンプル数
は各光ディスクについて10枚である。測定結果を図1
1に示す。The hub breaking strength was measured as follows. To measure the hub breaking strength, first, refer to FIG.
The optical disk 52 is mounted on the disk receiving stand 51 as shown in FIG. The disc pedestal 51 is a cylindrical body having an outer diameter slightly larger than the outer diameter of the disc hub 54, and a circular recess 51a along the outer periphery of the cylinder on one end surface on which the optical disc 52 is placed. Is provided, and the circumference of the hub mounting portion of the mounted optical disk 52 is supported in a ring shape. Then, the optical disk 52 is placed on such a disk receiving base 51, and the load cell 53 is loaded with various weights from the top toward the hub mounting portion.
To lower. Then, the hub breaking strength was evaluated by measuring the weight of the load cell 53 required to break the optical disk 52. The number of samples measured is 10 for each optical disc. Figure 1 shows the measurement results
Shown in 1.
【0028】図11からわかるように、ディスクハブを
紫外線硬化樹脂による接着と超音波溶着を併用して取り
付けたディスク1およびディスク2においては、ディス
クを破断するのに要する重量は60〜80kgであり、
ハブ破断強度がいずれも高いのに対し、紫外線硬化樹脂
接着のみでディスクハブを取り付けた比較ディスク1お
よび超音波溶着のみでディスクハブを取り付けた比較デ
ィスク2では、いずれもハブ破断強度が低い。したがっ
て、このことから、ディスクハブを超音波溶着と紫外線
硬化樹脂による接着の両方の手段で取り付けることは、
ディスクハブの取付け強度を確保して機械的強度の高い
光ディスクを得る上で有効であることが確認された。As can be seen from FIG. 11, in the disk 1 and the disk 2 to which the disk hub was attached by using both the bonding by the ultraviolet curing resin and the ultrasonic welding, the weight required to break the disk was 60 to 80 kg. ,
While the hub breaking strength is high, the comparative disk 1 having the disk hub attached only by the UV curable resin bonding and the comparative disk 2 having the disk hub attached only by ultrasonic welding have a low hub breaking strength. Therefore, from this fact, it is not possible to attach the disc hub by both means of ultrasonic welding and adhesion with an ultraviolet curable resin.
It was confirmed that it is effective in securing the mounting strength of the disk hub and obtaining an optical disk having high mechanical strength.
【0029】[0029]
【発明の効果】以上の説明からも明らかなように、本発
明の光ディスクの製造方法においては、透明基板の中央
部にディスクハブを取り付ける際に、超音波溶着と紫外
線硬化樹脂による接着の両方を行っているので、ディス
クハブの取付け強度の確保、取付け時間の短縮化、光デ
ィスクの機械的強度の向上を図ることができる。しか
も、超音波溶着と紫外線硬化樹脂による溶着を併用すれ
ば、どちらかの取付け状態が不十分であっても、ある程
度の強度は確保できるので、信頼性の向上が可能とな
る。As is apparent from the above description, in the method of manufacturing an optical disk of the present invention, both ultrasonic welding and adhesion by the ultraviolet curable resin are used when the disk hub is attached to the central portion of the transparent substrate. Since this is done, it is possible to secure the mounting strength of the disk hub, shorten the mounting time, and improve the mechanical strength of the optical disk. Moreover, if ultrasonic welding and welding using an ultraviolet curable resin are used together, a certain degree of strength can be secured even if one of the mounting states is insufficient, so that reliability can be improved.
【図1】本発明を適用した製造方法の一例において、デ
ィスクハブの溶着ホーン取付け工程を示す模式図であ
る。FIG. 1 is a schematic view showing a step of attaching a welding horn to a disc hub in an example of a manufacturing method to which the present invention is applied.
【図2】本発明を適用した製造方法の一例において、超
音波印加工程を示す模式図である。FIG. 2 is a schematic diagram showing an ultrasonic wave applying step in an example of a manufacturing method to which the present invention is applied.
【図3】超音波溶着されたリブの様子を示す模式図であ
る。FIG. 3 is a schematic view showing a state of ribs ultrasonically welded.
【図4】本発明を適用した製造方法の一例において、紫
外線硬化樹脂塗布工程を示す模式図である。FIG. 4 is a schematic diagram showing an ultraviolet curable resin coating step in an example of a manufacturing method to which the present invention is applied.
【図5】本発明を適用した製造方法の一例において、紫
外線照射工程を示す模式図である。FIG. 5 is a schematic diagram showing an ultraviolet irradiation step in an example of a manufacturing method to which the present invention is applied.
【図6】本発明を適用した製造方法の他の例において、
紫外線硬化樹脂塗布工程を示す模式図である。FIG. 6 shows another example of the manufacturing method to which the present invention is applied.
It is a schematic diagram which shows a ultraviolet curing resin application process.
【図7】本発明を適用した製造方法の他の例において、
ディスクハブの溶着ホーン取付け工程を示す模式図であ
る。FIG. 7 shows another example of the manufacturing method to which the present invention is applied.
It is a schematic diagram which shows the welding horn attachment process of a disc hub.
【図8】本発明を適用した製造方法の他の例において、
超音波印加工程を示す模式図である。FIG. 8 is another example of the manufacturing method to which the present invention is applied,
It is a schematic diagram which shows an ultrasonic wave application process.
【図9】本発明を適用した製造方法の他の例において、
紫外線照射工程を示す模式図である。FIG. 9 shows another example of the manufacturing method to which the present invention is applied.
It is a schematic diagram which shows an ultraviolet irradiation process.
【図10】ハブ破断強度の測定方法を示す模式図であ
る。FIG. 10 is a schematic view showing a method of measuring hub breaking strength.
【図11】光ディスクのハブ破断強度を示す特性図であ
る。FIG. 11 is a characteristic diagram showing hub breaking strength of an optical disc.
【図12】従来のディスクハブ取付け方法を示す模式図
である。FIG. 12 is a schematic view showing a conventional disc hub mounting method.
2 ・・・透明基板 3 ・・・溶着ホーン 5 ・・・ディスクハブ 11・・・紫外線硬化樹脂 2 ... Transparent substrate 3 ... Welding horn 5 ... Disk hub 11 ... UV curable resin
Claims (1)
部にハブを取付けるに際し、超音波による溶着と紫外線
硬化樹脂による接着の両方を行うことを特徴とする光デ
ィスクの製造方法。1. A method for manufacturing an optical disk, wherein both attachment by ultrasonic waves and adhesion by an ultraviolet curable resin are carried out when a hub is attached to the central portion of a transparent substrate on which a signal recording layer is formed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27682091A JP3194280B2 (en) | 1991-09-27 | 1991-09-27 | Optical disc and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27682091A JP3194280B2 (en) | 1991-09-27 | 1991-09-27 | Optical disc and method of manufacturing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0589529A true JPH0589529A (en) | 1993-04-09 |
JP3194280B2 JP3194280B2 (en) | 2001-07-30 |
Family
ID=17574856
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27682091A Expired - Fee Related JP3194280B2 (en) | 1991-09-27 | 1991-09-27 | Optical disc and method of manufacturing the same |
Country Status (1)
Country | Link |
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JP (1) | JP3194280B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6495235B2 (en) | 2000-03-24 | 2002-12-17 | Matsushita Electric Industrial Co., Ltd. | Optical disk, substrate of the same, and mold for forming the substrate |
FR3071186A1 (en) * | 2017-09-20 | 2019-03-22 | Compagnie Plastic Omnium | METHOD FOR ASSEMBLING A PANEL AND A STRUCTURE PART |
-
1991
- 1991-09-27 JP JP27682091A patent/JP3194280B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6495235B2 (en) | 2000-03-24 | 2002-12-17 | Matsushita Electric Industrial Co., Ltd. | Optical disk, substrate of the same, and mold for forming the substrate |
FR3071186A1 (en) * | 2017-09-20 | 2019-03-22 | Compagnie Plastic Omnium | METHOD FOR ASSEMBLING A PANEL AND A STRUCTURE PART |
Also Published As
Publication number | Publication date |
---|---|
JP3194280B2 (en) | 2001-07-30 |
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