JPH0584747A - Device for adjusting temperature of mold of plastic molding machine - Google Patents
Device for adjusting temperature of mold of plastic molding machineInfo
- Publication number
- JPH0584747A JPH0584747A JP3271826A JP27182691A JPH0584747A JP H0584747 A JPH0584747 A JP H0584747A JP 3271826 A JP3271826 A JP 3271826A JP 27182691 A JP27182691 A JP 27182691A JP H0584747 A JPH0584747 A JP H0584747A
- Authority
- JP
- Japan
- Prior art keywords
- fluid
- mold
- temperature
- switching
- high temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はプラスチック成形機の金
型を成形工程中に加熱又は冷却するための流体を、高温
と低温の２水準に調整して金型に選択供給できるように
した金型温度調整装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is a metal mold capable of selectively supplying a fluid for heating or cooling a metal mold of a plastic molding machine to two levels of high temperature and low temperature during the molding process. The present invention relates to a mold temperature adjusting device.
【０００２】[0002]
【従来の技術】従来からプラスチックの射出成形機など
では、その金型温度は工程中一定の温度となるように温
度調整されていた。しかし生産性向上の観点から、最近
では成形サイクルを大幅に短縮する必要が生じてきてお
り、成形サイクルを大幅に短縮するには金型に樹脂を充
填した後は急速に金型温度を下げて冷却を促進すること
が必要となる。しかるにこのような金型温度を急速に変
化させることは、一方において金型の熱容量が大きいた
め金型温度を変化させるのに時間がかかりすぎる。また
金型の冷却溝に高温流体と低温流体とを切り換えて流す
ことにより金型温度を上下させる場合、高温流体と低温
流体の切り換え時に金型部に残存する被置換流体が置換
流体の回路に流出し、高温流体と低温流体が混ざってし
まうなどの問題があり、この点を解決することが技術的
に困難であった。ここで流体とは水、油など金型の冷却
又は加熱に供される媒体を指す。2. Description of the Related Art Conventionally, in a plastic injection molding machine or the like, the temperature of the mold has been adjusted so as to be a constant temperature during the process. However, from the viewpoint of improving productivity, it has recently become necessary to significantly shorten the molding cycle, and in order to significantly shorten the molding cycle, it is necessary to rapidly lower the mold temperature after filling the mold with resin. It is necessary to promote cooling. On the other hand, such a rapid change of the mold temperature takes too much time to change the mold temperature because the heat capacity of the mold is large. When the mold temperature is raised or lowered by switching between the high-temperature fluid and the low-temperature fluid through the cooling groove of the mold, the fluid to be replaced remaining in the mold part at the time of switching between the high-temperature fluid and the low-temperature fluid becomes the replacement fluid circuit. There is a problem that the high temperature fluid and the low temperature fluid are mixed with each other, and it is technically difficult to solve this problem. Here, the fluid refers to a medium such as water or oil used for cooling or heating the mold.
【０００３】ところで最近前述の金型熱容量の問題につ
いては、本発明の発明者等が特願平２−４１１７７号で
開示したように、成形品キャビティ近傍に多条の冷却溝
を設けることにより解決できるようになったが、このも
のでも相変わらず高温流体と低温流体が混ざってしまう
問題は未解決であった。即ち、高温流体と低温流体が混
ざると、高温流体、低温流体それぞれの温度が大きく変
化するため所望の金型温度変化を達成できず、また高温
流体、低温流体が混ざった分のエネルギー損失が大きい
という致命的な欠陥を生じる。By the way, recently, the above-mentioned problem of mold heat capacity is solved by providing multiple cooling grooves in the vicinity of a cavity of a molded product, as disclosed by the inventors of the present invention in Japanese Patent Application No. 2-41177. Although it has become possible, the problem that the high-temperature fluid and the low-temperature fluid are mixed still remains unsolved. That is, when the high temperature fluid and the low temperature fluid are mixed, the temperatures of the high temperature fluid and the low temperature fluid change greatly, so that the desired mold temperature change cannot be achieved, and the energy loss corresponding to the mixture of the high temperature fluid and the low temperature fluid is large. That causes a fatal defect.
【０００４】[0004]
【発明が解決しようとする課題】以上のように従来の技
術にあっては、高温流体と低温流体を切り換え使用する
ことにより、金型を成形工程中に高温と低温の２水準に
温度調整する場合に、高温流体と低温流体の切り換え時
に両者が混ざってしまい、そのために所望の金型温度変
化を達成できず、かつエネルギー損失も大きいという問
題があった。As described above, in the prior art, the temperature of the mold is adjusted to two levels, high temperature and low temperature, during the molding process by switching between the high temperature fluid and the low temperature fluid. In this case, there is a problem in that the high temperature fluid and the low temperature fluid are mixed with each other at the time of switching, so that a desired mold temperature change cannot be achieved and energy loss is large.
【０００５】そこで本発明は、 １）高温流体と低温流体の切り換えを行なう複数の切換
弁を、成形機の金型取付盤又はその近傍に設置する。 ２）高温流体と低温流体の各戻り側切換弁の作動タイミ
ングを、各供給側切換弁の作動タイミングよりも次の何
れかの手段で遅らせる。 イ）タイマーによる設定時間だけ遅らせる。 ロ）金型の流体出口通路に温度検出手段を設け、同通路
の流体温度が高温から低温へ切り換える時の設定温度
に、又は低温から高温へ切り換える時の設定温度に達す
る時点を検出し、その時点まで遅らせる。 ３）流体のタンクを何れかの構造とする。 イ）高温流体と低温流体を貯蔵するそれぞれのタンク
が、金型における流体の入口側切換弁と出口側切換弁と
の間の流体通路に残存する被置換流体の容量以上の貯蔵
流体量変化を許容できるようにする。 ロ）同一のタンクで上側に高温流体、下側に低温流体を
両者の境界壁なしに収容できるようにし、かつ両流体の
各々の収容部に当該流体の吐出口と流入口を設ける。 等の技術的工夫を講じることにより、前述の問題点を解
決して高温流体と低温流体が混ざる量が極めて少ない金
型温度調整装置を提供しようとするものである。Therefore, according to the present invention, 1) a plurality of switching valves for switching between a high temperature fluid and a low temperature fluid are installed on a mold mounting plate of a molding machine or in the vicinity thereof. 2) The operation timing of each return side switching valve for the high temperature fluid and the low temperature fluid is delayed from the operation timing of each supply side switching valve by any of the following means. A) Delay by the time set by the timer. B) A temperature detecting means is provided in the fluid outlet passage of the mold to detect when the fluid temperature of the passage reaches a set temperature when switching from high temperature to low temperature or a set temperature when switching from low temperature to high temperature. Delay to the point. 3) The fluid tank has any structure. B) The tanks that store the high-temperature fluid and the low-temperature fluid each have a change in the amount of stored fluid that exceeds the capacity of the fluid to be replaced that remains in the fluid passage between the inlet-side switching valve and the outlet-side switching valve of the fluid in the mold. Be tolerable. (B) In the same tank, a high temperature fluid can be accommodated on the upper side and a low temperature fluid can be accommodated on the lower side without a boundary wall between the two, and a discharge port and an inflow port for the fluid are provided in each accommodating portion. It is an object of the present invention to solve the above-mentioned problems and to provide a mold temperature adjusting device in which the amount of the high temperature fluid and the low temperature fluid mixed is extremely small by taking technical measures such as the above.
【０００６】[0006]
【課題を解決するための手段】このため本発明は、成形
機によるプラスチック成形品の成形工程中に同成形機の
金型に高温流体と低温流体を選択的に切り換えて流すこ
とにより、金型の温度制御を行なうようにした金型温度
調整装置において、同高温流体と同低温流体の切り換え
を行なう切換弁を、成形機の金型取付盤又はその近傍に
設置してなるもので、これを課題解決のための手段とす
るものである。For this reason, the present invention provides a mold by selectively switching between a high temperature fluid and a low temperature fluid in a mold of a molding machine during the molding process of a plastic molded product by the molding machine. In the mold temperature adjusting device for controlling the temperature of 1., a switching valve for switching between the high temperature fluid and the low temperature fluid is installed on the mold mounting plate of the molding machine or in the vicinity thereof. It is a means for solving the problem.
【０００７】また本発明は、前記高温流体と低温流体の
切り換え時に、前記流体の各戻り側切換弁の作動タイミ
ングを、各供給側切換弁の作動タイミングより所定時間
遅らせるようにしてなるもので、これを課題解決のため
の手段とするものである。Further, according to the present invention, when switching between the high temperature fluid and the low temperature fluid, the operation timing of each return side switching valve of the fluid is delayed by a predetermined time from the operation timing of each supply side switching valve. This is a means for solving the problem.
【０００８】また本発明は、成形機によるプラスチック
成形品の成形工程中に同成形機の金型に高温流体と低温
流体を選択的に切り換えて流すことにより、金型の温度
制御を行なうようにした金型温度調整装置において、同
高温流体と同低温流体を貯蔵するタンクが、金型におけ
る流体の入口側切換弁と出口側切換弁との間の流体通路
に残存する被置換流体の容量以上の貯蔵流体量変化をタ
ンク内で許容できるようにしてなるもので、これを課題
解決のための手段とするものである。Further, according to the present invention, during the molding process of a plastic molded product by the molding machine, the temperature of the mold is controlled by selectively switching a high temperature fluid and a low temperature fluid to flow in the mold of the molding machine. In the mold temperature adjusting device described above, the tank for storing the same high temperature fluid and the same low temperature fluid has a capacity equal to or greater than the capacity of the fluid to be replaced remaining in the fluid passage between the inlet side switching valve and the outlet side switching valve of the fluid in the mold. The change in the amount of stored fluid is allowed in the tank, and this is a means for solving the problem.
【０００９】[0009]
【作用】本発明によれば、 １）高温流体、低温流体の切り換えを行なう複数の切換
弁を、成形機の金型取付盤又はその近傍に設置すること
により、それらの切換弁が金型取付盤から離れて設置さ
れた場合に比べて、金型における高温流体と低温流体の
切り換え時の被置換流体量が大幅に減少する。According to the present invention, 1) By installing a plurality of switching valves for switching between the high temperature fluid and the low temperature fluid on the mold mounting plate of the molding machine or in the vicinity thereof, those switching valves are mounted on the mold. The amount of fluid to be replaced when switching between the high temperature fluid and the low temperature fluid in the mold is significantly reduced as compared with the case where the fluid is installed away from the board.
【００１０】２）高温流体、低温流体の各戻り側切換弁
の作動タイミングを、各供給側切換弁の作動タイミング
より遅らせることにより、金型において置換される流体
を、それが高温の場合は高温流体の回路へ、低温の場合
は低温流体の回路へ戻すことができ、高温流体と低温流
体が混ざる量が極めて少なくなる。特に前記の戻り側切
換弁の作動タイミングの遅延方法を次のように変える
と、その作用も下記の如く異なる。 イ）タイマーの設定時間により作動タイミングを遅らせ
る手段をとった場合、任意に遅延時間を変更することが
でき、これによって高温流体と低温流体の混ざる量が最
少になる遅延時間を見いだすことを可能にする。 ロ）金型の流体出口通路に温度検出手段を設け、同通路
の流体温度が設定温度に達する時点を検出してその時点
まで遅らせる手段の場合、運転者が遅延時間の調整をす
る必要がなく、自動的に切換弁の遅延がなされる。2) By delaying the operation timing of each return-side switching valve for the high-temperature fluid and the low-temperature fluid with respect to the operation timing of each supply-side switching valve, the fluid to be replaced in the mold can be heated to a high temperature. When the temperature of the fluid is low and the temperature of the fluid is low, the fluid can be returned to the circuit of the low temperature fluid, and the amount of the high temperature fluid and the low temperature fluid mixed is extremely small. Particularly, when the method of delaying the operation timing of the return side switching valve is changed as follows, the operation also differs as follows. B) When the operation timing is delayed by the set time of the timer, the delay time can be changed arbitrarily, which makes it possible to find the delay time that minimizes the mixing amount of the high temperature fluid and the low temperature fluid. To do. B) In the case of means for providing a temperature detection means in the fluid outlet passage of the mold and detecting when the fluid temperature of the passage reaches the set temperature and delaying it until that time, the driver does not need to adjust the delay time. , The switching valve is automatically delayed.
【００１１】３）流体のタンクを金型での被置換流体量
分の高温流体と低温流体の貯蔵量変化を許容できる構成
とすることにより、被置換流体をそれが高温の場合は高
温回路へ、低温の場合は低温回路へ戻したとき、それに
よって生じる各流体量の変化を吸収できる。特にタンク
の構造の違いにより次のように作用も異なる。 イ）高温流体と低温流体のタンクを別々に設け、それぞ
れのタンクで貯蔵流体量変化を許容できるようにしたタ
ンクでは、各タンク内での貯蔵流体量変化は大きいが、
金型における被置換流体を高温又は低温の別に確実にそ
れぞれの回路へ戻すことができる。 ロ）同一のタンクで上側に高温流体、下側に低温流体を
両者の境界壁なしに収容できるようにしたタンクでは、
タンク内で高温流体と低温流体の相互の流体量変化に応
じて両者の境界面が上下するので、タンク１つの金型に
おける高温と低温の何れの被置換流体の移動にも対応で
きる。3) By configuring the fluid tank so that the storage amount change of the high temperature fluid and the low temperature fluid by the amount of the fluid to be replaced in the mold can be allowed, the fluid to be replaced is transferred to the high temperature circuit when it is hot. In the case of low temperature, when returned to the low temperature circuit, it is possible to absorb the change in each fluid amount caused thereby. Especially, the operation is different as follows depending on the structure of the tank. B) In tanks in which high-temperature fluid tanks and low-temperature fluid tanks are provided separately and each tank can tolerate changes in the amount of stored fluid, the changes in the amount of stored fluid in each tank are large.
It is possible to reliably return the fluid to be replaced in the mold to the respective circuits regardless of whether the fluid is hot or cold. B) In the same tank, a tank that can store a high temperature fluid on the upper side and a low temperature fluid on the lower side without a boundary wall between them,
Since the boundary surface of the high temperature fluid and the low temperature fluid moves up and down in the tank according to the change in the mutual fluid amount, it is possible to cope with the movement of both the high temperature and the low temperature replaced fluid in one mold of the tank.
【００１２】以上のように本発明では前記１）項の構成
により金型での被置換流体量を減らすことができ、２）
項の構成により金型において高温流体と低温流体が混ざ
らないようにでき、更に３）項の構成により金型での被
置換流体の移動をタンクで吸収することができる。As described above, according to the present invention, the amount of the fluid to be replaced in the mold can be reduced by the constitution of the above item 1) 2)
With the construction of item (1), it is possible to prevent the high temperature fluid and the low temperature fluid from mixing in the mold, and with the construction of item 3), the movement of the fluid to be replaced in the mold can be absorbed by the tank.
【００１３】[0013]
【実施例】以下本発明の実施例を図面に基づいて説明す
ると、図１は本発明の実施例における射出成形機の平面
図で、１は射出装置、２は原料ホッパー、３はスクリュ
シリンダであり、原料ホッパー２から投入された原料は
スクリュシリンダ３で可塑化されて射出装置１の射出動
作により金型８，９に射出される。４は固定盤、５は可
動盤であり、これら固定盤４と可動盤５には固定側金型
８と可動側金型９が取付けられている。６は型締ラム、
７は型締シリンダで、これらにより型の開閉が行なわれ
る。１０は流体温度調整機で、１１，１２で示す切換マ
ニホールドとの間を配管２１Ａ〜２４Ａ，２１Ｂ〜２４
Ｂで接続している。切換マニホールド１１，１２は、そ
れぞれ固定盤４と可動盤５に取付けられている。また切
換マニホールド１１から固定側金型８に配管３１Ａ，３
２Ａが接続され、切換マニホールド１２から可動側金型
９に配管３１Ｂ，３２Ｂが接続されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of an injection molding machine according to the embodiment of the present invention. 1 is an injection device, 2 is a raw material hopper, and 3 is a screw cylinder. The raw material charged from the raw material hopper 2 is plasticized by the screw cylinder 3 and injected into the molds 8 and 9 by the injection operation of the injection device 1. Reference numeral 4 is a fixed platen, 5 is a movable platen, and a fixed side mold 8 and a movable side mold 9 are attached to the fixed platen 4 and the movable platen 5, respectively. 6 is a mold clamping ram,
A mold clamping cylinder 7 is used to open and close the mold. Reference numeral 10 is a fluid temperature controller, and pipings 21A to 24A and 21B to 24 are provided between the fluid temperature controller and the switching manifolds 11 and 12.
Connected at B. The switching manifolds 11 and 12 are attached to the fixed platen 4 and the movable platen 5, respectively. In addition, the pipes 31A, 3 from the switching manifold 11 to the fixed side mold 8
2A is connected, and pipes 31B and 32B are connected from the switching manifold 12 to the movable side mold 9.
【００１４】図２は切換マニホールド１１の斜視図で、
Ｈ１Ａ，Ｌ１Ａ，Ｈ２Ａ，Ｌ２Ａで示す各切換弁を、配
管１７，１８を介してブラケット１５にＵボルト１６で
取付けた構造になっている。切換マニホールド１２も同
様の構成になっている。図１、図２のように切換マニホ
ールド１１，１２を金型取付の固定盤４と可動盤５に設
置することにより、これらの切換マニホールドを流体温
度調整機１０の近くに置いた場合に比べて、各切換マニ
ホールドから先の金型部分に残存する流体量を大幅に低
減できる。FIG. 2 is a perspective view of the switching manifold 11.
Each of the switching valves H1A, L1A, H2A, and L2A is attached to the bracket 15 with U bolts 16 via pipes 17 and 18. The switching manifold 12 has the same structure. As shown in FIGS. 1 and 2, by installing the switching manifolds 11 and 12 on the fixed platen 4 and the movable platen 5, which are attached to the mold, as compared with the case where these switching manifolds are placed near the fluid temperature controller 10. , The amount of fluid remaining in the die portion ahead of each switching manifold can be greatly reduced.
【００１５】図３は流体温度調整機１０に組み込まれる
流体タンクの構造を示し、これは高温流体、低温流体と
も同様の構成となっている。同図において６０はタンク
で、内部に流体６８が貯蔵されている。６１はフロート
で、貯蔵流体６８の高さがＳ1 より下がるとフロート６
１が下がって栓６２が開き、給水管６３から補給流体６
５が流入する。他方貯蔵流体６８の高さがＳ2 より上が
るとドレン管６４から外部６６へ流出する。従って貯蔵
流体６８の高さはＳ1 とＳ2 の間に保たれ、その間の貯
蔵流体量変化ΔＶが許される。また５０は吐出ポンプで
貯蔵流体６８を吸入して吐出口５１へ吐出し、他方流入
口５２から流体が流入する。なお、本タンクが高温流体
タンクである場合には、図示しないヒータが組み込まれ
て流体の昇温に使用され、また低温流体タンクである場
合には、図示しない冷却回路が組み込まれて流体の冷却
に使用される。FIG. 3 shows the structure of the fluid tank incorporated in the fluid temperature regulator 10, which has the same structure for both the high temperature fluid and the low temperature fluid. In the figure, reference numeral 60 is a tank in which the fluid 68 is stored. 61 is a float, and when the height of the stored fluid 68 falls below S 1 , the float 6
1 is lowered, the plug 62 is opened, and the supply fluid 6 is supplied from the water supply pipe 63.
5 flows in. On the other hand, when the height of the stored fluid 68 rises above S 2 , it flows out from the drain pipe 64 to the outside 66. Therefore, the height of the stored fluid 68 is maintained between S 1 and S 2 , and the stored fluid amount change ΔV during that period is allowed. A discharge pump 50 sucks the stored fluid 68 and discharges it to the discharge port 51, and the fluid flows in from the other inflow port 52. When this tank is a high temperature fluid tank, a heater (not shown) is incorporated to increase the temperature of the fluid, and when it is a low temperature fluid tank, a cooling circuit (not shown) is incorporated to cool the fluid. Used for.
【００１６】図４は温度調整流体回路を示し、１０は流
体温度調整機で、同調整機内に高温流体ユニット１０Ｈ
及び低温流体ユニット１０Ｌが装備され、それらのユニ
ットから高温流体及び低温流体が吐出されて循環後に戻
るようになっている。１９Ｈ，１９Ｌはそれぞれ高温流
体吐出管、低温流体吐出管で、２０Ｈ，２０Ｌはそれぞ
れ高温流体戻り管、低温流体戻り管であり、２５〜３０
は流量調整弁である。図３で説明した流体タンクは、高
温流体ユニット１０Ｈと低温流体ユニット１０Ｌにそれ
ぞれ１個ずつ組み込まれ、図３の吐出口５１が図４の高
温又は低温流体吐出管１９Ｈ又は１９Ｌに、同じく流入
口５２が図４の高温又は低温流体戻り管２０Ｈ又は２０
Ｌに相当する。FIG. 4 shows a temperature adjusting fluid circuit, 10 is a fluid temperature adjusting machine, and a high temperature fluid unit 10H is provided in the adjusting machine.
Also, a low temperature fluid unit 10L is provided, and a high temperature fluid and a low temperature fluid are discharged from these units and returned after circulation. 19H and 19L are a high temperature fluid discharge pipe and a low temperature fluid discharge pipe, respectively, and 20H and 20L are a high temperature fluid return pipe and a low temperature fluid return pipe, respectively.
Is a flow control valve. Each of the fluid tanks described in FIG. 3 is incorporated in each of the high temperature fluid unit 10H and the low temperature fluid unit 10L, and the discharge port 51 of FIG. 3 is connected to the high temperature or low temperature fluid discharge pipe 19H or 19L of FIG. 52 is the hot or cold fluid return pipe 20H or 20 of FIG.
Equivalent to L.
【００１７】また図４において固定側金型用の電磁切換
弁Ｈ１Ａ，Ｌ１Ａ，Ｈ２Ａ，Ｌ２Ａは図２で説明した如
く切換マニホールド１１に組み込まれ、同様に可動側金
型用の電磁切換弁Ｈ１Ｂ，Ｌ１Ｂ，Ｈ２Ｂ，Ｌ２Ｂは、
切換マニホールド１２に組み込まれている。更にＨ３，
Ｌ３はそれぞれ高温流体と低温流体のバイパス用の電磁
切換弁である。これらの電磁切換弁は全て開・閉の２位
置切換で、通電（ＯＮ）時に開となる。高温流体は、電
磁切換弁Ｈ３がＯＦＦ、即ち閉の時高温流体吐出管１９
Ｈから一方は配管２１Ａ，切換弁Ｈ１Ａ，配管３１Ａを
経て固定側金型内冷却溝３５Ａへ流入し、他方は配管２
１Ｂ，切換弁Ｈ１Ｂ，配管３１Ｂを経て可動側金型内冷
却溝３５Ｂへ流入する。そして冷却溝３５Ａから配管３
２Ａ，切換弁Ｈ２Ａ，配管２３Ａを経て、また他方は冷
却溝３５Ｂから配管３２Ｂ，切換弁Ｈ２Ｂ，配管２３Ｂ
を経て戻り管２０Ｈへ戻る。なお、電磁切換弁Ｈ３がＯ
Ｎ、即ち開の時、高温流体は吐出管１９Ｈから切換弁Ｈ
３を経て戻り管２０Ｈへ戻る。更に流量調整弁２７は金
型への流量を流量調整弁２５，２６で絞った場合、切換
弁Ｈ３をＯＦＦ、即ち閉にして金型へ流体を送る際に吐
出管１９Ｈにおける圧力が上がり過ぎるのを防ぐため、
同吐出管１９Ｈから流量調整弁２７を経て戻り管２０Ｈ
へ逃がす流量を調整するものである。また低温流体の回
路も全く同様に構成されている。Further, in FIG. 4, the electromagnetic switching valves H1A, L1A, H2A, L2A for the fixed side mold are incorporated in the switching manifold 11 as described with reference to FIG. L1B, H2B, L2B are
It is incorporated in the switching manifold 12. Further H3
L3 is an electromagnetic switching valve for bypassing the high temperature fluid and the low temperature fluid, respectively. All of these electromagnetic switching valves are switched between two positions, open and closed, and open when energized (ON). The high temperature fluid discharges the high temperature fluid discharge pipe 19 when the electromagnetic switching valve H3 is OFF, that is, when it is closed.
One from H flows into the fixed side mold cooling groove 35A through the pipe 21A, the switching valve H1A and the pipe 31A, and the other from the pipe 2
1B, the switching valve H1B, and the pipe 31B to flow into the movable-side mold cooling groove 35B. And from the cooling groove 35A to the pipe 3
2A, the switching valve H2A, the pipe 23A, and the other from the cooling groove 35B to the pipe 32B, the switching valve H2B, the pipe 23B.
And return to the return pipe 20H. The electromagnetic switching valve H3 is O
N, that is, when the high temperature fluid is open, the high temperature fluid flows from the discharge pipe 19H
Return to the return pipe 20H via 3. Further, when the flow rate adjusting valve 27 throttles the flow rate to the mold by the flow rate adjusting valves 25 and 26, the pressure in the discharge pipe 19H rises too much when the switching valve H3 is turned off, that is, closed and the fluid is sent to the mold. To prevent
Return pipe 20H from the discharge pipe 19H through the flow rate adjusting valve 27.
It adjusts the flow rate to escape. Also, the circuit for the cryogenic fluid is constructed in exactly the same way.
【００１８】図５は射出成形工程における金型の温度調
整モードを示すシーケンスである。同図で、射出充填工
程の開始からタイマー１の設定時間後に高温から低温に
切り換え、型開工程の開始からタイマー２の設定時間後
に低温から高温に切り換える。このように温度調整モー
ドを高温と低温に切り換えることにより、射出充填時は
金型温度を高くして金型内に樹脂が流れ易くし、その後
の冷却工程では金型温度を下げて樹脂の冷却を促進す
る。なお、同図で射出充填工程内においてタイマー１が
タイム・アウトして高温から低温へ切り換わっている
が、これはシーケンス上の切り換わりと実際の金型の温
度変化とのタイム・ラグを考慮しているからで、実際の
金型温度が低温になるのは射出充填工程が完了してから
である。FIG. 5 is a sequence showing a mold temperature adjustment mode in the injection molding process. In the figure, the temperature is switched from the high temperature to the low temperature after the set time of the timer 1 from the start of the injection filling process, and the low temperature is switched to the high temperature after the set time of the timer 2 from the start of the mold opening process. By switching the temperature adjustment mode between high temperature and low temperature in this way, the mold temperature is raised during injection filling to facilitate the resin flow in the mold, and in the subsequent cooling process the mold temperature is lowered to cool the resin. Promote. In the figure, the timer 1 times out and switches from high temperature to low temperature in the injection filling process. This is due to the time lag between the sequence switching and the actual mold temperature change. Therefore, the actual mold temperature becomes low only after the injection filling process is completed.
【００１９】図６は図５の金型温度調整モードの高温か
ら低温への切り換え及び低温から高温への切り換えにお
ける各電磁切換弁、特に電磁切換弁Ｈ１Ａ，Ｈ１Ｂ，Ｈ
２Ａ，Ｈ２Ｂ，Ｌ１Ａ，Ｌ１Ｂ，Ｌ２Ａ，Ｌ２ＢのＯＮ
・ＯＦＦのずらせ方を示すシーケンスであり、本発明の
特徴部分である。図６において、高温から低温への切り
換えを説明すると、先ず低温流体バイパス用の切換弁Ｌ
３、高温流体入口の切換弁Ｈ１Ａ，Ｈ１ＢはＯＦＦに
し、同時に高温流体切り・入り用の切換弁Ｈ３、低温流
体入口の切換弁Ｌ１Ａ，Ｌ１ＢはＯＮにして、金型へ流
入する流体を高温から低温に換える。その際、流体出口
の切換弁Ｈ２Ａ，Ｈ２Ｂ，Ｌ２Ａ，Ｌ２Ｂはまだ切り換
えていないので、金型部分に残っていた高温流体はその
まま切換弁Ｈ２Ａ，Ｈ２Ｂを通って高温流体の回路へ戻
る。そして前記の切換弁Ｌ３，Ｈ１Ａ，Ｈ１Ｂ，Ｈ３，
Ｌ１Ａ，Ｌ１Ｂの切り換え開始からのタイマーＡにより
切換弁Ｈ２ＡをＯＦＦに、切換弁Ｌ２ＡをＯＮにし、同
様にタイマーＢにより切換弁Ｈ２ＢをＯＦＦに、切換弁
Ｌ２ＢをＯＮに切り換える。ここでタイマーＡ，Ｂは、
それぞれ固定側金型と可動側金型において、流入した低
温流体が高温流体出口の切換弁Ｈ２ＡとＨ２Ｂから高温
回路へ流出しないような適切な時間に設定しておく。ま
た低温から高温へ切り換える場合も全く同様である。前
述のシーケンスにより、高温と低温の切り換えの際、金
型部分に残存していた被置換流体の大部分は、それが高
温なら高温回路へ、また低温なら低温回路へ戻るので、
高温流体と低温流体が混ざる量は極めて少なくて済む。
前述の如く図１、図２により金型部分の被置換流体量を
低減しているので、それだけタイマーＡ，Ｂの設定を短
くでき切り換えに要するロス時間を減らせる。FIG. 6 shows each electromagnetic switching valve, particularly electromagnetic switching valves H1A, H1B, H in switching from a high temperature to a low temperature and from a low temperature to a high temperature in the mold temperature adjusting mode of FIG.
2A, H2B, L1A, L1B, L2A, L2B ON
A sequence showing how to shift OFF, which is a characteristic part of the present invention. In FIG. 6, switching from high temperature to low temperature will be described. First, the switching valve L for low temperature fluid bypass.
3. The high temperature fluid inlet switching valves H1A, H1B are turned off, and at the same time, the high temperature fluid cutting / entry switching valve H3 and the low temperature fluid inlet switching valves L1A, L1B are turned on to keep the fluid flowing into the mold from high temperature. Change to low temperature. At this time, since the switching valves H2A, H2B, L2A, L2B at the fluid outlets have not been switched yet, the high temperature fluid remaining in the mold part directly returns to the high temperature fluid circuit through the switching valves H2A, H2B. Then, the changeover valves L3, H1A, H1B, H3,
The switching valve H2A is turned off and the switching valve L2A is turned on by the timer A after the switching of L1A and L1B is started. Similarly, the switching valve H2B is turned off and the switching valve L2B is turned on by the timer B. Here, the timers A and B are
In each of the fixed side mold and the movable side mold, an appropriate time is set so that the inflowing low temperature fluid does not flow out of the high temperature fluid outlet switching valves H2A and H2B into the high temperature circuit. The same applies when switching from low temperature to high temperature. According to the above-mentioned sequence, when switching between the high temperature and the low temperature, most of the fluid to be replaced that remains in the mold part returns to the high temperature circuit if it is high temperature, and returns to the low temperature circuit if it is low temperature.
The amount of the high temperature fluid and the low temperature fluid mixed is extremely small.
As described above, the amount of fluid to be replaced in the mold portion is reduced as shown in FIGS. 1 and 2, so that the setting of the timers A and B can be shortened and the loss time required for switching can be reduced.
【００２０】図７は高温流体と低温流体の切り換え時の
混合流体量に対するタンク内の流体温度変化の関係を試
算した例であり、図７の例では５５℃の高温流体と５℃
の低温流体を使用している。金型部の被置換流体量は２
５００ｃｍ3 あり、その被置換流体が高温流体と低温流
体の切り換えにより、切り換え後の置換流体側の流体回
路に混ざってしまうと置換流体側のタンク内流体温度は
５℃も変化してしまう。それに対して本実施例の手段を
適用すると、前記の混合流体量は多少のリークを見ても
５００ｃｍ3 以下になり、タンク内流体の温度変化も１
℃以下と小さくなり非常に改善される。このようにタン
ク内流体の温度変化が小さいと、金型温度調整を精度良
く実施でき、成形品の品質が安定する。FIG. 7 shows an example of trial calculation of the relationship between the fluid temperature change in the tank and the mixed fluid amount when switching between the high temperature fluid and the low temperature fluid. In the example of FIG.
Uses cryogenic fluid. The amount of fluid to be replaced in the mold is 2
There is 500 cm 3, and if the fluid to be replaced is mixed in the fluid circuit on the replacement fluid side after switching due to switching between the high temperature fluid and the low temperature fluid, the fluid temperature in the tank on the replacement fluid side will change by 5 ° C. On the other hand, when the means of this embodiment is applied, the amount of the mixed fluid becomes 500 cm 3 or less even if a slight leak is seen, and the temperature change of the fluid in the tank is 1 or less.
It will be less than ℃ and it will be greatly improved. When the temperature change of the fluid in the tank is small in this way, the mold temperature can be adjusted with high accuracy, and the quality of the molded product becomes stable.
【００２１】図８、図６で説明した電磁切換弁の作動タ
イミングをずらすタイマーＡ，Ｂの代わりに、実際の金
型の温度調整用流体の出口温度を計測して流体出口の切
換弁を切換える原理を示すものである。同図で、金型の
温度調整用流体の出口温度は高温ＴH から低温ＴL に切
換わり、後にまた高温ＴH に切換わる。高温から低温に
切換える際は、定常時の高温ＴH より少し低い温度ＴHL
を設定しておき、図６と同様に先ず切換弁Ｌ３，Ｈ１
Ａ，Ｈ１ＢはＯＦＦに、切換弁Ｈ３，Ｌ１Ａ，Ｌ１Ｂは
ＯＦＦにし、次に実際に金型の流体出口温度がＴHLにな
った時に（点Ｐで）切換弁Ｈ２Ａ又はＨ２ＢをＯＦＦ
に、切換弁Ｌ２Ａ又はＬ２ＢをＯＮに切り換える。金型
の流体出口は固定側金型と可動側金型の両方にあるの
で、図４の温度センサー４１，４２によりそれぞれの温
度を計測し、固定側の切換弁Ｈ２Ａ，Ｌ２Ａと、可動側
の切換弁Ｈ２Ｂ，Ｌ２Ｂとは別々に作動タイミングを決
める。また低温から高温に切り換える際も、定常時の低
温ＴL より少し低い温度ＴLHを設定して同様に実施す
る。このように温度センサーを用いて実際の金型の温度
調整用流体の出口温度が設定値に達する時点を検出し
て、電磁切換弁の作動タイミングを決めることにより、
図６のタイマーＡ，Ｂのような調整を運転者が実施する
必要がなく、金型や温度調整条件が変わっても自動的に
電磁切換弁の作動をずらすことができる。但し、金型の
流体出口温度が設定値に達する時点を検出してから、更
にタイマーで遅延させて一層適切な切換弁作動タイミン
グを設定してもよい。Instead of the timers A and B for shifting the operation timing of the electromagnetic switching valve described in FIGS. 8 and 6, the outlet temperature of the fluid for temperature control of the actual mold is measured and the switching valve of the fluid outlet is switched. It shows the principle. In the figure, the outlet temperature of the temperature adjusting fluid of the mold is switched from the high temperature T H to the low temperature T L and then to the high temperature T H again. When switching from a high temperature to low temperature, slightly lower temperature T HL higher temperature T H in a steady state
Is set, and the switching valves L3 and H1 are first set in the same manner as in FIG.
A, OFF H1B is OFF, the switching valve H3, L1A, L1B is OFF, the next actual when the fluid outlet temperature of the mold became T HL to (at point P) switching valve H2A or H2B
Then, the switching valve L2A or L2B is switched to ON. Since the fluid outlet of the mold is in both the fixed side mold and the movable side mold, the respective temperatures are measured by the temperature sensors 41 and 42 in FIG. 4, and the fixed side switching valves H2A and L2A and the movable side mold are The operation timing is determined separately from the switching valves H2B and L2B. Further, when switching from the low temperature to the high temperature, the temperature TLH which is slightly lower than the low temperature TL in the steady state is set and the same operation is performed. In this way, by using the temperature sensor to detect when the outlet temperature of the actual mold temperature control fluid reaches the set value, and by determining the operation timing of the electromagnetic switching valve,
It is not necessary for the driver to perform the adjustments such as the timers A and B in FIG. 6, and the operation of the electromagnetic switching valve can be automatically shifted even if the mold or the temperature adjustment condition is changed. However, after detecting the time when the fluid outlet temperature of the mold reaches the set value, the timing may be further delayed by a timer to set a more appropriate switching valve operation timing.
【００２２】図９は高温流体と低温流体を貯蔵するタン
クの他の実施例を示す。同図で８０はタンクで、高温流
体８８と低温流体９０とで共用である。７０は高温流体
用ポンプで吐出管１９Ｈへ高温流体を吐出し、戻り管２
０Ｈからタンクへ戻す。同様に７５は低温流体用ポンプ
で吐出管１９Ｌへ低温流体を吐出し、戻り管２０Ｌから
タンクへ戻す。最初の実施例で説明した如く、高温と低
温の切り換え時に金型部の被置換流体量分が高温回路、
低温回路に出入りするので、本タンク内の高温流体と低
温流体の境界面は高さＳH とＳL との間を上下してその
間の流体量変化ΔＶｃを許容する。更に８２は流体補給
用電磁切換弁で、液面センサー８１により貯蔵流体液面
が下がりすぎたことを検出した時、同切換弁を開いて９
１より流体を補給する。また８３はリリーフ弁でタンク
内の圧力が上がりすぎた時に自動的に開いてタンク内流
体を９２へドレンさせる。前述のように本実施例のタン
クは、１つのタンクで高温流体と低温流体を共用でき、
かつ両者の境界液面変動も許容するので、大変経済的に
システムを構築できる。なお本タンクのように上方の高
温流体と下方の低温流体が液面を介して接触しても、水
の熱伝導率は小さく、かつ上方が高温のため対流熱伝達
もないので、高温流体と低温流体間の熱移動は僅かで問
題ない。FIG. 9 shows another embodiment of a tank for storing hot fluid and cold fluid. In the figure, reference numeral 80 denotes a tank, which is shared by the high temperature fluid 88 and the low temperature fluid 90. 70 is a pump for high temperature fluid, which discharges the high temperature fluid to the discharge pipe 19H,
Return from 0H to the tank. Similarly, 75 is a low temperature fluid pump that discharges the low temperature fluid to the discharge pipe 19L and returns it from the return pipe 20L to the tank. As described in the first embodiment, when the high temperature and the low temperature are switched, the amount of the fluid to be replaced in the die part is the high temperature circuit,
As it goes in and out of the low temperature circuit, the boundary surface between the high temperature fluid and the low temperature fluid in this tank moves up and down between the heights S H and S L to allow the fluid amount change ΔVc therebetween. Further, reference numeral 82 is an electromagnetic switching valve for fluid replenishment, which is opened when the liquid level sensor 81 detects that the level of the stored fluid is too low.
Replenish the fluid from 1. Reference numeral 83 is a relief valve which is automatically opened when the pressure in the tank rises too much to drain the fluid in the tank to 92. As described above, in the tank of this embodiment, one tank can share the high temperature fluid and the low temperature fluid,
In addition, since the fluctuation of the boundary liquid level between the two is allowed, the system can be constructed very economically. Even if the upper high temperature fluid and the lower low temperature fluid come into contact with each other via the liquid level as in this tank, the thermal conductivity of water is small, and since the upper temperature is high, there is no convective heat transfer. The heat transfer between the cryogenic fluids is slight and no problem.
【００２３】[0023]
【発明の効果】以上詳述したように本発明によれば、 １）高温流体と低温流体の切り換えを行なう複数の切換
弁を、成形機の金型取付盤又はその近傍に設置すること
により、金型における高温と低温の切り換え時の被置換
流体量が少量となる。また切換弁を直接に金型に取付け
ると金型交換の度に切換弁の付け換えが必要になるのに
対して、本方式では金型を交換しても切換弁を付け換え
なくて済む。 ２）高温流体、低温流体の各戻り側切換弁の作動を、各
供給側切換弁の作動よりもタイマー又は金型部の流体出
口の温度検出手段で適宜遅らせることにより、金型部の
被置換流体が高温のものは高温回路へ、また低温のもの
は低温回路へ戻され、高温流体と低温流体の混ざり合い
が極めて少なくなる。 ３）高温流体と低温流体の各タンクで貯蔵流体量変動を
許容する構成とする、或いは両流体共用のタンクで上方
に高温流体、下方に低温流体を貯蔵し両者の界面の上下
移動を許容する構成とすることにより、金型部の被置換
流体の戻り量をタンクで吸収できる。 ４）これらにより、高温流体と低温流体を切り換え金型
温度調整を行なう際に、高温流体と低温流体の混ざる量
が極めて少なく、従って両者の混ざり合いによるエネル
ギー損失が少なくてかつ安定に成形することが可能とな
る等の優れた効果を奏するものである。As described above in detail, according to the present invention, 1) by installing a plurality of switching valves for switching between a high temperature fluid and a low temperature fluid on a die mounting plate of a molding machine or in the vicinity thereof, The amount of fluid to be replaced when switching between high temperature and low temperature in the mold becomes small. Further, when the switching valve is directly attached to the mold, the switching valve needs to be replaced every time the mold is replaced, whereas in this method, the switching valve does not need to be replaced even if the mold is replaced. 2) Replacing the die part by appropriately delaying the operation of each return-side switching valve for high-temperature fluid and low-temperature fluid with respect to the operation of each supply-side switching valve by a timer or a temperature detecting means at the fluid outlet of the die part. The fluid with a high temperature is returned to the high temperature circuit, and the fluid with a low temperature is returned to the low temperature circuit, and the mixture of the high temperature fluid and the low temperature fluid is extremely reduced. 3) Each tank for high-temperature fluid and low-temperature fluid is configured to allow fluctuations in the amount of stored fluid, or a tank shared by both fluids stores the high-temperature fluid above and the low-temperature fluid below to allow vertical movement of the interface between the two. With this configuration, the tank can absorb the return amount of the fluid to be replaced in the mold part. 4) As a result, when the mold temperature is adjusted by switching between the high temperature fluid and the low temperature fluid, the amount of the high temperature fluid and the low temperature fluid that are mixed is extremely small, and therefore the energy loss due to the mixture of the two is small and stable molding is possible. It is possible to obtain excellent effects such as
【図１】本発明の第１実施例における射出成形機の平面
図である。FIG. 1 is a plan view of an injection molding machine according to a first embodiment of the present invention.
【図２】図１の金型取付盤（固定盤）に設置された切換
マニホールドの斜視図である。FIG. 2 is a perspective view of a switching manifold installed on the mold mounting plate (fixed plate) of FIG.
【図３】高温流体と低温流体を貯蔵する個別タンクの構
造略図である。FIG. 3 is a structural schematic diagram of individual tanks for storing a high temperature fluid and a low temperature fluid.
【図４】全体の温度調整流体回路図である。FIG. 4 is an overall temperature control fluid circuit diagram.
【図５】射出成形工程における金型温度調整モードの高
温と低温を示すシーケンス図である。FIG. 5 is a sequence diagram showing a high temperature and a low temperature in a mold temperature adjustment mode in an injection molding process.
【図６】高温と低温の切り換えにおける電磁切換弁の作
動のずらせ方を示すシーケンス図である。FIG. 6 is a sequence diagram showing how to shift the operation of the electromagnetic switching valve when switching between high temperature and low temperature.
【図７】高温と低温の切り換え時の高温流体と低温流体
の混合量に対するタンク内流体温度変化の関係グラフで
ある。FIG. 7 is a graph showing the relationship between the fluid temperature change in the tank and the mixing amount of the high temperature fluid and the low temperature fluid when switching between the high temperature and the low temperature.
【図８】金型における温度調整用流体の出口温度検出に
より電磁切換弁の作動時点を決める原理図である。FIG. 8 is a principle diagram for determining an operation time point of an electromagnetic switching valve by detecting an outlet temperature of a temperature adjusting fluid in a mold.
【図９】高温流体と低温流体を収容するタンクの他の実
施例の略図である。FIG. 9 is a schematic diagram of another embodiment of a tank containing hot and cold fluids.
４ 固定盤（金型取付盤） ５ 可動盤（金型取付盤） ８ 固定側金型 ９ 可動側金型 １０ 流体温度調整機 １１，１２ 切換マニホールド ６０ タンク ８０ 共用タンク Ｈ１Ａ，Ｈ１Ｂ，Ｈ２Ａ，Ｈ２Ｂ，Ｈ３ 高温流体側電
磁切換弁 Ｌ１Ａ，Ｌ１Ｂ，Ｌ２Ａ，Ｌ２Ｂ，Ｌ３ 低温流体側電
磁切換弁4 Fixed Plate (Mold Mounting Plate) 5 Movable Plate (Mold Mounting Plate) 8 Fixed Side Mold 9 Movable Side Mold 10 Fluid Temperature Controller 11, 12 Switching Manifold 60 Tank 80 Shared Tank H1A, H1B, H2A, H2B , H3 High temperature fluid side solenoid switching valve L1A, L1B, L2A, L2B, L3 Low temperature fluid side solenoid switching valve
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成３年１２月６日[Submission date] December 6, 1991
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】請求項２[Name of item to be corrected] Claim 2
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【手続補正２】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００２１[Correction target item name] 0021
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００２１】図８、図６で説明した電磁切換弁の作動タ
イミングをずらすタイマーＡ，Ｂの代わりに、実際の金
型の温度調整用流体の出口温度を計測して流体出口の切
換弁を切換える原理を示すものである。同図で、金型の
温度調整用流体の出口温度は高温ＴＨから低温ＴＬに切
換わり、後にまた高温ＴＨに切換わる。高温から低温に
切換える際は、定常時の高温ＴＨより少し低い温度Ｔ
ＨＬを設定しておき、図６と同様に先ず切換弁Ｌ３，Ｈ
１Ａ，Ｈ１ＢはＯＦＦに、切換弁Ｈ３，Ｌ１Ａ，Ｌ１Ｂ
はＯＦＦにし、次に実際に金型の流体出口温度がＴＨＬ
になった時に（点Ｐで）切換弁Ｈ２Ａ又はＨ２ＢをＯＦ
Ｆに、切換弁Ｌ２Ａ又はＬ２ＢをＯＮに切り換える。金
型の流体出口は固定側金型と可動側金型の両方にあるの
で、図４の温度センサー４１，４２によりそれぞれの温
度を計測し、固定側の切換弁Ｈ２Ａ，Ｌ２Ａと、可動側
の切換弁Ｈ２Ｂ，Ｌ２Ｂとは別々に作動タイミングを決
める。また低温から高温に切り換える際も、定常時の低
温ＴＬより少し高い温度ＴＬＨを設定して同様に実施す
る。このように温度センサーを用いて実際の金型の温度
調整用流体の出口温度が設定値に達する時点を検出し
て、電磁切換弁の作動タイミングを決めることにより、
図６のタイマーＡ，Ｂのような調整を運転者が実施する
必要がなく、金型や温度調整条件が変わっても自動的に
電磁切換弁の作動をずらすことができる。但し、金型の
流体出口温度が設定値に達する時点を検出してから、更
にタイマーで遅延させて一層適切な切換弁作動タイミン
グを設定してもよい。Instead of the timers A and B for shifting the operation timing of the electromagnetic switching valve described in FIGS. 8 and 6, the outlet temperature of the fluid for temperature control of the actual mold is measured and the switching valve of the fluid outlet is switched. It shows the principle. In the figure, the outlet temperature of the temperature adjusting fluid of the mold switches to a low temperature T L from hot T H, switched later also switching to a high temperature T H. When switching from a high temperature to low temperature, high temperature T H than the slightly lower temperature T of the steady state
HL is set, and first, as in FIG. 6, the switching valves L3, H
1A, H1B is OFF, switching valves H3, L1A, L1B
Is turned off, and then the temperature of the fluid outlet of the mold is actually THL.
When it becomes, the switching valve H2A or H2B is turned off (at the point P).
To F, the switching valve L2A or L2B is switched to ON. Since the fluid outlet of the mold is in both the fixed side mold and the movable side mold, the respective temperatures are measured by the temperature sensors 41 and 42 in FIG. 4, and the fixed side switching valves H2A and L2A and the movable side mold are The operation timing is determined separately from the switching valves H2B and L2B. Also when switching from a low temperature to a high temperature, it performed similarly by setting the temperature T LH have slightly higher than the low temperature T L in the steady state. In this way, by using the temperature sensor to detect when the outlet temperature of the actual mold temperature control fluid reaches the set value, and by determining the operation timing of the electromagnetic switching valve,
It is not necessary for the driver to perform the adjustments such as the timers A and B in FIG. 6, and the operation of the electromagnetic switching valve can be automatically shifted even if the mold or the temperature adjustment condition is changed. However, after detecting the time when the fluid outlet temperature of the mold reaches the set value, the timing may be further delayed by a timer to set a more appropriate switching valve operation timing.
Claims (3)
工程中に同成形機の金型に高温流体と低温流体を選択的
に切り換えて流すことにより、金型の温度制御を行なう
ようにした金型温度調整装置において、同高温流体と同
低温流体の切り換えを行なう切換弁を、成形機の金型取
付盤又はその近傍に設置したことを特徴とするプラスチ
ック成形機の金型温度調整装置。1. A mold for controlling the temperature of a mold by selectively switching a high-temperature fluid and a low-temperature fluid to flow in a mold of the molding machine during a molding process of a plastic molded product by the molding machine. A mold temperature adjusting device for a plastic molding machine, characterized in that, in the temperature adjusting device, a switching valve for switching between the same high temperature fluid and the same low temperature fluid is installed on a mold mounting plate of the molding machine or in the vicinity thereof.
に、前記流体の各戻り側切換弁の作動タイミングを、各
供給側切換弁の作動タイミングより所定時間遅らせるよ
うにしたことを特徴とする請求項１記載のプラスチック
成形機の金型温度調整装置。2. The switching timing of each return side switching valve of the fluid is delayed by a predetermined time from the switching timing of each supply side switching valve when switching between the high temperature fluid and the low temperature fluid. 1. A mold temperature adjusting device for a plastic molding machine according to 1.
工程中に同成形機の金型に高温流体と低温流体を選択的
に切り換えて流すことにより、金型の温度制御を行なう
ようにした金型温度調整装置において、同高温流体と同
低温流体を貯蔵するタンクが、金型における流体の入口
側切換弁と出口側切換弁との間の流体通路に残存する被
置換流体の容量以上の貯蔵流体量変化をタンク内で許容
できるようにした構成を有することを特徴とするプラス
チック成形機の金型温度調整装置。3. A mold for controlling the temperature of the mold by selectively switching a high temperature fluid and a low temperature fluid to flow through the mold of the molding machine during the molding process of the plastic molded product by the molding machine. In the temperature control device, the tank that stores the same high-temperature fluid and the same low-temperature fluid has a storage fluid that is equal to or larger than the volume of the fluid to be replaced that remains in the fluid passage between the fluid inlet-side switching valve and the outlet-side switching valve of the mold. A mold temperature adjusting device for a plastic molding machine, characterized in that it has a structure in which a change in quantity can be allowed in a tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3271826A JPH0584747A (en) | 1991-09-25 | 1991-09-25 | Device for adjusting temperature of mold of plastic molding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3271826A JPH0584747A (en) | 1991-09-25 | 1991-09-25 | Device for adjusting temperature of mold of plastic molding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0584747A true JPH0584747A (en) | 1993-04-06 |
Family
ID=17505396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3271826A Withdrawn JPH0584747A (en) | 1991-09-25 | 1991-09-25 | Device for adjusting temperature of mold of plastic molding machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0584747A (en) |
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| JP2002210740A (en) * | 2001-01-15 | 2002-07-30 | Aisin Seiki Co Ltd | Heating/cooling change-over device of molding die and method for changing over heating/cooling processes for molding die |
| EP1741539A2 (en) | 2005-07-08 | 2007-01-10 | Gentex Optics, Inc. | Method and apparatus for injection molding with direct insert thermal control |
| JP2010005792A (en) * | 2008-06-24 | 2010-01-14 | Mitsubishi Heavy Industries Plastic Technology Co Ltd | Two material injection molding machine |
| WO2010050099A1 (en) * | 2008-10-28 | 2010-05-06 | 三菱重工プラスチックテクノロジー株式会社 | Injection molding machine and injection molding method |
| WO2010053091A1 (en) * | 2008-11-06 | 2010-05-14 | 株式会社松井製作所 | Heating/cooling switching device and mold heating/cooling system using same |
| JP2012045872A (en) * | 2010-08-30 | 2012-03-08 | Matsui Mfg Co | Mold thermostat |
| AT12805U1 (en) * | 2011-07-14 | 2012-12-15 | Engel Austria Gmbh | Temperiermedienverteiler |
| US8550800B2 (en) | 2009-12-07 | 2013-10-08 | Mitsubishi Heavy Industries Plastic Technology Co., Ltd. | Injection molding machine for two-material molding |
| KR20200044817A (en) | 2017-09-07 | 2020-04-29 | 도플로 코포레이션 가부시키가이샤 | Flow control device |
| KR20200047539A (en) | 2017-09-07 | 2020-05-07 | 도플로 코포레이션 가부시키가이샤 | Flow control unit |
| CN115214097A (en) * | 2022-07-18 | 2022-10-21 | 俄木罗钱 | Injection mold cooling system |
-
1991
- 1991-09-25 JP JP3271826A patent/JPH0584747A/en not_active Withdrawn
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4577544B2 (en) * | 2001-01-15 | 2010-11-10 | アイシン精機株式会社 | Heating / cooling switching device for molding die and heating / cooling switching method for molding die |
| JP2002210740A (en) * | 2001-01-15 | 2002-07-30 | Aisin Seiki Co Ltd | Heating/cooling change-over device of molding die and method for changing over heating/cooling processes for molding die |
| EP1741539A2 (en) | 2005-07-08 | 2007-01-10 | Gentex Optics, Inc. | Method and apparatus for injection molding with direct insert thermal control |
| EP1741539A3 (en) * | 2005-07-08 | 2007-01-17 | Gentex Optics, Inc. | Method and apparatus for injection molding with direct insert thermal control |
| AU2006202927B2 (en) * | 2005-07-08 | 2011-04-28 | Gentex Optics, Inc. | Method and apparatus for injection molding with direct insert thermal control |
| JP2010005792A (en) * | 2008-06-24 | 2010-01-14 | Mitsubishi Heavy Industries Plastic Technology Co Ltd | Two material injection molding machine |
| WO2010050099A1 (en) * | 2008-10-28 | 2010-05-06 | 三菱重工プラスチックテクノロジー株式会社 | Injection molding machine and injection molding method |
| US8360766B2 (en) | 2008-10-28 | 2013-01-29 | Mitsubishi Heavy Industries Plastic Technology Co., Ltd. | Injection molding machine and injection molding method |
| JP5529747B2 (en) * | 2008-10-28 | 2014-06-25 | 三菱重工プラスチックテクノロジー株式会社 | Injection molding machine |
| JP2010110989A (en) * | 2008-11-06 | 2010-05-20 | Matsui Mfg Co | Heating/cooling changeover device and mold heating/cooling system equipped with this device |
| WO2010053091A1 (en) * | 2008-11-06 | 2010-05-14 | 株式会社松井製作所 | Heating/cooling switching device and mold heating/cooling system using same |
| US8550800B2 (en) | 2009-12-07 | 2013-10-08 | Mitsubishi Heavy Industries Plastic Technology Co., Ltd. | Injection molding machine for two-material molding |
| JP2012045872A (en) * | 2010-08-30 | 2012-03-08 | Matsui Mfg Co | Mold thermostat |
| AT12805U1 (en) * | 2011-07-14 | 2012-12-15 | Engel Austria Gmbh | Temperiermedienverteiler |
| KR20200044817A (en) | 2017-09-07 | 2020-04-29 | 도플로 코포레이션 가부시키가이샤 | Flow control device |
| KR20200047539A (en) | 2017-09-07 | 2020-05-07 | 도플로 코포레이션 가부시키가이샤 | Flow control unit |
| US11003197B2 (en) | 2017-09-07 | 2021-05-11 | Toflo Corporation | Flow rate control device |
| US11287837B2 (en) | 2017-09-07 | 2022-03-29 | Toflo Corporation | Flow rate control unit |
| CN115214097A (en) * | 2022-07-18 | 2022-10-21 | 俄木罗钱 | Injection mold cooling system |
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Legal Events
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| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19981203 |