JPH0582976A - Method for positioning multilayered laminated board - Google Patents
Method for positioning multilayered laminated boardInfo
- Publication number
- JPH0582976A JPH0582976A JP24394391A JP24394391A JPH0582976A JP H0582976 A JPH0582976 A JP H0582976A JP 24394391 A JP24394391 A JP 24394391A JP 24394391 A JP24394391 A JP 24394391A JP H0582976 A JPH0582976 A JP H0582976A
- Authority
- JP
- Japan
- Prior art keywords
- positioning
- guide mark
- laminated plate
- sent
- ray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Jigs For Machine Tools (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、切断工程で適当な大き
さに切断されて送られてきた多層積層板を位置決めして
仕上げ加工ラインに送るのに用いる多層積層板の位置決
め方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for positioning a multi-layer laminate used for positioning and delivering the multi-layer laminate cut into a proper size in a cutting process and sent to a finishing line. is there.
【０００２】[0002]
【従来の技術】一般に多層積層板のガイドマークは内部
に設けてあるためＸ線を使って検出している。多層積層
板を適当な大きさに切断するラインでもＸ線を使ってガ
イドマークの位置を検出し、これを基準に切断を行って
いる。切断ラインにおけるガイドマークの検出は先ず広
い視野の中から、求めるガイドマークを探す必要があ
る。ところが、Ｘ線の画像はその視野に入る白黒の面
積、配置により影響される（像が引っ張られて歪む）。
よって切断ラインにおいては、そのガイドマークの回り
のパターンあるいは外層や内層の銅箔の厚みや他により
ガイドマークの位置が実際よりずれて検出されることが
ある。このためガイドマークを基準に正確に切断されな
く、切断した端面の精度が悪い。2. Description of the Related Art Generally, a guide mark of a multi-layer laminated plate is provided inside and is detected using X-rays. Even in a line for cutting the multilayer laminated plate into an appropriate size, the position of the guide mark is detected using X-rays, and the guide mark is used as a reference for cutting. In order to detect the guide mark on the cutting line, it is first necessary to search for a desired guide mark from a wide field of view. However, the X-ray image is affected by the black-and-white area and arrangement in the field of view (the image is stretched and distorted).
Therefore, in the cutting line, the position of the guide mark may be deviated from the actual position due to the pattern around the guide mark, the thickness of the outer or inner copper foil, or the like. Therefore, the guide mark is not used as a reference for accurate cutting, and the accuracy of the cut end face is poor.
【０００３】ところで、従来、適当な大きさに切断した
多層積層板を位置決めして仕上げ加工ラインに送る場
合、図３に示すように行っていた。つまり粗位置決め装
置１にて多層積層板２の四周を押圧して多層積層板２を
端面基準に位置決めし、粗位置決めした多層積層板２を
そのままの状態で仕上げ加工ラインに送り、仕上げ加工
ラインでＸ線位置検出装置３にてガイドマーク４を検出
し、このガイドマーク４の位置を基準に穴明け等を行っ
ている。Ｐは多層積層板２を送るピッチである。By the way, conventionally, when a multilayer laminated plate cut into an appropriate size is positioned and sent to a finishing line, it has been performed as shown in FIG. That is, the rough positioning device 1 presses the four circumferences of the multi-layer laminated plate 2 to position the multi-layer laminated plate 2 with the end face as a reference, and the rough-positioned multi-layer laminated plate 2 is sent to the finishing processing line as it is, and then the finishing processing line is used. The X-ray position detection device 3 detects the guide mark 4 and performs punching or the like based on the position of the guide mark 4. P is a pitch for sending the multilayer laminate 2.
【０００４】[0004]
【発明が解決しようとする課題】ところが、切断工程で
切断された多層積層板の切断端面の精度がよくないので
粗位置決め装置１で位置決めしたとき図４に示すように
ガイドマーク４の位置が一定の傾向でずれる。このため
仕上げ加工工程でＸ線位置検出装置３にてガイドマーク
４を検出したときもＸ線位置検出装置３のカメラやモニ
ターテレビの中心位置からガイドマーク４の位置が図４
に示すように一定の傾向でずれる。このずれが大きいと
Ｘ線位置検出装置の視野に入らないという問題があり、
また視野に入っても精度が悪くなる。つまりＸ線の特性
としてＸ線位置検出装置３の中心から外れるに従って像
が歪む。歪んだ像で位置を検出すれば当然精度が悪くな
る。However, since the accuracy of the cut end face of the multilayer laminated plate cut in the cutting process is not good, the position of the guide mark 4 is constant when the rough positioning device 1 positions the guide mark 4, as shown in FIG. It shifts with the tendency of. Therefore, even when the guide mark 4 is detected by the X-ray position detecting device 3 in the finishing process, the position of the guide mark 4 from the center position of the camera of the X-ray position detecting device 3 or the monitor TV is shown in FIG.
As shown in, it deviates with a certain tendency. If this deviation is large, there is a problem that the X-ray position detection device cannot enter the visual field.
In addition, the accuracy deteriorates even when entering the field of view. That is, the image is distorted as the X-ray characteristic deviates from the center of the X-ray position detection device 3. If the position is detected from the distorted image, the accuracy will naturally deteriorate.
【０００５】本発明は上記問題点に鑑みてなされたもの
であって、本発明の目的とするところは仕上げ加工ライ
ンに精度よく位置決めして多層積層板を送ることできて
仕上げ加工ラインでＸ線位置検出装置にてガイドマーク
の位置を精度よく検出できて仕上げ加工ラインの加工精
度が向上する多層積層板の位置決め方法を提供するにあ
る。The present invention has been made in view of the above problems, and an object of the present invention is to accurately position a multi-layer laminated plate on a finishing line and send it to an X-ray on the finishing line. It is an object of the present invention to provide a method for positioning a multilayer laminated plate in which the position detection device can detect the position of the guide mark with high accuracy and the processing accuracy of the finishing line is improved.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するため
本発明多層積層板の位置決め方法は、切断工程で適当な
大きさに切断されて送られてきた多層積層板２を端面基
準で粗位置決めし、この粗位置決めした多層積層板２を
仕上げ加工ラインに送り、仕上げ加工ラインでＸ線位置
検出装置にてガイドマーク４の位置を検出し、ガイドマ
ーク４の位置を基準に穴明け等を行う方法において、Ｘ
線位置検出装置でガイドマーク４を検出したときＸ線位
置検出装置のカメラやモニターテレビの中心位置がガイ
ドマーク４に対してずれている傾向を粗位置決め側にフ
ィードバックすると共にこのフィードバックデータに基
づいて多層積層板２を平面の２方向（Ｘ方向及びＹ方
向）及び垂直軸回り（θ）の位置決めを行い、このＸ・
Ｙ・θ位置決めした多層積層板２を仕上げ加工ラインに
送ることを特徴とする。In order to achieve the above object, a method for positioning a multilayer laminated plate of the present invention is such that a multilayer laminated plate 2 cut into an appropriate size in a cutting step and sent is roughly positioned based on an end face. Then, the rough-positioned multilayer laminated plate 2 is sent to the finishing processing line, the position of the guide mark 4 is detected by the X-ray position detecting device on the finishing processing line, and holes are made based on the position of the guide mark 4. In the method, X
When the guide mark 4 is detected by the line position detecting device, the tendency that the center position of the camera or monitor television of the X-ray position detecting device is deviated from the guide mark 4 is fed back to the rough positioning side and based on this feedback data. The multilayer laminated plate 2 is positioned in two directions (X direction and Y direction) on the plane and around the vertical axis (θ), and this X.
It is characterized in that the Y / θ-positioned multilayer laminated plate 2 is sent to a finishing line.
【０００７】[0007]
【作用】上記構成によれば、粗位置決め工程でガイドマ
ーク４を基準とする多層積層板２の位置決めができ、仕
上げ加工ラインでガイドマーク４の位置をＸ線位置検出
装置の中心に近づけ、仕上げ加工ラインでのガイドマー
ク４の検出の精度が向上して仕上げ加工ラインでの加工
精度が向上する。According to the above construction, the multi-layer laminated plate 2 can be positioned with the guide mark 4 as a reference in the rough positioning process, and the position of the guide mark 4 is brought closer to the center of the X-ray position detecting device on the finishing line to finish. The accuracy of detecting the guide mark 4 on the processing line is improved, and the processing accuracy on the finishing line is improved.
【０００８】[0008]
【実施例】仕上げ加工ラインでＸ線でガイドマーク４を
検出する工程は従来と同じであるので、従来と異なる粗
位置決め工程についてのみ述べる。図１に示す実施例は
粗位置決め工程を２ステーションに分けたものであり、
第１位置決め部と第２位置決め部とを有している。第１
位置決め部には従来と同じ端面基準で位置決めする粗位
置決め装置１を配置してあり、第１位置決め部から一定
の送りピッチＰ離れた位置に位置する第２位置決め部に
は平面の２方向（Ｘ方向及びＹ方向）及び垂直軸回り
（θ）の位置を自在に調整できる位置決めテーブル（以
下、Ｘ・Ｙ・θテーブルという）５を配置してある。切
断ラインで切断した多層積層板２は先ず第１の位置決め
部に送られ、粗位置決め装置１にて多層積層板２が端面
を基準に位置決めされる。第１位置決め部で位置決めさ
れた多層積層板２はＸ・Ｙ・θテーブル５に送られ、Ｘ
・Ｙ・θテーブル５でＸ・Ｙ・θ位置決めが行われる。
このとき仕上げ加工ラインのＸ線位置検出装置でガイド
マーク４を検出したときＸ線位置検出装置のカメラやモ
ニターテレビの中心位置がガイドマーク４に対してずれ
ている傾向を粗位置決め側にフィードバックすると共に
このフィードバックデータに基づいてＸ・Ｙ・θテーブ
ル５を駆動して位置決めがされる。このためガイドマー
ク４を基準にして位置決めしたのと略同じ精度に位置決
めされる。Ｘ・Ｙ・θテーブル５で位置決めされた多層
積層板２が一定の送りピッチＰで仕上げ加工ラインに送
られる。このようにして仕上げ加工ラインに多層積層板
２を送ると、Ｘ線位置検出装置の中心とガイドマーク４
とが殆ど近づいた状態でガイドマーク４が検出され、ガ
イドマーク４が精度よく検出され、精度よく検出したガ
イドマーク４を基準に穴明け等の仕上げ加工ができる。EXAMPLE Since the step of detecting the guide mark 4 by the X-ray on the finishing line is the same as the conventional one, only the rough positioning step different from the conventional one will be described. In the embodiment shown in FIG. 1, the rough positioning process is divided into two stations,
It has a first positioning portion and a second positioning portion. First
The coarse positioning device 1 for positioning with the same end face reference as the conventional one is arranged in the positioning section, and the second positioning section located at a position separated from the first positioning section by a constant feed pitch P has two planes (X direction). Direction and Y direction) and a positioning table (hereinafter referred to as X, Y, θ table) 5 that can freely adjust the position around the vertical axis (θ). The multilayer laminated plate 2 cut by the cutting line is first sent to the first positioning unit, and the rough positioning device 1 positions the multilayer laminated plate 2 with the end face as a reference. The multilayer laminated plate 2 positioned by the first positioning unit is sent to the X / Y / θ table 5,
・ Y / θ table 5 performs X / Y / θ positioning.
At this time, when the guide mark 4 is detected by the X-ray position detecting device of the finishing line, the tendency that the center position of the camera or monitor TV of the X-ray position detecting device is deviated from the guide mark 4 is fed back to the rough positioning side. At the same time, the XY table 6 is driven based on this feedback data for positioning. Therefore, the positioning is performed with substantially the same accuracy as the positioning with reference to the guide mark 4. The multilayer laminated plate 2 positioned by the X, Y, θ table 5 is sent to the finishing line at a constant feed pitch P. When the multi-layer laminate 2 is sent to the finishing line in this way, the center of the X-ray position detector and the guide mark 4
The guide mark 4 is detected in a state where the and are almost close to each other, the guide mark 4 is accurately detected, and finishing processing such as drilling can be performed based on the accurately detected guide mark 4.
【０００９】図２は他の実施例を示すものである。本実
施例の場合、上記実施例と同じ位置決めを１ステーショ
ンで行うようにしたものである。垂直軸回りに回転して
位置決めするテーブル（以下θテーブルという）６の上
に端面位置決めテーブル７を載設してあり、端面位置決
めテーブル７の上に端面当接部８と、端面当接部８を横
方向（Ｘ方向）に調整するＸ方向調整装置９と、端面当
接部８を縦方向（Ｙ方向）に調整するＹ方向調整装置１
０を設けてある。１１は駆動モータである。しかして切
断ラインから送られてきた多層積層板２を端面位置決め
テーブル７に載せ、端面当接部８を多層積層板２の端面
に当接して端面基準で粗位置決めし、仕上げ加工ライン
のＸ線位置検出装置でガイドマーク４を検出したときＸ
線位置検出装置のカメラやモニターテレビの中心位置が
ガイドマーク４に対してずれている傾向を粗位置決め側
にフィードバックすると共にこのフィードバックデータ
に基づいてＸ方向調整装置９、Ｙ方向調整装置１０及び
θテーブル７で位置を調整して位置決めし、位置決めし
た多層積層板２を仕上げ加工ラインに送る。FIG. 2 shows another embodiment. In the case of this embodiment, the same positioning as that of the above embodiment is performed in one station. An end face positioning table 7 is mounted on a table (hereinafter referred to as a θ table) 6 that rotates around a vertical axis and is positioned, and an end face abutting portion 8 and an end face abutting portion 8 are mounted on the end face positioning table 7. Direction adjusting device 9 for adjusting the horizontal direction (X direction) and a Y direction adjusting device 1 for adjusting the end face contact portion 8 in the vertical direction (Y direction).
0 is set. Reference numeral 11 is a drive motor. Then, the multilayer laminated plate 2 sent from the cutting line is placed on the end face positioning table 7, and the end face abutting portion 8 is brought into contact with the end face of the multilayer laminated plate 2 to perform rough positioning on the basis of the end face, and the X-ray of the finishing line. When the guide mark 4 is detected by the position detection device X
The tendency that the center position of the camera or monitor TV of the line position detecting device is displaced with respect to the guide mark 4 is fed back to the rough positioning side, and the X direction adjusting device 9, the Y direction adjusting device 10 and θ are fed based on this feedback data. The position is adjusted and positioned by the table 7, and the positioned multilayer laminated plate 2 is sent to the finishing line.
【００１０】[0010]
【発明の効果】本発明は上述のようにＸ線位置検出装置
でガイドマークを検出したときＸ線位置検出装置のカメ
ラやモニターテレビの中心位置がガイドマークに対して
ずれている傾向を粗位置決め側にフィードバックすると
共にこのフィードバックデータに基づいて多層積層板を
平面の２方向（Ｘ方向及びＹ方向）及び垂直軸回り
（θ）の位置決めし、このＸ・Ｙ・θ位置決めした多層
積層板を仕上げ加工ラインに送るものであるので、粗位
置決め工程でガイドマークを基準とする多層積層板の位
置決めができ、仕上げ加工ラインでガイドマークの位置
をＸ線位置検出装置の中心に近づけ、仕上げ加工ライン
でのガイドマークの検出の精度が向上して仕上げ加工ラ
インでの加工精度が向上するものであり、また位置決め
不良をなくして生産効率を向上できるものであり、仕上
げ加工ラインでの余分な手間を要せずタイムロスをなく
して生産性を向上できるものである。As described above, according to the present invention, when the guide mark is detected by the X-ray position detecting device, the center position of the camera or monitor television of the X-ray position detecting device is roughly positioned with respect to the guide mark. The multilayer laminated plate is positioned in two directions (X direction and Y direction) in the plane and around the vertical axis (θ) based on this feedback data, and the multilayer laminated plate is positioned in this X, Y, θ position. Since it is sent to the processing line, it is possible to position the multilayer laminate based on the guide mark in the rough positioning process, and the guide mark position is brought closer to the center of the X-ray position detection device on the finishing process line, The accuracy of guide mark detection is improved and the processing accuracy on the finishing processing line is improved. In addition, positioning errors are eliminated and production efficiency is improved. It is possible to improve productivity, and it is possible to improve productivity by eliminating time loss without requiring extra labor on the finishing line.
【図１】本発明の一実施例の方法を説明する概略平面図
である。FIG. 1 is a schematic plan view illustrating a method according to an embodiment of the present invention.
【図２】同上の他の実施例の方法を実施する装置の斜視
図である。FIG. 2 is a perspective view of an apparatus for carrying out the method of another embodiment of the same.
【図３】従来例を説明する概略平面図である。FIG. 3 is a schematic plan view illustrating a conventional example.
【図４】従来例の問題を説明する説明図である。FIG. 4 is an explanatory diagram illustrating a problem of a conventional example.
２ 多層積層板 ４ ガイドマーク 2 Multi-layer laminate 4 Guide mark
Claims (1)
られてきた多層積層板を端面基準で粗位置決めし、この
粗位置決めした多層積層板を仕上げ加工ラインに送り、
仕上げ加工ラインでＸ線位置検出装置にてガイドマーク
の位置を検出し、ガイドマークの位置を基準に穴明け等
を行う方法において、Ｘ線位置検出装置でガイドマーク
を検出したときＸ線位置検出装置のカメラやモニターテ
レビの中心位置がガイドマークに対してずれている傾向
を粗位置決め側にフィードバックすると共にこのフィー
ドバックデータに基づいて多層積層板を平面の２方向
（Ｘ方向及びＹ方向）及び垂直軸回り（θ）の位置決め
（以下、Ｘ・Ｙ・θ位置決めという）を行い、このＸ・
Ｙ・θ位置決めした多層積層板を仕上げ加工ラインに送
ることを特徴とする多層積層板の位置決め方法。1. A multi-layered laminate, which has been cut to an appropriate size in a cutting step and sent, is roughly positioned based on an end face, and the multi-layered plate that has been roughly positioned is sent to a finishing line.
X-ray position detection when the guide mark is detected by the X-ray position detection device in the method of detecting the guide mark position by the X-ray position detection device on the finishing line and making a hole based on the guide mark position The tendency that the center position of the camera or monitor TV of the device is deviated from the guide mark is fed back to the rough positioning side, and based on this feedback data, the multi-layer laminated plate is set in two plane directions (X direction and Y direction) and vertical. Positioning around the axis (θ) (hereinafter referred to as X / Y / θ positioning) is performed.
A method for positioning a multilayer laminated plate, which comprises sending the Y / θ positioned multilayer laminated plate to a finishing processing line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24394391A JPH0582976A (en) | 1991-09-25 | 1991-09-25 | Method for positioning multilayered laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24394391A JPH0582976A (en) | 1991-09-25 | 1991-09-25 | Method for positioning multilayered laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0582976A true JPH0582976A (en) | 1993-04-02 |
Family
ID=17111347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24394391A Withdrawn JPH0582976A (en) | 1991-09-25 | 1991-09-25 | Method for positioning multilayered laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0582976A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0866837A (en) * | 1994-08-24 | 1996-03-12 | Excellon Autom | Alignment device and method |
| WO2013171782A1 (en) * | 2012-05-14 | 2013-11-21 | 平田機工株式会社 | Positioning device, processing device, processing system, and positioning method |
| CN107954215A (en) * | 2017-12-20 | 2018-04-24 | 无锡特恒科技有限公司 | Belt line liquid crystal display coarse positioning mechanism |
-
1991
- 1991-09-25 JP JP24394391A patent/JPH0582976A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0866837A (en) * | 1994-08-24 | 1996-03-12 | Excellon Autom | Alignment device and method |
| WO2013171782A1 (en) * | 2012-05-14 | 2013-11-21 | 平田機工株式会社 | Positioning device, processing device, processing system, and positioning method |
| CN107954215A (en) * | 2017-12-20 | 2018-04-24 | 无锡特恒科技有限公司 | Belt line liquid crystal display coarse positioning mechanism |
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| Date | Code | Title | Description |
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| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19981203 |