JPH0582684A - Semiconductor device with cooling function - Google Patents
Semiconductor device with cooling functionInfo
- Publication number
- JPH0582684A JPH0582684A JP3238528A JP23852891A JPH0582684A JP H0582684 A JPH0582684 A JP H0582684A JP 3238528 A JP3238528 A JP 3238528A JP 23852891 A JP23852891 A JP 23852891A JP H0582684 A JPH0582684 A JP H0582684A
- Authority
- JP
- Japan
- Prior art keywords
- package
- cooling
- semiconductor device
- cooling function
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は冷却機能付半導体装置に
関し、特にパッケージと冷却装置とを一体化した冷却機
能付半導体装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device with a cooling function, and more particularly to a semiconductor device with a cooling function in which a package and a cooling device are integrated.
【０００２】[0002]
【従来の技術】従来、半導体装置のパッケージの冷却方
法は、図３に示すように、半導体装置のパッケージ３に
放熱板８を取り付け、この放熱板８に強制的に冷風９の
送風を行い冷却する方法、冷風９のかわりに絶縁液９中
に浸し絶縁液９を流動させることにより冷却を行う方
法、又は、放熱板８上、あるいは、パッケージ３上にヒ
ートパイプ等の冷却装置を直接接触させ、パッケージ３
を冷却する方法等種々の半導体装置のパッケージ３の冷
却方法がある。2. Description of the Related Art Conventionally, as shown in FIG. 3, a method of cooling a semiconductor device package is such that a heat radiating plate 8 is attached to the semiconductor device package 3 and the heat radiating plate 8 is forcibly blown with cool air 9 to cool it. Cooling method by immersing in the insulating liquid 9 instead of the cold air 9 and flowing the insulating liquid 9 or by directly contacting a cooling device such as a heat pipe on the radiator plate 8 or on the package 3. , Package 3
There are various methods for cooling the package 3 of the semiconductor device such as a method for cooling the semiconductor device.
【０００３】[0003]
【発明が解決しようとする課題】この従来の半導体装置
のパッケージを冷却するための放熱板及び方法では、外
部からの強制的な冷却方法を取っているため、パッケー
ジを冷却するためには半導体装置とは別個に強制冷却を
行うための装置を取り付けなければならないという問題
点があった。In this conventional heat dissipation plate and method for cooling the package of the semiconductor device, a forced cooling method from the outside is adopted. Therefore, in order to cool the package, the semiconductor device is cooled. There is a problem that a device for performing forced cooling must be attached separately from the above.
【０００４】本発明の目的は、別個に取り付けられた強
制冷却を行うための装置を排除し効率よく冷却出来る冷
却機能付半導体装置を提供することにある。It is an object of the present invention to provide a semiconductor device with a cooling function that can efficiently cool by eliminating a separately mounted device for performing forced cooling.
【０００５】[0005]
【課題を解決するための手段】本発明の冷却機能付半導
体装置は、パッケージを冷却する冷却装置の電極を前記
パッケージのリードに接続し、前記パッケージに収納さ
れた半導体素子の作動と同時に動作する前記冷却装置を
前記パッケージと一体化する。In the semiconductor device with a cooling function of the present invention, the electrodes of the cooling device for cooling the package are connected to the leads of the package, and operate simultaneously with the operation of the semiconductor element housed in the package. The cooling device is integrated with the package.
【０００６】[0006]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。Embodiments of the present invention will now be described with reference to the drawings.
【０００７】図１は本発明の第１の実施例の断面図であ
る。FIG. 1 is a sectional view of a first embodiment of the present invention.
【０００８】第１の実施例は、図１に示すように、パッ
ケージ３には小型ファン６用の電極４が取り付けられ、
電極４はパッケージ３のリード５に接続されているの
で、リード５に電源を印加すると半導体素子と小型ファ
ン６が同時に作動し、穴あき放熱器１を冷却する。In the first embodiment, as shown in FIG. 1, an electrode 4 for a small fan 6 is attached to a package 3,
Since the electrode 4 is connected to the lead 5 of the package 3, when a power supply is applied to the lead 5, the semiconductor element and the small fan 6 operate simultaneously to cool the perforated radiator 1.
【０００９】穴あき放熱器１とパッケージ３とは導熱性
接着剤２で接着されている。小型ファン６が作動する
と、穴あき放熱器１の中へ送風が行われ、半導体素子か
ら発熱された熱をパッケージ３，導熱性接着剤２を介し
て冷却が行われ、風速３ｍ／ｓで、約３０％の熱抵抗の
低減がはかれる。The perforated radiator 1 and the package 3 are bonded with a heat conductive adhesive 2. When the small fan 6 operates, air is blown into the perforated radiator 1, and the heat generated from the semiconductor element is cooled via the package 3 and the heat conductive adhesive 2, and the wind speed is 3 m / s. The thermal resistance can be reduced by about 30%.
【００１０】図２は本発明の第２の実施例の断面図であ
る。FIG. 2 is a sectional view of the second embodiment of the present invention.
【００１１】第２の実施例は、図２に示すように、パッ
ケージ３の内部には、例えば、ペルティエ素子等の冷却
機能を有する素子７が封止され電極がパッケージ３のリ
ード５に接続されているので、リード５に電源を印加す
ると半導体素子と冷却機能を有する素子７が同時に作動
し、第１の実施例と同様にパッケージ３の冷却を行うこ
とが出来る効果がある。In the second embodiment, as shown in FIG. 2, an element 7 having a cooling function such as a Peltier element is sealed inside the package 3 and an electrode is connected to a lead 5 of the package 3. Therefore, when power is applied to the leads 5, the semiconductor element and the element 7 having a cooling function are simultaneously activated, and the package 3 can be cooled as in the first embodiment.
【００１２】又、この第２の実施例では、冷却機能を有
する素子７だけでも冷却効果はあるが、更に、パッケー
ジ３の上に放熱器を取り付け冷却機能を向上させること
も出来る冷却方式を選択できる利点を有する。In the second embodiment, the cooling effect can be obtained only by the element 7 having the cooling function, but a cooling method can be selected in which a radiator is mounted on the package 3 to improve the cooling function. It has the advantage that it can.
【００１３】[0013]
【発明の効果】以上説明したように本発明は、パッケー
ジを冷却する冷却装置の電極をパッケージのリードに接
続し、パッケージに収納された半導体素子の作動と同時
に動作する冷却装置をパッケージと一体化したので、別
個に強制冷却装置を設けて外部から強制冷却を行うこと
なしにパッケージを効率よく冷却できるという効果があ
る。As described above, according to the present invention, the electrodes of the cooling device for cooling the package are connected to the leads of the package, and the cooling device that operates simultaneously with the operation of the semiconductor elements housed in the package is integrated with the package. Therefore, there is an effect that the package can be efficiently cooled without separately providing the forced cooling device and performing the forced cooling from the outside.
【図１】本発明の第１の実施例の断面図である。FIG. 1 is a sectional view of a first embodiment of the present invention.
【図２】本発明の第２の実施例の断面図である。FIG. 2 is a sectional view of a second embodiment of the present invention.
【図３】従来の放熱板付半導体装置の一例の断面図であ
る。FIG. 3 is a cross-sectional view of an example of a conventional semiconductor device with a heat sink.
１ 穴あき放熱器 ２ 導熱性接着剤 ３ パッケージ ４ 電極 ５ リード ６ 小型ファン ７ 冷却機能を有する素子 ８ 放熱板 ９ 冷風又は絶縁液 1 Perforated radiator 2 Thermal conductive adhesive 3 Package 4 Electrode 5 Lead 6 Small fan 7 Element with cooling function 8 Radiator 9 Cold air or insulating liquid
Claims (1)
前記パッケージのリードに接続し、前記パッケージに収
納された半導体素子の作動と同時に動作する前記冷却装
置を前記パッケージと一体化したことを特徴とする冷却
機能付半導体装置。1. An electrode of a cooling device for cooling a package is connected to a lead of the package, and the cooling device that operates simultaneously with the operation of a semiconductor element housed in the package is integrated with the package. Semiconductor device with cooling function.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3238528A JPH0582684A (en) | 1991-09-19 | 1991-09-19 | Semiconductor device with cooling function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3238528A JPH0582684A (en) | 1991-09-19 | 1991-09-19 | Semiconductor device with cooling function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0582684A true JPH0582684A (en) | 1993-04-02 |
Family
ID=17031596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3238528A Pending JPH0582684A (en) | 1991-09-19 | 1991-09-19 | Semiconductor device with cooling function |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0582684A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100630664B1 (en) * | 2000-05-09 | 2006-10-02 | 삼성전자주식회사 | Integrated circuit device having cooling system |
-
1991
- 1991-09-19 JP JP3238528A patent/JPH0582684A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100630664B1 (en) * | 2000-05-09 | 2006-10-02 | 삼성전자주식회사 | Integrated circuit device having cooling system |
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