JPH0574847A - Connecting structure of tab-system semiconductor device - Google Patents

Abstract

PURPOSE:To restrain the dislocation of a connecting pitch between connecting interconnections of both a flexible film and a wiring board when the flexible film is connected to the wiring board and to restrain the stress of their connecting part. CONSTITUTION:A flexible film 4 is connected to a wiring board 3 via a glass board 2 which is provided with continuity terminals 7 which are common to a plurality of faces in the long-side direction of a glass square pillar. Thereby, when the connecting condition of the flexible film and the wiring board 3 to the glass board 2 is selected, it is possible to restrain the dislocation of a connecting pitch. When they are connected respectively to two faces with which the glass wiring board 2 comes into contact, their wiring direction can be changed, and it is possible to restrain the stress of their connecting part.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、ポリイミドフイルムの
ごとき可撓性を有するフイルムに、半導体素子を搭載し
てフイルムに設けたインナーリードと接続したことから
なるＴＡＢ式半導体装置、あるいは上記のフイルムにリ
ードを設けてなるフレキシブルテープを、基板に設けた
配線端子に接続するＴＡＢ式半導体装置等の接続構造に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a TAB type semiconductor device comprising a semiconductor film mounted on a flexible film such as a polyimide film and connected to an inner lead provided on the film, or the above film. The present invention relates to a connection structure for a TAB type semiconductor device or the like, in which a flexible tape having a lead is connected to a wiring terminal provided on a substrate.

【０００２】[0002]

【従来の技術】ポリイミドフイルムのごとき可撓性を有
するフイルムに、半導体素子を搭載してフイルムに設け
たリードと接続したいわゆるＴＡＢ式半導体装置は広く
実用に供されている。また、上記のフイルムに多数のリ
ードを設け、その可撓性を利用して基板間あるいは、半
導体装置と基板間等を接続するフレキシブルテープも実
用化されている。2. Description of the Related Art A so-called TAB type semiconductor device in which a semiconductor element is mounted on a flexible film such as a polyimide film and connected to leads provided in the film is widely used. Further, a flexible tape has been put into practical use in which a large number of leads are provided on the above-mentioned film and the flexibility thereof is used to connect between the substrates or between the semiconductor device and the substrates.

【０００３】図６は従来のこの種の接続構造の一例を示
す模式図、図７はその要部の拡大図である。図に於て、
３は例えば液晶パネルを構成するガラス製の配線基板
で、その外縁には多数の配線端子８が設けられている。
１はＴＡＢ式半導体装置で、可撓性フイルム４の中央部
には半導体素子６が搭載され、その電極は可撓性フイル
ム４に形成したリード５にそれぞれ接続されている。FIG. 6 is a schematic view showing an example of a conventional connection structure of this kind, and FIG. 7 is an enlarged view of the main part thereof. In the figure,
Reference numeral 3 denotes, for example, a glass wiring board which constitutes a liquid crystal panel, and a large number of wiring terminals 8 are provided on the outer edge thereof.
Reference numeral 1 denotes a TAB type semiconductor device, in which a semiconductor element 6 is mounted at the center of the flexible film 4, and its electrodes are connected to leads 5 formed on the flexible film 4, respectively.

【０００４】なお、１３は例えばプリント基板、１４は
多数のリードが形成され、配線基板３に設けられた配線
端子８とプリント基板１３に設けられた電極パターン１
５とを電気的に接続するフレキシブルテープである。Incidentally, 13 is, for example, a printed board, 14 is formed with a large number of leads, and wiring terminals 8 provided on the wiring board 3 and electrode patterns 1 provided on the printed board 13 are provided.
5 is a flexible tape for electrically connecting to 5.

【０００５】上記のような配線基板３の配線端子８にＴ
ＡＢ式半導体装置１のリード５を接続するには、図７に
示すごとく配線基板３の配線端子８にＴＡＢ式半導体装
置１のリード５を整合（位置合わせ）させて両者の間に
異方性導電接着フイルムや異方性導電膜等の接続剤１２
を介装し、可撓性フイルム４を加熱かつ加圧して配線端
子８にリード５を接続する。The wiring terminals 8 of the wiring board 3 as described above are provided with T
In order to connect the leads 5 of the AB type semiconductor device 1, as shown in FIG. 7, the leads 5 of the TAB type semiconductor device 1 are aligned (aligned) with the wiring terminals 8 of the wiring board 3 and anisotropy is provided between them. Connection agent 12 such as conductive adhesive film or anisotropic conductive film
The flexible film 4 is heated and pressed to connect the lead 5 to the wiring terminal 8.

【０００６】配線基板３とプリント基板１３に対するフ
レキシブルテープ１４の接続も上記と同様にして行われ
る。The flexible tape 14 is connected to the wiring board 3 and the printed board 13 in the same manner as described above.

【０００７】[0007]

【発明が解決しようとする課題】しかし前述の従来技術
では、上記のような配線基板３とＴＡＢ式半導体装置１
またはフレキシブルテープ１４との接続構造において
は、接続剤１２で両者を接続する際に、接続時の加熱に
よって可撓性フイルム４が伸びるため、配線端子８とリ
ード５との位置が整合しなくなり、図８に示すごとく両
者の間に位置ずれが生じて配線基板３の一部の配線端子
８とＴＡＢ式半導体装置１のリード５との接続部に充分
な接続面積が得られない場合が生じ、ときとしてリード
５が配線端子８から外れてしまい電気的な接続が得られ
ない場合がある。このような位置ずれ傾向は、接続ピッ
チが狭くなるほど著しかった。However, in the above-mentioned prior art, the wiring board 3 and the TAB type semiconductor device 1 as described above are used.
Alternatively, in the connection structure with the flexible tape 14, since the flexible film 4 is stretched by the heating at the time of connecting the both with the connecting agent 12, the positions of the wiring terminals 8 and the leads 5 are not aligned. As shown in FIG. 8, there may be a case where a positional deviation occurs between the two and a sufficient connection area cannot be obtained at a connection portion between a part of the wiring terminal 8 of the wiring board 3 and the lead 5 of the TAB semiconductor device 1, In some cases, the lead 5 may come off from the wiring terminal 8 and electrical connection may not be obtained. Such a tendency of positional deviation was more remarkable as the connection pitch became narrower.

【０００８】また、接続後に図７のごとくＴＡＢ式半導
体装置１、あるいはフレキシブルテープをその可撓性を
生かして曲げて使用する場合、接続部にストレスがかか
り、接続不良の原因となることや、曲げ部に余裕範囲を
とらなければならず接続範囲の小範囲化ができずにＴＡ
Ｂ式半導体装置やフレキシブルテープを用いて接続した
製品の面積及び、製品体積が大きくなってしまう問題点
があった。Further, when the TAB type semiconductor device 1 or the flexible tape is bent and used after its connection as shown in FIG. 7, stress is applied to the connection portion, which may cause connection failure. Since a margin area must be taken in the bent part and the connection area cannot be reduced, TA
There is a problem that the area and the product volume of the product connected using the B type semiconductor device or the flexible tape are increased.

【０００９】本発明は上記の課題を解決すべくなされた
ものであり、位置ずれを生じるおそれのない配線端子と
リードの接続構造を得ることと、接続部のストレスを減
少させ接続不良のおこることのないようにすることと、
併せて接続範囲を小さく抑えることを目的としたもので
ある。The present invention has been made to solve the above-mentioned problems, and to obtain a connection structure of a wiring terminal and a lead that does not cause a positional deviation and to reduce connection stress to cause a connection failure. Not to
At the same time, the purpose is to keep the connection range small.

【００１０】[0010]

【課題を解決するための手段】本発明のＴＡＢ式半導体
装置の接続構造によれば、ガラス角柱の長辺方向の少な
くとも連続して接する２面に共通した導通端子を複数本
配置したガラス基板と、ＴＡＢ式半導体装置と配線基板
から構成され、ＴＡＢ式半導体装置、フレキシブルテー
プ等のリードと、ガラス基板の導通端子とを異方性導電
膜や、異方性導電接着剤等により接続した後、リードを
接続済みのガラス基板と、配線基板の配線端子とを接続
することを特徴とする。According to the connection structure of a TAB type semiconductor device of the present invention, a glass substrate in which a plurality of common conducting terminals are arranged on at least two surfaces which are in continuous contact with each other in the long side direction of the glass prism. , A TAB type semiconductor device and a wiring board, and after connecting a lead of a TAB type semiconductor device, a flexible tape or the like and a conductive terminal of a glass substrate with an anisotropic conductive film or an anisotropic conductive adhesive, The glass substrate to which the leads are already connected is connected to the wiring terminal of the wiring substrate.

【００１１】[0011]

【作用】本発明の構成によれば、ガラス角柱の長辺方向
の少なくとも連続して接する２面に共通した導通端子を
複数本配置したガラス基板の１面の導通端子にＴＡＢ式
半導体装置や、フレキシブルテープのリードを接続した
後、リードを接続済みのガラス基板の他の１面の導通端
子と、配線基板とを接続することにより、ＴＡＢ式半導
体装置やフレキシブルテープの可撓性を利用しての折曲
げて使用する場合の折曲げ回数を減少させることが可能
となるため、接続部のストレスを減少させることができ
る。また、折曲げて使用する場合のＴＡＢ式半導体装
置、フレキシブルテープの曲げ半径を考慮しなくても良
いことから接続範囲の減少も達成できる。According to the structure of the present invention, a TAB type semiconductor device is used as a conductive terminal on one surface of a glass substrate on which a plurality of conductive terminals common to two surfaces which are in continuous contact with each other in the long side direction of the glass prism are arranged. After connecting the leads of the flexible tape, by connecting the conductive terminal on the other surface of the glass substrate to which the leads are already connected to the wiring board, the flexibility of the TAB semiconductor device or the flexible tape is utilized. Since it is possible to reduce the number of times of bending when used by bending, the stress of the connecting portion can be reduced. Further, since it is not necessary to consider the bending radius of the TAB type semiconductor device and the flexible tape when it is bent and used, the connection range can be reduced.

【００１２】また、ガラス基板を用いることにより、Ｔ
ＡＢ式半導体装置や、フレキシブルテープのリードと、
ガラス基板の導通端子との接続を、配線基板への影響無
しに行えることにより、接続圧力や、接続温度を、接続
に適した温度、圧力に設定しやすいため確実な接続を行
うことが可能となる。By using a glass substrate, T
AB type semiconductor devices and flexible tape leads,
By connecting to the conductive terminal of the glass substrate without affecting the wiring substrate, it is easy to set the connection pressure and connection temperature to the temperature and pressure suitable for the connection, making it possible to make a reliable connection. Become.

【００１３】[0013]

【実施例】図１は本発明におけるＴＡＢ式半導体装置の
接続構造を示す斜視図であり、１はＴＡＢ式半導体装
置、２はガラス基板、３は配線基板であり、ＴＡＢ式半
導体装置１は、ポリイミドフイルムのごとき耐熱性を有
する可撓性フィルム４の表面に配置されたリード５と、
半導体素子６の電極とを電気的に接続したことよりな
り、ガラス基板２はガラス角柱の長辺方向の連続する２
面に共通して導通する導通端子７を有し、導通端子７
は、ＴＡＢ式半導体装置１のリード幅とほぼ等しく形成
されている。配線基板３には、ガラス製の液晶パネルを
用い、配線基板の外周部に、配線端子８が配列している
ものを用いた。1 is a perspective view showing a connection structure of a TAB type semiconductor device according to the present invention, wherein 1 is a TAB type semiconductor device, 2 is a glass substrate, 3 is a wiring substrate, and TAB type semiconductor device 1 is Leads 5 arranged on the surface of a flexible film 4 having heat resistance such as a polyimide film,
The glass substrate 2 is formed by electrically connecting to the electrodes of the semiconductor element 6, and the glass substrate 2 is continuous in the long side direction of the glass prism.
The conducting terminal 7 has a conducting terminal 7 which is electrically connected in common to the surfaces.
Are formed to have a width substantially equal to the lead width of the TAB semiconductor device 1. A liquid crystal panel made of glass was used as the wiring board 3, and wiring terminals 8 were arranged on the outer peripheral portion of the wiring board.

【００１４】ガラス基板２の導通端子７は、図２のガラ
ス基板の形成方法を示す斜視図、図３のガラス基板の配
線を示す正面図に示すごとくガラス角柱９の長辺方向の
連続して接する２面をパターン面１０としてスパッタ、
蒸着等の成膜方法により金属膜を配置し感光レジスト塗
布の後、２面のパターン面１０がほぼ均等な角度となる
ように載置治具１１上に配置し、図示しない露光機によ
り露光して、レジスト剥離、エッチング工程のごとき一
般的な配線パターン形成工程を経て２面のパターン面に
共通して導通する導通端子７として形成した。The conductive terminals 7 of the glass substrate 2 are continuously arranged in the long side direction of the glass prism 9 as shown in the perspective view of the method of forming the glass substrate of FIG. 2 and the front view of the wiring of the glass substrate of FIG. The two surfaces in contact with each other are used as the pattern surface 10 for sputtering,
After arranging a metal film by a film forming method such as vapor deposition and applying a photosensitive resist, it is arranged on a mounting jig 11 so that the two pattern surfaces 10 have substantially equal angles, and exposed by an exposing machine (not shown). Then, through a general wiring pattern forming process such as a resist stripping and etching process, a conductive terminal 7 is formed which is commonly conducted to the two pattern surfaces.

【００１５】次に図４の、ＴＡＢ式半導体装置と、ガラ
ス基板との接続について示す断面図と、図５のガラス基
板と配線基板との接続について示す断面図を用いてＴＡ
Ｂ式半導体装置の接続方法を説明する。Next, using the sectional view showing the connection between the TAB semiconductor device and the glass substrate in FIG. 4 and the sectional view showing the connection between the glass substrate and the wiring board in FIG. 5, TA
A method of connecting the B type semiconductor device will be described.

【００１６】図４のごとくＴＡＢ式半導体装置１のリー
ド５と、ガラス基板２に配置した導通端子７を整合し、
異方性導電膜、異方性接着剤等の接続剤１２にて接続す
る。次に図５に示すごとくＴＡＢ式半導体装置１を接続
剤１２により接続したガラス基板２の他方のパターン面
１０の導通端子７と配線基板３の配線端子８とを整合
し、同じく異方性導電膜、異方性接着剤等の接続剤１２
にて接続する。As shown in FIG. 4, the lead 5 of the TAB semiconductor device 1 is aligned with the conductive terminal 7 arranged on the glass substrate 2,
Connection is made with a connecting agent 12 such as an anisotropic conductive film or an anisotropic adhesive. Next, as shown in FIG. 5, the conductive terminals 7 on the other pattern surface 10 of the glass substrate 2 to which the TAB type semiconductor device 1 is connected by the connecting agent 12 and the wiring terminals 8 of the wiring substrate 3 are aligned, and anisotropic conductive material is also used. Membranes, connecting agents such as anisotropic adhesives 12
Connect with.

【００１７】この時、ＴＡＢ式半導体装置１と、ガラス
基板２との接続は、従来の方法と比較して、配線基板に
かかる接続時の加熱温度、もしくは加熱圧力等の制約が
少なくて接続することが出来るため、ガラス基板２側よ
り接続部を加熱することにより、ＴＡＢ式半導体装置１
の可撓性フイルム４にかかる熱量を抑えることが可能と
なり接続部のピッチずれを抑えることが可能となる。At this time, the connection between the TAB type semiconductor device 1 and the glass substrate 2 is less restricted by heating temperature or heating pressure applied to the wiring board than in the conventional method. Therefore, by heating the connecting portion from the glass substrate 2 side, the TAB semiconductor device 1
It is possible to suppress the amount of heat applied to the flexible film 4, and it is possible to suppress the pitch deviation of the connection portion.

【００１８】また、ＴＡＢ式半導体装置１と、ガラス基
板２を整合した後、加熱雰囲気中での接続等も可能とな
り、ＴＡＢ式半導体装置１と、ガラス基板２との接続ピ
ッチずれを抑えることが可能となる。Further, after the TAB semiconductor device 1 and the glass substrate 2 are aligned with each other, it is possible to connect them in a heating atmosphere, so that the deviation of the connection pitch between the TAB semiconductor device 1 and the glass substrate 2 can be suppressed. It will be possible.

【００１９】また、ＴＡＢ式半導体装置を接続済みのガ
ラス基板と、配線基板との接続においては、ガラス基板
２の温度による寸法変化が可撓性フイルム４に比較して
少いため、位置ずれ量を減少することができる。Further, in connecting the glass substrate to which the TAB type semiconductor device is already connected and the wiring substrate, the dimensional change due to the temperature of the glass substrate 2 is smaller than that of the flexible film 4, so that the positional deviation amount is reduced. Can be reduced.

【００２０】さらにガラス角柱の２辺を用いることによ
り、接続方向を約９０度変化することが可能となりリー
ド曲げ時のストレスを減少することも可能となる。Further, by using the two sides of the glass prism, it is possible to change the connecting direction by about 90 degrees, and it is also possible to reduce the stress at the time of bending the lead.

【００２１】上記実施例においてはＴＡＢ式半導体装置
と配線基板とを、ガラス基板を介して接続した例につい
て説明を行ったが、フレキシブルテープと、配線基板と
の接続についても同等の効果を得られることはいうまで
もない。またガラス基板のかわりにセラミック基板を用
いても同等の効果を得ることが可能であり、本発明に含
まれる。In the above embodiment, an example in which the TAB type semiconductor device and the wiring board are connected via the glass substrate has been described, but the same effect can be obtained for the connection between the flexible tape and the wiring board. Needless to say. Further, even if a ceramic substrate is used instead of the glass substrate, the same effect can be obtained, and this is included in the present invention.

【００２２】[0022]

【発明の効果】以上述べたごとく本発明のＴＡＢ式半導
体装置の接続構造によれば、ガラス角柱の長辺方向の少
なくとも連続して接する２面に共通した導電端子を配置
したガラス基板により、ＴＡＢ式半導体装置やフレキシ
ブルテープ等のリードと、配線基板に設けた配線端子と
を接続することにより、接続部にかかる接続時のストレ
スを緩和し、接続範囲を減少させることと、併せて接続
時の温度、圧力の基板への影響を少なくして、接続ピッ
チずれの少ないＴＡＢ式半導体装置の接続構造を得るこ
とができるという効果を有する。As described above, according to the connection structure of the TAB type semiconductor device of the present invention, the TAB is formed by the glass substrate in which the common conductive terminals are arranged on at least two continuously contacting surfaces in the long side direction of the glass prism. By connecting the lead of a semiconductor device or flexible tape to the wiring terminal provided on the wiring board, the stress at the time of connection at the connection part can be relieved and the connection range can be reduced. There is an effect that the influence of temperature and pressure on the substrate can be reduced and a connection structure of the TAB type semiconductor device with a small connection pitch deviation can be obtained.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明のＴＡＢ式半導体装置の接続構造を示す
斜視図。FIG. 1 is a perspective view showing a connection structure of a TAB type semiconductor device of the present invention.

【図２】本発明に用いるガラス基板の形成方法を示す斜
視図。FIG. 2 is a perspective view showing a method for forming a glass substrate used in the present invention.

【図３】本発明に用いるガラス基板の正面図。FIG. 3 is a front view of a glass substrate used in the present invention.

【図４】本発明のＴＡＢ式半導体装置とガラス基板との
接続を示す断面図。FIG. 4 is a cross-sectional view showing a connection between a TAB semiconductor device of the present invention and a glass substrate.

【図５】本発明に用いるガラス基板と配線基板との接続
を示す断面図。FIG. 5 is a cross-sectional view showing a connection between a glass substrate used in the present invention and a wiring substrate.

【図６】従来の接続構造を示す模式図。FIG. 6 is a schematic diagram showing a conventional connection structure.

【図７】従来の接続構造の要部を示す拡大図。FIG. 7 is an enlarged view showing a main part of a conventional connection structure.

【図８】従来の接続構造を示す断面図。FIG. 8 is a cross-sectional view showing a conventional connection structure.

【符号の説明】[Explanation of symbols]

１ ＴＡＢ式半導体装置 ２ ガラス基板 ３ 配線基板 ４ 可撓性フイルム ５ リード ６ 半導体素子 ７ 導通端子 ８ 配線端子 ９ ガラス角柱 １０ パターン面 １１ 載置治具 １２ 接続剤 １３ プリント基板 １４ フレキシブルテープ １５ 電極パターン DESCRIPTION OF SYMBOLS 1 TAB semiconductor device 2 Glass substrate 3 Wiring substrate 4 Flexible film 5 Lead 6 Semiconductor element 7 Conductive terminal 8 Wiring terminal 9 Glass prism 10 Pattern surface 11 Mounting jig 12 Connecting agent 13 Printed board 14 Flexible tape 15 Electrode pattern

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 ＴＡＢ式半導体装置、フレキシブルテー
プ等のリードを、配線基板に設けた配線端子に接続する
接続構造において、ガラス角柱の長辺方向の少なくとも
連続して接する２面に共通した導通端子を複数本配置し
たガラス基板と、ＴＡＢ式半導体装置と、配線基板とか
ら構成され、前記ＴＡＢ式半導体装置、フレキシブルテ
ープ等のリードと、配線基板の配線端子は、ガラス基板
の導通端子を介して接続されることを特徴とするＴＡＢ
式半導体装置の接続構造。1. In a connection structure for connecting a lead of a TAB type semiconductor device, a flexible tape or the like to a wiring terminal provided on a wiring board, a conductive terminal common to at least two continuously contacting surfaces of a glass prism in the long side direction. A plurality of glass substrates, a TAB type semiconductor device, and a wiring substrate. The TAB type semiconductor device, the leads such as the flexible tape, and the wiring terminals of the wiring substrate are connected via the conductive terminals of the glass substrate. TAB characterized by being connected
Type semiconductor device connection structure.