JPH0569919B2 - - Google Patents
Info
- Publication number
- JPH0569919B2 JPH0569919B2 JP60094076A JP9407685A JPH0569919B2 JP H0569919 B2 JPH0569919 B2 JP H0569919B2 JP 60094076 A JP60094076 A JP 60094076A JP 9407685 A JP9407685 A JP 9407685A JP H0569919 B2 JPH0569919 B2 JP H0569919B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- silver
- small holes
- electroforming
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052709 silver Inorganic materials 0.000 claims description 38
- 239000004332 silver Substances 0.000 claims description 38
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 37
- 239000011347 resin Substances 0.000 claims description 23
- 229920005989 resin Polymers 0.000 claims description 23
- 238000005323 electroforming Methods 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 238000007872 degassing Methods 0.000 claims description 11
- 238000007666 vacuum forming Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 239000003518 caustics Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 7
- 238000003754 machining Methods 0.000 description 5
- 230000000873 masking effect Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- RAESLDWEUUSRLO-UHFFFAOYSA-O aminoazanium;nitrate Chemical compound [NH3+]N.[O-][N+]([O-])=O RAESLDWEUUSRLO-UHFFFAOYSA-O 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- PLKATZNSTYDYJW-UHFFFAOYSA-N azane silver Chemical compound N.[Ag] PLKATZNSTYDYJW-UHFFFAOYSA-N 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 235000003891 ferrous sulphate Nutrition 0.000 description 1
- 239000011790 ferrous sulphate Substances 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 1
- 229910000359 iron(II) sulfate Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 150000003378 silver Chemical class 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229960004418 trolamine Drugs 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は電鋳型の製造法、詳しくは自動車内装
品であるコンソールボツクス、インストルメンタ
ルパネルパツド等の表皮体を真空成形により形成
する電鋳型を製造する方法に関するものである。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a method for manufacturing an electroforming mold, specifically an electroforming mold for forming skin bodies of automobile interior parts such as console boxes and instrumental panel pads by vacuum forming. The present invention relates to a method for manufacturing.
（従来の技術）
近年、コンソールボツクス、インストルメンタ
ルパネルパツドを構成しているポリ塩化ビニルあ
るいはABS樹脂からなる比較的肉薄の表皮材は、
スラツシユ成形あるいは真空成形により所定の形
状に型付けしている。なかでも、真空成形は比較
的形状の単純なもの、例えば、コーナー部やシボ
模様等の複雑形状の少ない形状を成形するにおい
ては最適であるが、反面、上記複雑形状の多い表
皮材を成形する場合には熱可塑性シートが真空成
形用金型のキヤビテイ内面のコーナー部において
熱可塑性シートが吸引されず、密接されないため
成形が不充分であつた。(Prior art) In recent years, relatively thin skin materials made of polyvinyl chloride or ABS resin that make up console boxes and instrument panel pads are
It is molded into a predetermined shape by slush molding or vacuum forming. Among these, vacuum forming is optimal for forming relatively simple shapes, such as shapes with few complex shapes such as corners and grain patterns, but on the other hand, it is suitable for forming skin materials with many complex shapes as mentioned above. In some cases, the thermoplastic sheet was not sucked into the corners of the inner surface of the cavity of the vacuum mold, and was not brought into close contact with the mold, resulting in insufficient molding.
そのため、真空成形用金型のコーナー部等にお
いては吸引脱気用の小孔を他の平坦な部分に比べ
て多く設ける必要があつた。 Therefore, it has been necessary to provide more small holes for suction and degassing in the corner portions of the vacuum forming mold than in other flat portions.
そこで、従来、真空成形用金型の１つとして、
電鋳加工した成形型が使用され、これに脱気用小
孔を形成するために、予め成形した電鋳型を超硬
度を有するキリで穴をあけたり、レーザーなどに
よつて後加工により機械的に該小孔を形成してい
た。 Therefore, conventionally, as one of the molds for vacuum forming,
An electroformed mold is used, and in order to form small holes for degassing, the preformed electroformed mold is punched with a super hard awl, or mechanically processed by post-processing using a laser, etc. The small hole was formed in the.
（発明が解決しようとする課題）
しかし、上記機械加工により孔開けする方法を
用いると、型の平坦部分はよいとしても数mmの厚
さをもつ電鋳型が加工後にそのコーナー部におい
て内部歪を有しているために、コーナー部の小孔
形成では機械加工時における僅かな衝突によつて
電鋳型が破損することもあり、またそればかりで
なく、機械加工では加工の工数も多く、多大の時
間を要する難があつた。(Problem to be Solved by the Invention) However, when using the method of making holes by machining, the flat part of the mold may be good, but the electroforming mold, which has a thickness of several mm, will suffer internal strain at the corner part after machining. Therefore, when forming a small hole in a corner part, the electroforming mold may be damaged due to a slight collision during machining. There was a problem that required time.
本発明は、このような問題に対処し、これを解
決するべく、特に上記電鋳型におけるコーナー部
など従来、小孔作成に問題があつた部位の小孔形
成にあたり、機械加工による電鋳型の破損を防止
し、当該の部位に対し必要な大きさの脱気用小孔
を化学的かつ有利に形成することを目的とするも
のである。 In order to address and solve these problems, the present invention aims to avoid damage to the electroforming mold due to machining, especially when forming small holes in areas where there have been problems in forming small holes in the past, such as the corners of the electroforming mold. The purpose is to chemically and advantageously form small degassing holes of the necessary size in the relevant area.
（課題を解決するための手段）
即ち、本発明の特徴とするところは、自動車内
装品の表皮材を真空成形するときの成形金型とし
て使用する電鋳型の製造法において、型平坦部分
に比し、脱気用小孔形成の困難なコーナー部など
の小孔形成を行なうに際し、モデル型から雌型を
作成し、次いで該雌型内に樹脂型を形成した後、
上記樹脂型の表面において銀鏡反応により銀層を
析出付着させ、前記コーナー部など所定の領域の
脱気用小孔形成部位以外をシールした後、少なく
とも前記所定の領域に銀腐食剤を塗布することに
よつて、該領域の小孔形成部位に前記銀腐食剤を
浸入させて銀層に小孔を形成処理し、しかる後、
上記小孔を形成せしめた銀層を表面に有する樹脂
型を電鋳加工法により上記銀層の表面に一定厚み
の電鋳皮膜金属層を付着させ、その後、前記電鋳
皮膜と樹脂型とを分離離脱せしめ、電鋳型を製造
する方法にある。(Means for Solving the Problems) That is, a feature of the present invention is that in a method for manufacturing an electroforming mold used as a molding die when vacuum forming a skin material of an automobile interior part, However, when forming small holes such as corners where it is difficult to form small holes for degassing, a female mold is created from the model mold, and then a resin mold is formed within the female mold.
A silver layer is precipitated and adhered on the surface of the resin mold by a silver mirror reaction, and after sealing a predetermined region such as the corner portion other than a portion where small degassing holes are formed, a silver corrosive agent is applied to at least the predetermined region. The silver corrosive agent is infiltrated into the pore-forming site in the area to form pores in the silver layer, and then,
A resin mold having a silver layer on the surface with the small holes formed thereon is electroformed to deposit an electroformed film metal layer of a certain thickness on the surface of the silver layer, and then the electroformed film and the resin mold are bonded together. A method for producing an electroforming mold by separating and releasing the mold.
とりわけ、上記本発明は樹脂型の表面において
銀鏡反応によつて得られた銀層を腐食させて脱気
用小孔を形成することに大きな特徴が存する。 Particularly, the present invention is characterized in that small pores for degassing are formed by corroding the silver layer obtained by silver mirror reaction on the surface of the resin mold.
ここで脱気用小孔は通常、30〜100μφで成形材
料によつても異なるが、最大0.5〜0.3mmφ程度で
１mm2、当り２個程度は必要である。 Here, the small holes for degassing usually have a diameter of 30 to 100 μι, and although it varies depending on the molding material, the maximum diameter is about 0.5 to 0.3 mm, and about 2 holes are required per 1 mm 2 .
（実施例）
以下、上記本発明の製造工程の実施例を添付図
面に従つて更に詳細に説明する。(Example) Hereinafter, an example of the manufacturing process of the present invention will be described in more detail with reference to the accompanying drawings.
第１図〜第８図は本発明に係る電鋳型の製造工
程を示す説明図であり、まず本発明は第１図の如
きインストルメンタルパネルパツドあるいはコン
ソールボツクスの表皮体の原型で表面に糸目２を
有する木製のモデル型１を用意する。 FIGS. 1 to 8 are explanatory diagrams showing the manufacturing process of the electroforming mold according to the present invention. First, the present invention uses a prototype of the skin body of an instrument panel pad or a console box as shown in FIG. A wooden model mold 1 having a shape of 2 is prepared.
次いで、上記モデル型１の表面にワツクスを塗
り込むか、又はポリビニルアルコール系の離型剤
をスプレーし、極めて薄い被膜を形成するか、も
しくはレザー貼りを行い、次の工程である液状ゴ
ムがモデル型１の糸目２内に進入しないように処
理する。 かくて、上記工程を終えると前記モデ
ル型１と約５〜20mmの間隔をもつ取り枠３をつく
り、第２図の如くモデル型１と取り枠３との間の
〓間５にシリコンゴムを初めとする液状ゴムを注
入し硬化せしめて適宜の弾性をもつ雌型４を形成
する。 Next, wax is applied to the surface of the model mold 1, or a polyvinyl alcohol-based mold release agent is sprayed to form an extremely thin film, or a laser is pasted. Treat it so that it does not enter into the thread 2 of the mold 1. After completing the above steps, a frame 3 with a distance of about 5 to 20 mm from the model mold 1 is made, and silicone rubber is placed in the gap 5 between the model mold 1 and the frame 3 as shown in Fig. 2. The first liquid rubber is injected and cured to form a female mold 4 having appropriate elasticity.
そしてこの成形を終えると前記雌型４の弾性を
利用してその雌型４をモデル型１から離型する。
この時、雌型４の内面にはモデル型１の表面を反
転したパターンが正確に再現されており、この雌
型４の内面に液状で20〜35℃で20〜60分で硬化可
能なエポキシ系樹脂原料を注入硬化することによ
つて樹脂型６を形成する（第３図参照）
かくして得られた樹脂型６を上記雌型４から脱
型すると、該樹脂型６の表面パターンはモデル型
１の表面と同一のパターンが再現されている。 When this molding is completed, the female mold 4 is released from the model mold 1 by utilizing its elasticity.
At this time, the inner surface of the female mold 4 accurately reproduces the pattern that is the reverse of the surface of the model mold 1, and the inner surface of the female mold 4 is coated with liquid epoxy that can be cured in 20 to 60 minutes at 20 to 35 degrees Celsius. A resin mold 6 is formed by injecting and curing the resin raw material (see Fig. 3). When the resin mold 6 thus obtained is removed from the female mold 4, the surface pattern of the resin mold 6 is shaped like a model mold. The same pattern as on the surface of 1 is reproduced.
そこで、続いて、上記樹脂型６の表面に、例え
ば硝酸銀とアンモニア水をスプレーにて塗布して
銀塩を形成させ、次いでこれを還元液、例えば、
ホルマリン、ブドウ糖の水溶液、ロツシエル塩、
クリオキザール、硝酸ヒドラジン、トリエタノー
るアミン等をスプレーにて塗布して銀鏡反応によ
つて銀層７を析出積層させる。（第４図参照）
この銀鏡反応は下記の如くである。 Then, the surface of the resin mold 6 is sprayed with, for example, silver nitrate and aqueous ammonia to form a silver salt, and then this is mixed with a reducing solution, for example,
Formalin, aqueous glucose solution, Rothsiel's salt,
Cryoxal, hydrazine nitrate, triethanol amine, etc. are applied by spraying, and a silver layer 7 is precipitated and laminated by a silver mirror reaction. (See Figure 4) This silver mirror reaction is as follows.
2AgNO3＋2NH4OH→Ag2O＋2NH4NO3＋H2O
Ag2O＋4NH4OH→2Ag（NH3）2OH＋3H2O
Ag（NH3）2OH＋NH4NO3Ag（NH3）2NO3＋
NH4OH
銀のアンモニア錯塩にはAg（NH3）2OHとAg
（NH3）2NO3の２つが考えれ、これが還元剤と作
用して
AgNH3）2NO3＋Ｈ→Ag＋2NH3＋H2Oとなり、
銀が析出する。2AgNO 3 +2NH 4 OH→Ag 2 O+2NH 4 NO 3 +H 2 O Ag 2 O+4NH 4 OH→2Ag(NH 3 ) 2 OH+3H 2 O Ag(NH 3 ) 2 OH+NH 4 NO 3 Ag(NH 3 ) 2 NO 3 +
NH 4 OH Silver ammonia complex salt contains Ag(NH 3 ) 2 OH and Ag
(NH 3 ) 2 NO 3 can be considered, and this acts with a reducing agent to become AgNH 3 ) 2 NO 3 +H→Ag+2NH 3 +H 2 O,
Silver precipitates.
以上のような銀鏡反応によつて樹脂型６の表面
に析出した銀層７の厚みは約５〜15μとなる。 The thickness of the silver layer 7 deposited on the surface of the resin mold 6 by the silver mirror reaction as described above is approximately 5 to 15 microns.
次いで、同第４図に示す如く樹脂型６表面に析
出した銀層７上面に吸気用小孔のため通気性を必
要とする箇所に該小孔に見合う小孔を形成したマ
スキング材１３、例えば紙テープ、シリンコ製テ
ープを被着して通気性を必要としない、例えば糸
目２のようなステツチ領域ならびにコーナー以外
の部分及び通気性を必要とする上記箇所でも前記
小孔以外の部分をシールし、過硫酸アンモン、シ
アン化カリウム等の５％水溶液等からなる銀腐食
剤１２をその上面に塗布することによりマスキン
グ材１３でシールされていない部分即ち、小孔形
成部位のみに該銀腐食剤１２が浸入して小孔を形
成処理し、上記銀層７を小孔のある状態とする。
（第５図、第６図、第７図参照）なおマスキング
材はその後、剥離する。 Next, as shown in FIG. 4, on the upper surface of the silver layer 7 deposited on the surface of the resin mold 6, a masking material 13, such as a masking material 13, is formed with small holes corresponding to the small holes for air intake at locations where ventilation is required. Paper tape or Silinco tape is applied to seal areas other than the stitch areas and corners that do not require air permeability, such as stitch 2, and the above-mentioned areas that require air permeability, except for the small holes, By applying a silver corrosive agent 12 made of a 5% aqueous solution of ammonium persulfate, potassium cyanide, etc. to the top surface, the silver corrosive agent 12 infiltrates only the portions not sealed with the masking material 13, that is, the small hole formation sites. Then, the silver layer 7 is formed with small holes.
(See FIGS. 5, 6, and 7) The masking material is then peeled off.
そして、更に引き続き上記銀層が小孔形成処理
された樹脂型６をスルフアミン酸ニツケル浴、硫
酸浴あるいは硫酸第１鉄浴等に電流密度0.5〜
8A／ｄm2で厚さ２〜５mmになるまで夫々ニツケ
ル、銅あるいは鉄メツキを行い、電鋳層１０を形
成させる。 Then, the resin mold 6 in which the silver layer has been subjected to the pore formation treatment is placed in a nickel sulfamate bath, a sulfuric acid bath, a ferrous sulfate bath, etc. at a current density of 0.5 to
Nickel, copper or iron plating is performed at 8 A/dm 2 to a thickness of 2 to 5 mm to form an electroformed layer 10.
このとき、上記メツキ液は小孔が形成された銀
層７の該小孔の中に入るが、孔が塞がる前に止め
るか、塞がないようなメツキ液を用いて孔は塞が
らないようにする。 At this time, the plating liquid enters into the small holes of the silver layer 7 in which small holes are formed, but the holes are stopped before they become clogged, or a plating liquid that does not clog the holes is used to prevent the holes from being clogged. do.
そして上記銀層７が腐食して小孔となつた部分
は電気伝導性を遮断されるために電鋳加工しても
前記ニツケル、銅等のメツキ液が析出しなくな
り、電鋳加工し終わつた電鋳層１０は貫通した小
孔９が形成される。（第７図参照）
なお、目的、用途によつて異なるが、この小孔
９は通常、30〜100μφの孔径で、１mm2当り、少な
くとも２個程度形成される。しかし、目的、用途
に応じて必ずしも一定しない。 In the areas where the silver layer 7 has corroded and become small holes, electrical conductivity is cut off, so the plating solution of nickel, copper, etc. does not precipitate even after electroforming, and the electroforming process is completed. Small holes 9 are formed through the electroformed layer 10 . (See FIG. 7) Although it varies depending on the purpose and use, the small holes 9 usually have a diameter of 30 to 100 μΦ and are formed at least 2 per 1 mm 2 . However, it is not necessarily constant depending on the purpose and use.
従つて、銀層の腐食の度合いを充分調節するこ
とが望ましい。 Therefore, it is desirable to sufficiently control the degree of corrosion of the silver layer.
以上の各工程を経て電鋳層１０を得ると、その
後この電鋳層１０をもつ樹脂型６を150〜200℃の
温度で加熱して樹脂型６を溶融排出するか、もし
くはアンダーカツト部を有しないときは溶融排出
せずに脱型して、これにより電鋳皮膜の電鋳型１
１を生成する。 After the electroformed layer 10 is obtained through each of the above steps, the resin mold 6 holding the electroformed layer 10 is heated at a temperature of 150 to 200°C to melt and discharge the resin mold 6, or the undercut portion is removed. If there is no electroformed film, the mold is demolded without being melted and discharged.
Generate 1.
この得られた電鋳型１１は第８図に示すように
電鋳層１０のみとなり、銀層７は樹脂型６を除去
する時、また電鋳型の表面処理時、水洗によりほ
ぼ剥離する。 As shown in FIG. 8, the obtained electroforming mold 11 has only the electroforming layer 10, and the silver layer 7 is almost peeled off by washing with water when removing the resin mold 6 or during surface treatment of the electroforming mold.
なお、真空成形用型は通常型平坦部分を含め全
面に脱気孔を有しているが、本発明は特にコーナ
ー部など従来問題のあつた部分の小孔形成であ
り、平坦部分の脱気用小孔は上記本発明により電
鋳型を得た後、適宜、機械加工により形成しても
よいが、無小孔としても充分成形することが可能
である。勿論、本発明方法によるコーナー部等の
小孔形成と同時に形成することも可能である。 Incidentally, vacuum forming molds usually have degassing holes all over the surface including flat parts, but the present invention is particularly concerned with forming small holes in areas where conventional problems have occurred, such as corners. The small holes may be formed by appropriate machining after obtaining the electroforming mold according to the present invention, but it is also possible to form the mold without small holes. Of course, it is also possible to form the holes simultaneously with the formation of small holes such as corner portions by the method of the present invention.
（発明の効果）
以上のように、本発明の方法は、銀鏡反応で得
られた銀層の腐食領域を自由選定し、しかも腐食
時間などの選択によつて腐食の度合いを調節する
ことを可能とし、それによつて吸気用小孔の存在
する電鋳皮膜をもつ真空成形用型を製造すること
ができると共に、特に真空成形用型として従来、
小孔形成に問題のあつたコーナー部、ステツチ部
などにおける吸気用小孔の形成を容易とし、破損
を来たすことをなくする外、密度を高めることも
容易ならしめ、これにより熱可塑性シート体が充
分に金型内面に密接して正確なパターンを再現す
ることが可能となり、しかも電鋳型の平坦領域を
無小孔部か、もしくは小孔の密度を小さくして型
の強度を高めることもできる特長がある。(Effects of the Invention) As described above, the method of the present invention makes it possible to freely select the corrosion area of the silver layer obtained by the silver mirror reaction and to adjust the degree of corrosion by selecting the corrosion time etc. As a result, it is possible to manufacture a vacuum forming mold having an electroformed film with small air intake holes, and in particular, as a vacuum forming mold,
Not only does it make it easier to form small air intake holes in corner areas and stitched areas where there are problems with forming small holes, it eliminates damage, but it also makes it easier to increase the density of thermoplastic sheets. It is possible to reproduce an accurate pattern by coming into close contact with the inner surface of the mold, and it is also possible to increase the strength of the mold by making the flat area of the electroforming mold porosity-free or by reducing the density of pores. It has its features.
従つて、本発明の方法によれば総合的に従来の
機械的加工手段によりコーナー部、ステツチ部な
どの領域に吸気用小孔を形成していた場合に比べ
て化学的手段を用いているために、電鋳型の破損
の件数が非常に小さくなるのと同時に簡単に吸気
用小孔形成ができる等の効果が期待される。 Therefore, according to the method of the present invention, compared to the case where small intake holes are formed in areas such as corner parts and stitch parts by conventional mechanical processing means, chemical means are used. In addition, it is expected that the number of breakages of the electroforming mold will be greatly reduced, and at the same time, it will be possible to easily form small air intake holes.
第１図乃至第８図は本発明に係る電鋳型の製造
工程を示す図で、第１図はモデル型の断面図、第
２図は雌型の製造工程を示す断面図、第３図は樹
脂型の製造工程を示す断面図、第４図は樹脂型の
表面に銀層を析出させ、マスキング材でシールし
た状態を示す断面図、第５図は銀層の表面に銀腐
食剤を塗布した状態を示す一部平面図、第６図は
第５図Ａ−Ａ線に沿う矢印方向拡大断面図、第７
図は銀層の表面に電鋳層を析出させた状態を示す
第５図のＡ−Ａ断面図に該当する断面図、第８図
は電鋳型の縦断面図である。
１……モデル型、４……雌型、６……樹脂型、
７……銀層、８……所定の領域（通気性を必要と
する個所）、１０……電鋳層、１１……電鋳型、
１２……銀腐食剤。
Figures 1 to 8 are diagrams showing the manufacturing process of the electroforming mold according to the present invention, where Figure 1 is a sectional view of the model mold, Figure 2 is a sectional view showing the manufacturing process of the female mold, and Figure 3 is a sectional view showing the manufacturing process of the female mold. A cross-sectional view showing the manufacturing process of a resin mold. Figure 4 is a cross-sectional view showing a state in which a silver layer is deposited on the surface of a resin mold and sealed with a masking material. Figure 5 is a cross-sectional view showing a state where a silver corrosive agent is applied to the surface of the silver layer. 6 is an enlarged sectional view in the direction of the arrow in FIG.
The figure is a cross-sectional view corresponding to the AA cross-sectional view of FIG. 5 showing the state in which the electroformed layer is deposited on the surface of the silver layer, and FIG. 8 is a longitudinal cross-sectional view of the electroforming mold. 1...Model mold, 4...Female mold, 6...Resin mold,
7... Silver layer, 8... Predetermined area (location requiring breathability), 10... Electroformed layer, 11... Electroformed mold,
12...Silver corrosive.
Claims (1)
成形金型として使用する脱気用小孔をもつ電鋳型
の製造法において、型平坦部分に比し脱気用小孔
形成の困難なコーナー部などの小孔形成を行なう
に際し、モデル型から雌刑を作成し、次いで該型
内に樹脂型を形成した後、上記樹脂型の表面にお
いて銀鏡反応により銀層を析出付着させ、前記コ
ーナー部など所定の領域の脱気用小孔形成部位以
外をシールした後、前記所定の領域に銀腐食剤を
塗布することによつて、該領域の小孔形成部位に
銀腐食剤を浸入させて、銀層に小孔を形成処理
し、しかる後、上記小孔形成処理した銀層を表面
に有する樹脂型を電鋳加工法により上記銀層の表
面に一定厚みの電鋳皮膜を析出させ、その後、前
記電鋳皮膜を樹脂型から分離することを特徴とす
る真空成形用電鋳型の製造法。1. In the manufacturing method of an electroforming mold with small holes for degassing, which is used as a mold for vacuum forming the skin material of automobile interior parts, the corner part where it is difficult to form the small holes for degassing compared to the flat part of the mold. When forming small holes such as, a female mold is created from a model mold, and then a resin mold is formed within the mold, and a silver layer is precipitated and adhered to the surface of the resin mold by a silver mirror reaction. After sealing a predetermined area other than the area where the small holes for degassing are formed, a silver corrosive agent is applied to the predetermined area to allow the silver corrosive to penetrate into the small hole forming area in the area. The layer is treated to form small holes, and then a resin mold having the small hole-formed silver layer on the surface is electroformed to deposit an electroformed film of a certain thickness on the surface of the silver layer, and then, A method for producing an electroforming mold for vacuum forming, comprising separating the electroformed film from a resin mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9407685A JPS61253392A (en) | 1985-04-30 | 1985-04-30 | Manufacture of porous electroforming die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9407685A JPS61253392A (en) | 1985-04-30 | 1985-04-30 | Manufacture of porous electroforming die |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61253392A JPS61253392A (en) | 1986-11-11 |
| JPH0569919B2 true JPH0569919B2 (en) | 1993-10-04 |
Family
ID=14100399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9407685A Granted JPS61253392A (en) | 1985-04-30 | 1985-04-30 | Manufacture of porous electroforming die |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61253392A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6417888A (en) * | 1987-07-13 | 1989-01-20 | Honda Motor Co Ltd | Production of porous electrocast body |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS592114Y2 (en) * | 1979-11-27 | 1984-01-20 | 池上化研工業株式会社 | Mother mold for electroforming |
-
1985
- 1985-04-30 JP JP9407685A patent/JPS61253392A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61253392A (en) | 1986-11-11 |
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