JPH0560552A - Height measuring apparatus - Google Patents
Height measuring apparatusInfo
- Publication number
- JPH0560552A JPH0560552A JP22589691A JP22589691A JPH0560552A JP H0560552 A JPH0560552 A JP H0560552A JP 22589691 A JP22589691 A JP 22589691A JP 22589691 A JP22589691 A JP 22589691A JP H0560552 A JPH0560552 A JP H0560552A
- Authority
- JP
- Japan
- Prior art keywords
- measured
- slit light
- image pickup
- height
- moving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Measurement Of Optical Distance (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は非接触で物体の高さを測
定する高さ測定装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a height measuring device for contactlessly measuring the height of an object.
【０００２】[0002]
【従来の技術】近年、接触式の高さ測定装置に代わり測
定に要する時間が短い点や取り扱い易さの点から光切断
法などを用いた非接触式の高さ測定装置が提案されてい
る。例えば、Ｏ ｐｌｕｓ Ｅ、Ｎｏ１２６「産業応用
における三次元物体の認識」（秦清治）記載の構成が知
られている。2. Description of the Related Art In recent years, a non-contact type height measuring device using an optical cutting method or the like has been proposed in place of a contact type height measuring device in view of short time required for measurement and easy handling. .. For example, a configuration described in O plus E, No126 “Recognition of three-dimensional object in industrial application” (Seiji Hata) is known.
【０００３】以下、従来の光切断法を用いた非接触式の
高さ測定装置について説明する。図５は従来の光切断法
による高さ測定装置例の構成を示すものである。図５に
おいて、５０１は被測定物を所定の位置に固定する被測
定物固定台、５０２は被測定物、５０３はスリット光を
発生させるスリット光源、５０４はスリット光、５０５
はスリット光を一次元的に移動させるスリット光移動手
段、５０６は被測定物からのスリット光の散乱光を撮像
する撮像装置、５０７は前記撮像装置からの輝度信号を
デジタル化した画像信号に変換するＡ／Ｄ変換器、５０
８は画像信号を一時的に記憶する画像メモリ、５０９は
画像信号よスリット散乱光の中心位置を計算するスリッ
ト散乱光中心位置検出手段、５１０はスリット散乱光中
心位置より被測定物の高さを計算する位置演算回路、５
１１は全体系を制御する装置制御手段、５１２は本装置
で得られる高さデータである。A non-contact type height measuring device using a conventional light cutting method will be described below. FIG. 5 shows a configuration of an example of a conventional height measuring device by a light cutting method. In FIG. 5, 501 is an object fixing base for fixing the object to be measured at a predetermined position, 502 is the object to be measured, 503 is a slit light source for generating slit light, 504 is slit light, and 505.
Is a slit light moving means for moving the slit light one-dimensionally, 506 is an image pickup device for picking up the scattered light of the slit light from the object to be measured, and 507 is a conversion of the luminance signal from the image pickup device into a digitized image signal. A / D converter, 50
8 is an image memory for temporarily storing an image signal, 509 is a slit scattered light center position detecting means for calculating the center position of slit scattered light from the image signal, and 510 is the height of the object to be measured from the slit scattered light center position. Position calculation circuit for calculation, 5
Reference numeral 11 is a device control means for controlling the entire system, and 512 is height data obtained by this device.
【０００４】以上のように構成された高さ測定装置につ
いて、以下その動作について説明する。まず、スリット
光源５０３からのスリット光５０４が被測定物固定台５
０１上に固定された被測定物５０２の上部に照射され
る。スリット光５０４はスリット光移動手段５０５によ
り被測定物５０２上を一定のピッチで移動する。撮像装
置５０６は被測定物５０２からのスリット散乱光をスリ
ット光の移動に同期して撮像する。この場合、撮像され
た撮像装置５０６上のスリット散乱光の像は被測定物５
０２の表面形状に応じたスリット散乱光の凹凸を示して
いる。Ａ／Ｄ変換器５０７は撮像装置５０６の信号をデ
ジタル信号に変換し、この信号は画像メモリ５０８に画
像信号として一時的に記憶される。スリット散乱光中心
位置検出手段５０９は前記画像信号より撮像装置の水平
走査ライン毎にスリット散乱光の輝度の中心点を求め測
定点の像と見なし、位置演算回路５１０において基線長
（スリット光源から撮像装置までの距離）と、切断角
（スリット光と撮像装置の光軸のなす角）と、撮像装置
の光軸と測定点のなす角とを用いて三角測量法の原理に
より測定点の奥行き情報を演算し、この奥行き情報より
被測定物の高さを計算する。装置制御手段５１１により
スリット光の移動と上記演算を同期させて繰り返し制御
することで被測定物における測定すべき複数領域全ての
高さデータ５１２を取得できる仕組みとなっている。The operation of the height measuring device constructed as above will be described below. First, the slit light 504 from the slit light source 503 is used as the object fixing base 5
The object to be measured 502 fixed on 01 is irradiated onto the upper part. The slit light 504 is moved by a slit light moving means 505 on the DUT 502 at a constant pitch. The imaging device 506 images the slit scattered light from the DUT 502 in synchronization with the movement of the slit light. In this case, the captured image of the slit scattered light on the image pickup device 506 is the object to be measured 5.
The unevenness of the slit scattered light according to the surface shape of No. 02 is shown. The A / D converter 507 converts the signal from the image pickup device 506 into a digital signal, and this signal is temporarily stored in the image memory 508 as an image signal. The slit scattered light center position detecting means 509 obtains the center point of the luminance of the slit scattered light for each horizontal scanning line of the image pickup device from the image signal and regards it as an image of the measurement point, and the position calculation circuit 510 takes the baseline length (image pickup from slit light source Depth information of the measurement point by the principle of triangulation using the distance to the device), the cutting angle (the angle between the slit light and the optical axis of the imaging device), and the angle between the optical axis of the imaging device and the measurement point. Is calculated, and the height of the object to be measured is calculated from this depth information. The device control means 511 synchronizes the movement of the slit light with the above calculation and repeatedly controls the height data 512 of all the plurality of regions to be measured in the measured object.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら上記の従
来の構成では、撮像装置の横方向の視野は被測定物の横
方向データ値と奥行き方向データ値の両方を反映してお
り、被測定物の横方向データ値は撮像装置の撮像面にそ
のまま反映するが、奥行き方向データ値は本来のデータ
値に切断角の正接を掛けた大きさで撮像装置の視野に反
映するため、奥行き方向の測定値を反映する撮像装置の
撮像面の画素数が少なくなってしまい、高さの分解能が
悪いという問題点があった。特に被測定物に於ける被測
定面の二次元的広がりが大きい場合にはこの問題点が顕
著に現れる。又、装置の小型化や死角の軽減の為に切断
角を極力小さくすることを要求されるが、切断角を小さ
くするほど高さ方向の測定精度が悪化するという課題を
有していた。この課題に対し、被測定物における測定す
べき複数領域を予め抽出し、それぞれの領域を分割して
測定する方法が考えられる。この方法では被測定物をそ
の都度移動させて撮像装置の視野とスリット光を各領域
に合わせることになるが、被測定物の重量が重く移動で
きない場合や、移動させると被測定物の形状が変化して
しまう場合には適用できないという課題があった。However, in the above-mentioned conventional configuration, the lateral visual field of the imaging device reflects both the lateral data value and the depth data value of the object to be measured, and the object to be measured is reflected. The horizontal data value is reflected as it is on the imaging surface of the imaging device, but the depth data value is reflected in the visual field of the imaging device by multiplying the original data value by the tangent of the cutting angle. However, the number of pixels on the image pickup surface of the image pickup apparatus that reflects is reduced, and the height resolution is poor. In particular, when the two-dimensional spread of the surface to be measured in the object to be measured is large, this problem becomes remarkable. In addition, it is required to make the cutting angle as small as possible in order to downsize the device and reduce the blind spot, but there is a problem that the measurement accuracy in the height direction deteriorates as the cutting angle becomes smaller. To solve this problem, a method may be considered in which a plurality of regions to be measured in the object to be measured are extracted in advance and the regions are divided and measured. In this method, the object to be measured is moved each time and the field of view of the imaging device and the slit light are adjusted to each region, but if the weight of the object to be measured cannot be moved or the shape of the object to be measured is moved. There is a problem that it cannot be applied when it changes.
【０００６】本発明は上記従来技術の課題を解決するも
ので、被測定物を移動させることなく高さ測定を精度良
くかつ高速に行うことができる高さ測定装置を提供する
ことを目的とする。The present invention solves the above-mentioned problems of the prior art, and an object of the present invention is to provide a height measuring device capable of performing height measurement accurately and at high speed without moving the object to be measured. ..
【０００７】[0007]
【課題を解決するための手段】この目的を達成するため
に本発明は、被測定物を所定の位置に固定する被測定物
固定手段と、被測定物に於ける測定すべき複数領域の位
置情報を予め格納している測定領域記憶手段と、スリッ
ト光を発生させるスリット光源と、スリット光を二次元
的に移動させるスリット光移動手段と、被測定物からの
スリット光の散乱光を撮像する幅の細い非分割型の１次
元位置検出センサをその幅方向に複数個配列して構成し
た撮像面を有する撮像手段と、前記撮像手段の視野を二
次元的に移動させる視野移動手段と、前記スリット光移
動手段と視野移動手段を制御することによりスリット光
と前記撮像手段の視野を前記測定領域記憶手段に格納さ
れている測定領域の位置に移動させる制御手段と、前記
撮像手段からの信号をデジタル化した位置信号に変換す
る位置演算手段と、前記位置信号より前記被測定物の高
さを計算する高さ演算手段と、全体系を制御する装置制
御手段から構成されている。In order to achieve this object, the present invention provides an object fixing means for fixing an object to be measured at a predetermined position, and positions of a plurality of regions to be measured on the object to be measured. Measurement area storage means for storing information in advance, slit light source for generating slit light, slit light moving means for two-dimensionally moving slit light, and scattered light of slit light from the object to be measured are imaged. An image pickup means having an image pickup surface formed by arranging a plurality of non-divided one-dimensional position detection sensors each having a narrow width; a visual field moving means for moving the visual field of the image pickup means two-dimensionally; The slit light moving means and the visual field moving means are controlled to move the slit light and the visual field of the image pickup means to a position of the measurement area stored in the measurement area storage means, and a signal from the image pickup means. A position computing means for converting the digitized position signals, the height calculation means for calculating the height of the object to be measured from the position signal, and a device control means for controlling the entire system.
【０００８】[0008]
【作用】本発明は上記構成によって、被測定物の測定す
べき複数領域を予め分割抽出しておき、それぞれの領域
に撮像装置の視野を合わせて測定することにより、従来
より狭い撮像領域を従来と同じ大きさの撮像面で撮像す
るため分解能が良くなり、さらに一次元位置検出センサ
を複数配列して撮像装置の撮像面を構成することにより
高速に被測定物からのスリット光の散乱光を撮像するこ
とができる。従って本装置の目的である奥行き方向測定
値を反映する撮像面が従来より大きくなり、被測定物を
移動させることなく高さデータを精度良くかつ高速に取
得することができる。According to the present invention, a plurality of regions to be measured of the object to be measured are divided and extracted in advance and the field of view of the image pickup device is adjusted to the respective regions to measure an image pickup region narrower than the conventional one. Since the image is picked up by an image pickup surface of the same size as the image pickup surface, the resolution is improved, and by arranging multiple one-dimensional position detection sensors to form the image pickup surface of the image pickup device, the scattered light of the slit light from the object to be measured can be detected at high speed. It can be imaged. Therefore, the image pickup surface reflecting the depth direction measurement value, which is the purpose of the present device, becomes larger than before, and height data can be acquired accurately and at high speed without moving the object to be measured.
【０００９】[0009]
【実施例】以下、本発明の一実施例について、図面を参
照しながら説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
【００１０】図１は本発明の一実施例における高さ測定
装置のブロック結線図である。図１において、１０１は
被測定物を所定の位置に固定する被測定物固定台、１０
２は被測定物である。１０３は被測定物に於ける測定す
べき複数領域の位置情報を予め格納している測定領域記
憶手段で、各測定領域は撮像装置の視野に応じた一定面
積を持つ長方形領域である。１０４はスリット光を発生
させるスリット光源、１０５はスリット光であり、スリ
ット光の長さは分割された各測定領域の１辺に相当する
長さを持つ。１０６はスリット光を二次元的に移動させ
るスリット光移動手段、１０７は被測定物からのスリッ
ト光の散乱光を撮像する撮像装置である。１０８は撮像
装置の視野を二次元状に移動させる視野移動手段、１０
９はスリット光移動手段１０６と視野移動手段１０８を
制御することによりスリット光と撮像装置１０７の視野
を測定領域記憶手段１０３に格納されている測定領域の
位置に移動させる測定領域制御手段、１１１は撮像装置
１０７からの信号をデジタル化した位置信号に変換する
位置演算回路、１１２は位置信号を一時的に記憶するメ
モリ、１１３は位置信号より三角測量の原理を用いて被
測定物の高さを計算する位置演算回路、１１４は全体系
を制御する装置制御手段、１１５は測定された高さデー
タである。FIG. 1 is a block connection diagram of a height measuring apparatus according to an embodiment of the present invention. In FIG. 1, 101 is an object fixing base for fixing the object to be measured at a predetermined position, 10
2 is an object to be measured. Reference numeral 103 denotes a measurement area storage unit that stores in advance positional information of a plurality of areas in the object to be measured, and each measurement area is a rectangular area having a constant area corresponding to the visual field of the image pickup device. Reference numeral 104 is a slit light source for generating slit light, 105 is slit light, and the length of the slit light has a length corresponding to one side of each divided measurement region. Reference numeral 106 is a slit light moving means for moving the slit light two-dimensionally, and 107 is an image pickup device for picking up the scattered light of the slit light from the object to be measured. Reference numeral 108 denotes a visual field moving means for moving the visual field of the image pickup apparatus two-dimensionally.
Reference numeral 9 denotes a measurement area control means for moving the slit light and the visual field of the imaging device 107 to the position of the measurement area stored in the measurement area storage means 103 by controlling the slit light moving means 106 and the visual field moving means 108. A position calculation circuit that converts the signal from the image pickup device 107 into a digitized position signal, 112 is a memory that temporarily stores the position signal, and 113 is the height of the object to be measured from the position signal using the principle of triangulation. A position calculation circuit for calculation, 114 is a device control means for controlling the entire system, and 115 is measured height data.
【００１１】図２は図１の高さ測定装置の要部であるス
リット光移動手段１０６の詳細を示す斜視図である。２
枚のミラー２ａ，２ｂより構成され、ミラー２ａはスリ
ット光走査方向に対して垂直な方向に振ることができ、
ミラー２ｂはスリット光走査方向に平行に振ることが出
来る。スリット光はこれらの２枚のミラーに反射するこ
とで被測定物上の所定の位置を照射し、その照射位置は
２枚のミラーの角度を変化させることで移動できる。FIG. 2 is a perspective view showing the details of the slit light moving means 106 which is a main part of the height measuring apparatus of FIG. Two
It is composed of a plurality of mirrors 2a and 2b, and the mirror 2a can be swung in a direction perpendicular to the slit light scanning direction,
The mirror 2b can be swung parallel to the slit light scanning direction. The slit light is reflected by these two mirrors to irradiate a predetermined position on the object to be measured, and the irradiation position can be moved by changing the angles of the two mirrors.
【００１２】図３は図１の高さ測定装置の要部である視
野移動手段１０８の詳細を示す斜視図である。２枚のミ
ラー３ａ，３ｂより構成され、各ミラーは互いに垂直な
方向に振ることができる。撮像装置１０７の撮像面には
これらの２枚のミラーに反射された被測定物上の所定の
位置が撮像され、その撮像位置は２枚のミラーの角度を
変化させることで移動できる。FIG. 3 is a perspective view showing details of the visual field moving means 108 which is a main part of the height measuring apparatus of FIG. It is composed of two mirrors 3a and 3b, and each mirror can swing in directions perpendicular to each other. A predetermined position on the object to be measured reflected by these two mirrors is imaged on the imaging surface of the imaging device 107, and the imaging position can be moved by changing the angle of the two mirrors.
【００１３】図４は、撮像装置１０７の撮像面の構成図
である。非分割型の一次元位置検出センサ４０１を幅方
向に１２８個配列して撮像面を構成している。本実施例
では、非分割型の一次元位置検出センサ４０１にＰＳＤ
［ポジション−センシティブ−ディテクタ（Position S
ensitive Detectors: 半導***置検出素子）］を用いて
おり、ＰＳＤに入射する被測定物からのスリット光の散
乱光の入射位置は、素子の両端電極４０２及び４０３に
流れる電流が各電極間との距離に反比例するものを用い
ている。位置演算回路１１１では、両電極からの電流Ｉ
１およびＩ２を第（１）式を用いて位置データを演算す
る。なお、Ｋは正規化するための係数である。FIG. 4 is a block diagram of the image pickup surface of the image pickup device 107. 128 non-divided one-dimensional position detection sensors 401 are arranged in the width direction to form an imaging surface. In this embodiment, the PSD is applied to the non-division type one-dimensional position detection sensor 401.
[Position-Sensitive-Detector (Position S
[Sensitive Detectors: semiconductor position detectors]] is used, and the incident position of the scattered light of the slit light from the DUT that is incident on the PSD is the distance between the electrodes at which the currents flowing through the electrodes 402 and 403 are between the electrodes. It is inversely proportional to. In the position calculation circuit 111, the current I from both electrodes is
The position data of 1 and I2 is calculated using the equation (1). Note that K is a coefficient for normalization.
【００１４】 位置データ＝Ｋ・（Ｉ１−Ｉ２）／（Ｉ１＋Ｉ２） ------（１） 位置演算回路１１１で得られた位置データは、デジタル
位置信号として一旦メモリ１１２に格納される。Position data = K · (I1-I2) / (I1 + I2) ------ (1) The position data obtained by the position calculation circuit 111 is temporarily stored in the memory 112 as a digital position signal.
【００１５】撮像装置１０７の撮像面をこのような構成
にすることにより、従来のＣＣＤカメラによる撮像方式
に比べより高速にスリット光の散乱光を撮像することが
できる。即ち、従来のＣＣＤカメラによる撮像方式で
は、１画面（垂直走査４８０ライン）を撮像するのに３
３ms必要であり、１点の撮像時間に換算すると約６０μ
ｓとなる。これに対し、本実施例によれば各ラインでの
一次元位置検出センサの応答速度は約１０μｓであり、
センサそれぞれに対応した演算回路を設けることにより
従来方式より約６倍の高速計測が実現できる。By configuring the image pickup surface of the image pickup device 107 in this way, the scattered light of the slit light can be picked up at a higher speed than in the image pickup method using the conventional CCD camera. That is, according to the conventional image pickup method using the CCD camera, it is necessary to take three images to image one screen (vertical scanning 480 lines).
3ms is required, and when converted to the imaging time of one point, it is about 60μ
s. On the other hand, according to this embodiment, the response speed of the one-dimensional position detection sensor on each line is about 10 μs,
By providing an arithmetic circuit corresponding to each sensor, high-speed measurement about 6 times faster than the conventional method can be realized.
【００１６】以上のように構成された高さ測定装置につ
いて、図１に示す分割された各測定領域の測定例を用い
て以下その動作を説明する。なお、図１において、１１
６は測定領域記憶手段１０３に記憶されている第一の測
定領域である。The operation of the height measuring device configured as described above will be described below with reference to the measurement example of each divided measurement region shown in FIG. In addition, in FIG.
Reference numeral 6 is a first measurement area stored in the measurement area storage means 103.
【００１７】まず、被測定物１０２を被測定物固定台１
０１上に固定する。測定領域制御手段１０９は測定領域
記憶手段１０３に記憶されている第１の測定領域１１６
の位置を受取り、前記位置情報に基づき視野移動手段１
０８に於ける２枚のミラー３ａ，３ｂの角度を制御して
撮像装置１０７の視野を指定された測定領域１１６に合
わせ、さらにスリット光移動手段１０６に於ける２枚の
ミラー２ａ，２ｂの角度を制御してスリット光１０５を
指定された測定領域１１６の一辺に合わせる。First, the measured object 102 is fixed to the measured object fixing base 1
Fixed on 01. The measurement area control unit 109 uses the first measurement area 116 stored in the measurement area storage unit 103.
The position of the visual field moving means 1 is received based on the position information.
08, the angles of the two mirrors 3a and 3b are controlled to adjust the field of view of the image pickup device 107 to the designated measurement region 116, and the angles of the two mirrors 2a and 2b in the slit light moving means 106. Is controlled to align the slit light 105 with one side of the designated measurement region 116.
【００１８】更にスリット光１０５はスリット光移動手
段１０６に於けるミラー２ａを一定角度で移動させるこ
とにより現在撮像装置の視野に入っている指定された測
定領域上を移動する。撮像装置１０７は被測定物１０２
からのスリット散乱光をスリット光１０５の移動に同期
して撮像する。この場合、撮像された撮像装置１０７上
のスリット散乱光の像は被測定物１０２の表面形状に応
じたスリット散乱光の凹凸を示している。位置演算回路
１１１は撮像装置１０７からの信号をデジタル位置信号
に変換し、この位置信号は撮蔵されたスリット散乱光中
心位置信号としてメモリ１１２に一時的に記憶される。
この位置信号を用いて位置演算回路１１３において基線
長（スリット光源から撮像装置までの距離）と、切断角
（スリット光と撮像装置の光軸のなす角）と、撮像装置
の光軸と測定点のなす角とを用いて三角測量法の原理に
より測定点の奥行き情報を演算し、この奥行き情報より
測定物の高さを計算する。装置制御手段１１４によりス
リット光の移動と上記演算を同期させて繰り返し制御す
ることで被測定物における指定された測定領域全ての高
さデータ１１５を取得できる仕組みとなっている。Further, the slit light 105 moves on the designated measurement area currently in the visual field of the image pickup device by moving the mirror 2a in the slit light moving means 106 at a constant angle. The imaging device 107 is the device under test 102.
The slit scattered light from is imaged in synchronization with the movement of the slit light 105. In this case, the image of the slit scattered light on the image pickup device 107 that has been imaged shows the unevenness of the slit scattered light according to the surface shape of the DUT 102. The position calculation circuit 111 converts the signal from the image pickup device 107 into a digital position signal, and this position signal is temporarily stored in the memory 112 as a captured slit scattered light center position signal.
Using this position signal, the base line length (distance from the slit light source to the image pickup device), the cutting angle (angle between the slit light and the optical axis of the image pickup device), the optical axis of the image pickup device, and the measurement point in the position calculation circuit 113. The depth information of the measurement point is calculated by the principle of the triangulation method using the angle formed by and the height of the measurement object is calculated from this depth information. The device control unit 114 has a mechanism in which the height data 115 of all the designated measurement regions of the object to be measured can be acquired by repeatedly controlling the movement of the slit light and the above-described calculation in synchronization with each other.
【００１９】次に、測定領域記憶手段１０３より第２の
測定領域の位置情報が測定領域制御手段１０９に渡され
る。以上の動作を装置制御手段１１４により測定領域記
憶手段１０３に記憶されている領域全てに繰り返し行う
ことにより被測定物１０２の全ての測定すべき複数領域
を測定することができる。又、測定時間を短縮するため
演算と測定は並列に行うこととする。Next, the position information of the second measurement area is passed from the measurement area storage means 103 to the measurement area control means 109. By repeating the above operation by the device control means 114 for all the areas stored in the measurement area storage means 103, it is possible to measure all the plurality of areas to be measured of the measured object 102. Moreover, in order to shorten the measurement time, the calculation and the measurement are performed in parallel.
【００２０】本実施例による高さ測定装置の特性と従来
の高さ測定装置の特性を比較する。例えば、被対象物の
大きさが１００ｍｍ（ｘ）×１００ｍｍ（ｙ）×２０ｍ
ｍ（ｚ，奥行き）、撮像装置として５００×４８０画素
のＣＣＤカメラを使用し、切断角を３０度とした場合、
従来の測定装置ではカメラの水平画素５００画素に対し
奥行き方向を反映する画素数が５１画素となり、この画
素数で奥行き２０ｍｍを測定するため高さ測定精度は約
０．３９ｍｍとなる。一方、本実施例による高さ測定装
置で被測定物における複数の分割測定領域としてそれぞ
れ約１０ｍｍ×約１０ｍｍの範囲を撮像した場合、奥行
き方向の分解能は約１／２６７で、高さ測定精度は約
０．０８ｍｍとなり、従来装置より高さ測定精度を約５
倍向上することができる。数値から明らかなように、本
実施例による高さ測定装置は、高さ測定精度向上の点で
優れた効果が得られる。The characteristics of the height measuring apparatus according to this embodiment and the characteristics of the conventional height measuring apparatus will be compared. For example, the size of the object is 100 mm (x) x 100 mm (y) x 20 m
m (z, depth), when a CCD camera of 500 × 480 pixels is used as an imaging device and the cutting angle is 30 degrees,
In the conventional measuring device, the number of pixels reflecting the depth direction is 51 pixels with respect to 500 horizontal pixels of the camera, and since the depth of 20 mm is measured with this number of pixels, the height measurement accuracy is about 0.39 mm. On the other hand, when the height measuring apparatus according to the present embodiment images a range of about 10 mm × about 10 mm as a plurality of divided measurement areas in the measured object, the resolution in the depth direction is about 1/267, and the height measurement accuracy is Approximately 0.08 mm, height measurement accuracy of about 5 compared to conventional equipment
Can be doubled. As is clear from the numerical values, the height measuring device according to the present embodiment has an excellent effect in improving the height measuring accuracy.
【００２１】以上のように本実施例によれば、被測定物
１０２を所定の位置に固定する被測定物固定台１０１
と、被測定物１０２に於ける測定すべき複数領域の位置
情報を予め格納している測定領域記憶手段１０３と、ス
リット光源１０４と、スリット光を二次元的に移動させ
るスリット光移動手段１０６と、被測定物１０２からの
スリット光の散乱光を撮像する幅の細い非分割型の１次
元位置検出センサをその幅方向に複数個配列して構成し
た撮像面を有する撮像装置１０７と、撮像装置１０７の
視野を二次元的に移動させる視野移動手段１０８と、ス
リット光移動手段１０６と視野移動手段１０８を制御す
ることによりスリット光と撮像装置１０７の視野を測定
領域記憶手段１０３に格納されている測定領域の位置に
移動させる装置制御手段１１４と、撮像装置１０７から
の信号をデジタル化した位置信号に変換する位置演算回
路１１１と、位置信号より被測定物１０２の高さを計算
する高さ演算回路１１３とを設けて、被測定物１０２の
測定すべき複数領域を分割して測定することにより、奥
行き方向の分解能が従来より高くなり、さらに一次元位
置検出センサを複数配列して撮像装置１０７の撮像面を
構成することにより高速に被測定物１０２からのスリッ
ト光の散乱光を撮像することができ、被測定物１０２を
移動させることなく高さデータを精度良くかつ高速に取
得することができる。As described above, according to this embodiment, the object fixing base 101 for fixing the object 102 to be measured at a predetermined position.
A measuring area storage means 103 for storing in advance positional information of a plurality of areas in the object to be measured 102, a slit light source 104, and a slit light moving means 106 for two-dimensionally moving slit light. An imaging device 107 having an imaging surface configured by arranging a plurality of narrow non-division type one-dimensional position detection sensors for imaging the scattered light of the slit light from the object to be measured 102, and an imaging device. The slit light and the visual field of the imaging device 107 are stored in the measurement area storage unit 103 by controlling the visual field moving means 108 for moving the visual field of the two-dimensionally 107 and the slit light moving means 106 and the visual field moving means 108. Device control means 114 for moving to the position of the measurement region, position calculation circuit 111 for converting the signal from the image pickup device 107 into a digitized position signal, and position By providing a height calculation circuit 113 for calculating the height of the DUT 102 from the signal, and dividing and measuring a plurality of regions to be measured of the DUT 102, the resolution in the depth direction becomes higher than before. Further, by arranging a plurality of one-dimensional position detection sensors to form the image pickup surface of the image pickup device 107, the scattered light of the slit light from the object to be measured 102 can be imaged at high speed, and the object to be measured 102 is moved. The height data can be acquired accurately and at high speed.
【００２２】[0022]
【発明の効果】以上のように本発明は、被測定物を所定
の位置に固定する被測定物固定手段と、被測定物に於け
る測定すべき複数領域の位置情報を予め格納している測
定領域記憶手段と、スリット光源と、スリット光を二次
元的に移動させるスリット光移動手段と、幅の細い非分
割型の１次元位置検出センサをその幅方向に複数個配列
して構成した撮像面を有し、被測定物からのスリット光
の散乱光を撮像する撮像手段と、撮像手段の視野を二次
元的に移動させる視野移動手段と、スリット光移動手段
と視野移動手段を制御することによりスリット光と撮像
手段の視野を測定領域記憶手段に格納されている測定領
域の位置に移動させる制御手段と、撮像手段からの信号
をデジタル化した位置信号に変換する位置演算手段と、
位置信号より被測定物の高さを計算する高さ演算手段
と、全体系を制御する装置制御手段とを設けて、被測定
物の測定すべき複数領域を分割して測定することにより
奥行き方向の分解能が従来より高くなり、さらに一次元
位置検出センサを複数配列して撮像装置の撮像面を構成
することにより高速に被測定物からのスリット光の散乱
光を撮像することができ、被測定物を移動させることな
く高さデータを精度良くかつ高速に取得することができ
る優れた高さ測定装置を実現できるものである。As described above, according to the present invention, the object-to-be-measured fixing means for fixing the object-to-be-measured at a predetermined position and the position information of a plurality of regions in the object-to-be-measured to be measured are stored in advance. Imaging by arranging a plurality of measurement area storage means, a slit light source, a slit light moving means for moving the slit light two-dimensionally, and a narrow non-division type one-dimensional position detection sensor in the width direction. An image pickup unit having a surface for picking up scattered light of slit light from an object to be measured, a visual field moving unit for two-dimensionally moving the visual field of the image pickup unit, and controlling the slit light moving unit and the visual field moving unit. Control means for moving the slit light and the visual field of the image pickup means to the position of the measurement area stored in the measurement area storage means, and position calculation means for converting the signal from the image pickup means into a digitized position signal,
A height calculation means for calculating the height of the object to be measured from the position signal and a device control means for controlling the entire system are provided, and a plurality of regions to be measured of the object to be measured are divided and measured to determine the depth direction. Of the slit light scattered from the object to be measured at high speed by arranging a plurality of one-dimensional position detection sensors to form the imaging surface of the imaging device. It is possible to realize an excellent height measuring device that can accurately and quickly obtain height data without moving an object.
【図１】本発明の一実施例における高さ測定装置のブロ
ック結線図FIG. 1 is a block connection diagram of a height measuring device according to an embodiment of the present invention.
【図２】同実施例における高さ測定装置の要部であるス
リット光移動手段の詳細斜視図FIG. 2 is a detailed perspective view of slit light moving means which is a main part of the height measuring device in the embodiment.
【図３】同実施例における高さ測定装置の要部である視
野移動手段の詳細斜視図FIG. 3 is a detailed perspective view of a visual field moving means that is a main part of the height measuring device in the embodiment.
【図４】同実施例における高さ測定装置の要部である撮
像装置の撮像面の平面図FIG. 4 is a plan view of an image pickup surface of an image pickup apparatus which is a main part of the height measuring apparatus in the embodiment.
【図５】従来の高さ測定装置のブロック結線図FIG. 5 is a block connection diagram of a conventional height measuring device.
１０１ 被測定物固定台 １０２ 被測定物 １０３ 測定領域記憶手段 １０４ スリット光源 １０５ スリット光 １０６ スリット光移動手段 １０７ 撮像装置 １０８ 視野移動手段 １０９ 測定領域制御手段 １１１ 位置演算回路 １１２ 画像メモリ １１３ 高さ演算回路 １１４ 装置制御手段 １１５ 高さデータ １１６ 第１の測定領域 101 Measured Object Fixing Base 102 Measured Object 103 Measuring Area Storage Means 104 Slit Light Source 105 Slit Light 106 Slit Light Moving Means 107 Imaging Device 108 Field of View Moving Means 109 Measuring Area Control Means 111 Position Calculation Circuit 112 Image Memory 113 Height Calculation Circuit 114 Device Control Means 115 Height Data 116 First Measurement Area
───────────────────────────────────────────────────── フロントページの続き (72)発明者 三宮 邦夫 神奈川県川崎市多摩区東三田３丁目10番１ 号 松下技研株式会社内 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Kunio Sannomiya 3-10-10 Higashisanda, Tama-ku, Kawasaki City, Kanagawa Prefecture Matsushita Giken Co., Ltd.
Claims (1)
物固定手段と、被測定物に於ける測定すべき複数領域の
位置情報を予め格納している測定領域記憶手段と、スリ
ット光を発生させるスリット光源と、スリット光を二次
元的に移動させるスリット光移動手段と、被測定物から
のスリット光の散乱光を撮像する幅の細い非分割型の１
次元位置検出センサをその幅方向に複数個配列して構成
した撮像面を有する撮像手段と、前記撮像手段の視野を
二次元的に移動させる視野移動手段と、前記スリット光
移動手段と視野移動手段を制御することによりスリット
光と前記撮像手段の視野を前記測定領域記憶手段に格納
されている測定領域の位置に移動させる制御手段と、前
記撮像手段からの信号をデジタル化した位置信号に変換
する位置演算手段と、前記位置信号より前記被測定物の
高さを計算する高さ演算手段と、全体系を制御する装置
制御手段を具備することを特徴とする高さ測定装置。1. An object fixing means for fixing an object to be measured at a predetermined position, a measuring area storing means for storing position information of a plurality of areas to be measured in the object in advance, and a slit light. A slit light source for generating a slit light, a slit light moving means for moving the slit light two-dimensionally, and a thin non-division type 1 for imaging scattered light of the slit light from the object to be measured.
Image pickup means having an image pickup surface configured by arranging a plurality of dimensional position detection sensors in the width direction thereof, visual field moving means for two-dimensionally moving the visual field of the image pickup means, slit light moving means and visual field moving means. Control means for moving the slit light and the field of view of the image pickup means to the position of the measurement area stored in the measurement area storage means, and converting the signal from the image pickup means into a digitized position signal. A height measuring device comprising: position calculating means, height calculating means for calculating the height of the object to be measured from the position signal, and device control means for controlling the entire system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22589691A JPH0560552A (en) | 1991-09-05 | 1991-09-05 | Height measuring apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22589691A JPH0560552A (en) | 1991-09-05 | 1991-09-05 | Height measuring apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0560552A true JPH0560552A (en) | 1993-03-09 |
Family
ID=16836582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22589691A Pending JPH0560552A (en) | 1991-09-05 | 1991-09-05 | Height measuring apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0560552A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012176262A1 (en) * | 2011-06-20 | 2012-12-27 | 株式会社安川電機 | Three-dimensional shape measuring device and robot system |
-
1991
- 1991-09-05 JP JP22589691A patent/JPH0560552A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012176262A1 (en) * | 2011-06-20 | 2012-12-27 | 株式会社安川電機 | Three-dimensional shape measuring device and robot system |
| JPWO2012176262A1 (en) * | 2011-06-20 | 2015-02-23 | 株式会社安川電機 | Three-dimensional shape measuring apparatus and robot system |
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