JPH0557623A - Abrasive cloth - Google Patents
Abrasive clothInfo
- Publication number
- JPH0557623A JPH0557623A JP21777891A JP21777891A JPH0557623A JP H0557623 A JPH0557623 A JP H0557623A JP 21777891 A JP21777891 A JP 21777891A JP 21777891 A JP21777891 A JP 21777891A JP H0557623 A JPH0557623 A JP H0557623A
- Authority
- JP
- Japan
- Prior art keywords
- base layer
- hardness
- layer
- polishing
- polished
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明はアルミニウム（その合
金を含む）磁気ディスク基板、半導体用ウェハー、光学
部品レンズ、ウェハー用マスク、金属サンプル等の研磨
加工に用いられる研磨布に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing cloth used for polishing aluminum (including alloys thereof) magnetic disk substrates, semiconductor wafers, optical component lenses, wafer masks, metal samples and the like.
【０００２】[0002]
【従来の技術】上記のような被研磨加工品の研磨加工
は、例えば次のようにして行われる。即ち、水平式の両
面研磨機の上下定盤に研磨布を接着した研磨機を用い、
上下定盤を一定圧にて加圧して研磨布と被研磨加工品と
を圧接する。そして、遊離砥粒を供給したのち、上下定
盤及び被研磨加工品に回転運動を与え、研磨布と被研磨
加工品とを摺動させることにより被研磨加工品の表面を
研磨している。2. Description of the Related Art The above-described polishing process for a product to be polished is performed, for example, as follows. That is, using a polishing machine in which a polishing cloth is adhered to the upper and lower surface plates of a horizontal double-sided polishing machine,
The upper and lower surface plates are pressed with a constant pressure to bring the polishing cloth and the workpiece to be pressed into contact with each other. Then, after supplying the loose abrasive grains, the upper and lower surface plates and the workpiece to be polished are rotated to slide the polishing cloth and the workpiece to polish the surface of the workpiece.
【０００３】上記例示したような研磨加工に用いられる
研磨布は、一般に図４に示すように、ポリエステル繊維
等の不織布からなるベース層（51）の表面にポリウレタ
ン等からなる多孔質の研磨用表面層（52）が一体的に被
覆形成され、さらにベース層（51）の裏面に定盤（60）
への接着用の接着層（53）が被覆された構造を有してい
る。As shown in FIG. 4, generally, a polishing cloth used for the polishing process as described above has a porous polishing surface made of polyurethane or the like on the surface of a base layer (51) made of a nonwoven fabric such as polyester fiber. The layer (52) is integrally formed on the back surface of the base layer (51), and the surface plate (60) is formed on the back surface of the base layer (51).
It has a structure coated with an adhesive layer (53) for adhering to the.
【０００４】[0004]
【発明が解決しようとする課題】ところで、近時、被研
磨加工品の小形、高精度化の要請に伴い、研磨加工につ
いても加工後における厳しい表面特性が要求されるよう
になってきている。By the way, recently, with the demand for miniaturization and high precision of the workpiece to be polished, strict surface characteristics after polishing have been required.
【０００５】しかるに、従来の研磨布を用いて研磨加工
を行うと、図４に示すように、研磨布（50）の被研磨加
工品（70）と接触する部分が弾力性により大きく圧縮変
形される結果、変形部分（54）と非変形部分（55）との
段差が大きくなり、このため変形部分（54）と非変形部
分（55）との境界に位置する被研磨加工品（70）のエッ
ジ部を湾曲状に覆って研磨布の表面が当接した状態とな
る。このような状態で研磨加工を行なうと、被研磨加工
品（70）のエッジ部に斜め方向から大きな押圧力が加わ
ることから、エッジ部が傾斜状ないし円弧状に研磨され
ていわゆる端面ダレ（71）を生じるという問題があっ
た。However, when the conventional polishing cloth is used for polishing, as shown in FIG. 4, the portion of the polishing cloth (50) that comes into contact with the workpiece (70) to be polished is largely compressed and deformed due to its elasticity. As a result, the step between the deformed portion (54) and the non-deformed portion (55) becomes large, so that the workpiece to be polished (70) located at the boundary between the deformed portion (54) and the non-deformed portion (55). The surface of the polishing pad is in contact with the edge portion in a curved shape. When polishing is performed in such a state, a large pressing force is applied diagonally to the edge portion of the workpiece (70), so that the edge portion is polished in a slanted or arcuate shape, so-called end face sag (71 ) Was caused.
【０００６】このため、研磨布（50）の表面層（52）に
硬化剤を含浸させることにより、研磨布の圧縮変形量を
可及的に抑え、もって端面ダレを抑制する試みもなされ
てはいる。For this reason, it has been attempted to suppress the amount of compressive deformation of the polishing cloth as much as possible by impregnating the surface layer (52) of the polishing cloth (50) with a curing agent, thereby suppressing the sagging of the end surface. There is.
【０００７】しかし、この方法では硬化処理の程度が激
しすぎると、被研磨加工品（70）の表面粗度の低下を招
くとか、表面に傷やスクラッチ等を生じさせる原因とな
り、研磨加工後の良好な表面状態を得ることができない
という新たな問題を派生するものであった。このため、
表面層の硬化処理には限界があり、端面ダレの確実かつ
十分な抑制を図ることができなかった。However, in this method, if the degree of hardening treatment is too severe, the surface roughness of the article to be polished (70) may be lowered, or the surface may be scratched or scratched. It was a new problem that the good surface condition of could not be obtained. For this reason,
There is a limit to the curing treatment of the surface layer, and it is not possible to reliably and sufficiently suppress the sagging of the end surface.
【０００８】また、ベース層（51）の厚さを薄くして研
磨布全体の弾力性を抑え、もって圧縮変形量を少なくす
ることも試みられたが、ベース層（51）の厚さを薄くす
ると接着層（53）の厚さによる影響や、定盤（60）の
傷、突起による影響が表面層（２）に承継され、やはり
研磨加工後の表面特性に大きな影響を与えてしまうとい
う問題を派生するものであった。Attempts have also been made to reduce the thickness of the base layer (51) to suppress the elasticity of the polishing cloth as a whole, thereby reducing the amount of compressive deformation, but the thickness of the base layer (51) was made thin. Then, the influence of the thickness of the adhesive layer (53), the scratches of the surface plate (60), and the protrusions are inherited by the surface layer (2), which also has a great influence on the surface characteristics after polishing. Was derived from.
【０００９】この発明は、かかる技術的背景に鑑みてな
されたものであって、被研磨加工品について研磨加工時
の表面粗度の低下や傷等の発生を招くことなく端面ダレ
を抑制し得る研磨布の提供を目的とする。The present invention has been made in view of the above technical background, and it is possible to suppress the sagging of the end face without causing a decrease in the surface roughness or the occurrence of scratches or the like during the polishing process for the workpiece to be polished. The purpose is to provide a polishing cloth.
【００１０】[0010]
【課題を解決するための手段】上記目的を達成するため
に、この発明は、図１の符号を参照して示すと、不織布
からなるベース層（１）の表面に研磨用表面層（２）が
積層された研磨布において、前記ベース層（１）が表面
層（２）側に位置する第１ベース層（1a）とその裏面の
第２ベース層（1b）とによる２重積層構造に形成される
とともに、前記第１ベース層（1a）が、ＪＩＳＫ６３０
１に示されたスプリングかたさ試験Ｃ形における硬度８
０°以上に規定され、前記第２ベース層（1b）が、ＪＩ
Ｓ Ｋ６３０１に示されたスプリングかたさ試験Ｃ形に
おける硬度８０°未満にそれぞれ規定されていることを
特徴とする研磨布を要旨とするものである。In order to achieve the above-mentioned object, the present invention shows, referring to the reference numerals in FIG. 1, a polishing surface layer (2) on the surface of a base layer (1) made of a nonwoven fabric. In the polishing cloth in which the base layers (1) are laminated, the base layer (1) is formed into a double layered structure including a first base layer (1a) located on the surface layer (2) side and a second base layer (1b) on the back surface thereof. And the first base layer (1a) is JISK630
Hardness test C type 1 shown in No. 1 hardness 8
The second base layer (1b) is defined to be 0 ° or more,
The gist is a polishing cloth characterized in that the hardness is less than 80 ° in the C type of spring hardness test shown in SK6301.
【００１１】[0011]
【作用】表面層（２）に隣接する第１ベース層（1a）
が、ＪＩＳ Ｋ６３０１に示されたスプリングかたさ試
験Ｃ形における硬度８０°以上に規定されているから、
第１ベース層（1a）ひいては研磨布全体の弾力性が低減
され、研磨加工時に被研磨加工品に圧接したときの圧縮
変形量が小さくなり、変形部分と非変形部分との段差が
小さくなる。このため、研磨布の変形部分と非変形部分
との境界に位置する被研磨加工品のエッジ部に付与され
る研磨布からの押圧力が軽減され、結果的に端面ダレが
抑制される。一方、第２ベース層（1b）が、ＪＩＳ Ｋ
６３０１に示されたスプリングかたさ試験Ｃ形における
硬度８０°未満に規定されているから、弾力性の低下に
よる定盤平行度の影響が軽減され、研磨布の片すべりや
研磨布の寿命短縮、さらには被研磨加工品の平行度異常
が防止される。[Function] The first base layer (1a) adjacent to the surface layer (2)
Is specified to have a hardness of 80 ° or more in the spring hardness test C type shown in JIS K6301,
The elasticity of the first base layer (1a) and the polishing cloth as a whole is reduced, the amount of compressive deformation when pressed against the workpiece to be polished during polishing is reduced, and the step between the deformed portion and the non-deformed portion is reduced. Therefore, the pressing force applied from the polishing cloth to the edge portion of the workpiece to be polished located at the boundary between the deformed portion and the non-deformed portion of the polishing cloth is reduced, and as a result, the end face sagging is suppressed. On the other hand, the second base layer (1b) is JIS K
Since the hardness is specified to be less than 80 ° in the spring hardness test C type shown in 6301, the influence of the parallelism of the platen due to the decrease in elasticity is reduced, and the sliding of the polishing cloth and the life of the polishing cloth are shortened. The abnormal parallelism of the workpiece to be polished is prevented.
【００１２】[0012]
【実施例】次に、この発明の実施例を説明する。Embodiments of the present invention will be described below.
【００１３】図１はこの発明の一実施例に係る研磨布
（Ａ）を示すものである。図１において、（１）はポリ
エステル繊維製の不織布からなるベース層、（２）は該
ベース層（１）の表面に一体的に被覆形成されたポリウ
レタン製の研磨用表面層であり、該表面層（２）は研磨
加工に際して供給される遊離砥粒を保持すべく多孔質に
形成されている。また、ベース層（１）の裏面はプライ
マー処理されると共に、該裏面に両面テープからなる接
着層（３）が形成されており、この接着層（３）を介し
て研磨布（Ａ）を定盤に接着し得るものとなされてい
る。FIG. 1 shows a polishing cloth (A) according to an embodiment of the present invention. In FIG. 1, (1) is a base layer made of polyester fiber non-woven fabric, and (2) is a polyurethane polishing surface layer integrally formed on the surface of the base layer (1). The layer (2) is made porous so as to retain loose abrasive grains supplied during the polishing process. The back surface of the base layer (1) is treated with a primer, and an adhesive layer (3) made of a double-sided tape is formed on the back surface, and the polishing cloth (A) is fixed through the adhesive layer (3). It is supposed to be able to adhere to the board.
【００１４】また、この発明では、前記ベース層（１）
は第１ベース層（1a) と第２ベース層（1b）との二重積
層構造をなすとともに、表面層（２）に隣接する第１ベ
ース層（1a）が、ＪＩＳ Ｋ６３０１に示されたスプリ
ングかたさ試験Ｃ形における硬度８０°以上に規定さ
れ、第１ベース層（1a）裏面の第２ベース層（1b）が、
ＪＩＳ Ｋ６３０１に示されたスプリングかたさ試験Ｃ
形における硬度８０°未満にそれぞれ規定された硬度を
有するものとなされなければならない。ＪＩＳＫ６３０
１に規定されたスプリングかたさ試験Ｃ形とは、試験片
として原則として厚さ６ｍｍ以上のもの（６ｍｍ未満の
ものは積み重ねてなるべく６ｍｍ以上とする）を用い、
この試験片をスプリングかたさ試験機のＣ形を用いて行
う硬度測定試験であり、本来的には加硫ゴムのかたさを
測定するための試験であるが、この発明ではこれを第
１、第２ベース層（1a）（1b）のかたさ試験として準用
する。ここに、第１ベース層（1a）の硬さが上記試験に
おける硬度８０°以上に規定されるのは、硬度８０°未
満では端面ダレの抑制を十分に図り得ないからである。
即ち、硬度８０°未満では第１ベース層が柔軟すぎて研
磨加工時に被研磨加工品に圧接したときの圧縮変形量が
大きすぎる結果、変形部分と非変形部分との段差が大き
くなる。このため、研磨布の変形部分と非変形部分との
境界に位置する被研磨加工品のエッジ部の全体に斜め方
向からの大きな押圧力が付与され、結果的に端面ダレの
発生を抑制し得ないからである。逆に言えば、第１ベー
ス層（1a）を硬度８０°以上とすることによって、研磨
布の圧縮変形部分と非変形部分との変形量の差を少なく
することができ、エッジ部に付与される研磨布からの押
圧力を軽減しえ、結果的に端面ダレの発生を抑制し得る
からである。特に好ましくは、第１ベース層（1a）の硬
さはこれを上記試験における硬度９０°以上に設定する
のが良い。In the present invention, the base layer (1)
Has a double-layered structure of a first base layer (1a) and a second base layer (1b), and the first base layer (1a) adjacent to the surface layer (2) is a spring shown in JIS K6301. Hardness test C hardness is specified to be 80 ° or more, and the second base layer (1b) on the back surface of the first base layer (1a) is
Spring hardness test C shown in JIS K6301
The hardness in the form must be such that each has a defined hardness of less than 80 °. JISK630
The spring hardness test C type specified in 1 uses a test piece having a thickness of 6 mm or more as a rule (6 mm or more should be stacked if less than 6 mm).
This test piece is a hardness measurement test performed by using a C type of a spring hardness tester, and is originally a test for measuring the hardness of a vulcanized rubber. The same applies to the hardness test of base layers (1a) and (1b). Here, the hardness of the first base layer (1a) is defined to be 80 ° or more in the above-mentioned test, because if the hardness is less than 80 °, the sagging of the end face cannot be sufficiently suppressed.
That is, if the hardness is less than 80 °, the first base layer is too soft and the amount of compressive deformation when pressed against the workpiece to be polished during polishing is too large, resulting in a large step between the deformed portion and the non-deformed portion. Therefore, a large pressing force is applied obliquely to the entire edge portion of the workpiece to be polished located at the boundary between the deformed portion and the non-deformed portion of the polishing cloth, and as a result, the occurrence of end face sagging can be suppressed. Because there is no. Conversely, by setting the hardness of the first base layer (1a) to 80 ° or more, it is possible to reduce the difference in the deformation amount between the compression-deformed portion and the non-deformed portion of the polishing cloth, and to impart it to the edge portion. This is because the pressing force from the polishing cloth can be reduced, and as a result, the occurrence of edge sag can be suppressed. Particularly preferably, the hardness of the first base layer (1a) is set to 90 ° or more in the above test.
【００１５】ベース層（１）を硬度８０°以上に規定す
るための手段は特に限定されることはなく、例えば、ベ
ース層を硬質の不織布で形成するとか、不織布の密度を
増大するとか、軟質ベース層に硬化剤を含浸させるとか
の方法を挙げ得る。The means for defining the base layer (1) to have a hardness of 80 ° or more is not particularly limited. For example, the base layer may be formed of a hard nonwoven fabric, the density of the nonwoven fabric may be increased, or the softness of the nonwoven fabric may be increased. A method of impregnating the base layer with a curing agent may be mentioned.
【００１６】而して、第１ベース層（1a）の硬さを上記
に規定したことにより、第１ベース層（1a）ひいては研
磨布（Ａ）全体の弾力性が低下し、このため定盤平行度
の影響を受けやすくなって研磨布の片すべりの原因や、
研磨布の寿命短縮、さらには被研磨加工品の平行度異常
の原因となる。そこで、第２ベース層（1b）の硬さをＪ
ＩＳ Ｋ６３０１に示されたスプリングかたさ試験Ｃ形
における硬度８０°未満に規定することによりある程度
の弾力性を確保し、上記不具合を防止するものである。Thus, by defining the hardness of the first base layer (1a) as described above, the elasticity of the first base layer (1a) and thus the polishing cloth (A) as a whole is lowered, so that the surface plate is reduced. It becomes easy to be affected by the parallelism, causing the slip of the polishing cloth,
This shortens the life of the polishing cloth and causes abnormal parallelism of the workpiece. Therefore, the hardness of the second base layer (1b) should be J
By defining the hardness in the C type of the spring hardness test shown in IS K6301 to be less than 80 °, the elasticity is secured to some extent and the above-mentioned problems are prevented.
【００１７】ちなみに、第１ベース層（1a）の厚さ１．
０ｍｍ、第２ベース層（1b）の厚さ０．５ｍｍ、表面層
（２）の厚さ０．５ｍｍに設定すると共に、第１ベース
層（1a）、第２ベース層（1b）の硬度のみを、ＪＩＳ
Ｋ６３０１に規定されたスプリングかたさ試験Ｃ形にお
いてそれぞれ下記表のように規定した数種類の研磨布を
用い、端面ダレの発生状況を調べた。また、ベース層が
１層構造である従来の研磨布を用いても同様の試験を行
った。Incidentally, the thickness of the first base layer (1a) is 1.
0 mm, the thickness of the second base layer (1b) is 0.5 mm, the thickness of the surface layer (2) is 0.5 mm, and only the hardness of the first base layer (1a) and the second base layer (1b) is set. JIS
In the C type of spring hardness test defined in K6301, several kinds of polishing cloths defined as shown in the following table were used to examine the occurrence of edge sag. The same test was performed using a conventional polishing cloth having a single-layer base layer.
【００１８】なお、試験片として図２に示すように、直
径Ｌ1 ：９５ｍｍ、外側チャンファー部（11）を除いた
直径Ｌ2 ：９４．７ｍｍ、厚さｔ：１．２７ｍｍのアル
ミニウム磁気ディスク基板（10）を用い、外側チャンフ
ァー部（11）の内側端縁から内方Ｌ3 ：４ｍｍの範囲に
わたってダレ測定部（12）を設定し、このダレ測定部
（12）における端部の高低差Ｈ（図３に示す）をダレ量
として測定した。その結果を表１に示す。As a test piece, as shown in FIG. 2, an aluminum magnetic disk substrate (diameter L1: 95 mm, diameter L2 excluding the outer chamfer portion (11): 94.7 mm, and thickness t: 1.27 mm ( 10) is used to set the sag measuring portion (12) from the inner end edge of the outer chamfer portion (11) to the inside L3: 4 mm, and the height difference H ( (Shown in FIG. 3) was measured as the amount of sag. The results are shown in Table 1.
【００１９】[0019]
【表１】 [Table 1]
【００２０】上記表１からわかるように、第１ベース層
（1a）、第２ベース層（1b）の硬度を、本発明範囲に規
定することにより、被研磨加工品の端面ダレを大幅に抑
制し得ることを確認し得た。As can be seen from Table 1 above, by defining the hardness of the first base layer (1a) and the second base layer (1b) within the scope of the present invention, the edge sagging of the workpiece to be polished can be significantly suppressed. It was confirmed that it was possible.
【００２１】[0021]
【発明の効果】この発明は上述の次第で、不織布からな
るベース層（１）の表面に研磨用表面層（２）が積層さ
れた研磨布において、前記ベース層（１）が表面層
（２）側に位置する第１ベース層（1a）とその裏面の第
２ベース層（1b）とによる２重積層構造に形成されると
ともに、前記第１ベース層（1a）が、ＪＩＳ Ｋ６３０
１に示されたスプリングかたさ試験Ｃ形における硬度８
０°以上に規定され、前記第２ベース層（1b）が、ＪＩ
Ｓ Ｋ６３０１に示されたスプリングかたさ試験Ｃ形に
おける硬度８０°未満にそれぞれ規定されていることを
特徴とするものであるから、定盤の平行度や接着層の厚
さの影響を受けることなく、研磨加工時における研磨布
の圧縮変形量を少なくでき、ひいては研磨品エッジ部の
端面ダレを抑制することができる。しかも、表面層は従
来のものと変わりないから、被研磨加工品に表面粗度の
低下や傷等を発生させるおそれがなく、表面研磨状態の
良好性を維持しつつ、エッジ部の端面ダレを抑制しえ
て、高品質の研磨加工品を提供することができる。As described above, according to the present invention, in the polishing cloth in which the polishing surface layer (2) is laminated on the surface of the non-woven base layer (1), the base layer (1) is the surface layer (2). ) Side, the first base layer (1a) and the second base layer (1b) on the back surface of the first base layer (1a) are formed into a double-layered structure, and the first base layer (1a) is JIS K630.
Hardness test C type 1 shown in No. 1 hardness 8
The second base layer (1b) is defined to be 0 ° or more,
Since the hardness is specified to be less than 80 ° in the spring hardness test C type shown in SK6301, it is not affected by the parallelism of the surface plate and the thickness of the adhesive layer. It is possible to reduce the amount of compressive deformation of the polishing cloth during polishing, and consequently to suppress the edge sagging of the edge portion of the polishing product. Moreover, since the surface layer is the same as that of the conventional one, there is no possibility of causing a decrease in surface roughness or scratches on the workpiece to be polished, and maintaining the goodness of the surface polished state, the edge surface sagging It is possible to suppress and provide a high-quality polished product.
【図１】この発明の一実施に係る研磨布の断面図であ
る。FIG. 1 is a cross-sectional view of a polishing cloth according to an embodiment of the present invention.
【図２】この発明の効果の確認試験に用いた被研磨加工
品としてのアルミニウム磁気ディスク基板の部分断面図
である。FIG. 2 is a partial cross-sectional view of an aluminum magnetic disk substrate as a workpiece to be polished used in a test for confirming the effect of the present invention.
【図３】研磨加工後のアルミニウム磁気ディスク基板の
要部拡大断面図である。FIG. 3 is an enlarged sectional view of an essential part of an aluminum magnetic disk substrate after polishing.
【図４】従来の研磨布を用いて研磨加工を行っている状
態を示す要部断面図である。FIG. 4 is a cross-sectional view of essential parts showing a state in which a polishing process is performed using a conventional polishing cloth.
Ａ…研磨布 １…ベース層 1a…第１ベース層 1b…第２ベース層 ２…表面層 A ... Polishing cloth 1 ... Base layer 1a ... First base layer 1b ... Second base layer 2 ... Surface layer
Claims (1)
研磨用表面層（２）が積層された研磨布において、前記
ベース層（１）が表面層（２）側に位置する第１ベース
層（1a）とその裏面の第２ベース層（1b）とによる２重
積層構造に形成されるとともに、前記第１ベース層（1
a）が、ＪＩＳ Ｋ６３０１に示されたスプリングかた
さ試験Ｃ形における硬度８０°以上に規定され、前記第
２ベース層（1b）が、ＪＩＳ Ｋ６３０１に示されたス
プリングかたさ試験Ｃ形における硬度８０°未満に規定
されていることを特徴とする研磨布。1. A polishing cloth in which a polishing surface layer (2) is laminated on the surface of a base layer (1) made of a non-woven fabric, wherein the base layer (1) is located on the surface layer (2) side. The layer (1a) and the second base layer (1b) on the back surface of the layer (1a) are formed into a double-layered structure, and the first base layer (1
a) is specified to have a hardness of 80 ° or more in the spring hardness test C type specified in JIS K6301, and the second base layer (1b) has a hardness of less than 80 ° in the spring hardness test C type specified in JIS K6301. An abrasive cloth characterized in that it is specified in.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21777891A JPH0557623A (en) | 1991-08-29 | 1991-08-29 | Abrasive cloth |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21777891A JPH0557623A (en) | 1991-08-29 | 1991-08-29 | Abrasive cloth |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0557623A true JPH0557623A (en) | 1993-03-09 |
Family
ID=16709588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21777891A Pending JPH0557623A (en) | 1991-08-29 | 1991-08-29 | Abrasive cloth |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0557623A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004022283A1 (en) * | 2002-09-02 | 2004-03-18 | Elm Inc. | Optical disk polishing device |
| KR100528884B1 (en) * | 1999-06-17 | 2005-11-16 | 스피드팜 가부시키가이샤 | An edge polishing machine and edge polishing method thereby |
| JP2007190678A (en) * | 2000-11-03 | 2007-08-02 | Three M Innovative Properties Co | Flexible abrasive product, and manufacturing method and use method of the product |
-
1991
- 1991-08-29 JP JP21777891A patent/JPH0557623A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100528884B1 (en) * | 1999-06-17 | 2005-11-16 | 스피드팜 가부시키가이샤 | An edge polishing machine and edge polishing method thereby |
| JP2007190678A (en) * | 2000-11-03 | 2007-08-02 | Three M Innovative Properties Co | Flexible abrasive product, and manufacturing method and use method of the product |
| WO2004022283A1 (en) * | 2002-09-02 | 2004-03-18 | Elm Inc. | Optical disk polishing device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7300335B2 (en) | Glass substrate for data recording medium, manufacturing method thereof and polishing pad used in the method | |
| KR100818683B1 (en) | Mirror chamfered wafer, mirror chamfering polishing cloth, and mirror chamfering polishing machine and method | |
| US6306021B1 (en) | Polishing pad, polishing method, and polishing machine for mirror-polishing semiconductor wafers | |
| US6852003B2 (en) | Method of manufacturing glass substrate for data recording medium | |
| JP2738392B1 (en) | Polishing apparatus and polishing method for semiconductor device | |
| JP5371251B2 (en) | Polishing pad | |
| EP2042267A1 (en) | Carrier for double side polishing device, and double side polishing device and double side polishing method using the carrier | |
| JP5061694B2 (en) | Polishing pad manufacturing method, polishing pad, and wafer polishing method | |
| JPH0413568A (en) | Backing pad, precise flattening method thereof and polishing method thereof for semiconductor wafer | |
| EP1820603A2 (en) | Wafer and method for producing the same | |
| JP3664676B2 (en) | Wafer polishing method and polishing pad for wafer polishing | |
| US20230015283A1 (en) | Spacer and laminate | |
| EP1283090B1 (en) | Method for polishing angular substrates | |
| KR102192288B1 (en) | Workpiece polishing device | |
| TW201505761A (en) | Template assembly and method for manufacturing template assembly | |
| JP2002307293A (en) | Polishing cloth | |
| US8574033B2 (en) | Wafer support member, method for manufacturing the same and wafer polishing unit comprising the same | |
| JPH0557623A (en) | Abrasive cloth | |
| JP5222070B2 (en) | Polishing pad | |
| JP3225815U (en) | Polishing pad of two-layer structure made of non-woven fabric | |
| JPH0557622A (en) | Abrasive cloth | |
| JP5298688B2 (en) | Polishing pad | |
| JP2010082703A (en) | Cushion sheet for polishing pad | |
| CN112091811B (en) | Carrier and method for manufacturing substrate using the same | |
| JP3611029B2 (en) | Semiconductor substrate polishing holding plate |