JPH0554921A - Lead type ic module - Google Patents
Lead type ic moduleInfo
- Publication number
- JPH0554921A JPH0554921A JP3214889A JP21488991A JPH0554921A JP H0554921 A JPH0554921 A JP H0554921A JP 3214889 A JP3214889 A JP 3214889A JP 21488991 A JP21488991 A JP 21488991A JP H0554921 A JPH0554921 A JP H0554921A
- Authority
- JP
- Japan
- Prior art keywords
- module
- lead
- slit
- external
- external lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はリード型ＩＣモジュール
に関し、特に外部リードに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead type IC module, and more particularly to external leads.
【０００２】[0002]
【従来の技術】従来のリード型モジュールは、図３
（ａ），（ｂ）に示すように、モジュール基板１の端部
の上面及び下面にコンタクトパッド２を形成し、外部リ
ード５のクリップ状端部でコンタクトパッド２を設けた
モジュール基板１を挟み付けるようにして外部リード５
を半田付けし接合していた。2. Description of the Related Art A conventional lead type module is shown in FIG.
As shown in (a) and (b), the contact pads 2 are formed on the upper and lower surfaces of the end portion of the module substrate 1, and the module substrate 1 provided with the contact pads 2 is sandwiched by the clip-shaped end portions of the external leads 5. External lead 5
Was soldered and joined.
【０００３】[0003]
【発明が解決しようとする課題】上述した従来のリード
型ＩＣモジュールは、外部リードの取り付け部分が平面
となっているため、図３（ａ）の紙面に平行な方向の力
に弱く、モジュール実装基板の反り等による応力でモジ
ュール基板と外部リード間の接合部が破損し接合不良を
発生するという問題点があった。In the conventional lead-type IC module described above, the mounting portion of the external lead is a flat surface, so that it is weak against the force in the direction parallel to the paper surface of FIG. There is a problem in that the joint portion between the module substrate and the external lead is damaged due to the stress due to the warp of the substrate or the like, resulting in defective joint.
【０００４】[0004]
【課題を解決するための手段】本発明のリード型ＩＣモ
ジュールは、モジュール基板の端部に設けたスリット
と、前記スリットに隣接する前記モジュール基板の上面
及び下面に設けたコンタクトパッドと、前記スリットに
端部を挿入し且つ前記コンタクトパッドに接合して設け
た外部リードとを有する。A lead type IC module according to the present invention comprises a slit provided at an end of a module substrate, contact pads provided on the upper and lower surfaces of the module substrate adjacent to the slit, and the slit. External leads provided by inserting end portions thereof and being joined to the contact pads.
【０００５】[0005]
【実施例】次に、本発明について図面を参照して説明す
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.
【０００６】図１（ａ），（ｂ）は本発明の第１の実施
例を示すリード型ＩＣモジュールの斜視図及びＡ−Ａ′
線断面図である。1 (a) and 1 (b) are perspective views of a lead type IC module showing the first embodiment of the present invention and AA '.
It is a line sectional view.
【０００７】図１（ａ），（ｂ）に示すように、モジュ
ール基板１の端部にスリット３を設け端部がＳ字形を有
する外部リード４をスリット３に挿入し、スリット３に
隣接するモジュール基板１の上面及び下面に設けたコン
タクトパッド２と半田付けして接合する。As shown in FIGS. 1 (a) and 1 (b), a slit 3 is provided at an end of a module substrate 1 and an external lead 4 having an S-shaped end is inserted into the slit 3 so as to be adjacent to the slit 3. The contact pads 2 provided on the upper and lower surfaces of the module substrate 1 are soldered and joined.
【０００８】図２（ａ），（ｂ）は本発明の第２の実施
例を示すリード型ＩＣモジュールの斜視図及びＢ−Ｂ′
線断面図である。2A and 2B are perspective views of a lead type IC module showing a second embodiment of the present invention and BB '.
It is a line sectional view.
【０００９】図２（ａ），（ｂ）に示すように、外部リ
ード４ａの端部がＨ字形に形成されている以外は第１の
実施例と同様の構成を有しており、コンタクトパッド２
と外部リード４ａとの接合面積が広いので、外部リード
４ａの接合強度が高いという利点がある。As shown in FIGS. 2 (a) and 2 (b), the contact pad has the same structure as that of the first embodiment except that the ends of the external leads 4a are formed in an H shape. Two
Since the bonding area between the external lead 4a and the external lead 4a is large, there is an advantage that the bonding strength of the external lead 4a is high.
【００１０】[0010]
【発明の効果】以上説明したように本発明は、モジュー
ル基板の外部リード取リ付け部分にスリットを設け、外
部リードの端部をスリットに挿入して取り付けることに
より、外部リードにかかる外力に対する接合強度を向上
させることができるという効果を有する。As described above, according to the present invention, a slit is provided in the external lead attaching portion of the module substrate, and the end portion of the external lead is inserted into the slit to be attached, thereby joining the external lead to the external force. It has the effect that the strength can be improved.
【図１】本発明の第１の実施例を示すリード型ＩＣモジ
ュールの斜視図及びＡ−Ａ′線断面図。FIG. 1 is a perspective view and a cross-sectional view taken along the line AA ′ of a lead type IC module showing a first embodiment of the present invention.
【図２】本発明の第２の実施例を示すリード型ＩＣモジ
ュールの斜視図およびＢ−Ｂ′線断面図。FIG. 2 is a perspective view and a sectional view taken along line BB ′ of the lead type IC module showing the second embodiment of the present invention.
【図３】従来のリード型ＩＣモジュールの一例を示す平
面図および側面図。FIG. 3 is a plan view and a side view showing an example of a conventional lead type IC module.
１ モジュール基板 ２ コンタクトパッド ３ スリット ４，４ａ，５ 外部リード 1 Module board 2 Contact pad 3 Slit 4, 4a, 5 External lead
Claims (2)
と、前記スリットに隣接する前記モジュール基板の上面
及び下面に設けたコンタクトパッドと、前記スリットに
端部を挿入し且つ前記コンタクトパッドに接合して設け
た外部リードとを有することを特徴とするリード型ＩＣ
モジュール。1. A slit provided at an end of a module substrate, contact pads provided on an upper surface and a lower surface of the module substrate adjacent to the slit, and an end portion inserted into the slit and bonded to the contact pad. Lead-type IC having external leads provided as
module.
部がＳ字形又はＨ字形である請求項１記載のリード型Ｉ
Ｃモジュール。2. The lead type I according to claim 1, wherein the end portion for connecting the contact pad of the external lead is S-shaped or H-shaped.
C module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3214889A JPH0554921A (en) | 1991-08-27 | 1991-08-27 | Lead type ic module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3214889A JPH0554921A (en) | 1991-08-27 | 1991-08-27 | Lead type ic module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0554921A true JPH0554921A (en) | 1993-03-05 |
Family
ID=16663245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3214889A Pending JPH0554921A (en) | 1991-08-27 | 1991-08-27 | Lead type ic module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0554921A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010113296A1 (en) * | 2009-04-01 | 2010-10-07 | 三菱電機株式会社 | Air-conditioning device |
-
1991
- 1991-08-27 JP JP3214889A patent/JPH0554921A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010113296A1 (en) * | 2009-04-01 | 2010-10-07 | 三菱電機株式会社 | Air-conditioning device |
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