JPH0554187B2 - - Google Patents
Info
- Publication number
- JPH0554187B2 JPH0554187B2 JP61294339A JP29433986A JPH0554187B2 JP H0554187 B2 JPH0554187 B2 JP H0554187B2 JP 61294339 A JP61294339 A JP 61294339A JP 29433986 A JP29433986 A JP 29433986A JP H0554187 B2 JPH0554187 B2 JP H0554187B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- hole
- processing
- center
- flat part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 81
- 239000007788 liquid Substances 0.000 claims description 18
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 238000012856 packing Methods 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000005236 sound signal Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Manufacturing Optical Record Carriers (AREA)
- Holding Or Fastening Of Disk On Rotational Shaft (AREA)
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、基板の処理の行なう基板処理装置に
係わり、特にコンパクトデイスク原盤等の透孔を
有する基板の処理を行なう基板処理装置に関す
る。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a substrate processing apparatus for processing a substrate, and in particular, a substrate processing apparatus for processing a substrate with through holes such as a compact disk master. It relates to a processing device.
（従来の技術）
一般に、半導体ウエハ表面に形成される半導体
素子、コンパクトデイスク原盤等を製造する場
合、その製造工程において処理液を用いた種々の
処理が行なわれる。(Prior Art) Generally, when manufacturing semiconductor elements formed on the surface of a semiconductor wafer, compact disk masters, etc., various treatments using treatment liquids are performed in the manufacturing process.
例えば半導体ウエハ、コンパクトデイスク原盤
等の表面に形成される微細なパターンは、感光性
膜を露光現像することによつて形成されることが
多いが、コンパクトデイスク原盤等では、ガラス
等からなる環状の基板表面にレジストを塗布して
レジスト膜を形成する工程、基板を回転させなが
らレジスト膜に対してレーザ光により所定の音声
信号に応じた光強度で露光した後、現像液を用い
て現像する工程等を経て、基板上に音声信号に応
じた微細パターンが形成される。 For example, fine patterns formed on the surfaces of semiconductor wafers, compact disk masters, etc. are often formed by exposing and developing photosensitive films, but in compact disk masters, annular patterns made of glass, etc. A process of applying resist to the substrate surface to form a resist film, a process of exposing the resist film to laser light at a light intensity corresponding to a predetermined audio signal while rotating the substrate, and then developing it using a developer. Through these steps, a fine pattern corresponding to the audio signal is formed on the substrate.
上述のような基板の処理を行なう工程のうち例
えばレジスト膜に所定の化学反応を生じさせる現
像工程では、基板を基板保持装置上に保持し、基
板表面にスプレー等により現像液を供給して現像
液とレジスト膜とを一定時間接触させ、この後、
基板表面から現像液を除去して現像を終了させる
現像装置が用いられる。 Among the steps of processing the substrate as described above, for example, in the developing step of causing a predetermined chemical reaction in the resist film, the substrate is held on a substrate holding device, and a developing solution is supplied by spraying or the like onto the surface of the substrate for development. The liquid and the resist film are brought into contact for a certain period of time, and then
A developing device is used that removes the developer from the substrate surface to complete the development.
現像装置に配置される従来の基板保持装置は、
上面に平面部が形成されており、この平面部に真
空チヤツク等により基板を保持し、駆動装置によ
り保持装置とともに基板を回転させることによ
り、処理液の均一な供給と、基板表面からの処理
液の除去を行なうよう構成されたものが多い。 A conventional substrate holding device placed in a developing device is
A flat part is formed on the top surface, and by holding the substrate on this flat part with a vacuum chuck, etc., and rotating the substrate together with the holding device by a drive device, the processing liquid can be supplied uniformly and the processing liquid can be removed from the substrate surface. Many of them are designed to remove .
（発明が解決しようとする問題点）
しかしながら、上述の従来の基板処理装置で
は、半導体ウエハ等の円板状の基板を処理する場
合には問題はないが、コンパクトデイスク原盤
等、中央部に透孔を有する環状の基板を処理する
場合には、透孔部と基板保持装置の平面部との間
に基板の厚さ分の処理液が溜り、この処理液が回
転により徐々に基板表面に流出し、処理液と基板
との接触状態が続くために処理が進行し、所定の
時間で処理を終了させることができず、所定の処
理を行えないという問題がある。(Problems to be Solved by the Invention) However, with the above-mentioned conventional substrate processing apparatus, there is no problem when processing disk-shaped substrates such as semiconductor wafers, but when processing disc-shaped substrates such as compact disk masters, there is a transparent part in the center. When processing an annular substrate with holes, a processing liquid equivalent to the thickness of the substrate accumulates between the through hole and the flat surface of the substrate holding device, and this processing liquid gradually flows out onto the substrate surface due to rotation. However, since the contact state between the processing liquid and the substrate continues, the processing progresses, and there is a problem that the processing cannot be completed within a predetermined time and the predetermined processing cannot be performed.
本発明は、かかる従来の事情に対処してなされ
たもので、中央部に透孔を有する環状の基板等で
も基板表面から速やかに処理液を除去することが
でき、所定の時間で確実に処理を終了させること
のできる基板処理装置を提供しようとするもので
ある。 The present invention has been made in response to such conventional circumstances, and it is possible to quickly remove a processing liquid from the surface of a substrate, such as an annular substrate having a through hole in the center, thereby ensuring that processing is completed within a predetermined time. The purpose of the present invention is to provide a substrate processing apparatus that can complete the process.
［発明の構成］
（問題点を解決するための手段）
すなわち本発明の基板処理装置は、中央部に透
孔を有する基板を上面に載置する平坦部を有する
基板支持機構と、前記平坦部に形成され、前記基
板を吸着保持するための吸着孔と、前記基板支持
機構とともに前記基板を回転させる回転駆動機構
と、前記平坦部中央に配設されるとともに、前記
透孔と嵌合され、少なくとも前記透孔の内周縁部
上端と液密な状態で密着する弾性部材からなる突
出部と、前記基板に処理液を供給する液体供給機
構とを備えたことを特徴とする。[Structure of the Invention] (Means for Solving the Problems) That is, the substrate processing apparatus of the present invention includes a substrate support mechanism having a flat part on which a substrate having a through hole in the center is placed, and the flat part a suction hole for sucking and holding the substrate; a rotation drive mechanism for rotating the substrate together with the substrate support mechanism; disposed at the center of the flat portion and fitted in the through hole; The method is characterized in that it includes a protrusion made of an elastic member that is in close contact with at least the upper end of the inner peripheral edge of the through hole in a liquid-tight state, and a liquid supply mechanism that supplies a processing liquid to the substrate.
（作用）
本発明の基板処理装置では、基板が上面に載置
される基板支持機構の平坦部中央に、基板の透孔
と嵌合され、少なくとも透孔の内周縁部上端と液
密な状態で密着する弾性部材からなる突出部が設
けられている。(Function) In the substrate processing apparatus of the present invention, the center of the flat part of the substrate support mechanism on which the substrate is placed is fitted into the through hole of the substrate and is in a liquid-tight state with at least the upper end of the inner peripheral edge of the through hole. A protrusion made of an elastic member that comes into close contact is provided.
したがつて、基板中央部に透孔を有するコンパ
クトデイスク原盤等の基板の現像等の処理を行な
う場合でも、突出部により基板中央部の透孔部分
と保持装置との間に現像液等の処理液が溜ること
を防止することができ、現像等の処理を確実に終
了させることができる。 Therefore, even when performing processing such as development on a substrate such as a compact disk master that has a through hole in the center of the substrate, the protrusion allows processing such as developing solution to occur between the through hole in the center of the substrate and the holding device. It is possible to prevent the liquid from accumulating, and it is possible to reliably complete processing such as development.
（実施例）
以下本発明の基板処理装置を図面を参照して一
実施例について説明する。(Embodiment) An embodiment of the substrate processing apparatus of the present invention will be described below with reference to the drawings.
コンパクトデイスク原盤等の中央部に透孔１ａ
を有する基板１を保持するこの実施例の基板保持
機構２は、上面に基板１よりやや小径な円形の平
坦部３が形成され、平坦部３の中央部には、透孔
１ａよりやや大径な円形の凹陥部４が配置されて
いる。凹陥部４を除いた平坦部３の環状の領域に
は、図示しない吸引装置に接続された複数の真空
チヤツク用開口５が配置されている。 Through hole 1a in the center of compact disk master etc.
The substrate holding mechanism 2 of this embodiment that holds the substrate 1 has a circular flat portion 3 with a diameter slightly smaller than that of the substrate 1 formed on the top surface, and a circular flat portion 3 with a diameter slightly larger than the through hole 1a in the center of the flat portion 3. A circular recess 4 is arranged. A plurality of vacuum chuck openings 5 connected to a suction device (not shown) are arranged in an annular region of the flat portion 3 excluding the recessed portion 4.
また、凹陥部４の底部中央には透孔１ａより小
径な穿孔４ａが配置されており、この穿孔４ａに
は真空チヤツク用開口５と吸引装置とを接続する
真空路６の開閉を行なうポペツト７が嵌装され、
このポペツト７の先端部には、縦断面が楕円状、
横断面が円形の中空球状のパツキン８が脱着自在
に装着され、平坦部３から突出する突出部を形成
している。なお、パツキン８は、柔軟な耐蝕性ゴ
ム等の弾性部材からなり、最大径が透孔１ａより
やや大径とされ、透孔１ａの内側周縁部に密着す
るよう構成されている。 Further, a perforation 4a having a smaller diameter than the through hole 1a is arranged in the center of the bottom of the recessed part 4, and a poppet 7 for opening and closing a vacuum path 6 connecting the vacuum chuck opening 5 and the suction device is provided in this perforation 4a. is fitted,
The tip of the poppet 7 has an elliptical longitudinal section;
A hollow spherical gasket 8 having a circular cross section is detachably attached to form a protruding portion that protrudes from the flat portion 3. The packing 8 is made of an elastic member such as a flexible corrosion-resistant rubber, has a maximum diameter slightly larger than the through hole 1a, and is configured to tightly fit against the inner peripheral edge of the through hole 1a.
そして、平坦部３の下方には、図示しない駆動
装置に接続され、平坦部３の中央を軸として回転
させる回転軸９が配置されている。 Further, below the flat part 3, a rotating shaft 9 is arranged which is connected to a drive device (not shown) and rotates around the center of the flat part 3.
上記構成のこの実施例の基板処理装置は、例え
ば現像装置等として用いられ、コンパクトデイス
ク原盤等の中央部に透孔１ａを有する基板１の処
理に用いられる。この時、まず透孔１ａの先端小
径部分からパツキン８に徐々に挿入することによ
つて基板１のセンタリングを行ない、次に吸引装
置から吸引を開始することによつて、ポペツト７
を下方へ移動させ、基板１と平坦部３とを接触さ
せるとともに、真空チヤツク用開口５による吸引
で基板面を平坦部３上に吸着保持する。 The substrate processing apparatus of this embodiment having the above structure is used, for example, as a developing apparatus, and is used to process a substrate 1 having a through hole 1a in the center of a compact disk master or the like. At this time, first center the substrate 1 by gradually inserting it into the gasket 8 from the small diameter portion at the tip of the through hole 1a, and then start suction from the suction device to remove the poppet 7.
is moved downward to bring the substrate 1 into contact with the flat portion 3, and the substrate surface is suctioned and held on the flat portion 3 by suction through the vacuum chuck opening 5.
そして、基板１を例えば10rpm〜30rpm程度の
回転数で回転させながら、図示しない液体供給機
構、例えば、スプレー等で現像液を霧状にして吹
き付け、基板１表面のレジスト膜に現像液を供給
して現像を行なう。このとき、スプレーノズルを
基板１上にスキヤンニングさせる場合もある。な
お、このような現像時間は、一般に数10秒程度で
ある。 Then, while rotating the substrate 1 at a rotation speed of, for example, about 10 rpm to 30 rpm, a liquid supply mechanism (not shown), for example, sprays a developer in the form of a mist using a sprayer or the like to supply the developer to the resist film on the surface of the substrate 1. Perform development. At this time, the spray nozzle may be scanned onto the substrate 1 in some cases. Note that such development time is generally about several tens of seconds.
この後、基板１に対する現像液の供給を停止
し、基板１を数1000rpm程度で回転させ、基板１
表面に付着した現像液を除去し、純水等によるリ
ンスを行なう。 After that, the supply of developer to the substrate 1 is stopped, and the substrate 1 is rotated at about several thousand rpm.
Remove the developer attached to the surface and rinse with pure water or the like.
このとき、基板１の透孔１ａは、パツキン８に
よつて閉塞されており、この部分に供給された現
像液等の処理液が溜ることがなく、基板１を高速
で回転させることによつて、基板１上から現像液
等の処理液を速やかに除去することができる。 At this time, the through hole 1a of the substrate 1 is closed by the packing 8, so that the processing liquid such as the developer supplied to this part does not accumulate, and by rotating the substrate 1 at high speed, , processing liquid such as a developer can be quickly removed from the substrate 1 .
したがつて、現像等の処理を所定の時間で確実
に停止させることができ、基板１に所望の処理を
施すことができる。また、半導体ウエハ等の円板
状の基板の場合は、パツキン８を取り外すことに
よつて従来の基板保持装置の場合と同様に処理を
行なうことができる。 Therefore, processing such as development can be reliably stopped at a predetermined time, and desired processing can be performed on the substrate 1. Further, in the case of a disk-shaped substrate such as a semiconductor wafer, by removing the packing 8, processing can be performed in the same manner as in the case of a conventional substrate holding device.
また、透孔１ａをパツキン８に挿入することに
よつて、基板１のセンタリングが行なわれるの
で、従来の処理装置において行なわれていた基板
１配置前のセンタリング操作が不要となるので、
場合によつては、装置の簡略化等も行なうことが
できる。 Furthermore, since the substrate 1 is centered by inserting the through hole 1a into the packing 8, the centering operation before placing the substrate 1, which is performed in conventional processing equipment, is no longer necessary.
Depending on the case, it is also possible to simplify the device.
なお、上記説明の基板処理装置は、現像装置に
限らず、例えばレジスト塗布装置等、処理液を用
いて基板の処理を行なうあらゆる処理装置に用い
ることができ、処理対象は、例えばハードデイス
ク等、どのような基板でもよい。 The substrate processing apparatus described above is not limited to a developing apparatus, but can be used in any processing apparatus that processes a substrate using a processing liquid, such as a resist coating apparatus. A substrate like this may also be used.
［発明の効果］
上述のように、本発明の基板処理装置では、基
板中央部に透孔を有するコンパクトデイスク原盤
等の基板の現像等の処理を行なう場合でも、現像
液等の処理液が、基板中央部の透孔部分と保持装
置との間に溜ることがなく、現像等の処理を確実
に終了させ、所望の処理を行なうことができる。[Effects of the Invention] As described above, in the substrate processing apparatus of the present invention, even when performing processing such as development of a substrate such as a compact disk master having a through hole in the center of the substrate, the processing liquid such as the developer is There is no accumulation between the through hole in the center of the substrate and the holding device, and processing such as development can be completed reliably and desired processing can be performed.
図は本発明の一実施例の基板処理装置を示す縦
断面図である。
１……基板、１ａ……透孔、２……基板保持機
構、３……平坦部、４……凹陥部、５……真空チ
ヤツク用開口、６……真空路、７……ポペツト、
８……パツキン。
The figure is a longitudinal sectional view showing a substrate processing apparatus according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Substrate, 1a... Through hole, 2... Substrate holding mechanism, 3... Flat part, 4... Recessed part, 5... Opening for vacuum chuck, 6... Vacuum path, 7... Poppet,
8... Patsukin.
Claims (1)
平坦部を有する基板支持機構と、 前記平坦部に形成され、前記基板を吸着保持す
るための吸着孔と、 前記基板支持機構とともに前記基板を回転させ
る回転駆動機構と、 前記平坦部中央に配設されるとともに、前記透
孔と嵌合され、少なくとも前記透孔の内周縁部上
端と液密な状態で密着する弾性部材からなる突出
部と、 前記基板に処理液を供給する液体供給機構とを
備えたことを特徴とする基板処理装置。 ２ 突出部は、平坦部に直交する方向へ移動する
ことにより真空チヤツク用の真空路の開閉を行な
うポペツトの平坦部側端部に着脱自在に装着され
た特許請求の範囲第１項記載の基板処理装置。[Scope of Claims] 1. A substrate support mechanism having a flat part on which a substrate having a through hole in the center is placed; a suction hole formed in the flat part to suction and hold the substrate; a rotational drive mechanism that rotates the substrate together with a substrate support mechanism; and a rotational drive mechanism that is disposed at the center of the flat portion, is fitted into the through hole, and is in close contact with at least the upper end of the inner peripheral edge of the through hole in a liquid-tight state. A substrate processing apparatus, comprising: a protrusion made of an elastic member; and a liquid supply mechanism that supplies a processing liquid to the substrate. 2. The substrate according to claim 1, wherein the protruding part is detachably attached to the flat part side end of the poppet which opens and closes the vacuum path for the vacuum chuck by moving in a direction perpendicular to the flat part. Processing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61294339A JPS63146265A (en) | 1986-12-09 | 1986-12-09 | Substrate holding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61294339A JPS63146265A (en) | 1986-12-09 | 1986-12-09 | Substrate holding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63146265A JPS63146265A (en) | 1988-06-18 |
| JPH0554187B2 true JPH0554187B2 (en) | 1993-08-11 |
Family
ID=17806422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61294339A Granted JPS63146265A (en) | 1986-12-09 | 1986-12-09 | Substrate holding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63146265A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0773372B1 (en) * | 1995-10-13 | 2004-12-15 | Kitano Engineering Co., Ltd. | Rotation holding table for rotating and holding a storage disc thereon and a boss thereof |
| NL1017267C2 (en) * | 2000-07-14 | 2002-01-18 | Otb Group Bv | Method and device for manufacturing a DVD disc. |
| DE10113833A1 (en) * | 2001-03-21 | 2002-10-24 | Steag Hamatech Ag | Device for joining substrates |
| JP2003091887A (en) * | 2001-09-20 | 2003-03-28 | Tdk Corp | Method of manufacturing multilayered optical recording medium and apparatus for manufacturing multilayered optical recording medium |
| JP2003099991A (en) * | 2001-09-27 | 2003-04-04 | Tdk Corp | Method and device for manufacturing optical recording medium |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS598177A (en) * | 1982-07-06 | 1984-01-17 | Seiko Epson Corp | Disc clamping mechanism |
| JPS61214273A (en) * | 1985-03-20 | 1986-09-24 | Matsushita Electric Ind Co Ltd | Rotation driving device of disc-shaped recording medium |
-
1986
- 1986-12-09 JP JP61294339A patent/JPS63146265A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS598177A (en) * | 1982-07-06 | 1984-01-17 | Seiko Epson Corp | Disc clamping mechanism |
| JPS61214273A (en) * | 1985-03-20 | 1986-09-24 | Matsushita Electric Ind Co Ltd | Rotation driving device of disc-shaped recording medium |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63146265A (en) | 1988-06-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101375423B1 (en) | Apparatus for liquid treatment of treatment object | |
| JP2845738B2 (en) | Substrate rotation holder for rotary substrate processing equipment | |
| KR100452898B1 (en) | Pattern forming method and method for disposing a chemical liquid | |
| JPH0554187B2 (en) | ||
| CN114649233A (en) | Wafer cleaning device and method for cleaning wafer | |
| JP2000252252A (en) | Spin process equipment and support pin therefor | |
| JPH05253853A (en) | Flake absorber and washing method for flake absorber | |
| JPS63143970A (en) | Substrate mounting stand | |
| JPH0669126A (en) | Wafer periphery cleaner | |
| JP3289208B2 (en) | Cleaning treatment method and cleaning treatment device | |
| JPH04206626A (en) | Removal of peripheral resist | |
| JP3210893B2 (en) | Processing device and processing method | |
| JPH031823B2 (en) | ||
| TWI748279B (en) | Substrate processing apparatus | |
| JP2003051477A (en) | Substrate processing apparatus | |
| JPH11186123A (en) | Development of photosensitive film formed on wafer | |
| KR100591156B1 (en) | Spin coater and method of manufacturing semiconductor device using the same | |
| JPH08290095A (en) | Rotational-type base-coating apparatus | |
| JPH0628224Y2 (en) | Substrate rotation processing device | |
| JPH03256321A (en) | Resist film forming apparatus | |
| KR100217326B1 (en) | Spinner device for semiconductor | |
| JPH01119024A (en) | Resist coater | |
| JPS60121719A (en) | Rotary processor | |
| JPH05283327A (en) | Resist coating device | |
| JPH02284415A (en) | Device for removing resist on periphery of semiconductor wafer |