JPH0551543U - Printed circuit board collection device in printed circuit board processing machine - Google Patents
Printed circuit board collection device in printed circuit board processing machineInfo
- Publication number
- JPH0551543U JPH0551543U JP10617491U JP10617491U JPH0551543U JP H0551543 U JPH0551543 U JP H0551543U JP 10617491 U JP10617491 U JP 10617491U JP 10617491 U JP10617491 U JP 10617491U JP H0551543 U JPH0551543 U JP H0551543U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- substrate
- path
- dust
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Auxiliary Devices For Machine Tools (AREA)
- Feeding Of Workpieces (AREA)
Abstract
(57)【要約】
【目的】切粉の集塵を停止すること無く、かつ切粉とプ
リント基板を分離して回収する。
【構成】集塵機9とプレッシャフットを結ぶ集塵路8
と、集塵路8から分岐し、プレッシャフットの内部に接
続された基板回収路10に一方を開放したとき他方を遮
断するシャッタ11を設け、基板回収路10にフィルタ
12と、端部に弁13を備え基板回収路10から分岐し
た配管14と、この配管14に着脱可能な基板回収箱1
5を設けた。
(57) [Summary] [Purpose] To collect chips separately from the printed circuit board without stopping the dust collection. [Structure] Dust collector 8 connecting the dust collector 9 and the pressure foot
And a shutter 11 that branches from the dust collecting passage 8 and is connected to the inside of the pressure foot to block the other when the other is opened. The substrate collecting passage 10 has a filter 12 and a valve at the end. A pipe 14 provided with a branch 13 from the substrate collection path 10 and a substrate collection box 1 detachable from the pipe 14.
5 is provided.
Description
【0001】[0001]
本考案は、プリント基板加工機により外形加工された一辺が20mm以下の小 さなプリント基板の回収装置に関するものである。 The present invention relates to a device for collecting a printed circuit board having a side of 20 mm or less which is externally processed by a printed circuit board processing machine.
【0002】[0002]
プリント基板は、穴明け、エッチングなどの工程を経て所定の加工が終了した 後、外形を所要の大きさに切りだされ製品となる。 The printed circuit board is a product that has been cut out into the required size after the specified processing is completed after undergoing processes such as drilling and etching.
【0003】 プリント基板の外形を加工するプリント基板加工機として、たとえば、実開平 2−15843号公報に開示されたものが提案されている。 このプリント基板加工機においては、母材からプリント基板を切り離す直前に 、プレッシャフットと集塵機の接続を遮断して、捕捉手段を集塵機に接続する。 そして、母材から切り出されたプリント基板を、捕捉手段で取り上げ、回収箱に 回収するようにしている。なお、プリント基板を母材から切り出すときにプリン ト基板を押さえるプレッシャフットとして、実開昭61−5509号公報に開示 されたプレッシャフットを使用している。As a printed circuit board processing machine for processing the outer shape of a printed circuit board, for example, one disclosed in Japanese Utility Model Laid-Open No. 2-15843 has been proposed. In this printed circuit board processing machine, immediately before the printed circuit board is separated from the base material, the connection between the pressure foot and the dust collector is cut off and the capturing means is connected to the dust collector. Then, the printed circuit board cut out from the base material is picked up by the capturing means and collected in the collection box. The pressure foot disclosed in Japanese Utility Model Laid-Open No. 61-5509 is used as the pressure foot that presses the printed board when cutting the printed board from the base material.
【0004】[0004]
上記のプリント基板加工機においては、プリント基板を切り離す直前に集塵機 とプレッシャフットを遮断するため、切り離すときの切粉が加工部の周辺に飛散 する。このため、次のプリント基板を加工するとき、プレッシャフットのブラシ で切粉をプリント基板に押し付け、プリント基板に圧痕などの損傷を与えること がある。また、切り離されたプリント基板を捕捉手段で取り上げ、回収箱に運ぶ 本考案の目的は、上記の事情に鑑み、切粉の集塵を停止すること無く、かつ切 粉とプリント基板を分離して回収できるようにしたプリント基板加工機における プリント基板の回収装置を提供することにある。 In the above-mentioned printed circuit board processing machine, since the dust collector and the pressure foot are shut off immediately before the printed circuit board is cut off, the cutting chips when cutting are scattered around the processing section. Therefore, when the next printed circuit board is processed, chips may be pressed against the printed circuit board by the brush of the pressure foot, and the printed circuit board may be damaged such as indentations. Further, the separated printed circuit board is picked up by the capturing means and conveyed to the collection box. In view of the above situation, the purpose of the present invention is to separate the printed circuit board from the cutting circuit without stopping the dust collection of the cutting chips. It is an object of the present invention to provide a printed circuit board collection device in a printed circuit board processing machine that enables collection.
【0005】[0005]
上記の目的を達成するため、本考案においては、プリント基板加工機に付設さ れた集塵機とプレッシャフットを結ぶ集塵路から分岐され、前記プレッシャフッ ト内に吸引口を設置した基板回収路を設け、一端に弁を備え、前記基板回収路か ら分岐した配管を設け、この配管に接続された基板回収箱を設け、前記基板回収 路の配管分岐位置の集塵機側に、プリント基板を捕捉し切粉を透過させるフィル タを設け、このフィルタと前記集塵路と基板回収路の分岐位置の間に、集塵路と 基板回収路のいずれか一方を開放したとき他方を遮断するようにしたシャッタを 設け、前記基板回収路に作用する負圧によって前記弁を開閉しするようにした。 In order to achieve the above object, in the present invention, there is provided a substrate collection path having a suction port installed in the pressure foot, which is branched from a dust collection path connecting a pressure collector and a dust collector attached to a printed circuit board processing machine. Provided with a valve at one end, provided with a pipe branched from the substrate recovery passage, provided a substrate recovery box connected to this pipe, and captured the printed circuit board on the dust collector side at the pipe branch position of the substrate recovery passage. A filter that allows chips to pass through is provided, and when one of the dust collection path and the substrate collection path is opened between this filter and the branch position of the dust collection path and the substrate collection path, the other is blocked. A shutter was provided, and the valve was opened and closed by the negative pressure acting on the substrate recovery path.
【0006】[0006]
そして、母材からプリント基板が切り離される直前までは、集塵機とプレッシ ャフットを結ぶ集塵路を通して切粉を吸引する。プリント基板の切り離し直前に シャッタを切り替えて、プレッシャフット内に吸引口を設置した基板回収路を通 して切粉の吸引を行う。この時、基板回収路が負圧になるため弁が吸引され、基 板回収箱の入口を閉じる。この状態で、母材から切り離されたプリント基板を切 粉と共に基板回収路から集塵機に向けて吸込みフィルタで捕捉する。そして、シ ャッタを切り替えることにより、再び、集塵路を通して切粉を吸引することによ り、基板回収路内の負圧を解消し、フィルタに捕捉されたプリント基板を配管を 通して弁上に落下させ基板回収箱に回収する。この時、弁に対する吸引力が解消 されるため、基板回収箱の入口は開いた状態になっている。 Then, until just before the printed circuit board is separated from the base material, the chips are sucked through the dust collection path connecting the dust collector and the pressure foot. Immediately before separating the printed circuit board, the shutter is switched, and the chips are sucked through the substrate collection path with the suction port inside the pressure foot. At this time, the valve is sucked because the substrate recovery path becomes negative pressure, and the inlet of the substrate recovery box is closed. In this state, the printed circuit board separated from the base material is taken together with the cutting chips from the substrate recovery path toward the dust collector and captured by the suction filter. Then, by switching the shutter, suctioning chips again through the dust collection path eliminates the negative pressure in the board recovery path, and the printed circuit board captured by the filter is passed through the piping to be installed on the valve. It is dropped to and collected in the substrate collection box. At this time, the suction force to the valve is released, so the inlet of the substrate recovery box is open.
【0007】[0007]
以下、本考案の一実施例を、図1および図2に基づいて説明する。 同図において、プリント基板1は、母材2から切り離される。プリント基板加 工機のスピンドルユニット3に回転可能に保持されたスピンドル4には、加工用 の工具5が着脱可能に保持されている。プレッシャフット6は、スピンドルユニ ット3に摺動可能に嵌合し、その先端にはブラシ7が固定され、側面には集塵路 8が接続されている。 An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. In the figure, the printed circuit board 1 is separated from the base material 2. A spindle 5 rotatably held by a spindle unit 3 of a printed circuit board processing machine holds a tool 5 for processing in a detachable manner. The pressure foot 6 is slidably fitted to the spindle unit 3, a brush 7 is fixed to the tip of the pressure foot 6, and a dust collecting path 8 is connected to the side surface.
【0008】 集塵機9は、集塵路8に接続されている。基板回収路10は、集塵路8から分 岐され、その吸引口は前記プレッシャフット6の内部に設置されている。シャッ タ11は、集塵路8と基板回収路10を横切るように配置され、一方を開放した とき他方を遮断するようになっている。フィルタ12は、基板回収路10に設け られている。プリント基板1を捕捉でき、切粉を透過させる大きさの穴が形成さ れ、基板回収路10に設けられている。一端に弁13を設けた配管14は、基板 回収路10から分岐している。基板回収箱15は、配管14に着脱可能に接続さ れている。The dust collector 9 is connected to the dust collecting passage 8. The substrate recovery path 10 is branched from the dust collection path 8, and its suction port is installed inside the pressure foot 6. The shutter 11 is arranged so as to cross the dust collecting path 8 and the substrate collecting path 10, and when one is opened, the other is shut off. The filter 12 is provided in the substrate recovery path 10. A hole having a size capable of capturing the printed circuit board 1 and allowing chips to pass therethrough is formed and provided in the substrate recovery path 10. A pipe 14 provided with a valve 13 at one end branches from the substrate recovery path 10. The substrate recovery box 15 is detachably connected to the pipe 14.
【0009】 上記の構成において、集塵機9を作動させ、シャッタ11を集塵路8を開放す る位置に設定した状態で、プレッシャフット6のブラシ7で母材2とプリント基 板1を押さえながら、工具5と母材2をプリント基板1の外形の軌跡に沿って相 対移動させて、プリント基板1の切り出しを行う。そして、プリント基板1が母 材2から切り離される直前になると、シャッタ11が切り替えられて、集塵路8 が遮断され、基板回収路10が開放される。すると、加工部で発生した切粉は、 基板回収路10を通って集塵機9に吸引される。同時に、配管14内が負圧にな るため、弁13が吸引され、配管14の出口を塞ぐ。In the above structure, while the dust collector 9 is operated and the shutter 11 is set to the position where the dust collecting passage 8 is opened, the brush 7 of the pressure foot 6 holds down the base material 2 and the print substrate 1. Then, the tool 5 and the base material 2 are moved relative to each other along the trajectory of the outer shape of the printed board 1 to cut out the printed board 1. Then, just before the printed circuit board 1 is separated from the base material 2, the shutter 11 is switched, the dust collecting path 8 is shut off, and the board collecting path 10 is opened. Then, the chips generated in the processing section are sucked into the dust collector 9 through the substrate recovery path 10. At the same time, since the inside of the pipe 14 has a negative pressure, the valve 13 is sucked and closes the outlet of the pipe 14.
【0010】 この状態で、プリント基板1が母材2から切り離された後、プリント基板1が プレッシャフット6の内側に残るようにプレッシャフット6を移動させ、ブラシ 7による押さえを外す。すると、プリント基板1は基板回収路10に吸い込まれ 、集塵機9に向けて切粉と共に送られて行く。そして、プリント基板1はフィル タ12で捕捉される。この時、切粉はフィルタ12を透過して集塵機9に集めら れる。In this state, after the printed board 1 is separated from the base material 2, the pressure foot 6 is moved so that the printed board 1 remains inside the pressure foot 6, and the pressing by the brush 7 is removed. Then, the printed circuit board 1 is sucked into the substrate collecting path 10 and sent to the dust collector 9 together with the chips. Then, the printed circuit board 1 is captured by the filter 12. At this time, the chips pass through the filter 12 and are collected in the dust collector 9.
【0011】 このようにして、プリント基板1がフィルタ12に捕捉されると、シャッタ1 1が作動して、基板回収路10を遮断し、集塵路8を開放する。すると、基板回 収路10の負圧が解消され、配管14の負圧も解消されるため、弁13が復旧し て配管14の出口を開放する。同時に、プリント基板1に作用していた吸引力が 無くなるため、プリント基板1はフィルタ12から弁13上に落下し、弁13上 を滑って基板回収箱15内に回収される。In this way, when the printed circuit board 1 is captured by the filter 12, the shutter 11 operates to shut off the substrate collecting path 10 and open the dust collecting path 8. Then, the negative pressure in the substrate collecting path 10 is released and the negative pressure in the pipe 14 is also released, so that the valve 13 is restored and the outlet of the pipe 14 is opened. At the same time, since the suction force acting on the printed circuit board 1 disappears, the printed circuit board 1 drops from the filter 12 onto the valve 13 and slides on the valve 13 to be recovered in the substrate recovery box 15.
【0012】[0012]
以上述べた如く、本考案によれば、プリント基板加工機に付設された集塵機と プレッシャフットを結ぶ集塵路から分岐され、前記プレッシャフット内に吸引口 を設置した基板回収路を設け、一端に弁を備え、前記基板回収路から分岐した配 管を設け、この配管に接続された基板回収箱を設け、前記基板回収路の配管分岐 位置の集塵機側に、プリント基板を捕捉し切粉を透過させるフィルタを設け、こ のフィルタと前記集塵路と基板回収路の分岐位置の間に、集塵路と基板回収路の いずれか一方を開放したとき他方を遮断するようにしたシャッタを設け、前記基 板回収路に作用する負圧によって前記弁を開閉しするようにしたので、切粉の集 塵を停止すること無く、かつ切粉とプリント基板を分離して回収することができ る。 As described above, according to the present invention, a substrate collection path is provided which is branched from the dust collection path connecting the dust collector attached to the printed circuit board processing machine and the pressure foot, and the suction port is installed in the pressure foot. Provided with a valve, a pipe branched from the substrate collection passage, and a substrate collection box connected to this pipe were provided.The printed circuit board was captured on the dust collector side at the pipe branch position of the substrate collection passage to permeate chips. A filter is provided, and a shutter is provided between the filter and the branch position of the dust collection path and the substrate collection path so that when one of the dust collection path and the substrate collection path is opened, the other is shut off. Since the valve is opened and closed by the negative pressure acting on the substrate collecting path, the chips and the printed circuit board can be separated and collected without stopping the collection of the chips.
【図1】本考案におけるプリント基板の回収装置の集塵
機側の構成を示す構成図。FIG. 1 is a configuration diagram showing a configuration on a dust collector side of a printed circuit board recovery device according to the present invention.
【図2】本考案におけるプリント基板の回収装置の加工
機側の構成を示す構成図。FIG. 2 is a configuration diagram showing a configuration of a processing machine side of a printed circuit board recovery device according to the present invention.
1 プリント基板、6 プレッシャフット、9
集塵路、10 基板回収路、 11 シャッタ、
12 フィルタ、13 弁、 14 配管
15 基板回収箱、1 printed circuit board, 6 pressure foot, 9
Dust collection path, 10 substrate recovery path, 11 shutter,
12 filters, 13 valves, 14 piping
15 PCB recovery box,
Claims (1)
プレッシャフットを結ぶ集塵路から分岐され、前記プレ
ッシャフット内に吸引口を設置した基板回収路を設け、
一端に弁を備え、前記基板回収路から分岐した配管を設
け、この配管に接続された基板回収箱を設け、前記基板
回収路の配管分岐位置の集塵機側に、プリント基板を捕
捉し切粉を透過させるフィルタを設け、このフィルタと
前記集塵路と基板回収路の分岐位置の間に、集塵路と基
板回収路のいずれか一方を開放したとき他方を遮断する
ようにしたシャッタを設け、前記基板回収路に作用する
負圧によって前記弁を開閉しするようにしたことを特徴
とするプリント基板加工機におけるプリント基板の回収
装置。1. A substrate collection path is provided which is branched from a dust collection path connecting a pressure collector and a dust collector attached to a printed circuit board processing machine, and a suction port is installed in the pressure foot.
A valve is provided at one end, a pipe branched from the substrate collection path is provided, a substrate collection box connected to this pipe is provided, and the printed circuit board is captured on the dust collector side of the piping branch position of the substrate collection path to collect chips. A filter that allows light to pass through is provided between the branch position of the filter and the dust collecting path and the substrate collecting path, and a shutter that blocks the other of the dust collecting path and the substrate collecting path when the other is opened, A printed circuit board collecting device in a printed circuit board processing machine, wherein the valve is opened and closed by a negative pressure acting on the substrate collecting path.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10617491U JPH0551543U (en) | 1991-12-24 | 1991-12-24 | Printed circuit board collection device in printed circuit board processing machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10617491U JPH0551543U (en) | 1991-12-24 | 1991-12-24 | Printed circuit board collection device in printed circuit board processing machine |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0551543U true JPH0551543U (en) | 1993-07-09 |
Family
ID=14426890
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10617491U Withdrawn JPH0551543U (en) | 1991-12-24 | 1991-12-24 | Printed circuit board collection device in printed circuit board processing machine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0551543U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002092305A1 (en) * | 2001-05-14 | 2002-11-21 | Citizen Watch Co., Ltd. | Device and method for product collection |
-
1991
- 1991-12-24 JP JP10617491U patent/JPH0551543U/en not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002092305A1 (en) * | 2001-05-14 | 2002-11-21 | Citizen Watch Co., Ltd. | Device and method for product collection |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19960404 |