JPH0550422A - Cutting method by means of multiwire saw - Google Patents
Cutting method by means of multiwire sawInfo
- Publication number
- JPH0550422A JPH0550422A JP23414491A JP23414491A JPH0550422A JP H0550422 A JPH0550422 A JP H0550422A JP 23414491 A JP23414491 A JP 23414491A JP 23414491 A JP23414491 A JP 23414491A JP H0550422 A JPH0550422 A JP H0550422A
- Authority
- JP
- Japan
- Prior art keywords
- work
- cut
- wire
- cutting
- reinforcing member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】この発明は半導体材料、セラミッ
クス等の脆性材料をワイヤと砥粒により薄板の多数のウ
エハに切断するマルチワイヤソー(以下説明の便宜上
「ワイヤソー」と略称する)に係り、特に切断中の被切
断物(以下「ワーク」と称する)の割れを防止し切断コ
ストおよび材料費の低減をはかる切断方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-wire saw for cutting brittle materials such as semiconductor materials and ceramics into a large number of thin wafers by wires and abrasive grains (hereinafter, simply referred to as "wire saw" for convenience of description), The present invention relates to a cutting method for preventing breakage of an object to be cut (hereinafter referred to as "workpiece") during cutting to reduce cutting cost and material cost.
【0002】[0002]
【従来の技術】ワイヤソーは、所定ピッチのワイヤ列に
ワークを押し付け、砥粒を含む加工液(以下「砥液」と
称する)を注ぎつつワイヤとワークを相対運動せしめ、
研削作用によって多数のウエハに切断する装置である。
図4は一般的なワイヤソーの切断部を例示したもので、
回転自在に保持された3個の溝ローラ1、2、3の外周
面に所定ピッチで刻設された多数のリング状の溝に1本
のワイヤ4を巻き付けて所定ピッチのワイヤ列5を形成
し、このワイヤ列を往復あるいは一方向に走行せしめ、
ワーク6に砥液7をかけながらワーク押上台10を徐々
に上昇させて切断していく。ワーク6にはセラミック
ス、ガラス等の脆性材料製のダミー板8が接着されてお
り、ダミー板8はワーク押上台10に締付ネジ11にて
着脱自在に取り付けられた鋼製のベース9に接着されて
いる。2. Description of the Related Art A wire saw presses a work against a row of wires having a predetermined pitch, and pours a working liquid containing abrasive grains (hereinafter referred to as "abrasive liquid") to move the wire and the work relative to each other.
It is a device that cuts a large number of wafers by a grinding action.
FIG. 4 shows an example of a cutting part of a general wire saw,
A wire row 5 having a predetermined pitch is formed by winding one wire 4 around a large number of ring-shaped grooves engraved at a predetermined pitch on the outer peripheral surfaces of three groove rollers 1, 2 and 3 rotatably held. Then, let this wire row travel back and forth or in one direction,
While the polishing liquid 7 is applied to the work 6, the work push-up base 10 is gradually raised and cut. A dummy plate 8 made of a brittle material such as ceramics or glass is adhered to the work 6, and the dummy plate 8 is adhered to a steel base 9 which is detachably attached to the work push-up base 10 with a tightening screw 11. Has been done.
【0003】図5はワイヤ列5がダミー板8の厚み中央
付近まで切込んだ状態を示すもので、図(A)は斜視
図、図(B)は一部拡大正面図である。この段階でワー
ク6は両端のワーク余長部6−2と、所定幅t1の多数
の製品ウエハ6−1に切断されている。ワイヤ4の切込
みによって形成された溝12には砥粒が充満している。
ここで、ウエハ6−1の採取方法としては、例えばワイ
ヤ列5を低速で走行させながらワーク押上台10を降下
せしめワイヤ列5とワーク6を分離し、固定ボルト11
を緩めてベース9を押上台10から取外し、片端の余長
部6−2から順にダミー板8の根元部まで折り取る方法
によって採取することができる。FIGS. 5A and 5B show a state in which the wire array 5 is cut to near the center of the thickness of the dummy plate 8. FIG. 5A is a perspective view and FIG. 5B is a partially enlarged front view. At this stage, the work 6 is cut into the work surplus portions 6-2 at both ends and a large number of product wafers 6-1 having a predetermined width t 1 . Abrasive grains are filled in the groove 12 formed by cutting the wire 4.
Here, as a method of collecting the wafer 6-1, for example, while the wire row 5 is traveling at a low speed, the work push-up base 10 is lowered to separate the wire row 5 and the work 6, and the fixing bolt 11 is used.
Can be removed by loosening the base 9 to remove the base 9 from the push-up base 10, and then the base 9 of the dummy plate 8 can be sequentially folded from the extra length portion 6-2 at one end.
【0004】[0004]
【発明が解決しようとする課題】ところで、1個のワー
ク6から可及的に多くの製品ウエハ6−1を採取しよう
とすれば、両端の余長部6−2の厚さt2が薄くなる。
ワーク6が脆性材料でかつ製品ウエハ6−1の断面積が
大きい場合、t2が薄いと切断途中で余長部6−2が割
れるおそれがある。図6は切断途中の余長部6−2およ
び製品ウエハ6−1の厚さ方向に作用する力を示す。す
なわち、ワイヤ4が走行している部位では、溝12内の
砥粒がワイヤ4の動きと共に走行しワークを研削してい
くので、水平方向に力f1が作用する。また、溝12の
側面には充満した砥液の圧力の合力としての水平方向の
力f2も作用する。f1は溝12の深さによらず一定と考
えられるが、f2は溝12が深くなるにつれて増加す
る。製品ウエハ6−1に関しては、f1、f2共に両側か
ら作用するので、f1、f2によって製品ウエハ6−1が
割れることはない。一方、余長部6−2は片側からのみ
f1、f2を受けるので、図6に示す矢印イの部分で割れ
ることがある。いったん割れが発生すると、端の溝12
から端の製品ウエハ6−1に作用する砥液の圧力がゼロ
となるので、端の製品ウエハ6−1は片側からのみ力f
2を受けることになる。このf2によって製品ウエハ6−
1に割れが発生すると、連鎖反応的に順次製品ウエハ6
−1に割れが発生し、被害が拡大していく。そして、製
品ウエハ6−1が採取不能となるばかりか、それまでの
切断に要した工数が無駄となり、場合によっては割れた
ワークの切れ端が飛散し、ワイヤソーを損傷することも
ある。なお、上記のような割れはマルチワイヤソーのみ
ならず、マルチブレードソーでも発生することがあり、
砥液を使用して多数枚の切断を同時に行う場合に共通の
問題である。By the way, when trying to collect as many product wafers 6-1 as possible from one work 6, the thickness t 2 of the extra length portions 6-2 at both ends is thin. Become.
When the work 6 is a brittle material and the product wafer 6-1 has a large cross-sectional area, if the t 2 is thin, the extra length portion 6-2 may be broken during cutting. FIG. 6 shows forces acting in the thickness direction of the extra length portion 6-2 and the product wafer 6-1 during cutting. That is, in the part where the wire 4 is running, the abrasive grains in the groove 12 run along with the movement of the wire 4 and grind the work, so that the force f 1 acts in the horizontal direction. Further, a horizontal force f 2 acting on the side surface of the groove 12 as a resultant force of the pressure of the filled polishing liquid also acts. It is considered that f 1 is constant regardless of the depth of the groove 12, but f 2 increases as the groove 12 becomes deeper. Since both f 1 and f 2 act on both sides of the product wafer 6-1, the product wafer 6-1 is not cracked by f 1 and f 2 . On the other hand, since the extra length portion 6-2 receives f 1 and f 2 from only one side, the extra length portion 6-2 may be broken at the portion indicated by the arrow a in FIG. Once cracks occur, the groove 12 at the end
Since the pressure of the polishing liquid acting on the product wafer 6-1 at the edge becomes zero, the product wafer 6-1 at the edge has a force f from only one side.
You will receive 2 . The product wafer by the f 2 6-
When cracks occur in No. 1, product wafers 6 are successively produced in a chain reaction.
-1 will crack and the damage will spread. Then, not only the product wafer 6-1 becomes uncollectible, but also the man-hours required for the cutting up to that point are wasted, and in some cases, the broken pieces of the work are scattered and the wire saw may be damaged. Incidentally, the crack as described above may occur not only in the multi-wire saw but also in the multi-blade saw,
This is a common problem when a large number of pieces are cut at the same time by using a polishing liquid.
【0005】この発明は特にマルチワイヤソーにおける
上記の問題を解決すべく、一つの素材ワークから可及的
に多数の製品ウエハを採取するために端部の余長部を薄
くしても、切断中に余長部および製品ウエハに割れが発
生しないように切断することができる切断方法を提案し
ようとするものである。In order to solve the above-mentioned problems in a multi-wire saw, the present invention is capable of collecting as many product wafers as possible from a single material work, even if the extra length of the end portion is thinned, while cutting. In addition, the present invention intends to propose a cutting method capable of cutting the surplus length portion and the product wafer without cracking.
【0006】[0006]
【課題を解決するための手段】この発明に係るマルチワ
イヤソーによる切断方法は、切断途中においてワークの
余長部に作用する外方向の力による当該余長部の割れを
防止する手段として、上記外方向の力に対抗し得る力を
ワークの端面に付与しようとするもので、その要旨は、
ワークの端面に補強部材を配して切断する方法であり、
またワークの端面と相対向する位置に離接可能に設けた
面板を当該ワークの端面に当接させて切断する方法であ
る。A cutting method using a multi-wire saw according to the present invention is a means for preventing cracking of a surplus length portion of a work due to an outward force acting on the surplus length portion during cutting. It aims to give a force that can counter the force in the direction to the end surface of the work, the gist of which is
It is a method of placing a reinforcing member on the end surface of the work and cutting it.
Further, it is a method in which a face plate provided so as to be separable at a position facing the end face of the work is brought into contact with the end face of the work to cut.
【0007】[0007]
【作用】補強部材、面板はワーク余長部が切断途中で外
側に折れるのを防止するために設けるもので、補強部材
はワークに直接接着するか、あるいはワークに接着され
ているダミー材、またはワーク押上台に締付ネジにて取
付けられている鋼製ベースに接着手段にて取付けること
ができ、また面板は鋼製ベースにマグネット等を用いて
取付けることができる。補強部材の材質は、ワークと接
着できて必要な剛性を有するものであればワークと同一
の材質である必要はなく、また大きさはワーク余長部が
外側に折れるのを防止し得る剛性を満足すれば、ワーク
の端面全体をカバーする寸法である必要はない。The reinforcing member and the face plate are provided to prevent the surplus portion of the work from breaking outward during cutting. The reinforcing member is directly bonded to the work, or a dummy material bonded to the work, or The work base can be attached to a steel base attached to the work lifting base with a tightening screw by an adhesive means, and the face plate can be attached to the steel base using a magnet or the like. The material of the reinforcing member does not have to be the same as that of the workpiece as long as it can bond to the workpiece and has the required rigidity, and the size of the reinforcing member must be sufficient to prevent the extra length of the workpiece from bending outward. If satisfied, the size does not need to cover the entire end surface of the work.
【0008】面板の取付手段としては、例えば面板をロ
ッドの先端に取付け、該ロッドを軸受台に前後にスライ
ド可能に取付け、締付ネジ等にて固定する方式を採用す
ることができる。なお、軸受台は鋼製ベースに吸着する
マグネットベースに設けることができる。マグネットベ
ースを用いると鋼製ベースとの着脱が容易である。As a means for attaching the face plate, for example, a face plate may be attached to the tip of the rod, the rod may be attached to the bearing base so as to be slidable back and forth, and fixed by a tightening screw or the like. The bearing stand can be provided on the magnet base that attracts the steel base. Using a magnet base makes it easy to attach and detach it from a steel base.
【0009】ワーク端面に補強部材を設けてワークの切
断を行う際、切断途中で余長部6−2に外向きの力が作
用した場合、補強部材にてその力に抗することができる
ことにより、余長部が折れることはない。また、ワーク
端面に面板を当接させてワークの切断を行う際、切断途
中で余長部6−2に外向きの力が作用した場合、余長部
の端面が面板にて支持されているため、余長部が折れる
ことはない。When a reinforcing member is provided on the end face of the work and the work is cut, when an outward force is applied to the extra length portion 6-2 during cutting, the reinforcement member can withstand the force. , The extra length does not break. Further, when the face plate is brought into contact with the work end face to cut the work, when an outward force is applied to the extra length portion 6-2 during cutting, the end face of the extra length portion is supported by the face plate. Therefore, the extra length portion does not break.
【0010】[0010]
【実施例】図1はワーク端面に補強部材を配して切断中
のワーク余長部の折れを防止する方法の一例であり、図
(A)は正面図、図(B)は側面図、図(C)はワイヤ
がダミー板の途中まで切込んだ状態の一部を示す正面図
であり、13は補強部材である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an example of a method of arranging a reinforcing member on the end face of a work to prevent breakage of a work surplus portion during cutting. FIG. 1A is a front view, FIG. FIG. 6C is a front view showing a part of a state in which the wire is cut in the middle of the dummy plate, and 13 is a reinforcing member.
【0011】すなわち、図1はダミー板8の部分に補強
部材14を設けて切断する方法を例示したもので、補強
部材13はダミー板8の端部に立設するとともに、接着
剤にてワーク6の端面6´に接着する。この補強部材1
3の高さhはワーク6の高さと同一にする必要はなく、
図1(C)においてワーク余長部6−2が当該補強部材
13の上端面13−1より上の位置で折れない範囲で低
くできる。また、補強部材13の幅w、厚さtはワーク
余長部6−2の折れが発生しないように剛性を考慮して
決定すればよい。勿論、単一に限らず、数個の補強部材
を用い、全体として必要な剛性を持たせてもよい。補強
部材の材質としては特に限定するものではないが、アル
ミニウム製が一般的である。That is, FIG. 1 exemplifies a method of cutting the dummy plate 8 by providing a reinforcing member 14 on the dummy plate 8, and the reinforcing member 13 is erected on the end of the dummy plate 8 and is bonded with an adhesive. 6 is attached to the end face 6 '. This reinforcing member 1
The height h of 3 does not have to be the same as the height of the work 6,
In FIG. 1C, the work surplus portion 6-2 can be lowered in a range where it does not break at a position above the upper end surface 13-1 of the reinforcing member 13. Further, the width w and the thickness t of the reinforcing member 13 may be determined in consideration of the rigidity so that the work surplus portion 6-2 is not bent. Of course, it is not limited to a single piece, and several reinforcing members may be used to give necessary rigidity as a whole. The material of the reinforcing member is not particularly limited, but is generally made of aluminum.
【0012】また、補強部材13の底部13−2はダミ
ー板8に接着した方が補強効果が大きいが、補強部材の
厚さtが大きければ当該底部が外向きの倒れを防ぐ働き
をするので、補強部材底部とダミー板8との接着は省略
するか、あるいは接着剤を塗布する面積を最小限にする
ことが好ましい。これは、切断終了後に製品ウエハ6−
1を採取するに際して、補強部材13が接着されている
余長部6−2をダミー板8から取外す手間を減らすこと
ができるからである。他方、補強部材13の厚さtが小
さい場合はダミー板8からの離脱が容易であるので、補
強部材底部13−2とダミー板8の接着は問題ない。な
お、補強部材13は図2に示すように、ダミー板8の上
に限らず、鋼製ベース9上に設けてもよい。Further, the bottom portion 13-2 of the reinforcing member 13 has a larger reinforcing effect when it is adhered to the dummy plate 8. However, if the thickness t of the reinforcing member is large, the bottom portion functions to prevent outward collapse. It is preferable that the bonding between the bottom of the reinforcing member and the dummy plate 8 is omitted, or the area where the adhesive is applied is minimized. This is the product wafer 6-
This is because it is possible to reduce the labor for removing the extra length portion 6-2 to which the reinforcing member 13 is bonded from the dummy plate 8 when collecting 1. On the other hand, when the thickness t of the reinforcing member 13 is small, the reinforcing member bottom portion 13-2 and the dummy plate 8 can be adhered to each other easily because they can be easily separated from the dummy plate 8. The reinforcing member 13 may be provided not only on the dummy plate 8 but also on the steel base 9, as shown in FIG.
【0013】図3はワーク端面に面板を当接させて切断
中のワーク余長部の折れを防止する方法の一例であり、
図(A)は正面図、図(B)は側面図、図(C)は切断
途中の状態の一部を示す側面図であり、14は面板支持
装置、14−1は面板、14−2は支持ロッド、14−
3は軸受、14−4は締付ネジ、14−5はマグネット
ベースである。FIG. 3 shows an example of a method for preventing the breakage of the surplus work portion during cutting by bringing a face plate into contact with the end face of the work.
Drawing (A) is a front view, Drawing (B) is a side view, Drawing (C) is a side view showing a part of state in the middle of cutting, 14 is a face plate support device, 14-1 is a face plate, 14-2 Is a support rod, 14-
3 is a bearing, 14-4 is a tightening screw, and 14-5 is a magnet base.
【0014】すなわち、この方法は面板14−1と一体
の支持ロッド14−2を軸受14−3にて前後にスライ
ド可能に支持し、面板14−1をワーク6の端面6´に
当接させた位置で支持ロッド14−2を締付ネジ14−
4にて固定する構造で、かつマグネットベース14−5
を介して鋼製ベース9の上に着脱可能となしたものであ
る。面板14−1はワーク端面全体をカバーする大きさ
を有する必要はなく、切断中に面板14−1が当接して
いない部分のワーク余長部に割れが発生しない大きさで
あればよい。また、面板14−1をセットする場合は、
ワーク6に押付力が発生しないように面板14−1をワ
ーク端面6´に当接させる。これは、ワーク6に押付力
が加わると、切断途中でワーク余長部6−2が内側に向
かって折れ、製品ウエハ6−1に被害が及ぶおそれが生
じるためである。なお、マグネットベース14−5を用
いたのは、切断終了後の面板支持装置14の取外しを簡
易化するためと、製品ウエハ6−1の採取を容易にする
ためである。面板14−1の材質としては特に限定する
ものではないが、前記補強部材と同様アルミニウム製が
一般的である。That is, according to this method, the support rod 14-2 integrated with the face plate 14-1 is supported by the bearing 14-3 so as to be slidable back and forth, and the face plate 14-1 is brought into contact with the end face 6'of the work 6. Tighten the support rod 14-2 at the closed position.
It is a structure fixed by 4, and the magnet base 14-5
It is made detachable on the steel base 9 via. The face plate 14-1 does not need to have a size that covers the entire end face of the work, and may be of a size that does not cause cracking in the work surplus portion of the portion which is not in contact with the face plate 14-1 during cutting. When setting the face plate 14-1,
The face plate 14-1 is brought into contact with the work end surface 6 ′ so that the pressing force is not generated on the work 6. This is because, if a pressing force is applied to the work 6, the work surplus portion 6-2 is bent inward during cutting, and the product wafer 6-1 may be damaged. The magnet base 14-5 is used for the purpose of simplifying the removal of the face plate supporting device 14 after completion of cutting and facilitating the collection of the product wafer 6-1. Although the material of the face plate 14-1 is not particularly limited, it is generally made of aluminum like the reinforcing member.
【0015】実施例1 図1の方法により、端面寸法240mm×240mm、
長さ100mmの石英ワークを、平面寸法240mm×
180mm、厚さ10mmのガラス製ダミー板に接着
し、さらにワーク端面とダミー板に幅w=20mm、高
さh=200mm、厚さt=30mmのアルミニウム製
補強部材を接着し、直径0.2mmのピアノ線を2mm
ピッチで溝ローラに巻付けて49本のワイヤ列を形成し
たワイヤソーのワーク押上台上の鋼製ベースに前記ダミ
ー板を接着し、該ワーク加工部に炭化硅素製の平均粒径
30μmの砥粒を混合した砥液を滴下しつつ、該ワイヤ
列を400m/分の速度で一方向に高速走行させながら
ワーク押上台を徐々に上昇せしめ、両端に厚さt2=
1.85mmの余長部を残して切断した結果、余長部に
割れを生じることなく、厚さt1=1.7mmの製品ウ
エハを48枚同時に切断することができた。Example 1 According to the method shown in FIG. 1, end face dimensions of 240 mm × 240 mm,
A quartz work with a length of 100 mm, with a plane dimension of 240 mm ×
180 mm, 10 mm thick glass dummy plate is bonded, and further, the work end surface and the dummy plate are bonded with an aluminum reinforcing member having a width w = 20 mm, a height h = 200 mm, and a thickness t = 30 mm, and a diameter of 0.2 mm. 2mm of piano wire
The dummy plate is adhered to a steel base on a work push-up base of a wire saw in which 49 wire rows are formed by winding the groove roller at a pitch, and an abrasive grain made of silicon carbide having an average particle diameter of 30 μm is attached to the work processed portion. While dripping the abrasive liquid mixed with, while moving the wire row at a speed of 400 m / min in one direction at a high speed, the work lifting platform is gradually raised, and the thickness t 2 =
As a result of cutting with an extra length of 1.85 mm left, 48 product wafers with a thickness t 1 = 1.7 mm could be cut at the same time without cracking in the extra length.
【0016】これに対し、補強部材を使用せずに同一ワ
ークを切断する場合には、切断途中での余長部の割れを
防止するために余長部の厚さt2を少なくとも7〜8m
mにする必要があり、製品ウエハの切断枚数は42枚が
限界であった。On the other hand, when cutting the same work without using the reinforcing member, the thickness t 2 of the extra length portion is at least 7 to 8 m in order to prevent cracking of the extra length portion during cutting.
The number of product wafers to be cut is 42.
【0017】実施例2 図1の方法により、端面寸法が直径200mm、長さ2
00mm、円筒外面上に全長にわたって幅60mmの平
坦面を有するシリコンワークの該平坦面を、平面寸法7
0mm×260mm、厚さ15mmのセラミック製ダミ
ー板に接着し、さらに該ワーク端面とダミー板に幅w=
10mm、厚さt=30mm、高さh=150mmのア
ルミニウム製補強部材を接着し、直径0.2mmのピア
ノ線を1.15mmピッチで溝ローラに巻付けて173
本のワイヤ列を形成したワイヤソーのワーク押上台上の
鋼製ベースに前記ダミー板を接着し、ワーク加工部に実
施例1と同じ砥液を滴下しつつ、該ワイヤ列を500m
/分の速度で一方向に高速走行させながらワーク押上台
を徐々に上昇させて、両端に厚さt2=0.95mmの
余長部を残して切断した結果、厚さt1=0.85mm
の製品ウエハを172枚同時に切断することができた。Example 2 According to the method of FIG. 1, the end face has a diameter of 200 mm and a length of 2
00 mm, the flat surface of the silicon work having a flat surface with a width of 60 mm on the outer surface of the cylinder was measured with a plane dimension 7
It is bonded to a ceramic dummy plate having a thickness of 0 mm × 260 mm and a thickness of 15 mm, and a width w = on the end face of the work and the dummy plate.
An aluminum reinforcing member having a thickness of 10 mm, a thickness of t = 30 mm, and a height of h = 150 mm is adhered, and a piano wire having a diameter of 0.2 mm is wound around a groove roller at a pitch of 1.15 mm to make 173.
The dummy plate is adhered to a steel base on a work push-up base of a wire saw on which a plurality of wire rows is formed, and the same row of the polishing liquid as in Example 1 is dropped onto the work processing section, and the wire row is moved to 500 m.
/ While one direction at a high speed travel at a rate gradually increased the work pushing stand, as a result of cutting, leaving the elongated portion of the thickness t2 = 0.95 mm on both ends, the thickness t 1 = 0.85 mm
It was possible to cut 172 product wafers at the same time.
【0018】これに対し、補強部材を使用せずに同一ワ
ークを切断する場合は、切断途中での余長部の割れを防
止するために余長部の厚さt2を少なくとも3〜4mm
にする必要があり、製品ウエハの切断枚数は168枚が
限度であった。On the other hand, when cutting the same work without using the reinforcing member, the thickness t 2 of the extra length portion is at least 3 to 4 mm in order to prevent cracking of the extra length portion during cutting.
The number of product wafers to be cut was 168.
【0019】実施例3 図3の方法により、端面寸法200mm×200mm、
長さ100mmのセラミックスワークを平面寸法200
mm×100mm、厚さ10mmのガラス製ダミー板に
接着するとともに、直径0.2mmのピアノ線を1.8
mmピッチで溝ローラに巻付けて55本のワイヤ列を形
成したワイヤソーのワーク押上台上の鋼製ベースに前記
ダミー板を接着し、直径100mmの面板を有する支持
装置を前記鋼製ベースに固定して当該面板を前記ワーク
の端面に当接させた状態で、ワーク加工部に実施例1と
同じ砥液を滴下しつつ、ワイヤ列を600m/分の速度
一方向に高速走行させながらワーク押上台を徐々に上昇
させて、両端に厚さt2=1.25mmの余長部を残し
て切断した結果、厚さt1=1.5mmの製品ウエハを
54枚同時に切断することができた。Example 3 According to the method of FIG. 3, end face dimensions of 200 mm × 200 mm,
A ceramic work piece with a length of 100 mm has a plane dimension of 200.
mm × 100 mm, 10 mm thick glass dummy plate, and 0.2 mm diameter piano wire 1.8
The dummy plate is adhered to the steel base on the work lifting table of the wire saw that is wound around the groove roller at a pitch of 55 mm to form a row of 55 wires, and a supporting device having a face plate with a diameter of 100 mm is fixed to the steel base. Then, with the face plate in contact with the end face of the work, the same polishing liquid as in Example 1 is dropped onto the work processing part, and the wire row is run at a speed of 600 m / min in one direction at a high speed to push up the work. As a result of gradually raising the table and cutting with leaving an extra length portion with a thickness t 2 = 1.25 mm at both ends, 54 product wafers with a thickness t 1 = 1.5 mm could be cut at the same time. ..
【0020】これに対し、面板を使用せずに切断する場
合には、切断途中での余長部の割れを防止するために余
長部の厚さt2を少なくとも3〜4mmにする必要があ
り、製品ウエハの切断枚数は52枚が限度であった。On the other hand, when cutting without using the face plate, the thickness t 2 of the extra length portion must be at least 3 to 4 mm in order to prevent cracking of the extra length portion during cutting. There was a limit of 52 product wafers to be cut.
【0021】[0021]
【発明の効果】以上説明したごとく、この発明方法によ
れば、マルチワイヤソーによる脆性材料の切断に際し、
ワーク両端の余長部を薄厚に設定しても切断途中におけ
る当該余長部の割れまたは折れを防止できるので、一つ
のワークから採取し得る製品ウエハの枚数を増加し、製
品ウエハ1枚あたりの切断コストを低減することができ
る。また、製品ウエハの枚数を一定とすれば、素材ワー
クの長さを減縮できるので、材料費を低減できる。な
お、この発明はマルチワイヤソーに限らず、マルチブレ
ードソー等多数枚を同時切断する方法にも適用できる。As described above, according to the method of the present invention, when cutting a brittle material with a multi-wire saw,
Even if the extra lengths at both ends of the work are set to be thin, it is possible to prevent cracks or breaks in the extra length during cutting, so the number of product wafers that can be taken from one work is increased, and The cutting cost can be reduced. Further, if the number of product wafers is constant, the length of the material work can be reduced, so that the material cost can be reduced. The present invention is not limited to the multi-wire saw, and can be applied to a method of simultaneously cutting a large number of blades such as a multi-blade saw.
【図1】この発明の請求項1に対応する実施例を示す図
で、(A)は正面図、(B)は側面図、(C)は切断完
了の状態の一部を示す側面図である。FIG. 1 is a view showing an embodiment corresponding to claim 1 of the present invention, (A) is a front view, (B) is a side view, and (C) is a side view showing a part of a state in which cutting is completed. is there.
【図2】この発明の請求項1に対応する他の実施例を示
す図で、(A)は正面図、(B)は側面図である。FIG. 2 is a view showing another embodiment corresponding to claim 1 of the present invention, (A) is a front view and (B) is a side view.
【図3】この発明の請求項2に対応する実施例を示す図
で、(A)は正面図、(B)は側面図、(C)は切断途
中の状態の一部を示す側面図である。FIG. 3 is a view showing an embodiment corresponding to claim 2 of the present invention, (A) is a front view, (B) is a side view, and (C) is a side view showing a part of a state during cutting. is there.
【図4】一般的なマルチワイヤソーの切断加工部を例示
した斜視図である。FIG. 4 is a perspective view exemplifying a cutting processing portion of a general multi-wire saw.
【図5】同上マルチワイヤソーでの切断完了の状態を示
す図で、(A)は斜視図、(B)は一部を拡大して示す
側面図である。5A and 5B are diagrams showing a state of completion of cutting with the same multi-wire saw, in which FIG. 5A is a perspective view and FIG. 5B is a partially enlarged side view.
【図6】同上マルチワイヤソーにおける切断途中のワー
ク余長部および製品ウエハに作用する力の説明図であ
る。FIG. 6 is an explanatory diagram of forces acting on a work surplus portion and a product wafer during cutting in the same multi-wire saw.
1、2、3 溝ローラ 4 ワイヤ 5 ワイヤ列 6 ワーク 6−1 製品ウエハ 6−2 ワーク余長部 8 ダミー板 9 鋼製ベース 13 補強部材 14 面板支持装置 14−1 面板 1, 2 and 3 groove roller 4 wire 5 wire row 6 work 6-1 product wafer 6-2 work surplus portion 8 dummy plate 9 steel base 13 reinforcing member 14 face plate support device 14-1 face plate
Claims (2)
含む加工液を供給し、当該ワイヤが形成する所定ピッチ
のワイヤ列に被切断物を押しつけながら研削作用によっ
て多数のウエハに切断するマルチワイヤソーにおいて、
被切断物の端面に補強部材を配して切断することを特徴
とするマルチワイヤソーによる切断方法。1. A cutting fluid is supplied between a traveling wire and an object to be cut, and the object to be cut is ground into a number of wafers by a grinding action while pressing the object to be cut against a wire row of a predetermined pitch formed by the wire. In the multi-wire saw
A cutting method using a multi-wire saw, which comprises arranging a reinforcing member on an end surface of an object to be cut.
含む加工液を供給し、当該ワイヤが形成する所定ピッチ
のワイヤ列に被切断物を押しつけながら研削作用によっ
て多数のウエハに切断するマルチワイヤソーにおいて、
被切断物の端面と相対向する位置に離接可能に設けた面
板を被切断物の端面に当接させて切断することを特徴と
するマルチワイヤソーによる切断方法。2. A cutting fluid is supplied between a running wire and an object to be cut, and the object to be cut is pressed against a wire row of a predetermined pitch formed by the wire to cut into a large number of wafers by a grinding action. In the multi-wire saw
A method for cutting with a multi-wire saw, characterized in that a face plate provided so as to be separable at a position facing the end surface of the object to be cut is brought into contact with the end surface of the object to be cut.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23414491A JPH0550422A (en) | 1991-08-20 | 1991-08-20 | Cutting method by means of multiwire saw |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23414491A JPH0550422A (en) | 1991-08-20 | 1991-08-20 | Cutting method by means of multiwire saw |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0550422A true JPH0550422A (en) | 1993-03-02 |
Family
ID=16966336
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23414491A Pending JPH0550422A (en) | 1991-08-20 | 1991-08-20 | Cutting method by means of multiwire saw |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0550422A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009072176A1 (en) * | 2007-12-03 | 2009-06-11 | Mitsubishi Electric Corporation | Multiwirer saw and cutting method of ingot |
JP2009196001A (en) * | 2008-02-19 | 2009-09-03 | Seiko Instruments Inc | Method for production of wafer |
CN102079113A (en) * | 2010-11-25 | 2011-06-01 | 保定天威英利新能源有限公司 | Equipment and method for solving squaring quality problem of silicon ingot |
CN109605590A (en) * | 2018-10-23 | 2019-04-12 | 无锡斯贝尔磁性材料有限公司 | A kind of diamond wire saw product viscose glue tool fixture |
CN109747057A (en) * | 2019-02-14 | 2019-05-14 | 厦门芯光润泽科技有限公司 | Silicon carbide crystal bar multi-line cutting method |
CN109866347A (en) * | 2019-02-14 | 2019-06-11 | 厦门芯光润泽科技有限公司 | Silicon carbide crystal bar multi-line cutting method |
-
1991
- 1991-08-20 JP JP23414491A patent/JPH0550422A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009072176A1 (en) * | 2007-12-03 | 2009-06-11 | Mitsubishi Electric Corporation | Multiwirer saw and cutting method of ingot |
JP2009196001A (en) * | 2008-02-19 | 2009-09-03 | Seiko Instruments Inc | Method for production of wafer |
CN102079113A (en) * | 2010-11-25 | 2011-06-01 | 保定天威英利新能源有限公司 | Equipment and method for solving squaring quality problem of silicon ingot |
CN109605590A (en) * | 2018-10-23 | 2019-04-12 | 无锡斯贝尔磁性材料有限公司 | A kind of diamond wire saw product viscose glue tool fixture |
CN109747057A (en) * | 2019-02-14 | 2019-05-14 | 厦门芯光润泽科技有限公司 | Silicon carbide crystal bar multi-line cutting method |
CN109866347A (en) * | 2019-02-14 | 2019-06-11 | 厦门芯光润泽科技有限公司 | Silicon carbide crystal bar multi-line cutting method |
CN109866347B (en) * | 2019-02-14 | 2021-08-31 | 厦门芯光润泽科技有限公司 | Multi-wire cutting method for silicon carbide crystal bar |
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