JPH0543079Y2 - - Google Patents
Info
- Publication number
- JPH0543079Y2 JPH0543079Y2 JP16819786U JP16819786U JPH0543079Y2 JP H0543079 Y2 JPH0543079 Y2 JP H0543079Y2 JP 16819786 U JP16819786 U JP 16819786U JP 16819786 U JP16819786 U JP 16819786U JP H0543079 Y2 JPH0543079 Y2 JP H0543079Y2
- Authority
- JP
- Japan
- Prior art keywords
- container
- carry
- workpiece
- adhesive
- arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 claims description 41
- 230000001070 adhesive effect Effects 0.000 claims description 41
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 14
- 239000001301 oxygen Substances 0.000 claims description 14
- 229910052760 oxygen Inorganic materials 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 12
- 229920003002 synthetic resin Polymers 0.000 claims description 7
- 239000000057 synthetic resin Substances 0.000 claims description 7
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 6
- 229910052753 mercury Inorganic materials 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 claims 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 229910001873 dinitrogen Inorganic materials 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 3
- 238000003908 quality control method Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は、合成樹脂フイルム等の薄板に接着し
たシリコンウエハその他の半導体ウエハを該薄板
から取外すための接着剤の接着力を減少させるよ
うに制御する装置に関する。[Detailed description of the invention] (Field of industrial application) The present invention is designed to reduce the adhesive force of an adhesive used to remove a silicon wafer or other semiconductor wafer bonded to a thin plate such as a synthetic resin film from the thin plate. It relates to a device to be controlled.
（従来の技術）
従来、半導体ウエハにIC回路を形成するエツ
チング等の回路形成処理を終えると、該ウエハに
合成樹脂フイルムその他の薄板を接着剤で粘着し
てワークとし、この状態でウエハをICチツプに
カツトすることが行なわれている。このあと各チ
ツプは該薄板から取り外されてパツケージにマウ
ントされるが、この場合取外された各チツプの背
面に接着剤が残存付着する汚染がないことが好ま
しく、そのため特公昭58−50164号公報に見られ
るように接着剤に光硬化性のものが使用されてい
る。光硬化性の接着剤は、ICチツプにカツト後
に光が照射されて硬化し、接着性能が弱化するの
でチツプの背面に接着剤が付着することを防止出
来るが、その接着剤の硬化は短時間に行なえるこ
とが好ましく、これに適合する装置として、出願
人は、透光窓及び開閉自在の蓋体を備え、内部に
半導体ウエハを光硬化性の接着剤により透光性の
合成樹脂フイルム等の薄板に接着したワークが収
容される密閉容器と、該容器の透光窓に対向する
水銀灯等の光源とを有し、該容器にその内部の雰
囲気から酸素成分を排除する脱酸素装置を接続す
るようにしたものを先に提案した（実願昭60−
190304号）。この場合、処理されるべきワークは
その複数枚をカセツトケースに収めて用意され、
該ケースから一枚ずつ取出して搬入アームにより
密閉容器に搬入し、接着剤の硬化処理のために光
を照射されたのち該容器内から搬出アームで搬出
して別個に用意した室のカセツトケースに収めら
れ、更に続く工程に送られる。(Prior art) Conventionally, after completing circuit forming processing such as etching to form an IC circuit on a semiconductor wafer, a synthetic resin film or other thin plate is adhered to the wafer with adhesive to form a workpiece, and in this state, the wafer is used as an IC circuit. Cutting into chips is practiced. After this, each chip is removed from the thin plate and mounted on a package cage, but in this case, it is preferable that there is no contamination due to adhesive remaining on the back surface of each removed chip. As seen in , photo-curable adhesives are used. Photo-curable adhesives are cured when exposed to light after being cut into an IC chip, weakening the adhesive performance and preventing the adhesive from adhering to the back of the chip, but the adhesive hardens for a short time. It is preferable that the device be able to carry out this process, and the applicant has developed an apparatus that is suitable for this purpose, which is equipped with a transparent window and a cover body that can be opened and closed, and a semiconductor wafer is placed inside using a transparent synthetic resin film or the like using a photocurable adhesive. It has a sealed container in which a workpiece bonded to a thin plate is stored, and a light source such as a mercury lamp facing a transparent window of the container, and an oxygen removal device is connected to the container to remove oxygen components from the atmosphere inside the container. I first proposed something that would
No. 190304). In this case, multiple pieces of work to be processed are stored in a cassette case and prepared.
The sheets are taken out one by one from the case and carried into a sealed container using a carry-in arm, and after being irradiated with light to cure the adhesive, they are carried out from the container by a carry-out arm and placed in a cassette case in a separately prepared room. It is collected and sent to further processing.
（考案が解決しようとする問題点）
処理されるべきワークはカセツトケース内に方
向を揃えて用意されるが、前記硬化処理のために
例えば旋回する搬入、搬出アームでワークを移動
させると、ワークの方向が変わり、元の方向でカ
セツトケースに収めることが出来なくなる不都合
があつた。一般に半導体ウエハはこれに形成した
フアセツトを基準として方向を定め、一定方向を
維持し乍ら製造工程を流すことにより品質管理さ
れるもので、前記のようにワークの方向が変わる
ことは好ましくない。(Problem to be solved by the invention) The workpieces to be processed are prepared in a cassette case in the same direction, but when the workpieces are moved by, for example, a rotating loading/unloading arm for the hardening process, the workpieces are There was an inconvenience that the direction of the tape changed and it became impossible to store it in the cassette case in the original direction. Generally, the direction of a semiconductor wafer is determined based on a facet formed on the wafer, and quality control is performed by continuing the manufacturing process while maintaining a constant direction, and it is undesirable for the direction of the workpiece to change as described above.
本考案は先に提案した接着力制御装置の前記不
都合を解決することを目的とするものである。 The present invention aims to solve the above-mentioned disadvantages of the previously proposed adhesive force control device.
（問題点を解決するための手段）
本考案では、透光窓及び開閉自在の蓋体を備
え、内部に半導体ウエハを光硬化性の接着剤によ
り透光性の合成樹脂フイルム等の薄板に接着した
ワークが収容される密閉容器と、該容器の透光窓
に対向する水銀灯の光源とを有し、該容器にその
内部の雰囲気から酸素成分を排除する脱酸素装置
を接続し、さらに該密閉容器の側方、該容器の外
部から内部へ該ワークを搬入する旋回自在の搬入
アームと、該容器の内部から外部へ該ワークを搬
出する旋回自在の搬出アームとを設けるようにし
たものに於て、該搬出アームの搬出移動位置に、
搬出されたワークを受取つてこれに所定の角度の
旋回を与えると共に下方の搬出コンベア上へ移送
するテーブルを設けることにより前記問題点を解
決するようにした。(Means for solving the problem) The present invention is equipped with a transparent window and a cover body that can be opened and closed, and a semiconductor wafer is attached to a thin plate such as a transparent synthetic resin film using a light-curing adhesive. The container has a sealed container in which the processed workpiece is stored, and a light source of a mercury lamp facing a translucent window of the container, and an oxygen removal device is connected to the container to remove oxygen components from the atmosphere inside the container, and the container is further sealed. A rotatable carry-in arm for carrying the workpiece from the outside of the container into the inside of the container and a rotatable carry-out arm for carrying the workpiece from the inside of the container to the outside are provided on the side of the container. and the unloading arm to the unloading movement position,
The above-mentioned problem is solved by providing a table that receives the carried-out workpiece, gives it a rotation at a predetermined angle, and transfers it onto the carrying-out conveyor below.
（作用）
該ワークの半導体ウエハの表面に多数のIC回
路を形成する工程が終ると、各IC回路毎のチツ
プに該ウエハは分割され、各チツプはパツケージ
にマウントされるが、該ウエハは接着剤により透
光性の合成樹脂フイルム等の薄膜に粘着されてい
るので薄板からチツプを取外すに先立ち該接着剤
に光を照射してその接着力を減少させるような処
理が施される。(Function) When the process of forming a large number of IC circuits on the surface of the semiconductor wafer of the workpiece is completed, the wafer is divided into chips for each IC circuit, and each chip is mounted on a package. Since the chip is adhered to a thin film such as a transparent synthetic resin film by an agent, the adhesive is irradiated with light to reduce its adhesive strength before removing the chip from the thin plate.
この処理は、該ワークの複数枚を一定方向に揃
えて収めたカセツトケースから一枚ずつワークを
取出し、搬入アームより該ワークを密閉容器内に
収め、蓋体を閉じて該容器内の雰囲気を脱酸素装
置からの例えば窒素ガスの導入等により酸素成分
を減少させて脱酸素状態とし、該容器の透光窓を
介して光源からの光線を接着剤に当てて接着力を
弱まらせ、再び該容器内に大気を導入したのち蓋
体を開いてワークを搬出アームにより取出して終
了するが、該接着剤には約１秒間光線を当てるだ
けで接着力を十分に減少させることが出来、また
搬出されたワークはテーブルにより所定の角度の
旋回を与えて下方の搬出コンベアに載せられるの
でその旋回角度を調節することによりカセツトケ
ースに該ワークの方向を取出したときと同方向で
収容することが出来る。 In this process, the workpieces are taken out one by one from a cassette case containing a plurality of workpieces aligned in a certain direction, placed in a sealed container from the carry-in arm, and the lid is closed to vent the atmosphere inside the container. For example, by introducing nitrogen gas from a deoxidizing device, the oxygen component is reduced to a deoxidized state, and the adhesive is exposed to light from a light source through a transparent window of the container to weaken the adhesive force. After introducing the atmosphere into the container again, the lid is opened and the workpiece is taken out by the carry-out arm to complete the process, but the adhesive force can be sufficiently reduced by simply exposing the adhesive to a light beam for about 1 second. Furthermore, the unloaded workpiece is rotated at a predetermined angle by the table and placed on the lower unloading conveyor, so by adjusting the rotation angle, the workpiece can be stored in the cassette case in the same direction as when it was taken out. I can do it.
（実施例）
本考案の実施例を図面について説明する。第１
図乃至第４図に於て、符号１は接着力を減少させ
る制御装置の機枠、２，２は該機枠１の後方に左
右に水平に横設した案内杆、３は該案内杆２に案
内されて左右に移動自在の移動板、４は該移動板
３を移動させる送りねじ、５は該送りねじ４を回
転させるモータである。(Example) An example of the present invention will be described with reference to the drawings. 1st
In the figures to FIG. 4, reference numeral 1 is a machine frame of a control device that reduces adhesive force, 2 and 2 are guide rods installed horizontally from side to side behind the machine frame 1, and 3 is the guide rod 2. 4 is a feed screw that moves the movable plate 3, and 5 is a motor that rotates the feed screw 4.
該移動板３には略垂直に前方へ延びる密閉容器
６を一体に設け、該容器６の下方の機枠１には複
数の案内ローラ７により水平方向に移動自在のケ
ース８で覆われ且つモータ９の回転で螺杆１０に
沿つて昇降する台枠１１を取付けされた光源１２
が配置される。 The movable plate 3 is integrally provided with a closed container 6 that extends forward approximately vertically, and the machine frame 1 below the container 6 is covered with a case 8 that can be moved horizontally by a plurality of guide rollers 7, and is equipped with a motor. A light source 12 attached to an underframe 11 that moves up and down along a screw rod 10 with rotation of 9.
is placed.
１３は該光源１２の一側に設けられた搬入コン
ベア、１４は該光源１２の他側に設けられた搬出
コンベアを示し、各コンベア１３，１４はその一
端をパルスモータ１５，１５により昇降されるワ
ーク台１６ａ，１６ｂに臨ませて設けられる。該
搬入コンベア１３が臨むワーク台１６ａには、第
５図示のようなワーク１７を収めた棚を多段に備
えたカセツトケース１８が載置され、該ワーク台
１６ａがカセツトケース１８と共に下降して最下
方のワーク１７が搬入コンベア１３上に乗ると駆
動モータ１９が該搬入コンベア１３を駆動し、カ
セツトケース１８からワーク１７を引き出す。ま
た搬出コンベア１４が臨むワーク台１６ｂには、
当初はワーク１７の入つてない空のカセツトケー
ス１８が載置され、該搬出コンベア１４上にワー
ク１７が乗せられると、第９図に見られるような
駆動モータ２０が該コンベア１４を駆動して空の
カセツトケース１８の棚に運び込み、この運び込
みが終る毎にワーク台１６ｂがカセツトケース１
８と共にパルスモータ１５により一段ずつ上昇
し、次の運び込みに備えられる。２１及び２２は
該密閉容器６の側方の機枠１に夫々支軸２３，２
３を中心として旋回自在に取付けした搬入アーム
及び搬出アームを示し、該搬入アーム２１はその
下面に設けた吸盤２４で搬入コンベア１３がカセ
ツトケース１８から引き出したワーク１７を吸着
して密閉容器６内へ搬入し、また該搬出アーム２
２は該密閉容器６内からワーク１７を吸盤２４で
吸着して搬出コンベア１４上へと搬出する。各支
軸２３，２３はロータリアクチユエータ２３ａで
旋回され、エアシリンダ２３ｂで軸方向の上下動
が与えられる。各吸盤２４は図示してない適当な
吸着制御装置に接続され、ワーク１７の吸着と解
放とが制御される。 Reference numeral 13 indicates a carry-in conveyor provided on one side of the light source 12, and 14 indicates a carry-out conveyor provided on the other side of the light source 12. Each conveyor 13, 14 has one end raised and lowered by a pulse motor 15, 15. It is provided facing the work tables 16a and 16b. A cassette case 18 having multiple shelves holding works 17 as shown in FIG. When the lower workpiece 17 is placed on the carry-in conveyor 13, the drive motor 19 drives the carry-in conveyor 13, and the workpiece 17 is pulled out from the cassette case 18. Moreover, on the work table 16b facing the carry-out conveyor 14,
Initially, an empty cassette case 18 containing no workpieces 17 is placed thereon, and when the workpieces 17 are placed on the delivery conveyor 14, a drive motor 20 as shown in FIG. 9 drives the conveyor 14. Empty cassette cases 18 are carried to the shelf, and each time this carrying is finished, the work table 16b is moved to the cassette case 1.
8 and is raised step by step by the pulse motor 15 in preparation for the next loading. 21 and 22 are provided with support shafts 23 and 2, respectively, on the machine frame 1 on the side of the airtight container 6.
The carry-in arm 21 and the carry-out arm 21 are attached so as to be able to rotate around 3, and the carry-in arm 21 uses a suction cup 24 provided on the lower surface of the carry-in arm 21 to adsorb the workpiece 17 pulled out from the cassette case 18 by the carry-in conveyor 13 into the closed container 6. and the unloading arm 2
2 sucks the workpiece 17 from inside the closed container 6 with a suction cup 24 and carries it out onto the carrying-out conveyor 14. Each support shaft 23, 23 is rotated by a rotary actuator 23a, and is given vertical movement in the axial direction by an air cylinder 23b. Each suction cup 24 is connected to a suitable suction control device (not shown), and suction and release of the workpiece 17 are controlled.
該ワーク１７の詳細は第６図示の如くであり、
接着剤２５を予め塗布した透明な塩化ビニール、
ポリエチレンテレフタート、ポリプロピレン等の
合成樹脂フイルムの円形の薄板２６に半導体ウエ
ハ２７を接着剤２５により接着して成形され、該
接着剤２５としては例えばアクリル系接着剤10〜
90重量部対ウレタンアクリレート系オリゴマー90
〜10重量部の成分を有し、水銀灯からの紫外線、
電子管の電子線等広義の光が照射されると光硬化
してその接着力が著しく弱化するものが使用され
る。２６ａは薄板２６の周辺に取付けたSUS製
の鍔板で、これに搬入アーム２１や搬出アーム２
２の吸盤２４が吸着して搬送される。 The details of the work 17 are as shown in Figure 6,
transparent vinyl chloride pre-applied with adhesive 25;
A semiconductor wafer 27 is bonded to a circular thin plate 26 of a synthetic resin film such as polyethylene tereftate or polypropylene using an adhesive 25, and the adhesive 25 may be, for example, an acrylic adhesive 10 to 10.
90 parts by weight to urethane acrylate oligomer 90
~10 parts by weight of ingredients, ultraviolet light from mercury lamps,
The material used is one that photocures when irradiated with light in a broad sense, such as an electron beam from an electron tube, and its adhesive strength significantly weakens. 26a is a SUS collar plate attached around the thin plate 26, to which the carry-in arm 21 and the carry-out arm 2 are attached.
The second suction cup 24 is sucked and conveyed.
図示の例では、光源１２に80W／cmの水銀灯を
使用し、該光源１２を囲むケース８の上方に形成
したスリツト２８を介してその上方を移動する密
閉容器６の底面を照射するようにしたが、該光源
１２には電子線発生装置を用いるようにしてもよ
い。２９は光源１２の冷却フアン、３０は冷却ダ
クトを示す。 In the illustrated example, an 80 W/cm mercury lamp is used as the light source 12, and the bottom surface of the closed container 6 moving above the slit 28 is illuminated through a slit 28 formed above the case 8 surrounding the light source 12. However, an electron beam generator may be used as the light source 12. 29 is a cooling fan for the light source 12, and 30 is a cooling duct.
該密閉容器６は、第７図に見られるように、移
動板３に設けたシリンダ３１で昇降されて開閉さ
れる上方の蓋体３２と光源１２に対向する底部の
透光窓３３とを備え、該光源１２が水銀灯の場
合、該透光窓３３は紫外線透過ガラスで形成さ
れ、該光源１２が電子線発生装置の場合にはBe
の窓ガラス３３が用いられる。該蓋体３２内には
第２図に見られるように脱酸素装置３５に接続さ
れる回路３６，３７，３８が形成され、同図示の
ものでは回路３６，３７を外部に開き、窒素ボン
ベ３５ａから回路３８を介して窒素ガスを該容器
６内に導入すると、該容器６内の空気と窒素ガス
とが置換されて酸素成分の排除された雰囲気が生
成されるようにした。 As seen in FIG. 7, the airtight container 6 includes an upper lid 32 that is raised and lowered to open and close by a cylinder 31 provided on the moving plate 3, and a transparent window 33 at the bottom facing the light source 12. When the light source 12 is a mercury lamp, the transparent window 33 is made of ultraviolet-transmitting glass, and when the light source 12 is an electron beam generator, the transparent window 33 is made of ultraviolet-transmitting glass.
window glass 33 is used. As shown in FIG. 2, circuits 36, 37, and 38 connected to the deoxidizer 35 are formed inside the lid 32, and in the one shown in the same figure, the circuits 36 and 37 are opened to the outside, and the nitrogen cylinder 35a is connected to the nitrogen cylinder 35a. When nitrogen gas is introduced into the container 6 through the circuit 38, the air in the container 6 is replaced with nitrogen gas, and an atmosphere free of oxygen components is generated.
該容器６内の雰囲気から酸素成分を排除する手
法として真空ポンプにより容器６内を真空化する
ことも考えられるが、蓋体３２や透光窓３３を外
気が浸入しないようにシール性の良好な構造とし
なければならないので製作価格が高価になり、実
施例のように窒素ガスを送り込んで容器６内の酸
素成分を排除すれば容器６の密閉性が多少寛容さ
れるので製作価格は安価になる。 One possible method for removing oxygen components from the atmosphere inside the container 6 is to evacuate the inside of the container 6 using a vacuum pump, but it is also possible to evacuate the inside of the container 6 using a vacuum pump. Since the structure has to be the same, the manufacturing cost is high, but if nitrogen gas is sent in to eliminate the oxygen component in the container 6 as in the embodiment, the sealing performance of the container 6 can be somewhat tolerated, so the manufacturing cost is low. .
該容器６内には窒素ガス以外の不活性ガスを注
入して酸素成分を排除するようにしてもよく、ま
た排気ポンプ等を用いて積極的に容器６内を減圧
化したのち不活性ガス等を注入して酸素成分を排
除することも可能である。 An inert gas other than nitrogen gas may be injected into the container 6 to eliminate oxygen components, or an inert gas, etc. may be injected into the container 6 after actively reducing the pressure inside the container 6 using an exhaust pump or the like. It is also possible to eliminate the oxygen component by injecting
該容器６内の酸素成分が約１％以下の雰囲気で
あれば、ワーク１７の接着剤２５に薄板２６を透
過して光が当ると短時間に接着剤２５の接着力が
弱化する光硬化を生じさせ得、この光硬化ではウ
エハ２７をカツトして得られる１つのチツプ２７
ａをわずかの力で薄板２６から剥がすことが出
来、該チツプ２７ａの背面には全く接着剤２５の
存在がない。 If the atmosphere in the container 6 has an oxygen content of about 1% or less, when light passes through the thin plate 26 and hits the adhesive 25 of the workpiece 17, the adhesive strength of the adhesive 25 weakens in a short period of time. In this photocuring, one chip 27 obtained by cutting the wafer 27 is produced.
a can be peeled off from the thin plate 26 with a slight force, and there is no adhesive 25 on the back side of the chip 27a.
図示の装置に於て、搬入コンベア１３上にワー
ク１７が取出されると、これを吸着して搬入アー
ム２１が密閉容器６へ搬入し、該密閉容器６がワ
ーク１７に脱酸素の雰囲気を与え乍ら光源１２上
を通過すると、ワーク１７の接着剤２５が光の照
射を受けて硬化する。この処理が終ると密閉容器
６の蓋体３２が開かれ、その内部から処理済みの
ワーク１７を搬出アーム２２が搬出コンベア１４
上へと取出す。この一連の処理工程に於て、ワー
ク１７は旋回する搬入アーム２１と搬出アーム２
２により、第８図示のように、次第に回転され、
例えば各アーム２１，２２が約90°の旋回角であ
る場合、搬出アーム２２の搬出移動位置ではワー
ク１７のフアセツト１７ａが対称の位置まで180°
回転することになり、もしこのままカセツトケー
ス１８に収容すると処理工程の前後でワーク１７
とカセツトケース１８の対称的な位置関係が変わ
るのでチツプ２７ａの品質管理が難しくなる。即
ち品質不良のチツプが発生した場合、各製造工程
をたどつて不良品発生の原因を追求することが難
しくなる。そこで、本考案では搬出アーム２２が
密閉容器６内からワーク１７を搬出コンベア１４
上へと取出すべく旋回した搬出移動位置に、該ワ
ーク１７を受取つてこれに所定の角度の旋回を与
えると共に下方の搬出コンベア１４上へと移送す
るテーブル３９を設け、搬入アーム２１及び搬出
アーム２２によるワーク１７の回転を戻してカセ
ツトケース１８に運び込み、接着剤２５の硬化処
理の前後でカセツトケース１８とこれに収められ
たワーク１７との相対的位置関係が変わることを
防ぐようにした。 In the illustrated apparatus, when a workpiece 17 is taken out onto the carry-in conveyor 13, the carry-in arm 21 adsorbs it and carries it into the closed container 6, and the closed container 6 provides the workpiece 17 with a deoxidizing atmosphere. When passing over the light source 12, the adhesive 25 of the workpiece 17 is irradiated with light and hardens. When this process is finished, the lid 32 of the closed container 6 is opened, and the processed workpiece 17 is transferred from the inside to the carry-out arm 22 onto the carry-out conveyor 14.
Take it out to the top. In this series of processing steps, the workpiece 17 is moved between a rotating carry-in arm 21 and a rotating carry-out arm 2.
2, it is gradually rotated as shown in the eighth figure,
For example, if each arm 21, 22 has a turning angle of approximately 90°, the facet 17a of the workpiece 17 will move 180° to the symmetrical position at the unloading movement position of the unloading arm 22.
If the workpiece 17 is stored in the cassette case 18 as it is, the workpiece 17 will rotate before and after the processing process.
Since the symmetrical positional relationship of the cassette case 18 changes, quality control of the chips 27a becomes difficult. That is, when chips of poor quality occur, it becomes difficult to trace the manufacturing process to find the cause of the defective product. Therefore, in the present invention, the carry-out arm 22 carries out the work 17 from inside the closed container 6 onto the conveyor 14.
A table 39 is provided at the carry-out movement position where the workpiece 17 has been rotated to be taken out upward, and which receives the workpiece 17, gives it a rotation at a predetermined angle, and transfers it onto the carry-out conveyor 14 below. The workpiece 17 is rotated back and carried into the cassette case 18 to prevent the relative positional relationship between the cassette case 18 and the workpiece 17 stored therein from changing before and after the curing process of the adhesive 25.
実施例では、第２図及び第９図に見られるよう
に、搬出コンベア１４を構成する左右のベルト１
４ａ，１４ａの中間部を下方に迂回させて間隙４
０，４０を形成し、そこにテーブル３９を構成す
る十文字状の台板３９ａが出没するようにした。
また、該テーブル３９は、該台板３９ａをばね３
９ｂで弾発された昇降旋回軸３９ｃの上端に取付
け、これにクラツチ３９ｄを介してロータリアク
チユエータ３９ｅの出力軸３９ｆがエアシリンダ
３９ｇに押されて接続されるとばね３９ｂに抗し
ての上昇と旋回とが該台板３９ａに与えられる構
成とした。 In the embodiment, as shown in FIGS. 2 and 9, the left and right belts 1 constituting the delivery conveyor 14 are
4a and 14a are detoured downward to form the gap 4.
0 and 40, and a cross-shaped base plate 39a constituting the table 39 appears and disappears there.
Further, the table 39 has the base plate 39a fixed to the spring 3.
When the output shaft 39f of the rotary actuator 39e is pushed and connected to the upper end of the lifting/lowering pivot shaft 39c which is sprung at the spring 39b, the output shaft 39f of the rotary actuator 39e is pressed against the air cylinder 39g, and the output shaft 39c is pressed against the spring 39b. The structure is such that the base plate 39a is capable of lifting and turning.
かくて、搬入アーム２１と搬出アーム２２とで
回転されたワーク１７は、テーブル３９に載せら
れてその回転を戻したのち搬出コンベア１４でカ
セツトケース１８に収められ、ワーク１７の接着
剤２５の硬化処理前後に於けるワーク１７とカセ
ツトケース１８の相対的位置関係を同一となし得
る。該搬入アーム２１と搬出アーム２２によりワ
ーク１７が180°回転されるときは、該テーブル３
９にはロータリアクチユエータ３９ｅにより180°
の旋回が与えられる。 In this way, the workpiece 17 rotated by the carry-in arm 21 and the carry-out arm 22 is placed on the table 39 and after returning its rotation, is placed in the cassette case 18 by the carry-out conveyor 14, and the adhesive 25 of the workpiece 17 is cured. The relative positional relationship between the workpiece 17 and the cassette case 18 can be made the same before and after processing. When the workpiece 17 is rotated 180° by the carry-in arm 21 and the carry-out arm 22, the table 3
9 is 180° by rotary actuator 39e.
rotation is given.
図示の装置の作動は次の通りである。まず、多
数枚のワーク１７を収めたカセツトケース１８を
一方のワーク台１６ａ上に載せ、空のカセツトケ
ース１８を他方のワーク台１６ｂ上に載せる。次
で搬入コンベア１３を作動させてワーク台１６ａ
のカセツトケース１８から一枚ずつワーク１７を
引き出し、搬入アーム２１がその吸盤２４で該ワ
ーク１７の鍔板２６ａを吸着して旋回し、蓋体３
２の開いた密閉容器６内に運び込む。このとき該
ワーク１７には、搬入コンベア１３上にあつたと
きから搬入アーム２１の旋回角αに相当する回転
が与えられる。該蓋体３２が閉じられ該容器６が
密閉されると、脱酸素装置３５から注入される窒
素ガスにより酸素成分を排除した雰囲気が該容器
６内に形成され、光源１２上を通つて該容器６が
移動する際に透光窓３３から内部のワーク１７の
接着剤２５に対して光が照射される。具体的には
光源１２のケース８のスリツト２８の幅を約50mm
とし、該容器６を約120mm／Ｓの速度で該光源８
の上方を通過させ、ワーク１７の該ウエハ２７が
５インチの直径、光源１２が80W／cmで容器６の
位置では230mW／cm2の光量が得られる条件で実
施された。 The operation of the illustrated device is as follows. First, a cassette case 18 containing a large number of works 17 is placed on one work stand 16a, and an empty cassette case 18 is placed on the other work stand 16b. Next, the carry-in conveyor 13 is operated and the work table 16a is
The workpieces 17 are pulled out one by one from the cassette case 18, and the carry-in arm 21 suctions the flange plate 26a of the workpiece 17 with its suction cup 24 and rotates to remove the cover body 3.
2 into the open airtight container 6. At this time, the work 17 is given a rotation corresponding to the turning angle α of the carry-in arm 21 from the time it is placed on the carry-in conveyor 13 . When the lid 32 is closed and the container 6 is hermetically sealed, nitrogen gas injected from the deoxidizing device 35 creates an atmosphere in which oxygen components are removed, and the atmosphere passes over the light source 12 and depletes the container. When the workpiece 6 moves, light is irradiated from the transparent window 33 onto the adhesive 25 of the workpiece 17 inside. Specifically, the width of the slit 28 in the case 8 of the light source 12 is approximately 50 mm.
and the light source 8 moves the container 6 at a speed of about 120 mm/s.
The experiment was carried out under conditions such that the wafer 27 of the work 17 had a diameter of 5 inches, the light source 12 was 80 W/cm, and a light amount of 230 mW/cm 2 was obtained at the position of the container 6.
ワーク１７が光源１２上を通過して光の照射を
受けた後、容器６内の窒素ガスを空気に交換し、
蓋体３２が開かれると搬出アーム２２がその吸盤
２４で処理済のワーク１７を吸着し、容器６から
搬出移送位置へと旋回し、該位置に於て上昇待機
するテーブル３９に該ワーク１７を受け渡す。そ
の際、該ワーク１７は搬入アーム２１による回転
角αに加え搬出アーム２２による回転角βだけ更
に回転されるが、その回転角α＋βに相当する逆
旋回を該テーブル３９が行なつたのち下降するこ
とによつて搬入コンベア１３上にあつたときと同
方向で搬出コンベア１４上にワーク１７を載置さ
せ得、そのままワーク１６ｂ上にカセツトケース
１８に送り込めば元の状態即ちワーク台１６ａの
カセツトケース１８に収められていたときと同じ
位置関係で処理済のワーク１７を収容することが
出来る。５インチのウエハ２７が光源８の光を受
け終るまでの時間は実施例では約1.4秒であり、
接着剤２５の接着力の減少の処理を終えたワーク
１７はチツプ２７ａを極めて弱い力で薄板２６か
ら取外せ、チツプ２７ａの背面には接着剤２５の
存在する汚染が殆どなく、不良品の発生率が少な
くなる。 After the workpiece 17 passes over the light source 12 and is irradiated with light, the nitrogen gas in the container 6 is replaced with air.
When the lid 32 is opened, the carry-out arm 22 sucks the processed work 17 with its suction cup 24, rotates from the container 6 to the carry-out transfer position, and transfers the work 17 to the table 39, which is waiting to rise at this position. Hand over. At this time, the workpiece 17 is further rotated by the rotation angle α by the carry-in arm 21 and the rotation angle β by the carry-out arm 22, but the table 39 makes a reverse rotation corresponding to the rotation angle α+β and then descends. By this, the work 17 can be placed on the carry-out conveyor 14 in the same direction as when it was placed on the carry-in conveyor 13, and if the work 17 is fed directly onto the work 16b into the cassette case 18, it will return to its original state, that is, the cassette on the work stand 16a. The processed work 17 can be stored in the same positional relationship as when it was stored in the case 18. In the example, the time it takes for the 5-inch wafer 27 to receive the light from the light source 8 is approximately 1.4 seconds.
The chip 27a of the workpiece 17 that has undergone the process of reducing the adhesive force of the adhesive 25 can be removed from the thin plate 26 with extremely weak force, and there is almost no contamination caused by the adhesive 25 on the back surface of the chip 27a, resulting in the occurrence of defective products. rate will decrease.
（考案の効果）
以上のように本考案によるときは、密閉容器内
で半導体ウエハと薄板を接着する接着剤の接着力
を減少すべく処理されたワークを搬出する搬出ア
ームの搬出移動位置に、ワークを受取つてこれに
所定の角度の旋回を与えると共に下方の搬出コン
ベアへ移送するテーブルを設けたので、その処理
に伴つて生ずる該ワークの回転を該テーブルによ
り戻して搬出することが出来、ワークをその処理
前後に於て変わらぬ位置関係でカセツトケースに
収め得て品質管理が容易になり、該テーブルは搬
出アームと搬出テーブルとの狭い空間に設備でき
るので装置全体の寸法を大型化させることがない
等の効果がある。(Effects of the Invention) As described above, according to the present invention, in order to reduce the adhesive force of the adhesive that bonds the semiconductor wafer and the thin plate in the sealed container, the unloading arm for unloading the processed work is moved to the unloading position. Since a table is provided to receive the workpiece, give it a rotation at a predetermined angle, and transfer it to the unloading conveyor below, the rotation of the workpiece caused by the processing can be reversed by the table and the workpiece can be unloaded. can be stored in a cassette case with the same positional relationship before and after processing, which facilitates quality control, and because the table can be installed in a narrow space between the carry-out arm and the carry-out table, the dimensions of the entire device can be increased. There are effects such as no
第１図は本考案の実施例の全体正面図、第２図
は第１図の平面図、第３図は第１図の一部を截除
した左側面図、第４図は第１図の−線断面
図、第５図はカセツトケースの斜視図、第６図は
ワークの斜視図、第７図は密閉状態の密閉容器の
拡大断面図、第８図はワークの回転状態を示す平
面線図、第９図は第２図の−線部分の側面図
である。
６……密閉容器、１２……光源、１４……搬出
コンベア、１７……ワーク、２１……搬入アー
ム、２２……搬出アーム、２５……接着剤、２６
……薄板、２７……半導体ウエハ、３２……蓋
体、３３……透光窓、３５……脱酸素装置、３９
……テーブル。
Fig. 1 is an overall front view of an embodiment of the present invention, Fig. 2 is a plan view of Fig. 1, Fig. 3 is a left side view with a portion of Fig. 1 cut away, and Fig. 4 is a view similar to Fig. 1. Fig. 5 is a perspective view of the cassette case, Fig. 6 is a perspective view of the workpiece, Fig. 7 is an enlarged sectional view of the sealed container in the sealed state, and Fig. 8 is a plane showing the rotating state of the workpiece. The diagram, FIG. 9 is a side view of the - line portion in FIG. 2. 6... airtight container, 12... light source, 14... carry-out conveyor, 17... workpiece, 21... carry-in arm, 22... carry-out arm, 25... adhesive, 26
... Thin plate, 27 ... Semiconductor wafer, 32 ... Lid, 33 ... Transparent window, 35 ... Oxygen removal device, 39
……table.
Claims (1)
体ウエハを光硬化性の接着剤により透光性の合成
樹脂フイルム等の薄板に接着したワークが収容さ
れる密閉容器と、該容器の透光窓に対向する水銀
灯等の光源とを有し、該容器にその内部の雰囲気
から酸素成分を排除する脱酸素装置を接続し、さ
らに該密閉容器の側方に、該容器の外部から内部
へ該ワークを搬入する旋回自在の搬入アームと、
該容器の内部から外部へ該ワークを搬出する旋回
自在の搬出アームとを設けるようにしたものに於
て、該搬出アームの搬出移動位置に、搬出された
ワークを受取つてこれに所定の角度の旋回を与え
ると共に下方の搬出コンベア上へ移送するテーブ
ルを設けたことを特徴とする半導体ウエハを薄板
を接着する接着剤の接着力制御装置。 A sealed container is equipped with a transparent window and a cover body that can be opened and closed, and a workpiece in which a semiconductor wafer is bonded to a thin plate such as a transparent synthetic resin film with a light-curing adhesive is housed therein. A light source such as a mercury lamp facing a light window is connected to the container, and a deoxidizing device for removing oxygen components from the atmosphere inside the container is connected to the container. a rotatable loading arm for loading the work;
A rotatable carry-out arm for carrying out the workpiece from the inside of the container to the outside is provided, and the carry-out arm receives the carried-out workpiece at a carry-out movement position and holds it at a predetermined angle. A device for controlling the adhesive force of an adhesive for bonding semiconductor wafers to thin plates, characterized in that the device is provided with a table that gives rotation and transfers the semiconductor wafers onto a lower carry-out conveyor.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16819786U JPH0543079Y2 (en) | 1986-11-04 | 1986-11-04 | |
| PH34571A PH25206A (en) | 1985-12-12 | 1986-12-09 | Control apparatus for reducing adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
| DE8686117185T DE3686314T2 (en) | 1985-12-12 | 1986-12-10 | DEVICE FOR DETERMINING THE ADHESIVE FORCE OF AN ADHESIVE BETWEEN A SEMICONDUCTOR AND ITS SUBSTRATE. |
| EP86117185A EP0226949B1 (en) | 1985-12-12 | 1986-12-10 | Control apparatus for adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
| US06/940,328 US4718967A (en) | 1985-12-12 | 1986-12-11 | Control apparatus for reducing adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
| KR1019860010635A KR900004688B1 (en) | 1985-12-12 | 1986-12-12 | Control apparatus for reducting adhesive force of adhesive agent adhering between semiconductor wafer |
| SG1063/92A SG106392G (en) | 1985-12-12 | 1992-10-13 | Control apparatus for adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16819786U JPH0543079Y2 (en) | 1986-11-04 | 1986-11-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6373337U JPS6373337U (en) | 1988-05-16 |
| JPH0543079Y2 true JPH0543079Y2 (en) | 1993-10-29 |
Family
ID=31100851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16819786U Expired - Lifetime JPH0543079Y2 (en) | 1985-12-12 | 1986-11-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0543079Y2 (en) |
-
1986
- 1986-11-04 JP JP16819786U patent/JPH0543079Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6373337U (en) | 1988-05-16 |
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