JPH0537939Y2 - - Google Patents
Info
- Publication number
- JPH0537939Y2 JPH0537939Y2 JP1987161979U JP16197987U JPH0537939Y2 JP H0537939 Y2 JPH0537939 Y2 JP H0537939Y2 JP 1987161979 U JP1987161979 U JP 1987161979U JP 16197987 U JP16197987 U JP 16197987U JP H0537939 Y2 JPH0537939 Y2 JP H0537939Y2
- Authority
- JP
- Japan
- Prior art keywords
- jig
- recess
- flakes
- vacuum suction
- minute
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001514 detection method Methods 0.000 claims description 4
- 238000001179 sorption measurement Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Feeding Of Articles To Conveyors (AREA)
- Attitude Control For Articles On Conveyors (AREA)
Description
【考案の詳細な説明】
産業上の利用分野
本考案は多数個の微小薄片を一定間隔で整列さ
せる装置に関する。[Detailed Description of the Invention] Industrial Application Field The present invention relates to an apparatus for aligning a large number of microscopic flakes at regular intervals.
従来の技術
電子部品の製造で、微小薄片状電子部品本体を
一定間隔で多数個整列し、他の電子部品構成部品
に組み付けることが一般的に行われている。この
ような目的のために真空吸着を利用した配列治具
が用いられる。第2図は配列装置の一例を示すも
ので、図において1は配列治具、2は負圧源であ
る吸引ポンプ、3は配列治具1と吸引ポンプ2と
を接続するパイプ、4はパイプ3の中間に挿入さ
れ、配列治具1を吸引ポンプ2と外気とに切換え
て連通させる切換弁を示す。配列治具1は上面周
縁を枠部1aで囲み、枠部1a内に微小薄片5を
収容する凹部1bを多数、整列して穿設してい
る。この凹部1bは底面に真空吸着孔1cを穿設
し、この吸着孔1cは治具1内部の空洞部1dに
連通している。2. Description of the Related Art In the manufacture of electronic components, it is common practice to align a large number of fine flake-like electronic component bodies at regular intervals and assemble them to other electronic component components. For this purpose, an arrangement jig that utilizes vacuum suction is used. FIG. 2 shows an example of an arrangement device. In the figure, 1 is an arrangement jig, 2 is a suction pump that is a negative pressure source, 3 is a pipe connecting the arrangement jig 1 and the suction pump 2, and 4 is a pipe. 3 shows a switching valve that is inserted in the middle of 3 to switch the arrangement jig 1 into communication with the suction pump 2 and the outside air. The arrangement jig 1 has a top surface surrounded by a frame 1a, and a large number of recesses 1b for accommodating the minute flakes 5 are formed in the frame 1a in an aligned manner. This recess 1b has a vacuum suction hole 1c formed in its bottom surface, and this suction hole 1c communicates with a cavity 1d inside the jig 1.
以下この動作を説明する。先ず配列治具1の凹
部1bを上方に向けて、枠部1a内に微小薄片5
を供給する。微小薄片5は凹部1bの数より数倍
程度多めに供給する。次いで、切換弁4を吸引ポ
ンプ2に接続し、治具1を真空引きし、治具1を
揺動させる。 This operation will be explained below. First, with the concave portion 1b of the arrangement jig 1 facing upward, the minute thin piece 5 is placed inside the frame portion 1a.
supply. The number of minute thin pieces 5 is supplied in an amount several times larger than the number of recesses 1b. Next, the switching valve 4 is connected to the suction pump 2, the jig 1 is evacuated, and the jig 1 is rocked.
これにより、微小薄片5は枠部1a内を移動す
るが、微小薄片5が入つた凹部1bは真空吸着孔
1cが微小薄片5によつて塞がれるため吸着力が
なくなり、他の微小薄片5は真空吸着孔1cが開
口した凹部1bに捕らえられる。この動作を繰り
返し、全ての凹部1bに微小薄片5が吸収された
時点で、治具1を反転し残余の微小薄片を除去す
る。次に治具1を他の組立治具(図示せず)上に
移動して凹部1bを下に向け、切換弁4を外気側
に連通させ、空洞部1d内の圧力を大気圧に戻す
と、微小薄片5は自重で落下し、組立治具に移し
替えできる。 As a result, the microfine flake 5 moves within the frame 1a, but the vacuum suction hole 1c of the recess 1b containing the microfine flake 5 is blocked by the microfine flake 5, so the suction force is lost, and other microfine flakes 5 is caught in the recess 1b in which the vacuum suction hole 1c is opened. This operation is repeated until all the micro flakes 5 have been absorbed into all the recesses 1b, and then the jig 1 is reversed to remove the remaining micro flakes. Next, the jig 1 is moved onto another assembly jig (not shown), the concave portion 1b is directed downward, the switching valve 4 is communicated with the outside air, and the pressure inside the cavity 1d is returned to atmospheric pressure. , the minute flakes 5 fall under their own weight and can be transferred to an assembly jig.
考案が解決しようとする問題点
ところで、凹部1bとして加工が容易な丸穴を
穿設すると、方形微小薄片の場合、凹部1b内壁
と微小薄片5との間に、第3図及び第4図に示す
ように間隙1b′が形成される。一方、第5図に示
すように微小薄片5が欠けたりして混入した欠片
などの異物8が凹部1bの底面に入り込んだり、
微小薄片5の角部が凹部1b内壁に引つかかつて
いると、微小薄片5と凹部1bの底面との間に空
隙が形成され、真空吸着孔1cと前記空隙1b′と
が連通して吸引力が作用する。このような凹部1
b上を他の微小薄片5′が移動する際に、この微
小薄片5′によつて間隙1b′の開口面積が減少し、
吸引力が増し他の微小薄片5′も吸着されること
があつた。Problems to be Solved by the Invention By the way, when a round hole that is easy to process is bored as the recess 1b, in the case of a rectangular microfine piece, a hole is formed between the inner wall of the recess 1b and the microfine flake 5 as shown in FIGS. 3 and 4. A gap 1b' is formed as shown. On the other hand, as shown in FIG. 5, foreign matter 8 such as fragments caused by chipping of the minute flakes 5 may enter the bottom surface of the recess 1b.
When the corner of the micro-fine piece 5 is stuck to the inner wall of the recess 1b, a gap is formed between the micro-fine piece 5 and the bottom surface of the recess 1b, and the vacuum suction hole 1c and the gap 1b' communicate with each other, creating a suction force. acts. Such a recess 1
When another minute flake 5' moves over b, the opening area of the gap 1b' is reduced by this minuscule flake 5'.
The suction force increased and other fine flakes 5' were also attracted.
問題点を解決するための手段
本考案は上記問題点に鑑み提案されたもので、
微小薄片を収容する凹部を多数、整列して穿設し
各凹部底面に真空吸着孔を開口した整列治具を負
圧源に連通した整列装置において、上記整列治具
の真空吸着孔と負圧源との間に、圧力センサと、
圧力センサの検出出力に基づいて整列治具の吸着
力を制御する制御弁とを挿入したことを特徴とす
る。Means for solving the problems This invention was proposed in view of the above problems.
In an alignment device in which an alignment jig in which a large number of recesses for accommodating minute flakes are aligned and drilled and vacuum suction holes are opened at the bottom of each recess is connected to a negative pressure source, the vacuum suction holes in the alignment jig and the negative pressure are connected to each other. a pressure sensor between the source and the
It is characterized by the insertion of a control valve that controls the suction force of the alignment jig based on the detection output of the pressure sensor.
作 用
治具凹部に微小薄片が収容されるにつれて真空
吸引力を減少させ吸着力をほぼ一様に保つ。Function: As the minute flakes are accommodated in the jig recess, the vacuum suction force is reduced and the suction force is kept almost uniform.
実施例
以下に本考案の実施例を第1図から説明する。
図において第2図と同一符号は同一物を示し説明
を省略する。第2図装置と相異するのは整列治具
1と負圧源(吸引ポンプ)2とを連通するパイプ
3の整列治具1側に圧力センサ6を、吸引ポンプ
2側に圧力センサ6の検出出力に基づいて整列治
具1の吸着力を制御する制御弁(電空比例弁)7
を挿入したことのみである。Embodiment An embodiment of the present invention will be described below with reference to FIG.
In the figure, the same reference numerals as in FIG. 2 indicate the same parts, and the explanation will be omitted. What is different from the apparatus shown in FIG. 2 is that a pressure sensor 6 is installed on the alignment jig 1 side of a pipe 3 that communicates the alignment jig 1 and a negative pressure source (suction pump) 2, and a pressure sensor 6 is placed on the suction pump 2 side. A control valve (electro-pneumatic proportional valve) 7 that controls the attraction force of the alignment jig 1 based on the detection output
The only difference is that the .
以下、この動作を説明する。先ず配列治具1の
凹部1bを上方に向けて、その上に微小薄片5を
供給する。このとき、電空比例弁7は吸引ポンプ
2に接続されており、圧力センサ6の検出出力に
基づいて吸引圧力が所定の力となるように弁の開
閉量が設定されており、微小薄片5が凹部1b内
に入ると真空吸着され真空吸着孔1cを塞ぐ。こ
れにより外部と連通して真空吸着孔1cの数が減
少し、圧力センサ6は圧力上昇を検出する。この
出力に対応して電空比例弁7が開き外部と連通し
た真空吸着孔1cのそれぞれの吸引力をほぼ一定
に保つことができる。 This operation will be explained below. First, the concave portion 1b of the arrangement jig 1 is directed upward, and the minute thin piece 5 is supplied thereon. At this time, the electropneumatic proportional valve 7 is connected to the suction pump 2, and the opening/closing amount of the valve is set so that the suction pressure becomes a predetermined force based on the detection output of the pressure sensor 6. When it enters the recess 1b, it is vacuum suctioned and closes the vacuum suction hole 1c. This reduces the number of vacuum suction holes 1c communicating with the outside, and the pressure sensor 6 detects an increase in pressure. In response to this output, the electropneumatic proportional valve 7 opens and the suction force of each of the vacuum suction holes 1c communicating with the outside can be kept approximately constant.
そのため、微小薄片5を供給しない状態での初
期吸引力を第5図状態のようにリークが生じた場
合でも余分な微小薄片5′が吸着されない吸引力
に設定することにより、各凹部1bにそれぞれ微
小薄片5が収容された後に、治具1を反転し余分
な微小薄片5′を除くことにより、凹部1b周縁
に余分な微小薄片が吸着されることはない。 Therefore, by setting the initial suction force in the state in which the minute flakes 5 are not supplied to a suction force that does not attract excess minute flakes 5' even if a leak occurs as shown in the state shown in FIG. After the minute flakes 5 are accommodated, the jig 1 is turned over and the extra minute flakes 5' are removed, so that no extra minute flakes are attracted to the periphery of the recess 1b.
また、治具1上で微小薄片5を移動させ各凹部
1bに収容してゆくときに、既に微小薄片5が収
容された凹部1b周縁で他の微小薄片が滞留する
ことがないため、微小薄片をスムーズに移動させ
ることができ、短時間で整列できる。 Furthermore, when the micro flakes 5 are moved on the jig 1 and accommodated in each recess 1b, other micro flakes do not stay around the periphery of the recess 1b where the micro flakes 5 have already been accommodated, so the micro flakes can be moved smoothly and lined up in a short time.
尚、本考案は上記実施例にのみ限定されるもの
ではなく、例えば圧力センサ6は整列治具1の空
洞部1d内の圧力を直接読みとるようにしてもよ
い。 Note that the present invention is not limited to the above-mentioned embodiment, and for example, the pressure sensor 6 may directly read the pressure within the cavity 1d of the alignment jig 1.
考案の効果
本考案によれば整列治具の吸引力が微小薄片の
整列状態にかかわらずほぼ一定に保ことができ、
余分な微小薄片を吸着することなく、整列時間を
短縮することができる。Effects of the invention According to the invention, the suction force of the alignment jig can be kept almost constant regardless of the alignment state of the minute flakes.
The alignment time can be shortened without adsorbing excess microscopic flakes.
第1図は本考案の実施例を示す部分断面側面
図、第2図は従来の配列装置を示す部分断面側面
図、第3図は凹部を示す平面図、第4図は第2図
要部示す拡大側断面図、第5図はリークにより2
個の微小薄片が吸着されている状態を示す要部拡
大側断面図である。
1……整列治具、1b……凹部、1c……真空
吸着孔、2……負圧源、3……パイプ、5……微
小薄片、6……圧力センサ、7……制御弁。
Fig. 1 is a partially sectional side view showing an embodiment of the present invention, Fig. 2 is a partially sectional side view showing a conventional arrangement device, Fig. 3 is a plan view showing the recess, and Fig. 4 is the main part of Fig. 2. The enlarged side cross-sectional view shown in Fig. 5 is due to leakage.
FIG. 2 is an enlarged side cross-sectional view of a main part showing a state in which several minute flakes are attracted. DESCRIPTION OF SYMBOLS 1... alignment jig, 1b... recess, 1c... vacuum suction hole, 2... negative pressure source, 3... pipe, 5... minute flake, 6... pressure sensor, 7... control valve.
Claims (1)
し各凹部底面に真空吸着孔を開口した整列治具を
負圧源に連通した整列装置において、上記整列治
具の真空吸着孔と負圧源との間に、圧力センサ
と、圧力センサの検出出力に基づいて整列治具の
吸着力を制御する制御弁とを挿入し治具凹部に微
小薄片が収容されるにつれて真空吸引力を減少さ
せ吸着力をほぼ一様に保つことを特徴とする微小
薄片整列装置。 In an alignment device in which an alignment jig in which a large number of recesses for accommodating minute flakes are aligned and drilled and vacuum suction holes are opened at the bottom of each recess is connected to a negative pressure source, the vacuum suction holes in the alignment jig and the negative pressure are connected to each other. A pressure sensor and a control valve that controls the suction force of the alignment jig based on the detection output of the pressure sensor are inserted between the source and the vacuum suction force is reduced as the minute flakes are accommodated in the jig recess. A micro flake alignment device that is characterized by maintaining almost uniform adsorption force.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987161979U JPH0537939Y2 (en) | 1987-10-21 | 1987-10-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987161979U JPH0537939Y2 (en) | 1987-10-21 | 1987-10-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01147323U JPH01147323U (en) | 1989-10-12 |
JPH0537939Y2 true JPH0537939Y2 (en) | 1993-09-27 |
Family
ID=31445391
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987161979U Expired - Lifetime JPH0537939Y2 (en) | 1987-10-21 | 1987-10-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0537939Y2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5886768B2 (en) * | 2013-01-15 | 2016-03-16 | マルゴ工業株式会社 | Article posture changing device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60167815A (en) * | 1984-02-09 | 1985-08-31 | Nec Corp | Pin inserting/aligning device |
-
1987
- 1987-10-21 JP JP1987161979U patent/JPH0537939Y2/ja not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60167815A (en) * | 1984-02-09 | 1985-08-31 | Nec Corp | Pin inserting/aligning device |
Also Published As
Publication number | Publication date |
---|---|
JPH01147323U (en) | 1989-10-12 |
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