JPH0537496Y2 - - Google Patents

Info

Publication number: JPH0537496Y2
Authority: JP; Japan
Prior art keywords: adhesive layer; copper foil; foil pattern; insulating film; printed circuit
Prior art date: 1987-03-17
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

JP1987039329U

Other languages

English (en)

Japanese (ja)

Other versions

JPS63147868U (zh

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1987-03-17

Filing date

1987-03-17

Publication date

1993-09-22

1987-03-17 Application filed filed Critical

1987-03-17 Priority to JP1987039329U priority Critical patent/JPH0537496Y2/ja

1988-09-29 Publication of JPS63147868U publication Critical patent/JPS63147868U/ja

1993-09-22 Application granted granted Critical

1993-09-22 Publication of JPH0537496Y2 publication Critical patent/JPH0537496Y2/ja

2002-03-17 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

239000012790 adhesive layer Substances 0.000 claims description 74
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 56
239000011889 copper foil Substances 0.000 claims description 56
239000010410 layer Substances 0.000 claims description 15
230000002265 prevention Effects 0.000 claims 1
238000005452 bending Methods 0.000 description 19
230000001154 acute effect Effects 0.000 description 8
239000004020 conductor Substances 0.000 description 6
239000000758 substrate Substances 0.000 description 6
238000009413 insulation Methods 0.000 description 3
238000010030 laminating Methods 0.000 description 3
230000000694 effects Effects 0.000 description 2
239000000463 material Substances 0.000 description 2
239000000123 paper Substances 0.000 description 2
KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
239000000853 adhesive Substances 0.000 description 1
230000001070 adhesive effect Effects 0.000 description 1
238000007796 conventional method Methods 0.000 description 1
230000007547 defect Effects 0.000 description 1
230000006866 deterioration Effects 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
239000011521 glass Substances 0.000 description 1
230000001771 impaired effect Effects 0.000 description 1
239000012212 insulator Substances 0.000 description 1
239000002655 kraft paper Substances 0.000 description 1
229920001568 phenolic resin Polymers 0.000 description 1
239000005011 phenolic resin Substances 0.000 description 1
238000007747 plating Methods 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
229920001225 polyester resin Polymers 0.000 description 1
239000004645 polyester resin Substances 0.000 description 1

Landscapes

Structure Of Printed Boards (AREA)

JP1987039329U 1987-03-17 1987-03-17 Expired - Lifetime JPH0537496Y2 (zh)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP1987039329U JPH0537496Y2 (zh)	1987-03-17	1987-03-17

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP1987039329U JPH0537496Y2 (zh)	1987-03-17	1987-03-17

Publications (2)

Publication Number	Publication Date
JPS63147868U JPS63147868U (zh)	1988-09-29
JPH0537496Y2 true JPH0537496Y2 (zh)	1993-09-22

Family

ID=30852387

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP1987039329U Expired - Lifetime JPH0537496Y2 (zh)	1987-03-17	1987-03-17

Country Status (1)

Country	Link
JP (1)	JPH0537496Y2 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4606181B2 (ja) *	2005-01-17	2011-01-05	京セラ株式会社	多層配線基板
JP5434167B2 (ja) *	2009-03-17	2014-03-05	株式会社村田製作所	回路基板
TWI748740B (zh) *	2020-11-11	2021-12-01	宸寰科技有限公司	散熱導電軟板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS57104560U (zh) *	1980-12-17	1982-06-28

1987
- 1987-03-17 JP JP1987039329U patent/JPH0537496Y2/ja not_active Expired - Lifetime

Also Published As

Publication number	Publication date
JPS63147868U (zh)	1988-09-29

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