JPH0534432B2 - - Google Patents
Info
- Publication number
- JPH0534432B2 JPH0534432B2 JP58141416A JP14141683A JPH0534432B2 JP H0534432 B2 JPH0534432 B2 JP H0534432B2 JP 58141416 A JP58141416 A JP 58141416A JP 14141683 A JP14141683 A JP 14141683A JP H0534432 B2 JPH0534432 B2 JP H0534432B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- tin
- gold
- plated
- ion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 53
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 20
- 229910052737 gold Inorganic materials 0.000 claims description 20
- 239000010931 gold Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052763 palladium Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 238000010304 firing Methods 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 2
- 239000010970 precious metal Substances 0.000 claims 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 20
- 238000007733 ion plating Methods 0.000 description 8
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 230000005856 abnormality Effects 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 210000004243 sweat Anatomy 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 229910001297 Zn alloy Inorganic materials 0.000 description 2
- 238000005422 blasting Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical class [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 101150031658 Nacc1 gene Proteins 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明はイオンプレーテイングされたTiN上
にニツケル、パラジウム、金、銀から選ばれた1
種類の金属を乾式メツキ法によりメツキする事に
よつてTiN上に金メツキ、白金メツキ、ロジウ
ムメツキ、パラジウムメツキ、銀メツキ及びこれ
らの合金メツキを施す方法に関し、時計側や時計
バンド、眼鏡或いはその他の装身具類における外
装品類のメツキに適した方法に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention provides an ion-plated TiN plated with aluminum alloy selected from nickel, palladium, gold, and silver.
Regarding the method of applying gold plating, platinum plating, rhodium plating, palladium plating, silver plating, and alloy plating of these on TiN by plating various metals by dry plating method, it is possible to apply plating on watch sides, watch bands, glasses, etc. The present invention relates to a method suitable for plating exterior items of jewelry.
(従来の技術)
従来金色を出すメツキ方法として金メツキ又は
銅亜鉛合金メツキ、銅錫合金メツキが用いられて
いた。しかし金メツキは金を使用するためコスト
が非常に高くなりかつ傷がつきやすい問題があ
り、又銅亜鉛合金メツキ、銅錫合金メツキは耐食
性が悪いなどの欠点を有していた。(Prior Art) Conventionally, gold plating, copper-zinc alloy plating, or copper-tin alloy plating has been used as a plating method to produce a golden color. However, since gold plating uses gold, it is very expensive and prone to scratches, and copper-zinc alloy plating and copper-tin alloy plating have drawbacks such as poor corrosion resistance.
この種の技術としては例えば特開昭56−169774
号が開示されており、これはAg、Cuを積層させ
て上層の膜厚を100Å以下の極薄層としたもので
ある。しかしAg、Cuは共に耐食性の悪い金属で
あり、本発明者の試験によればさらにCrを薄く
オーバーコートするか、クリヤーコートを実施し
なれば外装部品としては使用することができな
い。しかもCrの蒸着に当り厚過ぎると外観はク
ロムの白色になるし、表面コートがなくなると
Ag、Cuはすぐに変色する。そのため、この方法
は実用になりにくい。また特開昭57−116797号の
ものはCu、Zn、Snの合金メツキの上に金メツキ
を施している。しかしこの方法でも柔かい金メツ
キが摩耗すると下地の前記合金メツキが露出し、
この合金メツキは金色であるが変色し易いため金
色を維持できない。 Examples of this type of technology include Japanese Patent Application Laid-Open No. 56-169774.
No. 1 is disclosed, and this is an extremely thin layer of Ag and Cu stacked together with the upper layer having a thickness of 100 Å or less. However, Ag and Cu are both metals with poor corrosion resistance, and according to the inventor's tests, they cannot be used as exterior parts unless they are further overcoated with a thin layer of Cr or a clear coat is applied. Moreover, if the Cr is deposited too thick, the appearance will become white like chromium, and if the surface coating disappears,
Ag and Cu discolor quickly. Therefore, this method is difficult to put into practical use. Moreover, the one of JP-A No. 57-116797 has gold plating applied on top of alloy plating of Cu, Zn, and Sn. However, even with this method, when the soft gold plating wears away, the underlying alloy plating is exposed.
Although this alloy plating is gold in color, it is easily discolored and cannot maintain its gold color.
ところが乾式メツキ方法によつて作られた窒化
チタン(TiN)皮膜は色調が金色である、高度
が非常に高い、安価である、耐食性が良いなどの
長所を有しているため注目を集めている。 However, titanium nitride (TiN) films made using the dry plating method are attracting attention because they have advantages such as a golden color, very high altitude, low cost, and good corrosion resistance. .
しかしイオンプレーテイング法による窒化チタ
ン(TiN)皮膜は金メツキ皮膜に比較して、
(1) 色調がくらい、
(2) 色調のバラツキが出やすい、
(3) 指紋がつきやすい、
などの問題があつた。 However, compared to gold plating, titanium nitride (TiN) films made using the ion plating method have problems such as (1) poor color tone, (2) tendency to vary color tone, and (3) tendency to attract fingerprints. It was hot.
窒化チタンは電気伝導性が悪く、一般の金属メ
ツキの方法では湿式メツキが密着しないため、チ
タンや窒化チタンの表面を、ブラストや弗化物系
薬品による触刻等により粗面化しなければならな
いのである。しかし、TiNの表面がイオンプレ
ーテイングで形成されたものである場合それらの
膜圧は1〜2μ程度であり、前記ブラストや触刻
を行なうとその膜がなくなつてしまうことにな
る。こうしたことがTiNに対するメツキの実施
を困難にしているため、金色を有していても下地
への利用を阻んでいる。 Titanium nitride has poor electrical conductivity, and wet plating does not adhere well using general metal plating methods, so the surface of titanium or titanium nitride must be roughened by blasting or etching with fluoride chemicals. . However, if the surface of TiN is formed by ion plating, the film thickness is about 1 to 2 μm, and the film will disappear if the above-mentioned blasting or engraving is performed. This makes it difficult to perform plating on TiN, which prevents it from being used as a base material even though it has a golden color.
(技術的課題)
本発明の目的は上述の問題を解決し、イオンプ
レーテイングされたTiNの表面に密着性のよい
貴金属メツキを施す方法を提供することである。(Technical Problem) An object of the present invention is to solve the above-mentioned problems and provide a method for plating the surface of ion-plated TiN with a noble metal with good adhesion.
(技術的手段)
前記目的を達するため本発明は、イオンプレー
テイングされたTiN上に乾式メツキ法によりニ
ツケル、パラジウム、金又は銀のうちから選ばれ
た1種類の金属を1000〜2000Åの膜厚でメツキ
し、該金属メツキ皮膜上に金、又は金と白金、ロ
ジウム、パラジウム、銀若しくはこれらの合金の
うちの1種類以上より成りかつTiNの層と同色
調のメツキ層を湿式メツキ法により形成し、更に
この金属メツキ皮膜を200℃〜700℃の温度で1分
〜2時間焼成するという手段を講じたものであ
る。(Technical means) In order to achieve the above object, the present invention forms a film of one type of metal selected from nickel, palladium, gold, or silver with a thickness of 1000 to 2000 Å on ion-plated TiN using a dry plating method. A plating layer made of gold, or one or more of gold, platinum, rhodium, palladium, silver, or an alloy thereof and having the same color tone as the TiN layer is formed on the metal plating film by a wet plating method. In addition, this metal plating film is fired at a temperature of 200° C. to 700° C. for 1 minute to 2 hours.
而して、TiNの乾式メツキ皮膜は出来るだけ
薄いことが望ましいが薄すぎると次工程で湿式メ
ツキした後の密着性が弱い。又厚すぎると外観が
悪くなり密着度もおちてくるため、望ましい乾式
メツキ皮膜厚は1000Å〜2000Åである。なおTi
とNでTiNをイオンプレーテイングするときは、
TiNに少量のTiとTi2Nが共析する。 Therefore, it is desirable that the TiN dry plating film be as thin as possible, but if it is too thin, the adhesion after wet plating in the next step will be weak. Also, if it is too thick, the appearance will deteriorate and the degree of adhesion will decrease, so the desirable dry plating film thickness is 1000 Å to 2000 Å. Furthermore, Ti
When ion plating TiN with and N,
A small amount of Ti and Ti 2 N eutectoid in TiN.
焼成処理はTiN上の乾式メツキ層と湿式メツ
キ層との熱拡散を目的とするものである。処理温
度が200℃以下ではほとんど熱拡散されず、700℃
以上では表面に酸化膜ができて外観をそこない又
やきなましの現象が発生して機能上問題を生ず
る。量産で時計バンド等をメツキする場合、一つ
のラツクに数十セツト、ラツキングするが、メツ
キ厚の最低値を例えば0.5μとするとばらつきのた
め厚いところでは2μ近くになることもある。メ
ツキの厚い部分は剥離の可能性があるが、本発明
によれば熱処理によりそのおそれもなくなり、品
質を高めることができる。 The purpose of the firing treatment is to diffuse heat between the dry plating layer and the wet plating layer on the TiN. There is almost no heat diffusion when the processing temperature is below 200℃, and when the treatment temperature is 700℃
In this case, an oxide film is formed on the surface, which deteriorates the appearance and causes a phenomenon of dulling, which causes functional problems. When plating watch bands and the like in mass production, dozens of sets are plated on one rack, and if the minimum plating thickness is, for example, 0.5μ, the thickness may be close to 2μ due to variation. Although there is a possibility of peeling in thick plating parts, according to the present invention, heat treatment eliminates this risk and improves quality.
(発明の作用並びに効果)
このように本発明によれば、下地の硬いイオン
プレーテイング層に、乾式メツキ層を介してイオ
ンプレーテイング層と同じ色調の湿式メツキが施
される。故に使用中に表面の湿式メツキ層が摩耗
した場合でも、下地のイオンプレーテイング層と
同色調のため目立たず、しかもこの層は非常に硬
く、耐食性も良いのでそれ以上摩耗のおそれはな
く、耐食性の問題もない。なお硬度は窒化チタン
がHv2000、Au−Ni22KがHv200〜300である。(Operations and Effects of the Invention) As described above, according to the present invention, wet plating is applied to the hard underlying ion plating layer through the dry plating layer in the same color tone as the ion plating layer. Therefore, even if the wet plating layer on the surface wears out during use, it will not be noticeable because it has the same color tone as the underlying ion plating layer.Moreover, this layer is very hard and has good corrosion resistance, so there is no risk of further wear and corrosion resistance. No problem. The hardness of titanium nitride is Hv2000, and the hardness of Au-Ni22K is Hv200 to 300.
以下本発明の実施例について詳述する。 Examples of the present invention will be described in detail below.
実施例 1
SUS304で作られた時計バンドに常法により
TiNをイオンプレーテイングする。その後EB電
源10KV、600mA、真空度2×10-4Torrの条件
でNiを20分イオンプレーテイングし、そのニツ
ケルメツキ皮膜上に公知の電気メツキ法により
Au−Ni22Kを0.5μ厚さにメツキした。その後こ
の時計バンドを350℃で1時間焼成した。得られ
たバンドは22Kの金色であるためTiNの色調より
もやや明る目であつたが、色調のばらつきはな
く、指紋も殆んどつかないものであつた。Example 1 A watch band made of SUS304 was made using a conventional method.
Ion plating TiN. After that, Ni was ion-plated for 20 minutes under the conditions of EB power supply of 10 KV, 600 mA, and vacuum degree of 2 × 10 -4 Torr, and the well-known electroplating method was applied to the nickel plating film.
Au-Ni22K was plated to a thickness of 0.5μ. This watch band was then fired at 350°C for 1 hour. The obtained band was 22K gold, so it was slightly brighter than the TiN color, but there was no variation in color tone and there were almost no fingerprints.
これを人工汗液に24時間浸漬したが何の異常も
認められなかつた。またこのバンドを6箇月間携
帯試験をしたところ、コーナー部分の金メツキは
剥利したが、TiNの下地の金色が残存している
ので従来のように金とステンレス色のまだらにな
るようなことがなかつた。なお金メツキが0.5μ程
度の場合、焼成処理をしなくても折曲げで剥離す
ることはないが、下地がNiなどの場合電位差腐
蝕を起すことがある。しかし本発明によれば焼成
処理により拡散しているためその心配もない。 This was soaked in artificial sweat solution for 24 hours, but no abnormalities were observed. Also, when I tested this band for 6 months on a mobile phone, the gold plating on the corners peeled off, but the gold color of the TiN base remained, so it did not become mottled with gold and stainless steel color like before. I was bored. If the metal plating is about 0.5μ, it will not peel off when bent even without firing, but if the underlying material is Ni, etc., potential difference corrosion may occur. However, according to the present invention, there is no need to worry about this because the particles are diffused by the firing process.
人工汗液組成は次の通りである。 The composition of the artificial sweat fluid is as follows.
Nac1 9.9g/ Na2S9H2O 0.8g/ 28%アンモニア水 0.07m/ 85%乳酸 1.1m/ 蔗 糖 0.2g/ 尿 素 1.7g/ 水全容を1とする。Nac1 9.9g / Na 2 S9H 2 O 0.8g / 28% ammonia water 0.07m / 85% lactic acid 1.1m / Sucrose 0.2g / Urea 1.7g / The total volume of water is 1.
実施例 2
SUS316Lで作られた時計側に常法によりTiN
をイオンプレーテイングし、その後EB電源
10KV、800mA、真空度8×10-5Torrの条件で
金を10分間イオンプレーテイングし、その金皮膜
上に公知の電気メツキ法によりAu−Cu−Cd18K
を1μ厚さにメツキし、更にこの時計側を300℃で
1時間焼成した。この時計側を人工汗液に24時間
浸漬したが何の異常も認められず、また90日間の
携帯テストでも異常は発生しなかつた。Example 2 TiN was applied to the watch side made of SUS316L using a conventional method.
ion plating and then EB power
Gold was ion plated for 10 minutes at 10 KV, 800 mA, and a vacuum level of 8 x 10 -5 Torr, and Au-Cu-Cd18K was deposited on the gold film by a known electroplating method.
The watch side was plated to a thickness of 1μ, and the watch side was fired at 300°C for 1 hour. No abnormalities were observed when the watch side was soaked in artificial sweat solution for 24 hours, and no abnormalities occurred during a 90-day mobile phone test.
Claims (1)
メツキ法によりニツケル、パラジウム、金又は銀
のうちから選ばれた1種類の金属を1000〜2000Å
の膜厚でメツキし、該金属メツキ皮膜上に金、又
は金と白金、ロジウム、パラジウム、銀若しくは
これらの合金のうちの1種類以上より成りかつ
TiNの層と同色調のメツキ層を湿式メツキ法に
より形成し、更にこの金属メツキ皮膜を200℃〜
700℃の温度で1分〜2時間焼成することを特徴
とする貴金属メツキ方法。1 One type of metal selected from nickel, palladium, gold, or silver is deposited to a thickness of 1000 to 2000 Å on ion-plated TiN using a dry plating method.
The metal plating film is plated with a film thickness of
A plating layer with the same color tone as the TiN layer is formed by a wet plating method, and this metal plating film is further heated at 200℃~
A precious metal plating method characterized by firing at a temperature of 700°C for 1 minute to 2 hours.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58141416A JPS6033363A (en) | 1983-08-02 | 1983-08-02 | Noble metal plating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58141416A JPS6033363A (en) | 1983-08-02 | 1983-08-02 | Noble metal plating method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6033363A JPS6033363A (en) | 1985-02-20 |
JPH0534432B2 true JPH0534432B2 (en) | 1993-05-24 |
Family
ID=15291492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58141416A Granted JPS6033363A (en) | 1983-08-02 | 1983-08-02 | Noble metal plating method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6033363A (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0762273B2 (en) * | 1985-02-27 | 1995-07-05 | 株式会社日立製作所 | Electronic component manufacturing method |
JPH0765194B2 (en) * | 1990-06-04 | 1995-07-12 | 東芝タンガロイ株式会社 | Colored surface article and manufacturing method thereof |
JPH0762257B2 (en) * | 1990-05-31 | 1995-07-05 | 東芝タンガロイ株式会社 | Multicolor coated surface article and method for producing the same |
JP2630344B2 (en) * | 1990-06-01 | 1997-07-16 | 東芝タンガロイ 株式会社 | Method for producing multicolor surface articles |
JP2005146304A (en) * | 2003-11-12 | 2005-06-09 | Citizen Watch Co Ltd | Decorative part having decorative film, and its production method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56169774A (en) * | 1980-05-30 | 1981-12-26 | Kawaguchiko Seimitsu Kk | Outside parts of watch |
JPS5798694A (en) * | 1980-10-31 | 1982-06-18 | Hooker Chemicals Plastics Corp | Gold plating method |
JPS57116797A (en) * | 1981-01-09 | 1982-07-20 | Citizen Watch Co Ltd | Wristwatch case, band and neck chain of golden color |
-
1983
- 1983-08-02 JP JP58141416A patent/JPS6033363A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56169774A (en) * | 1980-05-30 | 1981-12-26 | Kawaguchiko Seimitsu Kk | Outside parts of watch |
JPS5798694A (en) * | 1980-10-31 | 1982-06-18 | Hooker Chemicals Plastics Corp | Gold plating method |
JPS57116797A (en) * | 1981-01-09 | 1982-07-20 | Citizen Watch Co Ltd | Wristwatch case, band and neck chain of golden color |
Also Published As
Publication number | Publication date |
---|---|
JPS6033363A (en) | 1985-02-20 |
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