JPH05339709A - Vacuum evaporation boat - Google Patents
Vacuum evaporation boatInfo
- Publication number
- JPH05339709A JPH05339709A JP4170197A JP17019792A JPH05339709A JP H05339709 A JPH05339709 A JP H05339709A JP 4170197 A JP4170197 A JP 4170197A JP 17019792 A JP17019792 A JP 17019792A JP H05339709 A JPH05339709 A JP H05339709A
- Authority
- JP
- Japan
- Prior art keywords
- cover
- boat
- vapor deposition
- vapor
- drop
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は真空加熱蒸着に使用する
通電加熱ボートに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric heating boat used for vacuum heating vapor deposition.
【0002】[0002]
【従来の技術】真空加熱方式で蒸着を行う場合、蒸着膜
面に蒸着物質の微粉末が混入したり、スプラッシュの混
入があった。これを防止するために、図4、図5のよう
にボートカバーを組み合わせて使用している。例えば、
ボート1の蒸着物質5を加熱した場合に、蒸着物質蒸気
がカバー2の穴を通り次にカバー3の穴を経由して蒸着
面に付着する。このカバー2とカバー3の穴の位置の差
で、微粉末またはスプラッシユが除去されることにな
る。図4はカバーが2枚のボート構造を示しているが、
この組み合わせでも微粉末等が蒸着膜に混入する場合が
ある。このような場合には、さらに図5のようにボート
カバー2、3、2′、3′の組み合わせをして使用す
る。この方法は、ボート1の温度をカバーのない条件に
対して高くして蒸着を行なわないと、蒸着物質がカバー
にさえぎられて蒸着されないことになる。従ってカバー
を増すごとに通電電流を多くして、ボート1の温度を高
くして行く。従って、蒸着物質の融点がボート材質の融
点に対し、大幅に低い場合には使用できる。しかし、蒸
着物質の融点が、ボート材質の融点に近い場合には、カ
バーを増すことはできない問題点があった。また、従来
のボートとボートカバーの構造は、全長をボート寸法に
合わせて、通電用ボート固定端子に一対で固定してい
る。このためにボート全体の抵抗が、重ねることで低下
して行くために、大電流を必要とする問題点もあった。2. Description of the Related Art When vapor deposition is performed by a vacuum heating method, fine powder of a vapor deposition substance is mixed in a vapor deposition film surface or splash is mixed. In order to prevent this, a boat cover is used in combination as shown in FIGS. For example,
When the vapor deposition material 5 of the boat 1 is heated, vapor of the vapor deposition material passes through the hole of the cover 2 and then passes through the hole of the cover 3 and adheres to the vapor deposition surface. Due to the difference in the positions of the holes of the cover 2 and the cover 3, fine powder or slush is removed. Although FIG. 4 shows a boat structure with two covers,
Even with this combination, fine powder and the like may be mixed in the vapor deposition film. In such a case, the boat covers 2, 3, 2'and 3'are used in combination as shown in FIG. In this method, if the temperature of the boat 1 is raised to a condition without the cover to perform the vapor deposition, the vapor deposition material is blocked by the cover and the vapor deposition is not performed. Therefore, each time the cover is increased, the energizing current is increased to raise the temperature of the boat 1. Therefore, it can be used when the melting point of the vapor deposition material is significantly lower than that of the boat material. However, when the melting point of the vapor deposition material is close to that of the boat material, the cover cannot be increased. Further, in the conventional boat and boat cover structures, the entire length is fixed to the boat fixing terminals for electricity in accordance with the size of the boat. For this reason, the resistance of the entire boat decreases due to stacking, and there is also a problem that a large current is required.
【0003】[0003]
【発明が解決しようとする課題】前述のように従来のボ
ート構造では、蒸着物質の融点が高いものには、カバー
の使用に制限がある。また、カバーを重ねると電流を増
加する必要が出ることから蒸着用電源を大型化する必要
があった。これらの制限内で蒸着物質の微粉末、スプラ
ッシュが蒸着膜に混入しないようにしたのが本発明の目
的である。As described above, in the conventional boat structure, the use of the cover is limited if the vapor deposition material has a high melting point. Moreover, since it is necessary to increase the current when the covers are overlapped, it is necessary to increase the size of the vapor deposition power source. It is an object of the present invention to prevent the fine powder of the vapor deposition material and the splash from entering the vapor deposition film within these limits.
【0004】[0004]
【課題を解決するための手段】本発明は、この問題点を
解決するために、ボート1内に落とし蓋方式で落し蓋カ
バーを使用して、蒸着物質の突沸を押えることと、従来
のカバーの効果を持たせたものである。SUMMARY OF THE INVENTION In order to solve this problem, the present invention uses a drop lid cover in the boat 1 by a drop lid method to suppress bumping of vapor deposition substance and It has an effect.
【0005】[0005]
【作用】蒸着物質の飛散、スプラッシュは、ボート1内
の微粉末物質が、部分的に溶解して突沸することで発生
する。この突沸を押えるには、蒸着物質を全体に加熱で
きれば良い。しかし、このボート加熱方式では、全体に
加熱することは非常に困難である。本発明の落し蓋方式
の落し蓋カバーはこの条件に近づけることを一つの目的
とする。蒸着物質の上部分にほぼ密接して使用する落し
蓋カバーはボート1を加熱して行くと、ボート1の温度
に近づく。この結果、蒸着物質の温度が全体に上昇し
て、突沸が押えられる。Operation The scattering and splash of the vapor deposition material are generated when the fine powder material in the boat 1 is partially melted and bumped. In order to suppress this bumping, it is sufficient that the vapor deposition material can be entirely heated. However, with this boat heating method, it is extremely difficult to heat the entire boat. The purpose of the drop cover type drop cover of the present invention is to approach this condition. When the boat 1 is heated, the drop lid cover used almost in close contact with the upper portion of the vapor deposition material approaches the temperature of the boat 1. As a result, the temperature of the vapor deposition material rises entirely, and bumping is suppressed.
【0006】[0006]
【実施例】以下この発明の実施例を図1、図2及び図3
で説明する。図1は本発明の実施例ボートの構造を示す
断面図である。1は蒸着物質を入れるボートで、2は従
来の2穴を開けたカバー、3は1穴を開けたカバーであ
る。このボート1とカバー2、3は全長寸法が同じで、
ボート固定端子で固定される。4、4’が本発明の落と
し蓋方式の落し蓋カバーである。5は蒸着物質である。
次にこの動作について説明する。この構造でボート固定
端子から電流を通電してボートを加熱して行う。この加
熱はボート1、落し蓋カバー4、カバー2、およびカバ
ー3の温度を上昇する。ボート1の温度が蒸着物質5の
蒸着温度に達すると、物質が蒸気になり落し蓋カバー4
と、ボート1の隙間を通りカバー2の穴を通過してカバ
ー3の穴から蒸着面に蒸着されて行く。ここで、落し蓋
カバー4はボート1の温度に近づくことから蒸着物質を
全体に蒸着温度にする。この結果蒸着物質の突沸現象を
押える効果がある。また、蒸気はカバー4とボート1の
隙間から出ることになり微粉末、スプラッシュの上昇を
低下させる。次のカバー2の穴から蒸気が出る時にはさ
らに蒸気内の微粉末、スプラッシュが低下する。カバー
3の穴を蒸気が通過する時にはさらに微粉末、スプラッ
シュが除去されて蒸着面に付着する蒸着物質5にはほと
んど微粉末、スプラッシュ等の微細欠陥を発生する物質
がない状態となる。このように、落し蓋カバー4は従来
のカバーの積み重ね効果を出す。また、落し蓋カバー4
はボート1内に設置されることによる蒸着物質との温度
差が少ない点と、ボート1との隙間面積が大きいことか
らボート1の極端な温度上昇を必要としない。図2、図
3は落とし蓋方式の落し蓋カバー4の形状の実施例を示
している。図2は落し蓋カバーの平面図で落し蓋カバー
4’の周辺を波形にした場合である。図3は図1の落し
蓋カバー4の斜視図で全体を波形にした場合である。当
然この組み合わせも可能である。これらカバー形状の選
択は、蒸着物質の上部への通過量と加熱電流値を考えて
適当に選択する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to FIGS.
Described in. FIG. 1 is a sectional view showing the structure of a boat according to an embodiment of the present invention. Reference numeral 1 is a boat for containing a vapor deposition material, 2 is a conventional cover with two holes, and 3 is a cover with one hole. The boat 1 and the covers 2 and 3 have the same overall length,
It is fixed by the boat fixing terminal. Reference numerals 4 and 4 ′ are drop lid type drop lid covers of the present invention. 5 is a vapor deposition material.
Next, this operation will be described. With this structure, the boat is heated by applying an electric current from the boat fixed terminal. This heating raises the temperatures of the boat 1, the drop cover 4, the cover 2, and the cover 3. When the temperature of the boat 1 reaches the vapor deposition temperature of the vapor deposition substance 5, the substance becomes vapor and drops off.
Then, it passes through the gap of the boat 1, passes through the hole of the cover 2, and is vapor-deposited on the vapor deposition surface from the hole of the cover 3. Here, since the drop cover 4 approaches the temperature of the boat 1, the evaporation material is entirely brought to the evaporation temperature. As a result, there is an effect of suppressing the bumping phenomenon of the vapor deposition material. In addition, the steam comes out from the gap between the cover 4 and the boat 1 to reduce the rise of fine powder and splash. When the steam is discharged from the next hole of the cover 2, fine powder and splash in the steam further decrease. When the vapor passes through the holes of the cover 3, the fine powder and splash are further removed, and the vapor deposition material 5 adhering to the vapor deposition surface is in a state in which there is almost no fine powder or a substance that causes fine defects such as splash. Thus, the drop cover 4 provides the stacking effect of conventional covers. Also, the drop cover 4
Does not require an extreme temperature rise of the boat 1 because it has a small temperature difference with the vapor deposition material when installed in the boat 1 and has a large gap area with the boat 1. 2 and 3 show an embodiment of the shape of the drop lid cover 4 of the drop lid type. FIG. 2 is a plan view of the drop lid cover and shows a case where the periphery of the drop lid cover 4'is corrugated. FIG. 3 is a perspective view of the drop cover 4 shown in FIG. Of course, this combination is also possible. The shape of these covers is appropriately selected in consideration of the amount of vapor deposition material passing over and the heating current value.
【0007】[0007]
【発明の効果】本発明の落とし蓋方式の落し蓋カバーを
使用した真空蒸着ボートを使用すれば、従来の蒸着ボー
トで蒸着した場合に発生する蒸着膜面内の微細凹凸欠陥
を減少させることが可能で良品率が向上する。従って、
例えば撮像管の面板の作成に有効で、特に高融点物質の
蒸着で穴カバー方式の追加が不可能の場合にも使用がで
きる。また、蒸着電流も大幅に上げる必要がなく従来の
蒸着電源で使用できる効果もある。EFFECTS OF THE INVENTION By using the vacuum evaporation boat using the drop lid cover of the present invention, it is possible to reduce fine unevenness defects in the surface of the vapor deposition film that occur when vapor deposition is performed by the conventional vapor deposition boat. The good product rate improves. Therefore,
For example, it is effective for forming a face plate of an image pickup tube, and can be used particularly when vapor deposition of a high melting point substance makes it impossible to add a hole cover method. In addition, there is also an effect that it can be used with a conventional vapor deposition power source without having to increase the vapor deposition current significantly.
【図1】本発明ボートの断面図。FIG. 1 is a cross-sectional view of a boat of the present invention.
【図2】本発明落し蓋カバー例の平面図。FIG. 2 is a plan view of an example of the dropping lid cover of the present invention.
【図3】本発明落し蓋カバー例の斜視図。FIG. 3 is a perspective view of an example of the dropping lid cover of the present invention.
【図4】従来ボートの断面図。FIG. 4 is a cross-sectional view of a conventional boat.
【図5】従来の多重ボート断面図。FIG. 5 is a cross-sectional view of a conventional multiple boat.
1 蒸着物質を入れるボート 2 2ケの穴があるボートカバー 3 1ケの穴があるボートカバー 4 本発明の落し蓋カバー 1 Boat for Depositing Vapor Deposition Material 2 Boat Cover with 2 Holes 3 Boat Cover with 1 Hole 4 Dropper Cover of the Present Invention
Claims (1)
の蒸着物質の上に落し蓋を使用することを特徴とした真
空蒸着ボート。1. A vacuum vapor deposition boat characterized by using a drop lid on the vapor deposition material of the boat for vacuum heating vapor deposition.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4170197A JPH05339709A (en) | 1992-06-04 | 1992-06-04 | Vacuum evaporation boat |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4170197A JPH05339709A (en) | 1992-06-04 | 1992-06-04 | Vacuum evaporation boat |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05339709A true JPH05339709A (en) | 1993-12-21 |
Family
ID=15900474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4170197A Pending JPH05339709A (en) | 1992-06-04 | 1992-06-04 | Vacuum evaporation boat |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05339709A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004211110A (en) * | 2002-12-26 | 2004-07-29 | Fuji Electric Holdings Co Ltd | Crucible for vapor deposition, vapor deposition system, and vapor deposition method |
KR100490537B1 (en) * | 2002-07-23 | 2005-05-17 | 삼성에스디아이 주식회사 | Heating crucible and deposit apparatus utilizing the same |
JP2007177319A (en) * | 2005-12-28 | 2007-07-12 | Samsung Sdi Co Ltd | Evaporation source and method of depositing thin film using the same |
KR100889761B1 (en) * | 2002-09-30 | 2009-03-24 | 삼성모바일디스플레이주식회사 | Heating crucible for forming apparatus of organic thin film |
-
1992
- 1992-06-04 JP JP4170197A patent/JPH05339709A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100490537B1 (en) * | 2002-07-23 | 2005-05-17 | 삼성에스디아이 주식회사 | Heating crucible and deposit apparatus utilizing the same |
KR100889761B1 (en) * | 2002-09-30 | 2009-03-24 | 삼성모바일디스플레이주식회사 | Heating crucible for forming apparatus of organic thin film |
JP2004211110A (en) * | 2002-12-26 | 2004-07-29 | Fuji Electric Holdings Co Ltd | Crucible for vapor deposition, vapor deposition system, and vapor deposition method |
JP2007177319A (en) * | 2005-12-28 | 2007-07-12 | Samsung Sdi Co Ltd | Evaporation source and method of depositing thin film using the same |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0529321B1 (en) | Metallic material deposition method for integrated circuit manufacturing | |
JP3301757B2 (en) | Deposition heater | |
EP0554593B1 (en) | A method of manufacturing a device employing a substrate of a material that exhibits the pyroelectric effect | |
US5157240A (en) | Deposition heaters | |
JPS5753947A (en) | Transistor and electronic device containing it | |
JPH0322390A (en) | Manufacture of thin film el panel | |
US2929750A (en) | Power transistors and process for making the same | |
US1584728A (en) | Method of manufacturing mirrors | |
JPH05339709A (en) | Vacuum evaporation boat | |
US3055775A (en) | Superconductive switching component | |
US3967296A (en) | Semiconductor devices | |
US6057235A (en) | Method for reducing surface charge on semiconducter wafers to prevent arcing during plasma deposition | |
JP2003147510A (en) | Evaporation source | |
JPS63227776A (en) | Cathode/target assembly for precipitation apparatus | |
JPS60255971A (en) | Thin film forming apparatus | |
JPH0222463A (en) | Production of metallic thin film | |
JPS6476736A (en) | Manufacture of semiconductor device | |
JPH02258971A (en) | Evaporating source | |
KR100653372B1 (en) | Source for depositing electroluminescent layer | |
JPS63239818A (en) | Dry etching method | |
JPH0541697B2 (en) | ||
JPS61163267A (en) | Vacuum deposition device | |
JPS606429Y2 (en) | Vacuum deposition equipment | |
JPH04346659A (en) | Sputtering apparatus | |
JPS60149767A (en) | Boat for vapor deposition |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20041104 |
|
A131 | Notification of reasons for refusal |
Effective date: 20041109 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
A02 | Decision of refusal |
Effective date: 20050308 Free format text: JAPANESE INTERMEDIATE CODE: A02 |