JPH05335724A - Etching device of printed circuit substrate - Google Patents
Etching device of printed circuit substrateInfo
- Publication number
- JPH05335724A JPH05335724A JP14062192A JP14062192A JPH05335724A JP H05335724 A JPH05335724 A JP H05335724A JP 14062192 A JP14062192 A JP 14062192A JP 14062192 A JP14062192 A JP 14062192A JP H05335724 A JPH05335724 A JP H05335724A
- Authority
- JP
- Japan
- Prior art keywords
- etching
- liquid supply
- printed circuit
- supply pipe
- branch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、絶縁基板上に接合され
た金属薄膜をエッチング液により所定の回路を形成する
プリント回路基板のエッチング装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an etching apparatus for a printed circuit board, which forms a predetermined circuit with an etching solution for a metal thin film bonded on an insulating substrate.
【０００２】[0002]
【従来の技術】プリント回路基板の製造に関し例えば特
開昭５７ー１５７５９３号公報が公知である。この公報
には絶縁基板に接合された金属薄膜上に溶液状の画像形
成材料を塗布乾燥するか或いはフイルム状の画像成形材
料を積層せしめ、この画像形成材料をパターン露光させ
た後、未露光部分を有機溶剤により溶解除去して硬化画
像を形成せしめ、次いでエッチング液により金属薄膜を
エッチング除去し、さらに前記パターン露光による硬化
画像を有機溶剤のよって溶解除去するものが開示されて
いる。2. Description of the Related Art For example, Japanese Laid-Open Patent Publication No. 57-157593 is known for manufacturing a printed circuit board. In this publication, a solution-like image-forming material is applied and dried on a metal thin film bonded to an insulating substrate, or a film-like image-forming material is laminated, and the image-forming material is subjected to pattern exposure, and then an unexposed portion is exposed. Is dissolved and removed with an organic solvent to form a cured image, the metal thin film is then removed by etching with an etching solution, and the cured image by the pattern exposure is dissolved and removed with an organic solvent.
【０００３】従来、金属薄膜をエッチング除去するプリ
ント回路基板のエッチング装置は、エッチング槽にプリ
ント回路基板の搬送路を設け、前記エッチング槽の片側
に前記エッチング液の分岐室を設け、前記分岐室に前記
搬送路に対向して揺動可能な給液管を連結し、前記搬送
路に対向して前記給液管に該給液管に沿って噴出孔を複
数設け、さらに前記分岐室に排出管を介してエッチング
液の供給用ポンプを連結している。したがって、供給用
ポンプより供給されたエッチング液は排出管、分岐室、
給液管、噴出孔を通って搬送路上のプリント回路基板に
向けて噴出されるものであった。Conventionally, a printed circuit board etching apparatus for etching and removing a metal thin film is provided with a conveyance path for the printed circuit board in an etching tank, a branch chamber for the etching solution is provided on one side of the etching tank, and the branch chamber is provided in the branch chamber. A swingable liquid supply pipe is connected to face the transport path, a plurality of ejection holes are provided in the liquid supply pipe facing the transport path, and a discharge pipe is further provided to the branch chamber. A pump for supplying the etching solution is connected via the. Therefore, the etching liquid supplied from the supply pump is discharged from the discharge pipe, the branch chamber,
It was ejected toward the printed circuit board on the transport path through the liquid supply pipe and the ejection hole.
【０００４】[0004]
【発明が解決しようとする課題】従来技術においては、
分岐室の一方側からのみエッチング液が供給されるもの
であったため、供給用ポンプにより圧送されるエッチン
グ液が、給液管に設けられた分岐室側の噴出孔から比較
的高圧力で噴出され一方、分岐室と反対側の噴出孔から
比較的低圧力で噴出される。したがってエッチング液の
噴出圧力が均一な分布とならず、このために搬送路に並
べられて搬送されるプリント回路基板が均一にエッチン
グされず、品質管理が困難であるという問題があった。DISCLOSURE OF THE INVENTION In the prior art,
Since the etching liquid was supplied only from one side of the branch chamber, the etching liquid pumped by the supply pump was ejected at a relatively high pressure from the ejection hole on the side of the branch chamber provided in the liquid supply pipe. On the other hand, it is ejected at a relatively low pressure from the ejection hole on the side opposite to the branch chamber. Therefore, the jetting pressure of the etching solution does not have a uniform distribution, so that the printed circuit boards arranged and conveyed in the conveying path are not uniformly etched, and there is a problem that quality control is difficult.
【０００５】本発明は、前記問題を解決して噴出孔から
噴出するエッチング液の圧力を均一にしてプリント回路
基板を均一にエッチングしてできるようにしたプリント
回路基板のエッチング装置を提供することを目的とす
る。SUMMARY OF THE INVENTION The present invention provides an etching apparatus for a printed circuit board, which solves the above-mentioned problems and makes it possible to uniformly etch the printed circuit board by making the pressure of the etching solution ejected from the ejection holes uniform. To aim.
【０００６】[0006]
【課題を解決するための手段】第１の発明は、エッチン
グ槽と、前記エッチング槽に設けるプリント回路基板の
搬送路と、前記エッチング槽の両側に設ける横長なエッ
チング液の分岐室と、前記一対の分岐室を連結し揺動可
能な給液管と、前記搬送路に対向して前記給液管に設け
られ該給液管の軸方向に沿って複数設けた噴出孔と、前
記一対の分岐室に各々排出管を介して連結したエッチン
グ液の供給用ポンプとを具備したプリント回路基板のエ
ッチング装置である。According to a first aspect of the present invention, there is provided an etching tank, a conveyance path for a printed circuit board provided in the etching tank, a laterally long etching liquid branch chamber provided on both sides of the etching tank, and the pair of etching chambers. Liquid supply pipe that connects the branch chambers of the liquid supply pipe and is swingable, a plurality of ejection holes that are provided in the liquid supply pipe facing the transport path and that are provided along the axial direction of the liquid supply pipe, and the pair of branch pipes. An etching apparatus for a printed circuit board, comprising an etching liquid supply pump connected to each chamber via a discharge pipe.
【０００７】第２の発明は、エッチング槽と、前記エッ
チング槽に設けるプリント回路基板の搬送路と、前記エ
ッチング槽の両側に設ける横長なエッチング液の分岐室
と、前記一対の分岐室を連結し揺動可能な給液管と、前
記搬送路に対向して前記給液管に設けられ該給液管の軸
方向に沿って複数設けた噴出孔と、前記一対の分岐室に
分岐管を介して連結したエッチング液の供給用ポンプと
を具備したプリント回路基板のエッチング装置である。A second aspect of the present invention connects an etching tank, a conveyance path of a printed circuit board provided in the etching tank, a laterally long branch chamber of the etching solution provided on both sides of the etching tank, and the pair of branch chambers. A swingable liquid supply pipe, a plurality of ejection holes provided in the liquid supply pipe facing the transport path and provided in a plurality along the axial direction of the liquid supply pipe, and a branch pipe through the pair of branch chambers. An etching apparatus for a printed circuit board, comprising an etching liquid supply pump connected together.
【０００８】[0008]
【作用】第１発明においては、各々の供給用ポンプから
給液管を介してエッチング液が分岐室に供給され、そし
て各々の分岐室から給液管へエッチング液が供給され
て、該給液管の軸方向に沿って複数設けた各噴出孔から
エッチング液がプリント回路基板に均一圧力で噴射でき
る。According to the first aspect of the invention, the etching liquid is supplied from each supply pump to the branch chamber via the liquid supply pipe, and the etching liquid is supplied from each branch chamber to the liquid supply pipe to supply the liquid supply liquid. The etching liquid can be sprayed onto the printed circuit board at a uniform pressure from each of a plurality of spray holes provided along the axial direction of the tube.
【０００９】第２発明においては、各々の供給用ポンプ
から分岐管を介してエッチング液が分岐室に供給され、
そして各々の分岐室から給液管へエッチング液が供給さ
れて、該給液管の軸方向に沿って複数設けた各噴出孔か
らエッチング液がプリント回路基板に均一圧力で噴射で
きる。In the second invention, the etching liquid is supplied to the branch chamber from each supply pump via the branch pipe.
Then, the etching liquid is supplied from each of the branch chambers to the liquid supply pipe, and the etching liquid can be sprayed onto the printed circuit board at a uniform pressure from a plurality of ejection holes provided along the axial direction of the liquid supply pipe.
【００１０】[0010]
【実施例】以下、本発明の第１実施例を図１及び図２を
参照して説明する。エッチング液１を収容するエッチン
グ槽２の上面にはプリント回路基板３を一側４から他側
５へ搬送するためのローラコンベア等の搬送路６が水平
に設けられている。さらに前記エッチング槽２の底部に
は水平な目皿７を介して回収部８が設けられている。前
記エッチング槽２のやや上方の一側４寄り、他側５寄り
には第１の上部分岐室９、第２の上部分岐室10が対向す
るように配設されている。前記第１の上部分岐室９と第
２の上部分岐室10の間には上部給液管11が複数間隔をお
いて並んで連結しており、前記上部給液管11の端部は継
手12を介して前記上部分岐室９、10に回動可能に連通し
ている。そして前記上部給液管11には前記搬送路６に向
けてノズル等の噴出孔13が複数間隔をおいて軸方向に並
んで設けられている。前記上部給液管11の片側には第１
の固定アーム14が上向きに設けられ、各々の第１の固定
アーム14の上部は進退可能な第１の従動アーム15に軸着
されていると共に、前記第１の従動アーム14の基端には
駆動装置16によって進退する第１の駆動アーム17が軸着
して連結されて、該駆動アーム17が進退することによっ
て上部給液管11が矢印Ａ方向に揺動するようになってい
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIGS. A transport path 6 such as a roller conveyor for transporting the printed circuit board 3 from the one side 4 to the other side 5 is horizontally provided on the upper surface of the etching tank 2 containing the etching solution 1. Further, a collecting section 8 is provided at the bottom of the etching tank 2 via a horizontal plate 7. A first upper branch chamber 9 and a second upper branch chamber 10 are arranged so as to face one side 4 and the other side 5 of the etching tank 2 slightly above. An upper liquid feed pipe 11 is connected between the first upper branch chamber 9 and the second upper branch chamber 10 side by side at a plurality of intervals, and an end portion of the upper liquid feed pipe 11 is a joint 12. Is rotatably connected to the upper branch chambers 9 and 10 via. The upper liquid supply pipe 11 is provided with ejection holes 13 such as nozzles arranged in the axial direction at a plurality of intervals toward the transport path 6. On one side of the upper liquid supply pipe 11, there is a first
Fixed arm 14 is provided upward, and the upper part of each first fixed arm 14 is pivotally attached to a first driven arm 15 that can move forward and backward, and at the base end of the first driven arm 14. A first drive arm 17 that advances and retreats by a drive device 16 is pivotally connected to the first drive arm 17, and as the drive arm 17 advances and retracts, the upper liquid supply pipe 11 swings in the direction of arrow A.
【００１１】さらに前記第１の上部分岐室９、第２の上
部分岐室10には、前記回収部８のエッチング液１を供給
する第１の上部供給用ポンプ20、第２の上部供給用ポン
プ21が連結している。この上部供給用ポンプ20、21の吸
込管22、23は前記回収部８に接続され、排出管24、25は
前記第１の上部分岐室９、第２の上部分岐室10に夫々連
結されている。Further, a first upper supply pump 20 and a second upper supply pump 20 for supplying the etching liquid 1 of the recovery part 8 to the first upper branch chamber 9 and the second upper branch chamber 10, respectively. 21 are connected. The suction pipes 22 and 23 of the upper supply pumps 20 and 21 are connected to the recovery unit 8, and the discharge pipes 24 and 25 are connected to the first upper branch chamber 9 and the second upper branch chamber 10, respectively. There is.
【００１２】同様に前記搬送路６のやや下方の一側４寄
り、他側５寄りには第１の下部分岐室30、第２の下部分
岐室31が対向するように配設されており、両者間には下
部給液管32が複数間隔をおいて並んで連結しており、前
記下部給液管32の端部は継手33を介して前記第１の下部
分岐室30、第２の下部分岐室31に回動可能に連通してい
る。そして前記下部給液管32には前記搬送路６に向けて
ノズル等の噴出孔34が複数間隔をおいて並んで設けられ
ている。前記下部給液管32の片側には第２の固定アーム
35が下向きに設けられ、各々の第２の固定アーム35は進
退可能な第２の従動アーム36に軸着され、前記第２の従
動アーム35の基端には駆動装置16によって進退する第２
の駆動アーム37が連結されている。さらに前記第１の下
部分岐室30、第２の下部分岐室31には、前記回収部８の
エッチング液１を供給する第１の下部供給用ポンプ40、
第２の下部供給用ポンプ41が連結している。この下部供
給用ポンプ40、41の吸込管42、43は前記回収部８に接続
され、排出管44、45は、夫々前記第１の下部分岐室30、
第２の下部分岐室31に連結されている。Similarly, a first lower branching chamber 30 and a second lower branching chamber 31 are arranged so as to face one side 4 and the other side 5 slightly below the conveying path 6, respectively. Lower liquid supply pipes 32 are connected side by side with a plurality of intervals between them, and the ends of the lower liquid supply pipes 32 are connected via a joint 33 to the first lower branch chamber 30 and the second lower chamber. It is rotatably connected to the branch chamber 31. The lower liquid supply pipe 32 is provided with ejection holes 34 such as nozzles arranged side by side at a plurality of intervals toward the transport path 6. A second fixed arm is provided on one side of the lower liquid supply pipe 32.
35 is provided downward, and each second fixed arm 35 is pivotally attached to a second driven arm 36 that can move back and forth, and a second end that is moved forward and backward by a drive unit 16 at the base end of the second driven arm 35.
Drive arm 37 is connected. Further, a first lower supply pump 40 for supplying the etching liquid 1 of the recovery unit 8 to the first lower branch chamber 30 and the second lower branch chamber 31,
A second lower supply pump 41 is connected. The suction pipes 42, 43 of the lower supply pumps 40, 41 are connected to the recovery unit 8, and the discharge pipes 44, 45 are respectively connected to the first lower branch chamber 30,
It is connected to the second lower branch chamber 31.
【００１３】つぎに前記構成につきその作用を説明す
る。未加工のプリント回路基板３が一側４より搬送路６
に載置されて他側５へ搬送される際に、回収部８のエッ
チング液１は第１の供給用ポンプ20によって吸込管22、
排出管24を通って第１の上部分岐室９、第２の上部分岐
室10に排出され、同時に回収部８のエッチング液１は第
２の供給用ポンプ21によって吸込管23、排出管25を通っ
て第１の上部分岐室９、第２の上部分岐室10に排出され
そして上部分岐室９、10を通ったエッチング液１は両側
から上部給液管11へ供給され、そして噴出孔13からプリ
ント回路基板３の上面に向けて噴出してプリント回路基
板３の不要な金属薄膜（図示せず）をエッチング処理し
て除去する。この際に駆動装置16が進退することによっ
て、第１の固定アーム14、第１の従動アーム15、第１の
固定アーム14を介して前記進退運動が回動運動に変換さ
れて上部給液管11が揺動する。Next, the operation of the above configuration will be described. The unprocessed printed circuit board 3 has a transport path 6 from one side 4.
When the etching liquid 1 in the recovery unit 8 is placed on the suction pipe 22 by the first supply pump 20,
It is discharged to the first upper branch chamber 9 and the second upper branch chamber 10 through the discharge pipe 24, and at the same time, the etching liquid 1 in the recovery part 8 is sucked into the suction pipe 23 and the discharge pipe 25 by the second supply pump 21. The etching liquid 1 discharged through the first upper branch chamber 9 and the second upper branch chamber 10 and passed through the upper branch chambers 9 and 10 is supplied to the upper liquid supply pipe 11 from both sides, and then from the ejection hole 13. The unnecessary metal thin film (not shown) of the printed circuit board 3 is ejected toward the upper surface of the printed circuit board 3 and removed by etching. At this time, as the drive unit 16 moves back and forth, the forward / backward movement is converted into a rotational movement through the first fixed arm 14, the first driven arm 15, and the first fixed arm 14, and the upper liquid supply pipe 11 swings.
【００１４】したがって、第１の上部供給用ポンプ20、
第２の上部供給用ポンプ21によってエッチング液１が第
１の上部分岐室９、第２の上部分岐室10を介して上部給
液管11の両側から供給されるために、該上部給液管11に
沿って設けられた各噴出孔13のエッチング液１の噴出圧
力が均一となり、したがってプリント回路基板３上面の
不要な金属薄膜（図示せず）を均一にエッチング処理し
て除去できる。Therefore, the first upper supply pump 20,
Since the etching liquid 1 is supplied from both sides of the upper liquid supply pipe 11 via the first upper branch chamber 9 and the second upper branch chamber 10 by the second upper supply pump 21, the upper liquid supply pipe The ejection pressure of the etching solution 1 in each ejection hole 13 provided along the line 11 is uniform, and therefore, unnecessary metal thin film (not shown) on the upper surface of the printed circuit board 3 can be uniformly etched and removed.
【００１５】同様に、回収部８のエッチング液１は第１
の下部供給用ポンプ40、第２の下部供給用ポンプ41によ
って、吸込管42、43、排出管44、45を通って下部分岐室
30、31に排出され、そしてエッチング液１は両側から下
部給液管32へ供給され、噴出孔34からプリント回路基板
３の下面に向けて噴出してプリント回路基板３の不要な
金属薄膜（図示せず）をエッチング処理して除去する。
この際に駆動装置16が進退することによって、下部給液
管32が揺動する。したがって、第２の上部供給用ポンプ
20、第２の上部供給用ポンプ21によって第１の下部分岐
室30、第２の下部分岐室31を介してエッチング液１が上
部給液管11の両側から供給されるために、該上部給液管
11に沿って設けられた各噴出孔34のエッチング液１の噴
出圧力が均一となり、プリント回路基板３下面を均一に
エッチング処理できる。Similarly, the etching solution 1 in the recovery unit 8 is the first
Lower supply pump 40, second lower supply pump 41, through the suction pipes 42, 43, discharge pipes 44, 45
Then, the etching liquid 1 is discharged to the lower liquid supply pipe 32 from both sides and is ejected from the ejection holes 34 toward the lower surface of the printed circuit board 3 to remove unnecessary metal thin film of the printed circuit board 3 (see FIG. (Not shown) is removed by etching.
At this time, the drive unit 16 moves back and forth, so that the lower liquid supply pipe 32 swings. Therefore, the second upper supply pump
20, the etching liquid 1 is supplied from both sides of the upper liquid supply pipe 11 via the first lower branch chamber 30 and the second lower branch chamber 31 by the second upper supply pump 21. Liquid pipe
The ejection pressure of the etching liquid 1 in each ejection hole 34 provided along the line 11 is made uniform, and the lower surface of the printed circuit board 3 can be uniformly etched.
【００１６】以上のように前記実施例においては、上部
給液管11の両方からエッチング液１を収容するエッチン
グ槽２にプリント回路基板３の搬送路６を設け、前記エ
ッチング槽２の両側に前記エッチング液１の第１の上部
分岐室９、第２の上部分岐室10を設け、前記第１の上部
分岐室９、第２の上部分岐室10に前記搬送路６に対向し
て揺動可能な上部給液管11を複数水平に連結し、前記搬
送路６に対向して前記上部給液管11に噴出孔13を設け、
さらに前記に第１の上部分岐室９、第２の上部分岐室10
に排出管24、25を介してエッチング液１の第１の上部供
給用ポンプ20、第２の上部供給用ポンプ21を各々連結し
たことによって、上部給液管11に沿って設けられた各噴
出孔13のエッチング液１の噴出圧力が均一となり、搬送
路６に並べられた各々のプリント回路基板３上面を均一
にエッチング処理できる。同様に第１の下部分岐室30、
第２の下部分岐室31には第１の下部供給用ポンプ40、第
２の下部供給用ポンプ41を各々連結したことによって、
噴出孔34からのエッチング液１の噴出圧力が均一とな
り、プリント回路基板３下面を均一にエッチング処理で
きる。As described above, in the above-described embodiment, the transport path 6 for the printed circuit board 3 is provided in the etching tank 2 for containing the etching solution 1 from both the upper liquid supply pipes 11, and the transport paths 6 for the printed circuit board 3 are provided on both sides of the etching tank 2. A first upper branch chamber 9 and a second upper branch chamber 10 for the etching liquid 1 are provided, and the first upper branch chamber 9 and the second upper branch chamber 10 can be swung so as to face the transfer path 6. A plurality of upper liquid supply pipes 11 are horizontally connected, and ejection holes 13 are provided in the upper liquid supply pipe 11 so as to face the transport path 6.
Further, the first upper branch chamber 9 and the second upper branch chamber 10
By connecting the first upper supply pump 20 and the second upper supply pump 21 of the etching solution 1 to the respective upper and lower supply pumps 21 and 24 via the discharge pipes 24 and 25, the jets provided along the upper liquid supply pipe 11 are connected. The ejection pressure of the etching liquid 1 in the holes 13 becomes uniform, and the upper surface of each printed circuit board 3 arranged in the transport path 6 can be uniformly etched. Similarly, the first lower branch chamber 30,
By connecting the first lower supply pump 40 and the second lower supply pump 41 to the second lower branch chamber 31, respectively,
The ejection pressure of the etching liquid 1 from the ejection holes 34 becomes uniform, and the lower surface of the printed circuit board 3 can be uniformly etched.
【００１７】図３は本発明の第２実施例を示しており、
前記第１実施例と同一部分には同一符号を付しその詳細
な説明を省略する。第２実施例においては上部供給用ポ
ンプ50の排出口に分岐管51の基端52を連結し、分岐管51
の一方の先端53を第１の上部分岐室９に連結すると共に
他方の先端54を第２の上部分岐室10に連結している。同
様に下部供給用ポンプ55の排出口に分岐管56の基端57を
連結し、分岐管56の一方の先端58を第１の下部分岐室30
に連結すると共に他方の先端59を第２の下部分岐室31に
連結している。FIG. 3 shows a second embodiment of the present invention.
The same parts as those in the first embodiment are designated by the same reference numerals and detailed description thereof will be omitted. In the second embodiment, the base end 52 of the branch pipe 51 is connected to the outlet of the upper supply pump 50, and the branch pipe 51
One end 53 is connected to the first upper branch chamber 9 and the other end 54 is connected to the second upper branch chamber 10. Similarly, the base end 57 of the branch pipe 56 is connected to the outlet of the lower supply pump 55, and one end 58 of the branch pipe 56 is connected to the first lower branch chamber 30.
And the other end 59 is connected to the second lower branch chamber 31.
【００１８】したがって、前記第２実施例では第１の上
部分岐室９、第２の上部分岐室10に分岐管51を介して上
部供給用ポンプ50を各々連結したことによって、上部給
液管11に沿って設けられた各噴出孔13のエッチング液１
の噴出圧力が均一となり、搬送路６に並べられた各々の
プリント回路基板３上面を均一にエッチング処理でき
る。同様に第１の下部分岐室30、第２の下部分岐室31に
は分岐管56を介して下部供給用ポンプ55を各々連結した
ことによって、噴出孔34からのエッチング液１の噴出圧
力が均一となり、プリント回路基板３下面を均一にエッ
チング処理できる。 尚、本発明は前記実施例に限定さ
れるものではなく、例えば第１実施例の排出管24、25、
排出管44、45に圧力調節弁を設けたり、また第２実施例
の分岐管51、56に圧力調節弁を設けて、前記圧力調節弁
により分岐室９、10、30、31の圧力が同じになるように
調節できるようにしてもよいなど種々の変形が可能であ
る。Therefore, in the second embodiment, the upper feed pump 11 is connected to the first upper branch chamber 9 and the second upper branch chamber 10 via the branch pipe 51, respectively. Etching solution 1 for each ejection hole 13 provided along
Since the ejection pressure of the printed circuit boards 3 becomes uniform, the upper surface of each printed circuit board 3 arranged in the transport path 6 can be uniformly etched. Similarly, a lower supply pump 55 is connected to each of the first lower branch chamber 30 and the second lower branch chamber 31 via a branch pipe 56, so that the ejection pressure of the etching solution 1 from the ejection holes 34 is uniform. Therefore, the lower surface of the printed circuit board 3 can be uniformly etched. The present invention is not limited to the above-mentioned embodiment, and for example, the discharge pipes 24, 25 of the first embodiment,
The discharge pipes 44, 45 are provided with pressure control valves, and the branch pipes 51, 56 of the second embodiment are provided with pressure control valves so that the pressure in the branch chambers 9, 10, 30, 31 is the same. It is possible to make various modifications such as adjustment so that
【００１９】[0019]
【発明の効果】第１の発明は、エッチング槽と、前記エ
ッチング槽に設けるプリント回路基板の搬送路と、前記
エッチング槽の両側に設ける横長なエッチング液の分岐
室と、前記一対の分岐室を連結し揺動可能な給液管と、
前記搬送路に対向して前記給液管に設けられ該給液管の
軸方向に沿って複数設けた噴出孔と、前記一対の分岐室
に各々排出管を介して連結したエッチング液の供給用ポ
ンプとを具備したプリント回路基板のエッチング装置で
あり、前記各噴出孔からのエッチング液噴出圧力を均一
にして搬送路に並べられて搬送されるプリント回路基板
を均一にエッチングして、品質管理の向上を図ることが
できる。According to a first aspect of the present invention, there are provided an etching tank, a conveyance path for a printed circuit board provided in the etching tank, a laterally long branch chamber for an etching solution provided on both sides of the etching tank, and the pair of branch chambers. Connectable and swingable liquid supply pipe,
For supplying an etching solution, which is connected to the pair of branch chambers via discharge pipes, respectively, and a plurality of ejection holes provided in the supply pipe opposite to the transfer path and provided along the axial direction of the supply pipe. A printed circuit board etching apparatus comprising a pump, wherein the etching solution jetting pressures from the jet holes are made uniform to uniformly etch the printed circuit boards that are lined up and conveyed in the conveying path, for quality control. It is possible to improve.
【００２０】第２の発明は、エッチング槽と、前記エッ
チング槽に設けるプリント回路基板の搬送路と、前記エ
ッチング槽の両側に設ける横長なエッチング液の分岐室
と、前記一対の分岐室を連結し揺動可能な給液管と、前
記搬送路に対向して前記給液管に設けられ該給液管の軸
方向に沿って複数設けた噴出孔と、前記一対の分岐室に
分岐管を介して連結したエッチング液の供給用ポンプと
を具備したプリント回路基板のエッチング装置であり、
前記各噴出孔からのエッチング液噴出圧力を均一にして
搬送路に並べられて搬送されるプリント回路基板を均一
にエッチングして、品質管理の向上を図ることができ
る。In a second aspect of the present invention, an etching tank, a conveyance path for a printed circuit board provided in the etching tank, a horizontally long branch chamber for an etching solution provided on both sides of the etching tank, and the pair of branch chambers are connected to each other. A swingable liquid supply pipe, a plurality of ejection holes provided in the liquid supply pipe facing the transport path and provided in a plurality along the axial direction of the liquid supply pipe, and a branch pipe through the pair of branch chambers. Is an etching apparatus for a printed circuit board, which is provided with a pump for supplying an etching solution connected to each other,
It is possible to improve the quality control by uniformly making the pressures of the etching solution ejected from the ejection holes uniform and etching the printed circuit boards arranged and conveyed in the conveyance path.
【図１】本発明の第１実施例を示す縦断面図である。FIG. 1 is a vertical cross-sectional view showing a first embodiment of the present invention.
【図２】本発明の第１実施例を示す要部の斜示図であ
る。FIG. 2 is a perspective view of a main part showing the first embodiment of the present invention.
【図３】本発明の第２実施例を示す斜示図である。FIG. 3 is a perspective view showing a second embodiment of the present invention.
１ エッチング液 ２ エッチング槽 ３ プリント回路基板 ６ 搬送路 ９ １０ 上部分岐室 １１ 上部給液管 １３ ３４ 噴出孔 ２０ ２１ ５０ 上部供給用ポンプ ２４ ２５ ４４ ４５ 排出管 ３０ ３１ 下部分岐室 ３２ 下部給液管 ４０ ４１ ５５ 下部供給用ポンプ ５１ ５６ 分岐管 DESCRIPTION OF SYMBOLS 1 Etching liquid 2 Etching tank 3 Printed circuit board 6 Transport path 9 10 Upper branch chamber 11 Upper liquid supply pipe 13 34 Jet hole 20 21 50 Upper supply pump 24 25 44 45 Discharge pipe 30 31 Lower branch chamber 32 Lower liquid supply pipe 40 41 55 Lower supply pump 51 56 Branch pipe
Claims (2)
けるプリント回路基板の搬送路と、前記エッチング槽の
両側に設ける横長なエッチング液の分岐室と、前記一対
の分岐室を連結し揺動可能な給液管と、前記搬送路に対
向して前記給液管に設けられ該給液管の軸方向に沿って
複数設けた噴出孔と、前記一対の分岐室に各々排出管を
介して連結したエッチング液の供給用ポンプとを具備し
たことを特徴とするプリント回路基板のエッチング装
置。1. An etching tank, a conveyance path for a printed circuit board provided in the etching tank, a horizontally long branch chamber for an etching solution provided on both sides of the etching tank, and the pair of branch chambers are connected and swingable. A liquid supply pipe, a plurality of ejection holes provided in the liquid supply pipe facing the transport path and provided along the axial direction of the liquid supply pipe, and connected to the pair of branch chambers via respective discharge pipes. An etching apparatus for a printed circuit board, comprising: an etching liquid supply pump.
けるプリント回路基板の搬送路と、前記エッチング槽の
両側に設ける横長なエッチング液の分岐室と、前記一対
の分岐室を連結し揺動可能な給液管と、前記搬送路に対
向して前記給液管に設けられ該給液管の軸方向に沿って
複数設けた噴出孔と、前記一対の分岐室に分岐管を介し
て連結したエッチング液の供給用ポンプとを具備したこ
とを特徴とするプリント回路基板のエッチング装置。2. An etching tank, a conveyance path for a printed circuit board provided in the etching tank, a laterally long branch chamber for an etching solution provided on both sides of the etching tank, and the pair of branch chambers are connected and swingable. Etching in which a liquid supply pipe, a plurality of ejection holes provided in the liquid supply pipe facing the transport path and provided in the axial direction of the liquid supply pipe, and the pair of branch chambers are connected via a branch pipe A printed circuit board etching apparatus comprising: a liquid supply pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14062192A JPH05335724A (en) | 1992-06-01 | 1992-06-01 | Etching device of printed circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14062192A JPH05335724A (en) | 1992-06-01 | 1992-06-01 | Etching device of printed circuit substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05335724A true JPH05335724A (en) | 1993-12-17 |
Family
ID=15272968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14062192A Pending JPH05335724A (en) | 1992-06-01 | 1992-06-01 | Etching device of printed circuit substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05335724A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112020230A (en) * | 2020-09-10 | 2020-12-01 | 四川睿杰鑫电子股份有限公司 | Etching solution recycling device and method |
| CN114143975A (en) * | 2021-12-06 | 2022-03-04 | 江西华兴四海机械设备有限公司 | Circuit board compensation etching device and compensation etching method |
-
1992
- 1992-06-01 JP JP14062192A patent/JPH05335724A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112020230A (en) * | 2020-09-10 | 2020-12-01 | 四川睿杰鑫电子股份有限公司 | Etching solution recycling device and method |
| CN112020230B (en) * | 2020-09-10 | 2023-10-31 | 四川睿杰鑫电子股份有限公司 | Etching solution recycling device and method |
| CN114143975A (en) * | 2021-12-06 | 2022-03-04 | 江西华兴四海机械设备有限公司 | Circuit board compensation etching device and compensation etching method |
| CN114143975B (en) * | 2021-12-06 | 2024-02-23 | 江西华兴四海机械设备有限公司 | Circuit board compensation etching device and compensation etching method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8388800B2 (en) | Apparatus for wet processing substrate | |
| KR100251034B1 (en) | Method and apparatus for spray etching | |
| KR20010067387A (en) | Film forming unit | |
| JP5762915B2 (en) | Etching method and etching apparatus | |
| KR100889953B1 (en) | Apparatus for etching | |
| JP4117135B2 (en) | Printed circuit board spray processing equipment | |
| JPH05335724A (en) | Etching device of printed circuit substrate | |
| US8500949B2 (en) | Apparatus and method for wet processing substrate | |
| JP3550277B2 (en) | Substrate processing equipment | |
| KR102018271B1 (en) | Etching apparatus for uniform etch condition | |
| JP3232070B2 (en) | Etching equipment | |
| JP3535706B2 (en) | Substrate processing equipment | |
| KR20030003235A (en) | Substrate processing apparatus | |
| KR100728890B1 (en) | Device for etching a flexible film | |
| KR100311829B1 (en) | A device for etching PCB | |
| JPH02211691A (en) | Etching method for forming fine pattern and etching device | |
| JP2010182755A (en) | Substrate processor and substrate processing method | |
| KR101622211B1 (en) | Etching method and etching system | |
| JP3232069B2 (en) | Etching equipment | |
| JP4598911B2 (en) | Method and apparatus for removing processing liquid from substrate | |
| KR101603504B1 (en) | Extraction Apparatus for Removing Puddling on Board in Wet Etching Process of Printed Circuit Board | |
| JPH06260412A (en) | Shower type single sheet processing developing device | |
| JPH0496291A (en) | Method and apparatus for cleaning printed wiring board | |
| JPH11216433A (en) | Substrate treating device | |
| CN210897202U (en) | Spray treatment device |