JPH05318314A - Grinding machining method - Google Patents
Grinding machining methodInfo
- Publication number
- JPH05318314A JPH05318314A JP4148424A JP14842492A JPH05318314A JP H05318314 A JPH05318314 A JP H05318314A JP 4148424 A JP4148424 A JP 4148424A JP 14842492 A JP14842492 A JP 14842492A JP H05318314 A JPH05318314 A JP H05318314A
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- dressing
- ground
- surface plate
- same time
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、金属製の基盤を研削す
る研削加工方法に係り、特に基盤を研削する研削部材の
ドレッシング方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a grinding method for grinding a metal base, and more particularly to a dressing method for a grinding member for grinding a base.
【０００２】[0002]
【従来の技術】従来から、円盤状に形成した保持部材に
複数の孔を穿設し、この孔内に研削する基盤を装填して
位置規制し、基盤の両面を砥石などの研削部材によって
研削する研削加工装置が知られている。2. Description of the Related Art Conventionally, a disc-shaped holding member is provided with a plurality of holes, a base to be ground is loaded in the holes to regulate the position, and both sides of the base are ground by a grinding member such as a grindstone. A grinding processing device is known.
【０００３】図４は、このような従来の研削加工装置の
一例を示す概略的断面図で、保持部材１によって位置規
制した基盤２を、下定盤３の上面に固着した砥石４と上
定盤５の下面に固着した砥石６とによって所定の圧力で
挟持し、研削するように構成されている。FIG. 4 is a schematic sectional view showing an example of such a conventional grinding apparatus. A base 2 whose position is regulated by a holding member 1 is fixed to the upper surface of a lower surface plate 3 and an upper surface plate. It is configured to be sandwiched by a predetermined pressure by a grindstone 6 fixed to the lower surface of 5 and to be ground.
【０００４】保持部材１は円盤状に形成されており、研
削する金属基盤２を装填するために複数、例えば４つの
基盤セット用孔１ａが穿設されている。保持部材１は、
図５に示すように、外周面に歯形が形成されており、下
定盤３の上部軸心部に形成されているサンギア７および
外周の機枠８に形成されているインターナルギア９とそ
れぞれ噛み合うように砥石４上に設定されている。The holding member 1 is formed in a disk shape and is provided with a plurality of, for example, four board setting holes 1a for loading a metal board 2 to be ground. The holding member 1 is
As shown in FIG. 5, a tooth profile is formed on the outer peripheral surface of the lower surface plate 3 so as to mesh with the sun gear 7 formed on the upper shaft center of the lower surface plate 3 and the internal gear 9 formed on the outer peripheral machine frame 8. Is set on the whetstone 4.
【０００５】下定盤３は下部に形成したスリーブ軸１０
のプーリ１１を介して図示しないモータにより一方向に
回転駆動し、上定盤５は下定盤３およびスリーブ軸１０
を回転自在に貫通する軸１２の上部に形成したクラッチ
１３と噛み合いながら軸１２のプーリ１４を介して図示
しないモータにより下定盤３と反対方向に回転駆動す
る。研削液は上定盤５に設けられた供給口１５から供給
し、下定盤３の下部に設置した受皿１６に排出して回収
する。The lower surface plate 3 has a sleeve shaft 10 formed at the bottom thereof.
Is driven to rotate in one direction by a motor (not shown) via the pulley 11 of the upper surface plate 5 and the lower surface plate 3 and the sleeve shaft 10.
Is engaged with a clutch 13 formed on an upper portion of a shaft 12 which rotatably passes through, and is rotationally driven in a direction opposite to the lower surface plate 3 by a motor (not shown) via a pulley 14 of the shaft 12. The grinding liquid is supplied from the supply port 15 provided in the upper surface plate 5, and is discharged and collected in the tray 16 installed in the lower part of the lower surface plate 3.
【０００６】両定盤３および５を相対的に回転駆動する
と、保持部材１はサンギヤ７の周囲を自転しながら公転
し、保持部材１に装填してある各基盤２がスパイラル状
に回転する。このスパイラル回転と砥石４および６によ
る押圧力との相乗効果によって各基盤２は両面が鏡面化
するように研削される。When the two surface plates 3 and 5 are driven to rotate relative to each other, the holding member 1 revolves around the sun gear 7 while rotating around the sun gear 7, and the bases 2 mounted on the holding member 1 rotate in a spiral shape. Due to the synergistic effect of this spiral rotation and the pressing force of the grindstones 4 and 6, each base 2 is ground so that both surfaces are mirror-finished.
【０００７】[0007]
【発明が解決しようとする課題】ところで、砥石などの
研削部材によって基盤を何枚も研削していると、研削屑
および砥粒の砥石気孔への蓄積または砥粒刃先の減少な
どによって研削部材の表面が目詰まりおよび目つぶれを
起こし、徐々に研削能力が低下していく。このため、研
削部材が目詰まりした場合は、装置を一旦停止させて研
削作業を中断し、目詰まりした研削部材の表面をドレッ
シング治具で削り取り、新加工面を表面に出す作業を行
わなければならない。特に現在のドレッシング治具は重
量が重いため作業性が悪く、研削作業の中断と相まって
生産性の低下を招いていた。By the way, when a number of substrates are ground by a grinding member such as a grindstone, grinding dust and abrasive grains are accumulated in the pores of the grindstone or the number of cutting edges of the grindstone is reduced. The surface becomes clogged and crushed, and the grinding ability gradually decreases. For this reason, if the grinding member is clogged, the device must be stopped to interrupt the grinding work, the surface of the clogged grinding member must be scraped off with a dressing jig, and the newly machined surface must be exposed. I won't. In particular, the current dressing jigs have a heavy weight, so that the workability is poor, and the productivity is lowered due to the interruption of the grinding work.
【０００８】研削部材や研削液の選定に工夫を凝らし、
加工条件の最適化を図って研削部材の目詰まりを防ぐ対
策もなされているが、これとても研削部材が目詰まりす
る時間を遅らせているにすぎず、最終的には装置を停止
させて目詰まりした研削部材の表面をドレッシング治具
で削り取る作業を行う必要がある。本発明は、研削作業
を中断することなしに研削部材の表面を常に新加工面に
維持することの出来る新規な研削加工方法を提供するこ
とを目的とする。Ingenuity in selection of grinding members and grinding fluid,
Although measures have been taken to prevent the clogging of grinding members by optimizing the processing conditions, this is merely delaying the time when the grinding members are clogged, and eventually the equipment is stopped and clogging occurs. It is necessary to perform a work of scraping off the surface of the ground grinding member with a dressing jig. It is an object of the present invention to provide a novel grinding method that can always maintain the surface of a grinding member on a new machined surface without interrupting the grinding operation.
【０００９】[0009]
【課題を解決するための手段】本発明による研削加工方
法は、保持部材に装填した複数の金属製の基盤を、下定
盤の上面に固着した研削部材と上定盤の下面に固着した
研削部材とによって所定の圧力で挟持しながら研削する
研削加工装置において、複数の基盤の一部をドレッシン
グ用部材に置換し、研削部材によって基盤を研削すると
同時に、ドレッシング用部材によって研削部材の表面を
削り取り目詰まりを防止する。In the grinding method according to the present invention, a plurality of metal bases loaded on a holding member are fixed to the upper surface of a lower surface plate and the lower surface of an upper surface plate. In a grinding machine that grinds while sandwiching with a predetermined pressure by using, a part of a plurality of substrates is replaced with a dressing member, the substrate is ground by the grinding member, and the surface of the grinding member is scraped off by the dressing member at the same time. Prevent clogging.
【００１０】また、本発明による研削加工方法は、前記
保持部材にドレッシング用部材を固着し、研削部材によ
って基盤を研削すると同時に、ドレッシング用部材によ
って研削部材の表面を削り取り目詰まりを防止する。Further, in the grinding method according to the present invention, the dressing member is fixed to the holding member, the substrate is ground by the grinding member, and at the same time, the surface of the grinding member is scraped off by the dressing member to prevent clogging.
【００１１】また、本発明による研削加工方法は、前記
保持部材をドレッシング用部材で形成し、研削部材によ
って基盤を研削すると同時に、ドレッシング用部材によ
って研削部材の表面削り取り目詰まりを防止する。Further, in the grinding method according to the present invention, the holding member is formed of a dressing member, and the substrate is ground by the grinding member, and at the same time, the dressing member prevents surface scraping and clogging of the grinding member.
【００１２】また、本発明に適用するドレッシング用部
材は、電着またはレジン、メッキなどにより結合したダ
イヤモンドまたは炭化珪素、アルミナなどの砥粒を分散
させたもので構成する。Further, the dressing member applied to the present invention is formed by dispersing abrasive grains such as diamond or silicon carbide or alumina bonded by electrodeposition, resin, plating or the like.
【００１３】[0013]
【作用】本発明においては、研削する複数の基盤の一部
を同一形状のドレッシング用部材に置換することによ
り、または複数の基盤を保持する保持部材にドレッシン
グ用部材を固着することにより、あるいは保持部材その
ものをドレッシング用部材で形成することにより、研削
部材による基盤の研削と同時に研削部材の表面をドレッ
シング用部材で削り取るようにしたので、研削作業を中
断することなしに研削部材のドレッシングを行うことが
できる。In the present invention, a part of a plurality of bases to be ground is replaced with a dressing member having the same shape, or the dressing member is fixed to a holding member for holding the plurality of bases, or held. By forming the member itself with the dressing member, the surface of the grinding member was scraped off with the dressing member at the same time as grinding the base by the grinding member, so dressing of the grinding member without interrupting the grinding operation. You can
【００１４】[0014]
【実施例】本発明による研削加工方法は、図１に示すよ
うに、保持部材１の基盤セット用孔１ａの一部に、研削
する金属製の基盤２に代えてドレッシング用部材２０を
装填することを特徴とする。ドレッシング用部材２０は
基盤２と同一形状の円盤状の支持部材２０ａの表面にド
レッシング能力のある薄膜２０ｂを張り合わせた構造を
有し、薄膜２０ｂとしては、ダイヤモンドの砥粒をバイ
ンダに電着またはバインダに混ぜ合わせて焼結したもの
を用いている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the grinding method according to the present invention, as shown in FIG. 1, a dressing member 20 is loaded in a part of a base-setting hole 1a of a holding member 1 instead of a metal base 2 to be ground. It is characterized by The dressing member 20 has a structure in which a thin film 20b having a dressing ability is attached to the surface of a disk-shaped support member 20a having the same shape as the base 2, and as the thin film 20b, diamond abrasive grains are electro-deposited or bound to a binder. It is used by mixing and sintering.
【００１５】このドレッシング用部材２０は、研削する
金属製の基盤２の最終仕上げ板厚に対して＋３０μm 〜
−１０μm の範囲で有効であり、加工圧力に対して板厚
方向の弾性変形が５μm 以下の剛体で構成するか、ある
いは板厚方向の研削部材への面圧、すなわち砥石への面
圧が１０ｇ／cm2 以下になるように弾性変形する弾性体
で構成する。The dressing member 20 has a thickness of +30 μm to the final finished plate thickness of the metal base 2 to be ground.
It is effective in the range of -10 μm, and is composed of a rigid body whose elastic deformation in the plate thickness direction is 5 μm or less against the processing pressure, or the surface pressure on the grinding member in the plate thickness direction, that is, the surface pressure on the grindstone is 10 g It is composed of an elastic body that is elastically deformed so that it is less than / cm 2 .
【００１６】このような構成を有するドレッシング用部
材２０を、保持部材１の基盤セット用孔１ａの一部に装
填し、下定盤３および上定盤５を相対的に回転駆動すれ
ば、前述したように砥石４および６により基盤２が研削
されると同時に、ドレッシング用部材２０が砥石４およ
び６の表面を削り取るので、研削作業を中断することな
しに砥石４および６の表面を常に新加工面に維持するこ
とが出来る。If the dressing member 20 having such a structure is loaded in a part of the board setting hole 1a of the holding member 1 and the lower surface plate 3 and the upper surface plate 5 are driven to rotate relatively, Since the dressing member 20 scrapes off the surfaces of the whetstones 4 and 6 at the same time that the base 2 is ground by the whetstones 4 and 6 as described above, the surfaces of the whetstones 4 and 6 are always processed without interruption of the grinding work. Can be maintained at
【００１７】なお、前述の実施例においては、保持部材
１の基盤セット用孔１ａの一部に金属製の基盤２と同一
形状のドレッシング用部材２０を装填するようにした
が、図２に示すように、保持部材１の外周縁にドレッシ
ング用部材専用の孔１ｂを穿設し、この孔１ｂ内にリン
グ状に形成したドレッシング用部材２１を装填するよう
にしてもよい。また、図３に示すように、保持部材１の
表面にドレッシング能力のある薄膜２０ｂを張り合わせ
る構造とし、保持部材１自体をドレッシング用部材とす
るようにしてもよい。In the embodiment described above, the dressing member 20 having the same shape as the metal base 2 is loaded in a part of the base setting hole 1a of the holding member 1, as shown in FIG. As described above, the holding member 1 may be provided with the dressing member-dedicated hole 1b on the outer peripheral edge thereof, and the ring-shaped dressing member 21 may be loaded into the hole 1b. Further, as shown in FIG. 3, the holding member 1 may have a structure in which a thin film 20b having a dressing ability is attached to the surface thereof, and the holding member 1 itself may be used as a dressing member.
【００１８】また、前述の実施例においては、ドレッシ
ング用部材の構造を、支持部材または保持部材の表面に
ドレッシング能力のある薄膜を張り合わせる構造とした
が、支持部材または保持部材そのものをドレッシング用
部材で形成するようにしてもよい。Further, in the above-mentioned embodiments, the structure of the dressing member has a structure in which a thin film having a dressing ability is laminated on the surface of the support member or the holding member, but the support member or the holding member itself is the dressing member. It may be formed by.
【００１９】また、前述の実施例においては、ドレッシ
ング能力のある部材としてダイヤモンドの砥粒をバイン
ダに電着またはバインダに混ぜ合わせて焼結したものを
用いるようにしたが、これに限らず炭化珪素（Ｓi Ｃ）
やアルミナなどの砥粒をメタル、レジン、電着などによ
り結合して分散させるようにしてもよい。Further, in the above-mentioned embodiment, as the member having the dressing ability, the one in which the abrasive grains of diamond are electrodeposited on the binder or mixed with the binder and sintered is used. However, the present invention is not limited to this. (Si C)
Abrasive grains such as alumina or alumina may be bonded and dispersed by metal, resin, electrodeposition or the like.
【００２０】[0020]
【発明の効果】本発明によれば、金属製基盤を研削部材
によって研削する際に、これと同時に研削部材の表面を
ドレッシング用部材で削り取るようにしたので、研削作
業と同時に研削部材の表面の目詰まりを防止することが
でき、研削加工の生産性向上を図ることができる。According to the present invention, when the metal base is ground by the grinding member, the surface of the grinding member is scraped off by the dressing member at the same time, so that the surface of the grinding member is ground at the same time as the grinding operation. It is possible to prevent clogging and improve productivity of grinding.
【図１】本発明の一実施例を示す図である。FIG. 1 is a diagram showing an embodiment of the present invention.
【図２】本発明の他の実施例を示す図である。FIG. 2 is a diagram showing another embodiment of the present invention.
【図３】本発明のさらに他の実施例を示す図である。FIG. 3 is a diagram showing still another embodiment of the present invention.
【図４】研削加工装置の概略的断面図である。FIG. 4 is a schematic sectional view of a grinding apparatus.
【図５】下定盤の砥石上に保持部材を載置した状態を示
す部分斜視図である。FIG. 5 is a partial perspective view showing a state in which a holding member is placed on a grindstone of a lower turn table.
１ 保持部材１ａ 基盤セット用孔 ２ 基盤 ３ 下定盤 ４，６ 砥石 ５ 上定盤 ７ サンギア ８ 機枠 ９ インターナルギア １３ クラッチ ２０，２１ ドレッシング用部材 ２０ａ 支持部材 ２０ｂ 薄膜 1 Holding Member 1a Base Set Hole 2 Base 3 Lower Plate 4,6 Grinding Stone 5 Upper Plate 7 Sun Gear 8 Machine Frame 9 Internal Gear 13 Clutch 20,21 Dressing Member 20a Supporting Member 20b Thin Film
Claims (4)
を、下定盤の上面に固着した研削部材と上定盤の下面に
固着した研削部材とによって所定の圧力で挟持しながら
研削する研削加工装置において、 前記複数の基盤の一部をドレッシング用部材に置換し、
前記研削部材によって前記基盤を研削すると同時に、前
記ドレッシング用部材によって前記研削部材の表面を削
り取り目詰まりを防止することを特徴とする研削加工方
法。1. Grinding in which a plurality of metal bases loaded on a holding member are ground while being sandwiched at a predetermined pressure by a grinding member fixed to the upper surface of a lower surface plate and a grinding member fixed to the lower surface of an upper surface plate. In the processing device, a part of the plurality of substrates is replaced with a dressing member,
At the same time as grinding the substrate with the grinding member, the dressing member scrapes the surface of the grinding member to prevent clogging.
を、下定盤の上面に固着した研削部材と上定盤の下面に
固着した研削部材とによって所定の圧力で挟持しながら
研削する研削加工装置において、 前記保持部材にドレッシング用部材を固着し、前記研削
部材によって前記基盤を研削すると同時に、前記ドレッ
シング用部材によって前記研削部材の表面を削り取り目
詰まりを防止することを特徴とする研削加工方法。2. Grinding in which a plurality of metal bases loaded on a holding member are ground while being sandwiched at a predetermined pressure by a grinding member fixed to the upper surface of a lower surface plate and a grinding member fixed to the lower surface of an upper surface plate. In the processing device, a dressing member is fixed to the holding member, the substrate is ground by the grinding member, and at the same time, the surface of the grinding member is scraped off by the dressing member to prevent clogging. Method.
を、下定盤の上面に固着した研削部材と上定盤の下面に
固着した研削部材とによって所定の圧力で挟持しながら
研削する研削加工装置において、 前記保持部材をドレッシング用部材で形成し、前記研削
部材によって前記基盤を研削すると同時に、前記ドレッ
シング用部材によって前記研削部材の表面を削り取り目
詰まりを防止することを特徴とする研削加工方法。3. A grinding method in which a plurality of metal bases loaded on a holding member are ground while being sandwiched by a grinding member fixed to the upper surface of a lower surface plate and a grinding member fixed to the lower surface of an upper surface plate at a predetermined pressure. In the processing device, the holding member is formed of a dressing member, the substrate is ground by the grinding member, and at the same time, the dressing member scrapes the surface of the grinding member to prevent clogging. Method.
ング用部材は、電着またはレジン、メッキなどにより結
合したダイヤモンドまたは炭化珪素、アルミナなどの砥
粒を分散させたものであることを特徴とする研削加工方
法。4. The dressing member according to any one of claims 1 to 3, wherein the abrasive grains of diamond or silicon carbide, alumina or the like bonded by electrodeposition, resin, plating or the like are dispersed. Grinding method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4148424A JPH05318314A (en) | 1992-05-15 | 1992-05-15 | Grinding machining method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4148424A JPH05318314A (en) | 1992-05-15 | 1992-05-15 | Grinding machining method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05318314A true JPH05318314A (en) | 1993-12-03 |
Family
ID=15452489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4148424A Pending JPH05318314A (en) | 1992-05-15 | 1992-05-15 | Grinding machining method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05318314A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012011510A (en) * | 2010-07-01 | 2012-01-19 | Honda Motor Co Ltd | Brush grinding method of metal ring and device therefor |
-
1992
- 1992-05-15 JP JP4148424A patent/JPH05318314A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012011510A (en) * | 2010-07-01 | 2012-01-19 | Honda Motor Co Ltd | Brush grinding method of metal ring and device therefor |
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