JPH05314546A - Production of optical disk substrate - Google Patents

Production of optical disk substrate

Info

Publication number
JPH05314546A
JPH05314546A JP11915792A JP11915792A JPH05314546A JP H05314546 A JPH05314546 A JP H05314546A JP 11915792 A JP11915792 A JP 11915792A JP 11915792 A JP11915792 A JP 11915792A JP H05314546 A JPH05314546 A JP H05314546A
Authority
JP
Japan
Prior art keywords
mold
substrate
air
fixed
optical disk
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP11915792A
Other languages
Japanese (ja)
Inventor
Nobuitsu Kinoshita
伸逸 木下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Holdings Ltd
Original Assignee
Hitachi Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Maxell Ltd filed Critical Hitachi Maxell Ltd
Priority to JP11915792A priority Critical patent/JPH05314546A/en
Publication of JPH05314546A publication Critical patent/JPH05314546A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/43—Removing or ejecting moulded articles using fluid under pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Abstract

PURPOSE:To stably mold an optical substrate having the satisfactory transcription properties by starting the supply of air to a mold releasing air path provided on a fixed metallic mold before the mold opening is started after the cooling is over. CONSTITUTION:A gap t1 is produced between a fixed metallic mold 1 and a mobile metallic mold 3 when the cooling is over and t1<t2 is satisfied by a mold opening action. At the same time, a substrate 15 and a fixed mirror surface 16 are released from the mold 1 when the mold releasing air 13 is blown from the mold 1. The air 13 is turned on and off by a solenoid valve and a delay is caused between the opening of the solenoid valve and the actual blowing of air according to the distance between the solenoid valve and the surface 16 and the diameter of an air path. In this respect, the solenoid valve is actuated before t1<t2 is satisfied. Thus it is possible to eliminate the defective transcription the substrate 15 remains behind the mold 1 and to stably mold an optical disk substrate having the satisfactory transcription properties.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は光デイスク基板の製造方
法に係わり、詳しくは、そのプラスチツク基板の成形法
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an optical disk substrate, and more particularly to a method for molding the plastic substrate.

【０００２】[0002]

【従来の技術】一般の光デイスク基板の成形において
は、冷却完了後の型開開始前あるいは型開開始と同時に
固定金型の離型用エアー通路にエアーを供給させて固定
鏡面から基板を離型させ、型開完了後の取出機の取り出
し動作に合わせて可動金型の離型用エアー通路にエアー
を供給させてスタンパーと基板を離型していた。2. Description of the Related Art In the formation of a general optical disk substrate, air is supplied to a mold release air passage of a fixed mold before mold opening after cooling is completed or at the same time when mold opening is started to separate the substrate from a fixed mirror surface. After the mold is opened, the stamper and the substrate are separated by supplying air to the mold release air passage of the movable mold according to the take-out operation of the take-out machine after the completion of the mold opening.

【０００３】[0003]

【発明が解決しようとする課題】従来の光デイスク基板
の製造方法においては、上記離型前にスタンパーと基板
がずれて転写異常となることがあつた。また、特開平２
−３９９１０号公報にある、型開と同時に固定、可動両
側の離型エアーが吹き出す成形方法だと、固定金型に基
板が残留したり、基板が落下あるいは倒れてしまい、取
り出し不良となることがあつた。In the conventional method for manufacturing an optical disk substrate, the stamper and the substrate may be displaced before the above-mentioned mold release, resulting in abnormal transfer. In addition, JP-A-2
In the molding method described in JP-A-39910, in which the mold air is blown out on both sides of fixing and moving at the same time as the mold is opened, the substrate may remain in the fixed mold, or the substrate may drop or fall down, resulting in poor takeout. Atsuta

【０００４】この発明は上記のような転写異常および基
板の固定金型側残留による取り出し不良という問題を解
決し、転写性の良好な光デイスク基板を安定して成形す
ることを目的とする。An object of the present invention is to solve the above-mentioned problems of transfer abnormality and pick-up failure due to the substrate remaining on the fixed mold side, and to stably form an optical disk substrate having good transferability.

【０００５】[0005]

【課題を解決するための手段】上記目的は、鏡面を有す
る固定金型とスタンパーをセツトしてある可動金型を型
締めし、中央のスプールより熱可塑性樹脂を射出充填す
る光デイスク基板の製造方法において、冷却完了後の型
開開始前に固定金型に備えられた離型用エアー通路にエ
アの供給を開始し、型開開始と同時に可動金型に備えら
れた離型用エアー通路にエアーの供給を開始させるよう
にすることにより達成される。The above object is to manufacture an optical disk substrate in which a fixed mold having a mirror surface and a movable mold having a stamper set therein are clamped, and a thermoplastic resin is injected and filled from a central spool. In the method, after the cooling is completed and before the mold opening is started, the air is started to be supplied to the mold release air passage provided in the fixed mold, and at the same time as the mold opening is started, the mold release air passage is provided in the movable mold. This is achieved by starting the supply of air.

【０００６】[0006]

【作用】図２、図３を参照して説明する。The operation will be described with reference to FIGS.

【０００７】冷却完了後の型開開始前に固定金型の離型
用エアー通路にエアー１３の供給を開始させておくと、
型締力の低下とともに固定側から離型用エアー１３が吹
き出し始め、基板面１５と固定鏡面１６は離型する。次
に、型開動作に入ると同時に可動金型の離型用エアー通
路にエアー１４の供給を開始すると、可動側の離型用エ
アー１４が実際にスタンパーと基板を離型させるまでの
遅れがあるため、基板は型開動作と固定側のエアーによ
り確実に固定鏡面１６から離れた直後に可動側のスタン
パーから離型する。しかも可動側スタンパーからの離型
は型開動作の初期に完了するため、型開動作から取り出
しまでの数秒間に生じる転写異常の前に離型が完了して
おり、良好な転写状態が得られる。After the cooling is completed and before the opening of the mold, the supply of the air 13 to the mold release air passage of the fixed mold is started.
As the mold clamping force decreases, the mold release air 13 begins to blow from the fixed side, and the substrate surface 15 and the fixed mirror surface 16 separate from each other. Next, when the supply of the air 14 to the mold release air passage of the movable mold is started at the same time when the mold opening operation is started, there is a delay until the mold release air 14 on the movable side actually separates the stamper and the substrate. Therefore, the substrate is released from the movable-side stamper immediately after it is reliably separated from the fixed mirror surface 16 by the mold opening operation and the fixed-side air. Moreover, since the mold release from the movable stamper is completed at the initial stage of the mold opening operation, the mold release is completed before the transfer abnormality occurs in a few seconds from the mold opening operation to the taking out, and a good transfer state can be obtained. ..

【０００８】[0008]

【実施例】図１は光デイスク基板成形用金型の縦断面図
である。EXAMPLE FIG. 1 is a vertical sectional view of a mold for molding an optical disk substrate.

【０００９】図において、１は固定金型、２はスタンパ
ー保持リング、３は可動金型、４はスタンパー、５はス
タンパーホルダー、６は突出しリング、７は可動カツタ
ー、８は突出しピン、９はスプールブツシユ、１０はス
プール、１１は固定カツター、１２は基板、１５は基板
面、１６は固定鏡面である。In the figure, 1 is a fixed mold, 2 is a stamper holding ring, 3 is a movable mold, 4 is a stamper, 5 is a stamper holder, 6 is a protruding ring, 7 is a movable cutter, 8 is a protruding pin, and 9 is Spool bush, 10 is a spool, 11 is a fixed cutter, 12 is a substrate, 15 is a substrate surface, and 16 is a fixed mirror surface.

【００１０】図１は光デイスク基板成形用金型に熱可塑
性樹脂を充填後の冷却工程を示しており、冷却完了時の
固定金型１と可動金型３の隙間寸法をｔ1 とすると、型
開動作によりｔ1 ＜ｔ2 となると同時に、固定金型１か
ら離型用エアー１３を吹き出させることにより、基板１
５と固定鏡面１６は離型する。この離型用エアー１３は
電磁弁によりオン、オフされ、電磁弁から固定鏡面１６
の吹き出し部までの距離および流路径により電磁弁開か
ら実際にエアーが吹き出すまでの遅れがあるため、この
時間を見込んでｔ1 ＜ｔ2 となる前に電磁弁を作動させ
る必要がある。図２はｔ1 ＜ｔ2 となり、離型用エアー
１３により固定鏡面１６と基板面１５が離型した状態を
示す。FIG. 1 shows a cooling process after filling a mold for molding an optical disk substrate with a thermoplastic resin. When the clearance between the fixed mold 1 and the movable mold 3 at the time of cooling is t 1 , At the same time that t 1 <t 2 is achieved by the mold opening operation, the mold releasing air 13 is blown out from the fixed mold 1 so that the substrate 1
5 and the fixed mirror surface 16 are released. The release air 13 is turned on and off by a solenoid valve, and the release mirror 13 is fixed to a fixed mirror surface 16 from the solenoid valve.
Since there is a delay from the opening of the solenoid valve until the air is actually blown out depending on the distance to the blowout part and the diameter of the flow path, it is necessary to operate the solenoid valve before t 1 <t 2 in consideration of this time. FIG. 2 shows that t 1 <t 2 , and the fixed mirror surface 16 and the substrate surface 15 are released from each other by the release air 13.

【００１１】図２の状態になつたら直ちに可動金型３か
ら離型用エアー１４を吹き出させることにより基板１２
はスタンパー４から離型し、可動カツター７により可動
金型３に保持されて取り出されていく。この場合、可動
金型３からの離型用エアー１４も実際に吹き出すまでの
遅れを見込んで電磁弁を作動させなければならない。ま
た、ｔ2 ＜ｔ3 となつた時にエアーを吹き出させるが、
ｔ3 は出来る限りｔ2 に近い方がスタンパー４と基板１
２のずれによる転写異常は起こらない。可動金型３のス
タンパー４から基板１２を離型させた状態を図３に示し
た。As soon as the state shown in FIG. 2 is reached, the release air 14 is blown from the movable mold 3 to release the substrate 12.
Is released from the stamper 4, held by the movable mold 3 by the movable cutter 7, and taken out. In this case, the solenoid valve must be operated in anticipation of a delay before the release air 14 from the movable mold 3 is actually blown out. Also, when t 2 <t 3 , air is blown out,
The stamper 4 and the substrate 1 should have t 3 as close as possible to t 2.
The transfer abnormality due to the deviation of 2 does not occur. A state where the substrate 12 is released from the stamper 4 of the movable mold 3 is shown in FIG.

【００１２】ｔ1 ，ｔ2 ，ｔ3 は成形条件によつて多少
変わるが、一般にｔ1 ＝０〜０．１ｍｍにて成形されて
おり、これに対してｔ2 ，ｔ3 は出来る限り小さい方が
転写異常は起こりにくく、ｔ1 ＜ｔ2 ＜ｔ3 ＜１０ｍｍ
で良好な転写が得られている。Although t 1 , t 2 and t 3 are slightly changed depending on molding conditions, they are generally molded at t 1 = 0 to 0.1 mm, whereas t 2 and t 3 are as small as possible. Transcription abnormality is less likely to occur, and t 1 <t 2 <t 3 <10 mm
Good transfer is obtained.

【００１３】[0013]

【発明の効果】以上説明したように、本発明によれば、
冷却完了後の型開開始前に固定金型に備えられた離型用
エアー通路にエアの供給を開始し、型開開始と同時に可
動金型に備えられた離型用エアー通路にエアーの供給を
開始させることにより、固定側に基板が残留する取り出
し不良やスタンパーと基板のずれによる転写不良をなく
し、転写性の良好な光デイスク基板を安定して成形する
ことが可能になる。As described above, according to the present invention,
After the cooling is completed and before the mold is opened, air is supplied to the mold release air passage provided in the fixed mold, and at the same time the mold is opened, air is supplied to the mold release air passage provided in the movable mold. By starting the process, it becomes possible to eliminate the defective take-out in which the substrate remains on the fixed side and the defective transfer due to the gap between the stamper and the substrate, and it is possible to stably form an optical disk substrate having good transferability.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の実施例に係る光デイスク基板成形用金
型の縦断面図である。FIG. 1 is a vertical cross-sectional view of an optical disk substrate molding die according to an embodiment of the present invention.

【図２】本発明の実施例に係る光デイスク基板成形過程
の要部縦断面図である。FIG. 2 is a longitudinal sectional view of an essential part of the optical disk substrate molding process according to the embodiment of the present invention.

【図３】本発明の実施例に係る光デイスク基板成形過程
の要部縦断面図である。FIG. 3 is a longitudinal sectional view of an essential part of a process for molding an optical disk substrate according to an embodiment of the present invention.

【符号の説明】[Explanation of symbols]

１ 固定金型 ３ 可動金型 １３ 離型用エアー（固定側） １４ 離型用エアー（可動側） １５ 基板面 １６ 固定鏡面 1 Fixed Mold 3 Movable Mold 13 Release Air (Fixed Side) 14 Release Air (Movable Side) 15 Substrate Surface 16 Fixed Mirror Surface

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 鏡面を有する固定金型とスタンパーをセ
ツトしてある可動金型を型締めし、中央のスプールより
熱可塑性樹脂を射出充填する光デイスク基板の製造方法
において、 冷却完了後の型開開始前に固定金型に備えられた離型用
エアー通路にエアーの供給を開始し、型開開始と同時に
可動金型に備えられた離型用エアー通路にエアーの供給
を開始させるようにしたことを特徴とする光デイスク基
板の製造方法。1. A method for manufacturing an optical disk substrate, comprising: fixing a fixed mold having a mirror surface and a movable mold set with a stamper, and injecting and filling a thermoplastic resin from a center spool; Before starting opening, supply air to the mold release air passage provided in the fixed mold, and at the same time as opening the mold, start supplying air to the mold release air passage provided in the movable mold. A method for manufacturing an optical disk substrate, characterized in that
JP11915792A 1992-05-12 1992-05-12 Production of optical disk substrate Withdrawn JPH05314546A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11915792A JPH05314546A (en) 1992-05-12 1992-05-12 Production of optical disk substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11915792A JPH05314546A (en) 1992-05-12 1992-05-12 Production of optical disk substrate

Publications (1)

Publication Number Publication Date
JPH05314546A true JPH05314546A (en) 1993-11-26

Family

ID=14754333

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11915792A Withdrawn JPH05314546A (en) 1992-05-12 1992-05-12 Production of optical disk substrate

Country Status (1)

Country Link
JP (1) JPH05314546A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1213120A1 (en) * 1999-03-12 2002-06-12 Matsushita Electric Industrial Co., Ltd. Optical disk molding device and method
WO2011091647A1 (en) * 2010-01-29 2011-08-04 东莞宏威数码机械有限公司 Stamping device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1213120A1 (en) * 1999-03-12 2002-06-12 Matsushita Electric Industrial Co., Ltd. Optical disk molding device and method
EP1213120A4 (en) * 1999-03-12 2002-10-16 Matsushita Electric Ind Co Ltd Optical disk molding device and method
US6875378B1 (en) 1999-03-12 2005-04-05 Matsushita Electric Industrial Co., Ltd. Optical disk molding apparatus and method
WO2011091647A1 (en) * 2010-01-29 2011-08-04 东莞宏威数码机械有限公司 Stamping device

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Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 19990803