JPH05305467A - Method for cutting optical transmission material by laser beam - Google Patents
Method for cutting optical transmission material by laser beamInfo
- Publication number
- JPH05305467A JPH05305467A JP4107935A JP10793592A JPH05305467A JP H05305467 A JPH05305467 A JP H05305467A JP 4107935 A JP4107935 A JP 4107935A JP 10793592 A JP10793592 A JP 10793592A JP H05305467 A JPH05305467 A JP H05305467A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- glass
- light
- laser beam
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
Description
【０００１】本発明はレーザービームを用いた光透過性
材料、特にガラス板の切断方法に関するものである。The present invention relates to a method of cutting a light-transmitting material using a laser beam, particularly a glass plate.
【０００２】[0002]
【従来技術とその問題点】一般に物品をレーザーにより
切断することは公知の技術事項である。特開平1-271084
号にはガラスに対しレーザー、例えばYAG レーザーの吸
収率が高い支持材料をガラスに密着させ、レーザービー
ム焦点をガラスと支持材料の境界近傍にくるように設定
してガラスの表側からレーザービームを照射し、ガラス
を切断する方法が開示されている。2. Description of the Related Art Generally, it is a known technical matter to cut an article with a laser. Japanese Patent Laid-Open No. 1-271084
In the No. 6, a support material having a high absorptivity of a laser such as a YAG laser is adhered to the glass, and the laser beam focus is set near the boundary between the glass and the support material to irradiate the laser beam from the surface Then, a method of cutting glass is disclosed.
【０００３】この方法では、ガラスが二次元、三次元的
に湾曲しているケースにおいては支持材料もそれに倣っ
て湾曲させガラスに密着させねばならないという不具合
があり、きわめて非効率的である。This method is extremely inefficient, because in the case where the glass is curved two-dimensionally or three-dimensionally, the support material must be curved accordingly and adhered to the glass.
【０００４】さらに、極めて高いレーザーエネルギーが
照射されるため、支持材料が焼損し易く、長時間の使
用、繰り返し使用に耐え難いという問題点もある。本発
明はこれらの問題点を解消し、容易かつ効率的に切断で
きる光透過性材料のレーザー切断法を提供するものであ
る。Further, since a very high laser energy is irradiated, the supporting material is easily burned, and it is difficult to endure long-time use and repeated use. The present invention solves these problems and provides a laser cutting method for a light transmissive material that can be cut easily and efficiently.
【０００５】[0005]
【問題点を解決するための手段】本発明は光透過性材料
のレーザー切断法に関し、光透過性材料の少なくとも一
面に光吸収性の塗料を塗布し、該材料の他の面側より所
望切断ラインに沿ってレーザービームを走査するように
したこと、好適には光透過性材料の少なくとも一面に塗
料による切断ラインを線引し、該材料の他の面側より前
記線引部に沿ってレーザービームを走査するようにした
こと、該材料がガラス板であること、加えて前記レーザ
ー光がYAG レーザーであること、さらにレーザー光が平
行光束よりなりその径が0.5 μm 以下であることからな
る。The present invention relates to a laser cutting method for a light transmissive material, in which a light absorptive coating is applied to at least one surface of the light transmissive material and desired cutting is performed from the other surface side of the material. The laser beam is scanned along the line, preferably, a cutting line made of a paint is drawn on at least one surface of the light transmissive material, and the laser is drawn along the drawn portion from the other surface side of the material. The beam scanning is performed, the material is a glass plate, the laser light is a YAG laser, and the laser light is a parallel light beam having a diameter of 0.5 μm or less.
【０００６】本発明において光透過性材料とはガラス、
樹脂等広範囲のものが対象となるが、レーザー光を50％
を超えて透過するもの、好適には70％以上透過するもの
であればよく、一例としてガラス板を推奨するものであ
る。In the present invention, the light transmissive material is glass,
A wide range of materials such as resins are targeted, but 50% of laser light
It is sufficient that the glass plate has a transmittance of more than 70%, preferably 70% or more, and a glass plate is recommended as an example.
【０００７】本発明にいう切断とはレーザー照射のみに
より溶断する場合は勿論であるが、レーザー照射により
局部的に熱的歪を発生させバーティカルクラックを誘起
して手操作等による折割を容易とする場合、あるいはバ
ーティカルクラック発生後、該部に水等の冷媒を接触さ
せることにより切断する場合なども含まれる。The cutting referred to in the present invention is not limited to the case of fusing only by laser irradiation, but laser irradiation locally causes a thermal strain to induce a vertical crack and facilitate breakage by manual operation or the like. Also, it includes the case where the vertical crack is generated and the cutting is performed by bringing a coolant such as water into contact with the portion.
【０００８】レーザーは前記のように光透過性材料透過
するものであればエキシマーレーザーその他適宜各種レ
ーザーが採用できるが、例えばガラス板の場合YAG レー
ザー(波長1.06μm ) が好適に採用でき、ソーダ石灰系
ガラス、アルミノ珪酸系ガラス、ほう珪酸系ガラス等多
くのガラスが適用され、さらにポリカーボネート、ポリ
アクリレート等多くの樹脂は上記波長域のものを殆ど透
過するので都合がよい。従ってこれら光透過性材料のレ
ーザー入射に対する対向面側にレーザー光を吸収する塗
料を塗布しておけば該部に熱が発生して溶断、あるいは
バーティカルクラックを起生し折割することができる。As the laser, an excimer laser and various other lasers can be adopted as appropriate as long as they can transmit a light-transmitting material as described above. For example, in the case of a glass plate, a YAG laser (wavelength 1.06 μm) can be preferably adopted, and soda lime can be used. Many kinds of glass such as glass, aluminosilicate glass, and borosilicate glass are applied, and many resins such as polycarbonate and polyacrylate are convenient because most of those in the above wavelength range are transmitted. Therefore, if a coating that absorbs laser light is applied to the surface of these light-transmissive materials facing the laser incidence, heat is generated in that portion to cause fusing or vertical cracks, which can be broken.
【０００９】また、例えば金属等による熱線反射膜を膜
付けしたいわゆる熱線反射ガラスにおいては、熱線反射
と雖も吸収率の方が勝り、レーザー光吸収性の塗料と同
様な挙動を呈するので都合がよい。Further, in a so-called heat-reflecting glass having a heat-reflecting film made of, for example, a metal, the absorptance of heat-ray reflection and 雛 is superior, and the same behavior as that of a laser-absorptive paint is exhibited. Good.
【００１０】さらに熱線吸収ガラスの場合も先述のごと
く透過率が過半であれば何ら不都合はない。加えて線入
り、網入りガラス板の切断の場合は、これら線材がレー
ザー光を吸収して溶断し、あるいは脆化して切断を容易
とするので好都合である。Further, in the case of heat ray absorbing glass, if the transmittance is more than half as described above, there is no inconvenience. In addition, in the case of cutting a glass plate with a wire or a net, it is convenient because these wires absorb laser light and are melted or cut, or become brittle to facilitate cutting.
【００１１】光透過性材料の切断においてはより好まし
くは切断ラインに沿って光透過性材料の両面に塗料を線
引きするのが望ましく、前記両面の塗料塗布部が加熱さ
れて両面側からバーティカルクラックが発生し容易に切
断、あるいは溶断できる。In the cutting of the light-transmitting material, it is more preferable to draw the paint on both surfaces of the light-transmitting material along the cutting line, and the paint coating portions on the both surfaces are heated to cause vertical cracks on both surfaces. Occurs and can be easily cut or melted.
【００１２】レーザー照射手段としては、石英ファイバ
ー等の細繊維を採用すれば、0.5 μm 以下の極めて細い
平行したレーザー光束が得られ、切断寸法もきわめて精
密なものとすることができる。If a fine fiber such as quartz fiber is adopted as the laser irradiation means, an extremely thin parallel laser beam of 0.5 μm or less can be obtained, and the cutting dimension can be made extremely precise.
【００１３】塗料は前記波長域において良好にレーザー
エネルギー吸収するものであればよく、特に熱により揮
散しない無機顔料を含むものがよい。従って殆どの市販
の着色塗料が利用でき、卑近な例では着色インクも好適
に採用できる。The coating material may be one that absorbs the laser energy well in the above wavelength range, and particularly one that contains an inorganic pigment that does not volatilize by heat. Therefore, most commercially available colored paints can be used, and colored inks can be preferably used in the most common examples.
【００１４】[0014]
【実施例】以下本発明を実施例に基づき説明する。 (実施例１）添付図１の部分概略斜視図において、1 が
例えば厚み5mm の湾曲したソーダ石灰系ガラス板、2 、
2 がガラス板の支持台であり、3 が予めガラス板の下面
に黄色のマジックインキ（商標名）で形成した切断ライ
ン、4 が予めガラス板の上面に同様にマジックインキで
形成した前記切断ライン3 に対向する切断ラインであ
る。すなわち本実施例においてはガラス板両面に塗料を
線引したケースを示すものである。EXAMPLES The present invention will be described below based on examples. (Example 1) In the partial schematic perspective view of the attached FIG. 1, 1 is a curved soda-lime glass plate having a thickness of 5 mm, 2,
2 is a support for the glass plate, 3 is a cutting line previously formed on the lower surface of the glass plate with yellow magic ink (trademark), and 4 is a cutting line previously formed on the upper surface of the glass plate similarly with magic ink It is a cutting line that faces 3. That is, this embodiment shows a case where paint is drawn on both surfaces of the glass plate.
【００１５】5 はロボットアームの一端を示し、6 はロ
ボットアームに担持された例えば石英ガラスからなる光
ファイバーであって約0. 3μm の直径を有し、従って光
束0.3 μm φのYAG レーザー光が照射される。なお光フ
ァイバーは図示しない公知のYAG レーザー発信装置に接
続されるものである。Reference numeral 5 denotes one end of the robot arm, and 6 is an optical fiber made of, for example, quartz glass carried by the robot arm and having a diameter of about 0.3 μm, and therefore a YAG laser beam having a luminous flux of 0.3 μm φ is irradiated. To be done. The optical fiber is connected to a known YAG laser transmission device (not shown).
【００１６】本実施例においてはガラス板1 に波長1.06
μm 、出力150W、発射パルス 200Hz、走査速度1.5m/min
の条件でYAG レーザーを照射した。図はその状態を示
し、バーティカルクラック7 （斜線で示す）が形成され
た。レーザー照射の段階においてはガラス板の完全な切
断には到らないが、レーザー照射終了後手操作による折
割できわめて容易に切断でき、切断面も凹凸のない平坦
な面を呈していた。In this embodiment, the glass plate 1 has a wavelength of 1.06
μm, output 150W, firing pulse 200Hz, scan speed 1.5m / min
Irradiation with a YAG laser was carried out under the conditions. The figure shows that state, and vertical cracks 7 (indicated by diagonal lines) were formed. Although the glass plate could not be completely cut at the laser irradiation stage, it could be cut very easily by breaking manually after the laser irradiation, and the cut surface had a flat surface without unevenness.
【００１７】マジックインキによるガラス板両面の線引
は公知のプログラムコントロールされたロボットアーム
により容易に行うことができ、またレーザー照射もレー
ザー発信装置に接続した光ファイバーの先端部を同様に
ロボットアームにより同一軌跡を以て走査させることが
できるので都合がよい。The drawing of both sides of the glass plate with the magic ink can be easily performed by a well-known program-controlled robot arm, and the laser irradiation is also performed by the same robot arm at the tip of the optical fiber connected to the laser transmitter. This is convenient because it can be scanned along a locus.
【００１８】(実施例２）図２の部分概略斜視図におい
て1aが厚み5mm の金属線1b入りソーダ石灰系ガラス板、
2 、2 がガラス板の支持台であり、3aが予めガラス板の
下面に黒色のマジックインキ（商標名）で形成した切断
ライン、4aが予めガラス板の上面に同様にマジックイン
キで形成した前記切断ライン3aに対向する切断ラインで
あり、すなわち本実施例は実施例１同様ガラス板両面に
塗料を線引したケースを示すものである。(Embodiment 2) In the partial schematic perspective view of FIG. 2, 1a is a soda-lime glass plate containing a metal wire 1b having a thickness of 5 mm,
2, 2 is a support for the glass plate, 3a is a cutting line previously formed on the lower surface of the glass plate with black magic ink (trade name), 4a is previously formed on the upper surface of the glass plate similarly with magic ink This is a cutting line opposite to the cutting line 3a, that is, this embodiment shows a case where paint is drawn on both surfaces of the glass plate as in the first embodiment.
【００１９】5 は実施例１と同様のロボットアームの一
端を示し、6 は光ファイバーであって光束0.3 μm φの
YAG レーザー光が照射される。本実施例においてはガラ
ス板1aに波長1.06μm 、出力130W、発射パルス 200Hz、
走行速度1.0m/minの条件でレーザー照射した。図はその
状態を示し、バーティカルクラック7 （斜線で示す）が
形成され、また金属線1bのレーザー照射部は変質劣化に
よるものと思われる変色が認められた。レーザー照射終
了後においてはガラス板の完全な切断には到らないが、
手操作で折割したところ金属線を含め簡単に切断でき、
切断面も凹凸のない平坦面が得られた。Reference numeral 5 denotes one end of a robot arm similar to that of the first embodiment, and 6 denotes an optical fiber having a luminous flux of 0.3 μm φ.
Irradiated with YAG laser light. In this embodiment, the glass plate 1a has a wavelength of 1.06 μm, an output of 130 W, an emission pulse of 200 Hz,
Laser irradiation was performed at a running speed of 1.0 m / min. The figure shows this state, in which vertical cracks 7 (indicated by diagonal lines) were formed, and the laser-irradiated portion of the metal wire 1b was discolored, which was thought to be due to deterioration. Although the glass plate cannot be completely cut after the laser irradiation,
When you manually break it, you can easily cut it, including metal wires,
The cut surface was also a flat surface without irregularities.
【００２０】(実施例３)厚み 1.6mmのソーダ石灰系ガラ
ス板の下面に赤色のマジックインキ (商標名)で線引き
し、ガラス板上面より前記下線に倣って実施例１同様の
レーザー照射装置で、但し波長1.06μm 、出力115W、発
射パルス 200Hz、走行速度1.2m/minの条件でレーザー照
射した。ガラスはレーザー照射により完全に破断でき、
また切断面も凹凸のない平坦面であった。(Example 3) A soda-lime glass plate having a thickness of 1.6 mm was drawn on the lower surface with a red magic ink (trademark), and the laser irradiation device similar to that of Example 1 was used to trace the underline from the upper surface of the glass plate. However, laser irradiation was performed under the conditions of a wavelength of 1.06 μm, an output of 115 W, an emission pulse of 200 Hz, and a traveling speed of 1.2 m / min. The glass can be completely broken by laser irradiation,
Also, the cut surface was a flat surface without irregularities.
【００２１】[0021]
【発明の効果】本発明によれば通常のガラス、湾曲ガラ
ス、網入りガラスをはじめとする光透過性材料の切断が
容易にでき、かつ切断面も凹凸のない平坦面が得られる
という効果を奏する。EFFECTS OF THE INVENTION According to the present invention, it is possible to easily cut a light-transmissive material such as ordinary glass, curved glass, and reticulated glass, and to obtain a flat surface without cuts. Play.
【図１】一実施例にかかる部分概略斜視図である。FIG. 1 is a partial schematic perspective view according to an embodiment.
【図２】別の態様にかかる部分概略斜視図である。FIG. 2 is a partial schematic perspective view according to another aspect.
1 、1a ガラス板 3 、3a、4 、4a 切断ライン 5 ロボットアーム 6 光ファイバー 1, 1a Glass plate 3, 3a, 4, 4a Cutting line 5 Robot arm 6 Optical fiber
フロントページの続き (72)発明者 砂子田 敏之 富山県富山市石金20番地 株式会社不二越 内Front page continuation (72) Inventor Toshiyuki Sunakoda 20 Ishigane, Toyama City, Toyama Prefecture Fujikoshi Co., Ltd.
Claims (5)
の塗料を塗布し、該材料の他の面側より所望切断ライン
に沿ってレーザービームを走査するようにしたことを特
徴とする光透過性材料のレーザー切断法。1. A light which is characterized in that a light absorbing paint is applied to at least one surface of a light transmitting material, and a laser beam is scanned from the other surface side of the material along a desired cutting line. Laser cutting method for transparent materials.
る切断ラインを線引し、該材料の他の面側より前記線引
部に沿ってレーザービームを走査するようにしたことを
特徴とする請求項１記載の光透過性材料のレーザー切断
法。2. A cutting line made of a paint is drawn on at least one surface of the light transmissive material, and a laser beam is scanned along the drawn part from the other surface side of the material. A laser cutting method for the light transmissive material according to claim 1.
する請求項１または２記載の光透過性材料のレーザー切
断法。3. The laser cutting method for a light transmissive material according to claim 1, wherein the light transmissive material is glass.
徴とする請求項１ないし３記載の光透過性材料のレーザ
ー切断法。4. The laser cutting method for a light transmissive material according to claim 1, wherein the laser light is a YAG laser.
0.5 μm 以下であることを特徴とする請求項１ないし４
記載の光透過性材料のレーザー切断法。5. The laser light is a parallel light beam having a diameter of
5. The size is 0.5 μm or less, and the size is less than 0.5 μm.
A laser cutting method for the light-transmitting material described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4107935A JPH05305467A (en) | 1992-04-27 | 1992-04-27 | Method for cutting optical transmission material by laser beam |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4107935A JPH05305467A (en) | 1992-04-27 | 1992-04-27 | Method for cutting optical transmission material by laser beam |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05305467A true JPH05305467A (en) | 1993-11-19 |
Family
ID=14471785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4107935A Withdrawn JPH05305467A (en) | 1992-04-27 | 1992-04-27 | Method for cutting optical transmission material by laser beam |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05305467A (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0761377A1 (en) * | 1995-08-16 | 1997-03-12 | Santa Barbara Research Center | Laser scribing on glass using Nd:YAG laser |
| EP1112974A3 (en) * | 1999-12-30 | 2001-11-28 | Schott Desag AG | Method for making pre-stressed or bended glass sheets |
| US6812430B2 (en) * | 2000-12-01 | 2004-11-02 | Lg Electronics Inc. | Glass cutting method and apparatus with controlled laser beam energy |
| JP2011011917A (en) * | 2009-06-30 | 2011-01-20 | Mitsuboshi Diamond Industrial Co Ltd | Glass substrate processing device using laser beam |
| CN102531371A (en) * | 2011-12-19 | 2012-07-04 | 深圳市木森科技有限公司 | Method for cutting glass by laser |
| JP2013142052A (en) * | 2012-01-12 | 2013-07-22 | Npo Research Institute Of Nanophotonics | Surface planarization method for glass disk |
| WO2014010488A1 (en) * | 2012-07-10 | 2014-01-16 | 旭硝子株式会社 | Method for processing glass plate |
| US8791387B2 (en) | 2006-03-27 | 2014-07-29 | Nlt Technologies, Ltd. | Laser cutting method, display apparatus manufacturing method, and display apparatus |
| WO2014175145A1 (en) * | 2013-04-26 | 2014-10-30 | 旭硝子株式会社 | Method for cutting glass plate |
| WO2014192482A1 (en) * | 2013-05-28 | 2014-12-04 | 旭硝子株式会社 | Glass substrate cutting method and glass substrate manufacturing method |
| WO2015053167A1 (en) * | 2013-10-07 | 2015-04-16 | 日本電気硝子株式会社 | Method for cutting sheet glass with laser, and sheet glass |
| JP2015524379A (en) * | 2012-07-27 | 2015-08-24 | アップル インコーポレイテッド | Sapphire window |
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1992
- 1992-04-27 JP JP4107935A patent/JPH05305467A/en not_active Withdrawn
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| EP0761377A1 (en) * | 1995-08-16 | 1997-03-12 | Santa Barbara Research Center | Laser scribing on glass using Nd:YAG laser |
| EP1112974A3 (en) * | 1999-12-30 | 2001-11-28 | Schott Desag AG | Method for making pre-stressed or bended glass sheets |
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| JP2011011917A (en) * | 2009-06-30 | 2011-01-20 | Mitsuboshi Diamond Industrial Co Ltd | Glass substrate processing device using laser beam |
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| TWI498297B (en) * | 2012-06-19 | 2015-09-01 | Mitsuboshi Diamond Ind Co Ltd | Glass substrate processing methods |
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| WO2014175145A1 (en) * | 2013-04-26 | 2014-10-30 | 旭硝子株式会社 | Method for cutting glass plate |
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| CN105164073A (en) * | 2013-05-28 | 2015-12-16 | 旭硝子株式会社 | Glass substrate cutting method and glass substrate manufacturing method |
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| WO2015053167A1 (en) * | 2013-10-07 | 2015-04-16 | 日本電気硝子株式会社 | Method for cutting sheet glass with laser, and sheet glass |
| JP2019038737A (en) * | 2017-08-22 | 2019-03-14 | 日本電気硝子株式会社 | Manufacturing method of glass article and manufacturing apparatus of glass article |
| WO2021102065A1 (en) * | 2019-11-20 | 2021-05-27 | Corning Incorporated | Method of cutting combined structure of glass substrate and light-absorbing plate |
| CN114981220A (en) * | 2019-11-20 | 2022-08-30 | 康宁公司 | Method for cutting combined structure of glass substrate and light absorption plate |
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