JPH05291769A - Multiterminal connection structure - Google Patents
Multiterminal connection structureInfo
- Publication number
- JPH05291769A JPH05291769A JP4096308A JP9630892A JPH05291769A JP H05291769 A JPH05291769 A JP H05291769A JP 4096308 A JP4096308 A JP 4096308A JP 9630892 A JP9630892 A JP 9630892A JP H05291769 A JPH05291769 A JP H05291769A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- flexible wiring
- cover lay
- terminal
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、液晶パネルやＥＬパ
ネルおよびフレキシブル配線基板等を接続する多端子接
続構造における組み立て時の断線防止に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to wire breakage prevention during assembly in a multi-terminal connection structure for connecting a liquid crystal panel, an EL panel, a flexible wiring board and the like.
【０００２】[0002]
【従来の技術】近年、ＩＣをはじめとする半導体部品の
開発が精力的に行われ、液晶パネルやＥＬパネルなどを
利用した平面型ディスプレイパネルが商品化されるとと
もに、各種部品の平面実装化および端子配線の微細ピッ
チ化が急速に進んでいる。2. Description of the Related Art In recent years, semiconductor parts such as ICs have been vigorously developed, and flat panel display panels using liquid crystal panels and EL panels have been commercialized. The fine pitch of terminal wiring is rapidly advancing.
【０００３】図４（Ａ）は、従来の薄膜表示素子２１と
フレキシブル配線基板２２との接続部を示す図であり、
同図（Ｂ）はフレキシブル配線基板２２の外観図であ
る。薄膜表示素子２１およびフレキシブル配線基板２２
には、それぞれ同一ピッチの微細ピッチ端子２３、２４
が半田メッキされ設けられている。また、複数の微細ピ
ッチ端子２３、２４の両端には同じく半田メッキされた
仮接続端子２５、２６が設けられている。この仮接続端
子２５、２６は組み立て時の接続強度を上げるため、他
の微細ピッチ端子２３、２４に比べて大きくされてお
り、素子とは接続されていない。さらに、フレキシブル
配線基板２２の接続部以外の部分には、絶縁および強度
補強のためカバーレイ２７が覆設されている。このよう
な薄膜表示素子２１およびフレキシブル配線基板２２の
各端子を相互結線する際には、両者の仮接続端子２５、
２６に加熱して仮接続をした後、全体に加熱して微細ピ
ッチ端子２３、２４を接続する。こうして接続されたフ
レキシブル配線基板２２は、薄膜表示素子２１の後方に
折り曲げられて組み立てられる。FIG. 4A is a view showing a connection portion between a conventional thin film display element 21 and a flexible wiring board 22,
FIG. 1B is an external view of the flexible wiring board 22. Thin film display element 21 and flexible wiring board 22
Include fine pitch terminals 23 and 24 having the same pitch, respectively.
Are plated with solder. Further, temporary connection terminals 25 and 26, which are also plated with solder, are provided on both ends of the plurality of fine pitch terminals 23 and 24. The temporary connection terminals 25 and 26 are larger than the other fine pitch terminals 23 and 24 in order to increase the connection strength during assembly, and are not connected to the element. Further, a cover lay 27 is provided on the portion other than the connecting portion of the flexible wiring board 22 for insulation and strength reinforcement. When the terminals of the thin film display element 21 and the flexible wiring board 22 are connected to each other, the temporary connection terminals 25 of both terminals,
After heating to 26 for temporary connection, the whole is heated to connect the fine pitch terminals 23 and 24. The flexible wiring board 22 thus connected is bent and assembled to the rear of the thin film display element 21.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上述の
ような接続方法では、その後の組み立て工程において図
５のようにフレキシブル配線基板を薄膜表示素子の後方
に折り曲げる際、フレキシブル配線基板の接続部でカバ
ーレイが切断されて厚みが薄くなっているため、カバー
レイライン（図４Ａ−Ａ線参照）に曲げ応力が集中して
しまう。このため、カバーレイラインに沿ってフレキシ
ブル配線基板の微細ピッチ端子が断線する問題があっ
た。しかも、表示素子およびフレキシブル配線基板の高
密度化が進むにつれて、配線幅はますます細かくなると
思われる。However, in the connecting method as described above, when the flexible wiring board is bent rearward of the thin film display element as shown in FIG. 5 in the subsequent assembling process, the flexible wiring board is covered with the connecting portion. Since the ray is cut and the thickness is reduced, bending stress concentrates on the cover lay line (see FIG. 4A-A line). Therefore, there is a problem that the fine pitch terminals of the flexible wiring board are disconnected along the cover lay line. Moreover, the wiring width is expected to become finer as the density of display elements and flexible wiring boards increases.
【０００５】この発明の目的は、組み立て時に微細ピッ
チ端子のカバーレイラインに集中する曲げ応力を回避
し、微細ピッチ端子の断線を無くすことができる多端子
接続構造を提供することにある。An object of the present invention is to provide a multi-terminal connection structure capable of avoiding bending stress concentrated on a cover lay line of a fine pitch terminal during assembly and eliminating disconnection of the fine pitch terminal.
【０００６】[0006]
【課題を解決するための手段】この発明の多端子接続構
造は、第２部品のカバーレイおよび接続部の境界に相当
するカバーレイラインの裏側に補強材を設けたことを特
徴とする。The multi-terminal connection structure of the present invention is characterized in that a reinforcing member is provided on the back side of the cover lay line corresponding to the boundary between the cover lay and the connecting portion of the second component.
【０００７】[0007]
【作用】この発明は、例えば第１部品に薄膜表示素子、
第２部品にフレキシブル配線基板を適用することができ
る。この場合、フレキシブル配線基板において、カバー
レイラインの裏側に補強材を設けることにより、カバー
レイの切断部における剛性が大きくなる。このため、組
み立て時にフレキシブル配線基板を折り曲げる際、仮接
続端子およびカバーレイラインに集中していた曲げ応力
は、カバーレイ部および端子接続部に分散される。しか
も、カバーレイ部では、微細ピッチ端子の配線はカバー
レイにより保護されており、接続部は半田により接続さ
れているため、微細ピッチ端子が断線することはない。According to the present invention, for example, the first component is a thin film display element,
A flexible wiring board can be applied to the second component. In this case, in the flexible wiring board, by providing the reinforcing material on the back side of the coverlay line, the rigidity of the cut portion of the coverlay increases. Therefore, when the flexible wiring board is bent at the time of assembly, the bending stress concentrated on the temporary connection terminal and the cover lay line is dispersed to the cover lay portion and the terminal connection portion. Moreover, in the coverlay portion, the wiring of the fine pitch terminals is protected by the coverlay and the connecting portions are connected by solder, so that the fine pitch terminals are not broken.
【０００８】[0008]
【実施例】図１（Ａ）は、この発明の実施例である多端
子接続構造をもつ薄膜ＥＬパネル表示装置を示す図であ
り、同図（Ｂ）はフレキシブル配線基板２の外観図であ
る。薄膜ＥＬパネル表示装置は、薄膜表示素子１と該薄
膜表示素子１を駆動するためのＩＣを実装したフレキシ
ブル配線基板２とで構成されており、前記薄膜表示素子
１は、薄膜表示素子を形成した透光性基板と背面板とで
構成されている。薄膜表示パネルの外周には、任意の間
隔をもった複数の微細ピッチ端子３が形成されている。
この微細ピッチ端子３は、フレキシブル配線基板２に形
成された対向する微細ピッチ端子５と接続される。ま
た、接続の際、薄膜表示素子１とフレキシブル配線基板
２を仮止めするために、薄膜表示素子１およびフレキシ
ブル配線基板２には複数の微細ピッチ端子３、５の両端
に仮接続端子４、６が設けられている。この仮接続端子
４、６は組み立て時の接続強度を上げるため、他の微細
ピッチ端子３、５に比べてパターン幅を大きくしてお
り、素子とは接続されていない。これらの各接続端子
３、４、５、６はそれぞれ半田でメッキされている。ま
た、フレキシブル配線基板２の接続部以外の部分には、
絶縁および強度補強のためカバーレイ７が覆設されてお
り、さらにフレキシブル配線基板２のカバーレイライン
（図１Ａ−Ａ線参照）の裏側には補強材８が設けられて
いる。1A is a diagram showing a thin film EL panel display device having a multi-terminal connection structure according to an embodiment of the present invention, and FIG. 1B is an external view of a flexible wiring substrate 2. .. The thin film EL panel display device comprises a thin film display element 1 and a flexible wiring board 2 on which an IC for driving the thin film display element 1 is mounted. The thin film display element 1 forms a thin film display element. It is composed of a transparent substrate and a back plate. A plurality of fine pitch terminals 3 having arbitrary intervals are formed on the outer periphery of the thin film display panel.
The fine pitch terminals 3 are connected to the fine pitch terminals 5 facing each other formed on the flexible wiring board 2. Further, in order to temporarily fix the thin film display element 1 and the flexible wiring board 2 at the time of connection, the thin film display element 1 and the flexible wiring board 2 have temporary connection terminals 4, 6 at both ends of a plurality of fine pitch terminals 3, 5, respectively. Is provided. The temporary connection terminals 4 and 6 have a larger pattern width than the other fine pitch terminals 3 and 5 in order to increase the connection strength during assembly, and are not connected to the element. Each of these connection terminals 3, 4, 5 and 6 is plated with solder. In addition, in the portion other than the connecting portion of the flexible wiring board 2,
A cover lay 7 is provided for insulation and reinforcement of strength, and a reinforcing material 8 is provided on the back side of the cover lay line (see FIG. 1A-A line) of the flexible wiring board 2.
【０００９】図２はこの発明の実施例である微細ピッチ
端子の接続部の拡大断面図である。FIG. 2 is an enlarged sectional view of a connecting portion of a fine pitch terminal which is an embodiment of the present invention.
【００１０】Ａ−Ａ線から薄膜表示素子１側の補強材８
切断部までをＸ、Ａ−Ａ線からフレキシブル配線基板２
側の補強材８切断部までをＹ、Ａ−Ａ線から薄膜表示素
子１の接続端子端部までをＺとすると、補強材８の幅は
Ｘ−Ｚ＞０、Ｙ＞０が条件とされる。本実施例において
は、Ｘ−Ｚ＝１〜５ｍｍ、Ｙ＝１〜５ｍｍとするのが好
ましい。また、補強材８の材質については銅箔、アルミ
箔等の金属箔や金属板、ポリイミド、ポリエステル等の
テープ類、ベーク、アクリル、塩化ビニル等の樹脂板
類、室温硬化、加熱硬化、ＵＶ硬化タイプの接着剤およ
びレジスト等が利用できる。Reinforcing material 8 on the thin film display element 1 side from line AA
Flexible wiring board 2 from the X, AA line to the cut part
Letting Y be up to the cut portion of the reinforcing material 8 on the side and Z be the distance from the AA line to the end of the connection terminal of the thin film display element 1, the width of the reinforcing material 8 is XZ> 0, Y> 0. It In the present embodiment, it is preferable that X-Z = 1 to 5 mm and Y = 1 to 5 mm. As the material of the reinforcing material 8, metal foil such as copper foil and aluminum foil, metal plate, tapes such as polyimide and polyester, resin plates such as bake, acryl and vinyl chloride, room temperature curing, heat curing, UV curing Types of adhesives and resists etc. can be used.
【００１１】このような薄膜表示素子１とフレキシブル
配線基板２は、仮接続端子４、６に加熱することにより
半田が溶解し仮止めされる。この後、全体に加熱して微
細ピッチ端子３、５の半田も溶解され、薄膜表示素子１
とフレキシブル配線基板２の各端子が接続される。こう
して接続されたフレキシブル配線基板２は、接続部以外
の部分で薄膜表示素子１の後方に折り曲げて組み立てら
れる。The thin-film display element 1 and the flexible wiring board 2 thus constructed are temporarily fixed by melting the solder by heating the temporary connection terminals 4 and 6. After this, the whole is heated to melt the solder of the fine pitch terminals 3 and 5, and the thin film display element 1
And each terminal of the flexible wiring board 2 are connected. The flexible wiring board 2 thus connected is assembled by bending it to the rear of the thin film display element 1 at a portion other than the connection portion.
【００１２】[0012]
【発明の効果】以上のように、この発明によれば、薄膜
表示素子およびフレキシブル配線基板の接続後、フレキ
シブル配線基板を折り曲げて組み立てる際、フレキシブ
ル配線基板は図３に示すように補強材の外側切断部（Ｂ
−Ｂ線）で折り曲げられるため、曲げ応力はカバーレイ
および接続部に分散されて、カバーレイラインで発生し
ていた微細ピッチ端子の断線は防止される。As described above, according to the present invention, when the flexible wiring board is bent and assembled after the thin film display element and the flexible wiring board are connected, the flexible wiring board is provided on the outside of the reinforcing member as shown in FIG. Cutting part (B
-B line), the bending stress is dispersed in the cover lay and the connecting portion, and the breakage of the fine pitch terminal generated in the cover lay line is prevented.
【図１】この発明の実施例である多端子接続構造をもつ
薄膜ＥＬパネル表示装置とフレキシブル配線基板の構成
を示す図である。FIG. 1 is a diagram showing a configuration of a thin film EL panel display device having a multi-terminal connection structure and a flexible wiring board according to an embodiment of the present invention.
【図２】この発明の実施例である微細ピッチ端子の接続
部の拡大断面図である。FIG. 2 is an enlarged sectional view of a connection portion of a fine pitch terminal which is an embodiment of the present invention.
【図３】この発明の実施例である薄膜ＥＬパネル表示装
置とフレキシブル配線基板の組み立て時の構成を示す図
である。FIG. 3 is a diagram showing a configuration at the time of assembling a thin film EL panel display device and a flexible wiring board according to an embodiment of the present invention.
【図４】従来の薄膜ＥＬパネル表示装置とフレキシブル
配線基板の構成を示す図である。FIG. 4 is a diagram showing a configuration of a conventional thin film EL panel display device and a flexible wiring board.
【図５】従来の薄膜ＥＬパネル表示装置とフレキシブル
配線基板の組み立て時の構成を示す図である。FIG. 5 is a diagram showing a configuration of a conventional thin-film EL panel display device and a flexible wiring board during assembly.
１ 薄膜表示素子 ２ フレキシブル配線基板 ３ 微細ピッチ端子 ４ 仮接続端子 ５ 微細ピッチ端子 ６ 仮接続端子 ７ カバーレイ ８ 補強材 1 Thin Film Display Element 2 Flexible Wiring Board 3 Fine Pitch Terminal 4 Temporary Connection Terminal 5 Fine Pitch Terminal 6 Temporary Connection Terminal 7 Coverlay 8 Reinforcement Material
Claims (1)
微細ピッチ端子とその両側に形成された幅広の仮接続端
子とを備えた第１部品と、フレキシブル基板上に前記第
１部品の微細ピッチ端子および仮接続端子に対向する配
線を有し、端部を露出するようにカバーレイを覆設して
露出部を接続部とした第２部品と、を前記仮接続端子に
より仮止めを行った後、微細ピッチ端子を接続する多端
子接続構造において、 前記第２部品のカバーレイおよび接続部の境界に相当す
るカバーレイラインの裏側に補強材を設けたことを特徴
とする多端子接続構造。1. A first component having a plurality of fine pitch terminals arranged at fine intervals at component ends and wide temporary connection terminals formed on both sides thereof, and a first component on the flexible substrate. A second component having wirings opposed to the fine pitch terminal and the temporary connection terminal, covering the coverlay so as to expose the end portion and using the exposed portion as a connection portion, is temporarily fixed by the temporary connection terminal. After that, in the multi-terminal connection structure for connecting the fine pitch terminals, a reinforcing material is provided on the back side of the cover lay line corresponding to the boundary between the cover lay and the connecting portion of the second component. Construction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4096308A JPH05291769A (en) | 1992-04-16 | 1992-04-16 | Multiterminal connection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4096308A JPH05291769A (en) | 1992-04-16 | 1992-04-16 | Multiterminal connection structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05291769A true JPH05291769A (en) | 1993-11-05 |
Family
ID=14161403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4096308A Pending JPH05291769A (en) | 1992-04-16 | 1992-04-16 | Multiterminal connection structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05291769A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001331122A (en) * | 2000-05-18 | 2001-11-30 | Toshiba Corp | Plane display device |
| US7348679B2 (en) | 2004-11-24 | 2008-03-25 | Seiko Epson Corporation | Electronic part having reinforcing member |
| KR100904710B1 (en) * | 2007-11-01 | 2009-06-29 | 삼성에스디아이 주식회사 | Flexible printed circuit board, junction method thereof and battery pack using the same |
| JP2014026449A (en) * | 2012-07-26 | 2014-02-06 | Kyocera Corp | Piezoelectric device, input device, display device, and electronic apparatus |
| US9356371B2 (en) | 2014-06-30 | 2016-05-31 | Molex, Llc | Connector |
| USD767499S1 (en) | 2014-06-18 | 2016-09-27 | Molex, Llc | Electric connector |
-
1992
- 1992-04-16 JP JP4096308A patent/JPH05291769A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001331122A (en) * | 2000-05-18 | 2001-11-30 | Toshiba Corp | Plane display device |
| US7348679B2 (en) | 2004-11-24 | 2008-03-25 | Seiko Epson Corporation | Electronic part having reinforcing member |
| CN100392806C (en) * | 2004-11-24 | 2008-06-04 | 精工爱普生株式会社 | Electronic part and method for manufacturing the same |
| KR100904710B1 (en) * | 2007-11-01 | 2009-06-29 | 삼성에스디아이 주식회사 | Flexible printed circuit board, junction method thereof and battery pack using the same |
| US8790130B2 (en) | 2007-11-01 | 2014-07-29 | Samsung Sdi Co., Ltd. | Flexible printed circuit (PC) board, junction method thereof, and battery pack using the flexible PC board |
| JP2014026449A (en) * | 2012-07-26 | 2014-02-06 | Kyocera Corp | Piezoelectric device, input device, display device, and electronic apparatus |
| USD767499S1 (en) | 2014-06-18 | 2016-09-27 | Molex, Llc | Electric connector |
| US9356371B2 (en) | 2014-06-30 | 2016-05-31 | Molex, Llc | Connector |
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