JPH0527411A - Foreign matter inspecting device - Google Patents
Foreign matter inspecting deviceInfo
- Publication number
- JPH0527411A JPH0527411A JP20639391A JP20639391A JPH0527411A JP H0527411 A JPH0527411 A JP H0527411A JP 20639391 A JP20639391 A JP 20639391A JP 20639391 A JP20639391 A JP 20639391A JP H0527411 A JPH0527411 A JP H0527411A
- Authority
- JP
- Japan
- Prior art keywords
- light
- foreign matter
- reticle
- pellicle
- inspected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
Description
【０００１】[0001]
【目次】以下の順序で本発明を説明する。 産業上の利用分野 従来の技術 発明が解決しようとする課題 課題を解決するための手段（図１及び図２） 作用（図１及び図２） 実施例 （１）第１の実施例（図１） （２）第２の実施例（図２及び図３） （３）第３の実施例（図４） （４）他の実施例 発明の効果[Table of Contents] The present invention will be described in the following order. Field of Industrial Application Conventional Technology Problems to be Solved by the Invention Means for Solving the Problems (FIGS. 1 and 2) Action (FIGS. 1 and 2) Working Example (1) First Working Example (FIG. 1) ) (2) Second embodiment (FIGS. 2 and 3) (3) Third embodiment (FIG. 4) (4) Other embodiments Effect of the invention
【０００２】[0002]
【産業上の利用分野】本発明は異物検査装置に関し、特
に集積回路の製造工程において用いられるレチクル及び
フオトマスク等の表面上に付着した異物の有無を検査す
るものに適用して好適なものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a foreign matter inspection apparatus, and is particularly suitable for application to an apparatus for inspecting the presence or absence of foreign matter adhering to the surface of a reticle, a photomask or the like used in the manufacturing process of integrated circuits. ..
【０００３】[0003]
【従来の技術】従来、集積回路の製造工程の１つである
フオトリソグラフイ工程においては、レチクルやフオト
マスク（以下レチクルと称す）による回路パターンの半
導体ウエハへの転写が行なわれる。この場合レチクルに
塵等の異物が付着していると製造されたウエハの欠陥の
原因となるため、事前にレチクル表面に異物が付着して
いないかどうかを検査する必要がある。2. Description of the Related Art Conventionally, in a photolithography process which is one of manufacturing processes of integrated circuits, a circuit pattern is transferred onto a semiconductor wafer by a reticle or a photomask (hereinafter referred to as a reticle). In this case, if foreign matter such as dust adheres to the reticle, it may cause defects in the manufactured wafer. Therefore, it is necessary to inspect whether the foreign matter adheres to the reticle surface in advance.
【０００４】このため例えば特開昭57-128834 号公報に
開示されているように、レーザ光等の光ビームをレチク
ル上で走査し、異物からの比較的指向性の低い散乱光を
光電検出器によつて光電検出し、一定レベル以上の光電
信号の有無に基づいて、異物の有無を検出する装置が提
案されている。Therefore, as disclosed in, for example, Japanese Patent Application Laid-Open No. 57-128834, a light beam such as a laser beam is scanned on a reticle to detect scattered light having a relatively low directivity from foreign matter by a photoelectric detector. There is proposed a device for detecting the presence / absence of foreign matter based on the presence / absence of a photoelectric signal above a certain level.
【０００５】これに加えて異物がレチクルに付着するこ
とを防止するため、レチクル表面をペリクルと呼ばれる
薄膜（異物付着防止膜）で覆うようになされたものもあ
る。これはペリクルを支持枠（以下フレームと称す）に
張設し、フレームとレチクルを接着固定して、レチクル
表面を被覆するように装着することにより、レチクルに
直接異物が付着することを未然に防止し得るようになさ
れている。In addition to this, in order to prevent foreign matter from adhering to the reticle, there is also a reticle whose surface is covered with a thin film called a pellicle (foreign matter adhesion prevention film). This is because the pellicle is stretched on a support frame (hereinafter referred to as a frame), the frame and reticle are adhesively fixed, and the reticle is mounted so as to cover the surface of the reticle, preventing foreign matter from directly adhering to the reticle. It is designed to be able to do.
【０００６】このようなペリクル付きのレチクルを用い
て露光装置による投影露光を行う場合、ペリクルの表面
上に異物が付着していても、ペリクルがレチクルからフ
レームの高さ分だけ離れているため、被露光物体すなわ
ち半導体ウエハ面上には異物像が合焦せず、従つて異物
像はウエハ上に転写されないことになる。しかしペリク
ル上に付着している異物が比較的大きい場合、デフオー
カスした異物像が転写されウエハ上で光量ムラが生じる
おそれがあり、ペリクルを装着する場合でもレチクル面
とペリクル面の異物の有無を検査する必要がある。When projection exposure is performed by an exposure apparatus using such a reticle with a pellicle, even if foreign matter adheres to the surface of the pellicle, the pellicle is separated from the reticle by the height of the frame. The foreign matter image is not focused on the object to be exposed, that is, the surface of the semiconductor wafer, and thus the foreign matter image is not transferred onto the wafer. However, if the foreign matter adhered to the pellicle is relatively large, the defocused foreign matter image may be transferred and uneven light amount may occur on the wafer.Even when the pellicle is mounted, the presence or absence of foreign matter on the reticle surface and the pellicle surface is inspected. There is a need to.
【０００７】このため例えば特開昭57-80546号公報に開
示されているように、レーザ光等の光ビームをペリクル
上にほぼ水平に入射させて表面に帯状の照射部を形成
し、帯状照射部内の異物からの散乱光を、一次元ＣＣＤ
アレイ等の光電検出器によつて光電変換し、一定レベル
以上の光電信号の有無に基づいて、異物の有無を検出す
る装置が提案されている。Therefore, for example, as disclosed in Japanese Patent Laid-Open No. 57-80546, a light beam such as a laser beam is made to enter the pellicle substantially horizontally to form a belt-shaped irradiation portion on the surface, and a belt-shaped irradiation is performed. Scattered light from foreign matter inside the unit, one-dimensional CCD
There has been proposed a device for photoelectrically converting by a photoelectric detector such as an array and detecting the presence / absence of a foreign matter based on the presence / absence of a photoelectric signal of a certain level or higher.
【０００８】[0008]
【発明が解決しようとする課題】ところがかかる構成の
異物検査装置においては、レーザ光等の光源が点灯して
いない場合や光電検出器が破壊されている場合には、被
検査面上にたとえ異物が付着していても光電信号が出力
されず、この結果異物検査装置は被検査面上には異物が
存在しないと判定してしまう問題がある。However, in the foreign matter inspection apparatus having such a structure, even if the light source such as laser light is not turned on or the photoelectric detector is broken, even if the foreign matter is present on the surface to be inspected. However, there is a problem that a photoelectric signal is not output even if the foreign matter is attached, and as a result, the foreign matter inspection apparatus determines that there is no foreign matter on the surface to be inspected.
【０００９】このように被検査面上に異物が存在するに
もかかわらず異物検査装置が被検査面上には異物が存在
しないと判定してしまうと、このまま半導体ウエハへの
転写が行なわれ、この結果半導体ウエハに欠陥が生じる
おそれを回避できなかつた。Thus, if the foreign matter inspection apparatus determines that there is no foreign matter on the surface to be inspected despite the presence of foreign matter on the surface to be inspected, the transfer to the semiconductor wafer is performed as it is, As a result, it has been impossible to avoid the possibility of defects in the semiconductor wafer.
【００１０】本発明は以上の点を考慮してなされたもの
で、従来の問題を一挙に解決して確実に光照射手段又は
光電検出器の動作異常を判定し得る異物検査装置を提案
しようとするものである。The present invention has been made in consideration of the above points, and it is an object of the present invention to propose a foreign matter inspection apparatus which can solve the conventional problems all at once and can reliably determine the operation abnormality of the light irradiation means or the photoelectric detector. To do.
【００１１】[0011]
【課題を解決するための手段】かかる課題を解決するた
め本発明においては、被検査面１、３上に検査光Ｌを照
射する光照射手段３０、３１と、被検査面１、３上の被
検査領域ＬA 、ＬB 上に付着した異物からの散乱光を受
光する受光レンズ系５、６と、受光レンズ系５、６に関
して被検査領域ＬA 、ＬB に対してほぼ共役な位置に配
置され、受光レンズ系５、６を通じて得られる異物から
の散乱光を受光する光電検出手段７、８とを有する異物
検査装置において、被検査面１、３とほぼ同一平面上に
設けられた光散乱手段１３、２０、２１と、光照射手段
３０、３１による光散乱手段１３、２０、２１からの散
乱光を、光電検出手段７、８により検出し、光照射手段
３０、３１又は光電検出手段７、８の少なくとも一方の
動作異常を判定する判定手段１００とを設けるようにし
た。In order to solve such a problem, in the present invention, light irradiation means 30 and 31 for irradiating the inspection surfaces L and 3 with the inspection light L and the inspection surfaces 1 and 3 are provided. The light receiving lens systems 5 and 6 for receiving scattered light from the foreign matter adhered on the inspection areas LA and LB, and the light receiving lens systems 5 and 6 are arranged at positions substantially conjugate to the inspection areas LA and LB, In a foreign matter inspection device having photoelectric detection means 7, 8 for receiving scattered light from a foreign matter obtained through the light receiving lens systems 5, 6, a light scattering means 13 provided on substantially the same plane as the inspected surfaces 1, 3. , 20, 21 and the scattered light from the light scattering means 13, 20, 21 by the light irradiation means 30, 31 are detected by the photoelectric detection means 7, 8, and the light irradiation means 30, 31 or the photoelectric detection means 7, 8 are detected. The operation abnormality of at least one of It was provided and a constant unit 100.
【００１２】[0012]
【作用】被検査面１、３とほぼ同一平面上に光散乱手段
１３、２０、２１を設置し、光照射手段３０、３１によ
る光散乱手段１３、２０、２１からの散乱光を、光電検
出手段７、８により検出し、光照射手段３０、３１又は
光電検出手段７、８の少なくとも一方の動作異常を判定
するようにしたことにより、確実かつ必要に応じて光照
射手段３０、３１又は光電検出器７、８の動作を確認す
ることができる。The light scattering means 13, 20, 21 are installed on the same plane as the surfaces 1, 3 to be inspected, and the light scattered by the light scattering means 13, 20, 21 by the light irradiation means 30, 31 is photoelectrically detected. By detecting the operation abnormality by at least one of the light irradiation means 30, 31 or the photoelectric detection means 7, 8 by means of the means 7, 8, the light irradiation means 30, 31 or the photoelectric detection means can be reliably and as needed. The operation of the detectors 7 and 8 can be confirmed.
【００１３】[0013]
【実施例】以下図面について本発明の一実施例を詳述す
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described in detail with reference to the drawings.
【００１４】（１）第１の実施例 図１は全体としてレーザビームの入射面を紙面上にとつ
た異物検査装置の断面を示し、この異物検査装置におい
て図１（Ａ）に示すように、ペリクル１はフレーム２を
介してレチクル３に装着され、このレチクル３が載物台
４に載置されている。載物台４は駆動系（図示せず）に
より矢印ａ方向に移動可能になされており、これにより
ペリクル１付きのレチクル３が矢印ａ方向に移動可能な
構成となつている。(1) First Embodiment FIG. 1 shows a cross section of a foreign matter inspection apparatus in which the incident surface of a laser beam is on the paper as a whole, and in this foreign matter inspection apparatus, as shown in FIG. The pellicle 1 is mounted on the reticle 3 via the frame 2, and the reticle 3 is placed on the stage 4. The stage 4 is movable in the direction of arrow a by a drive system (not shown), so that the reticle 3 with the pellicle 1 is movable in the direction of arrow a.
【００１５】この載物台４の矢印ａ方向の位置は測定手
段３２によつて検出され、この結果得られる位置情報が
マイクロコンピユータ（ＭＰＵ）構成の主制御系１００
に送られ、主制御系１００はこの位置情報に基づいて載
物台４を移動させう駆動系を制御する。The position of the stage 4 in the direction of arrow a is detected by the measuring means 32, and the position information obtained as a result is the main control system 100 of the micro computer (MPU) configuration.
The main control system 100 controls the drive system for moving the stage 4 based on this position information.
【００１６】また光源３０から出力されたレーザビーム
Ｌはペリクル１及びレチクル３に対して斜めに入射して
ペリクル１及びレチクル３の表面上をそれぞれ照射す
る。このレーザビームＬは例えばポリゴンミラーやガル
バノスキヤナー等でなる光ビーム走査手段３１によつ
て、入射面（すなわち紙面）と垂直にビーム走査され、
このときレチクル３の表面上では点Ａを通る走査線ＬA
（紙面と垂直）が照射可能になり、ペリクル１の表面上
では点Ｂを通る走査線ＬB （紙面と垂直）が照射可能に
なつている。The laser beam L output from the light source 30 is obliquely incident on the pellicle 1 and the reticle 3 and irradiates the surfaces of the pellicle 1 and the reticle 3, respectively. The laser beam L is beam-scanned by an optical beam scanning means 31 composed of, for example, a polygon mirror or a galvanometer scanner, in a direction perpendicular to the incident surface (that is, the paper surface),
At this time, the scanning line LA passing through the point A on the surface of the reticle 3
Irradiation is possible (perpendicular to the paper surface), and scanning line LB (perpendicular to the paper surface) passing through point B is irradiable on the surface of the pellicle 1.
【００１７】これにより載物台４と走査手段３１によつ
てペリクル１及びレチクル３の全面をレーザビームＬで
ラスタ走査し得るようになされている。この走査手段３
１は主制御系１００により制御され、走査線上でのビー
ム位置は走査手段３１の制御情報（位置情報）から主制
御系１００によつて演算される。Thus, the entire surface of the pellicle 1 and the reticle 3 can be raster-scanned by the laser beam L by the stage 4 and the scanning means 31. This scanning means 3
1 is controlled by the main control system 100, and the beam position on the scanning line is calculated by the main control system 100 from the control information (position information) of the scanning means 31.
【００１８】ここでこの異物検査装置では、走査線ＬA
、ＬB 上の異物を検出するために、それぞれ受光レン
ズ５、６と光電検出器７、８が設けられている。さらに
このようにレチクル３にレーザビームＬを集光させてレ
チクル３上で走査して異物から出る散乱光を光電検出器
７で受光し、その光電検出器７からの光電信号によつて
異物を有無を検査する場合、レチクル３の表面上の異物
のみならず、レチクル３を透過した光によつてレチクル
３の裏面の異物もレーザビームＬによつて散乱する。In this foreign matter inspection apparatus, the scanning line LA
, LB are provided with light-receiving lenses 5 and 6 and photoelectric detectors 7 and 8, respectively. Further, in this way, the laser beam L is focused on the reticle 3, the reticle 3 scans, and the scattered light emitted from the foreign matter is received by the photoelectric detector 7, and the foreign matter is detected by the photoelectric signal from the photoelectric detector 7. In the presence / absence inspection, not only the foreign matter on the front surface of the reticle 3 but also the foreign matter on the back surface of the reticle 3 is scattered by the laser beam L by the light transmitted through the reticle 3.
【００１９】またペリクル１付きのレチクル３において
は、検査している面すなわち光を照射しているペリクル
１の表面以外に光が透過して、レチクル３やフレーム２
等の別の面に照射されるため、検査面（すなわちペリク
ル１）以外の面に付着している異物も散乱光を発生す
る。In the reticle 3 with the pellicle 1, light is transmitted to the reticle 3 and the frame 2 other than the surface to be inspected, that is, the surface of the pellicle 1 which is radiating light.
Since another surface such as the above is irradiated, foreign matter attached to the surface other than the inspection surface (that is, the pellicle 1) also generates scattered light.
【００２０】このためこの実施例の場合、検査している
面上に付着した異物のみを検出する方法として、特開昭
63-118640 号公報に開示されているように、散乱光を受
光する受光レンズ５、６の後ろにスリツト９、１０を設
けるようになされている。Therefore, in the case of this embodiment, as a method for detecting only the foreign matter adhering to the surface to be inspected
As disclosed in Japanese Patent Laid-Open No. 63-118640, slits 9 and 10 are provided behind the light receiving lenses 5 and 6 which receive scattered light.
【００２１】実際上このスリツト９、１０は検査してい
るレチクル３やペリクル１表面のビーム走査位置に対し
て共役な位置に配置され、これにより例えばペリクル１
付きのレチクル３表面を検査している場合、これ以外の
面すなわちレチクル３の裏面やペリクル１面に付着した
異物からの散乱光はスリツト９、１０により遮光され
る。従つてスリツト９、１０を通して受光する光電検出
器７、８の信号はすべて検査している面上の光情報だけ
となる。In practice, the slits 9 and 10 are arranged at a position conjugate with the beam scanning position on the surface of the reticle 3 or the pellicle 1 to be inspected.
When the surface of the attached reticle 3 is inspected, the slits 9 and 10 shield the scattered light from the foreign matter attached to the other surface, that is, the back surface of the reticle 3 and the surface of the pellicle 1. Therefore, the signals of the photoelectric detectors 7 and 8 received through the slits 9 and 10 are all optical information on the surface being inspected.
【００２２】このようにしてこの実施例の場合、受光レ
ンズ５、６と光電検出器７、８の間にスリツト９、１０
を設けるようにしたことにより、レチクル３の表面上の
異物を検出する検出系（受光レンズ５と光電検出器７）
がペリクル１の表面上の異物を検出してしまうことや、
逆にペリクル１の表面上の異物を検出する検出系（受光
レンズ６と光電検出器８）がレチクル３の表面上の異物
を検出してしまうことを未然に防止し得るようになされ
ている。Thus, in the case of this embodiment, the slits 9 and 10 are provided between the light receiving lenses 5 and 6 and the photoelectric detectors 7 and 8.
By providing the detector, a detection system (light receiving lens 5 and photoelectric detector 7) for detecting foreign matter on the surface of the reticle 3 is provided.
Detects foreign matter on the surface of the pellicle 1,
On the contrary, it is possible to prevent the detection system (the light receiving lens 6 and the photoelectric detector 8) for detecting the foreign matter on the surface of the pellicle 1 from detecting the foreign matter on the surface of the reticle 3.
【００２３】スリツト９、１０は各々点Ａ、Ｂを通る受
光レンズ５、６、の光軸１１、１２でかつ走査線ＬA 、
ＬB と共役な位置関係になるように配置されている。こ
れにより、光電検出器７はレチクル３の表面上、光電検
出器８はペリクル１の表面上の異物を検出することが可
能となる。なおこの光電検出器７、８からの光電信号は
主制御系１００に送出され、このようにして主制御系１
００はこの光電信号を処理して異物の有無を検出し得る
ようになされている。The slits 9 and 10 are the optical axes 11 and 12 of the light receiving lenses 5 and 6 passing through the points A and B, respectively, and the scanning lines LA and
It is arranged so as to have a conjugate positional relationship with LB. As a result, the photoelectric detector 7 can detect foreign matter on the surface of the reticle 3 and the photoelectric detector 8 can detect foreign matter on the surface of the pellicle 1. The photoelectric signals from the photoelectric detectors 7 and 8 are sent to the main control system 100, and thus the main control system 1
00 is adapted to process this photoelectric signal to detect the presence or absence of foreign matter.
【００２４】ここでこの実施例の異物検査装置において
は、ペリクル１及びレチクル３を載置する載物台４上
に、曇ガラスや拡散板等でなる光散乱物体１３を例えば
レチクル３とほぼ同一平面上に配し、この光散乱物体１
３にレーザ光Ｌが照射されて得られる光電検出器７、８
からの散乱信号を電気的に信号処理して動作を確認する
ようになされている。従つてもしこの散乱信号が得られ
なければ、光源３０又は光電検出器７の動作に異常があ
ると判定することができる。Here, in the foreign matter inspection apparatus of this embodiment, a light scattering object 13 made of, for example, fog glass or a diffuser plate is almost the same as the reticle 3 on the stage 4 on which the pellicle 1 and the reticle 3 are placed. This light scattering object 1 is placed on a plane.
Photoelectric detectors 7 and 8 obtained by irradiating the laser beam L on the laser beam 3
The operation is confirmed by electrically processing the scattered signal from the device. Therefore, if this scattered signal is not obtained, it can be determined that the operation of the light source 30 or the photoelectric detector 7 is abnormal.
【００２５】以上の構成によれば、ペリクル１、レチク
ル３の何れかとほぼ同一平面上に光散乱物体１３を設置
し、レーザ光Ｌによる光散乱物体１３からの散乱光を、
光電検出手段７、８により検出して、光源３０又は光電
検出手段７、８の少なくとも一方の動作異常を判定する
ようにしたことにより、確実かつ必要に応じて光源３０
又は光電検出器７、８の動作を確認し得る異物検査装置
を実現できる。According to the above configuration, the light scattering object 13 is installed on substantially the same plane as either the pellicle 1 or the reticle 3, and the light scattered by the laser light L from the light scattering object 13 is
By detecting the operation abnormality of at least one of the light source 30 and the photoelectric detection means 7 and 8 by detecting by the photoelectric detection means 7 and 8, the light source 30 can be reliably and as needed.
Alternatively, it is possible to realize a foreign matter inspection device that can confirm the operation of the photoelectric detectors 7 and 8.
【００２６】（２）第２の実施例 ところで上述のように異物検査装置において、光源３０
又は光電検出器７、８の動作異常を確認する場合、ペリ
クル１とレチクル３とで検査する面の高さが異なるた
め、単に載物台４に光散乱物体１３を設置しただけで
は、何れかの光電検出器７又は８の異常のみしか検出で
きず、さらに図１（Ｂ）に示すように光散乱物体１３か
らの散乱光がスリツト９、１０で遮光されて受光できな
いというおそれがある。(2) Second Embodiment In the foreign matter inspection apparatus as described above, the light source 30 is used.
Alternatively, when confirming the operation abnormality of the photoelectric detectors 7 and 8, since the pellicle 1 and the reticle 3 have different heights of the surfaces to be inspected, it is possible to simply install the light scattering object 13 on the stage 4. Only the abnormality of the photoelectric detector 7 or 8 can be detected, and as shown in FIG. 1B, the scattered light from the light scattering object 13 is blocked by the slits 9 and 10 and cannot be received.
【００２７】そこで図１との対応部分に同一符号を付し
た図２に示すように、第２の実施例の異物検査装置で
は、載物台４には曇ガラスや光拡散板等でなり断面Ｌ字
形状の光散乱物体２０が設けられている。この光散乱物
体２０において面２０Ａはレチクル表面（点Ａを含む水
平面）とほぼ同一平面上に位置し、また面２０Ｂはペリ
クル表面（点Ｂを含む水平面）とほぼ同一平面上に位置
している。Therefore, in the foreign matter inspection apparatus of the second embodiment, as shown in FIG. 2 in which parts corresponding to those of FIG. An L-shaped light-scattering object 20 is provided. In this light scattering object 20, the surface 20A is located substantially on the same plane as the reticle surface (horizontal plane including the point A), and the surface 20B is located substantially on the same plane as the pellicle surface (horizontal plane including the point B). ..
【００２８】従つて載物台４を矢印ａ方向に移動し、図
３（Ａ）に示すようにレーザビームＬが光散乱物体２０
の面２０Ｂに当たるときには、ペリクル１の表面にレー
ザビームＬが当たつている状態と同様になることによ
り、スリツト１０によつて遮光されることなく光散乱物
体２０の面２０Ｂからの散乱光が、ペリクル表面受光系
の光電検出器８に入射し光電検出される。Accordingly, the stage 4 is moved in the direction of arrow a, and the laser beam L is applied to the light scattering object 20 as shown in FIG. 3 (A).
When the laser beam L hits the surface 20B of the pellicle 1, the scattered light from the surface 20B of the light scattering object 20 without being blocked by the slit 10 becomes The light enters the photoelectric detector 8 of the pellicle surface light receiving system and is photoelectrically detected.
【００２９】また同様に、図３（Ｂ）に示すようにレー
ザビームＬが光散乱物体２０の面２０Ａに当たるときに
は、レチクル３の表面にレーザビームＬが当たつている
状態と同様になることにより、スリツト９によつて遮光
されることなく光散乱物体２０の面２０Ａからの散乱光
が、レチクル表面受光系の光電検出器７に入射し光電検
出される。なお主制御系１００は光電検出器７、８から
の出力信号の有無に基づいて、光源３０、光電検出器
７、８の少なくとも１つの動作異常を判定する。Similarly, as shown in FIG. 3B, when the laser beam L hits the surface 20A of the light scattering object 20, the laser beam L hits the surface of the reticle 3 in the same manner. The light scattered from the surface 20A of the light-scattering object 20 without being blocked by the slit 9 enters the photoelectric detector 7 of the reticle surface light receiving system and is photoelectrically detected. Note that the main control system 100 determines at least one operation abnormality of the light source 30 and the photoelectric detectors 7 and 8 based on the presence or absence of output signals from the photoelectric detectors 7 and 8.
【００３０】以上の構成において、異物検査処理及び光
散乱物体２０の散乱光を用いた動作確認処理について述
べる。ペリクル１及びレチクル３の全面をレーザビーム
Ｌでラスター走査したとき、前述の装置によりペリクル
１やレチクル３上に異物が存在すれば、異物からの散乱
光が各々光電検出器８、７により受光され光電変換され
る。The foreign substance inspection process and the operation confirmation process using the scattered light of the light scattering object 20 in the above configuration will be described. When the entire surface of the pellicle 1 and the reticle 3 is raster-scanned by the laser beam L, if foreign matter is present on the pellicle 1 or the reticle 3 by the above-mentioned device, the scattered light from the foreign matter is received by the photoelectric detectors 8 and 7, respectively. It is photoelectrically converted.
【００３１】この結果得られる散乱光に応じた光電信号
から主制御系１００によつて得られた異物情報は、その
ときのレーザビームＬの走査位置及び載物台４の送り位
置を測定手段３２で測定して得られる例えばペリクル
１、レチクル３上のＸ、Ｙ座標値でなる異物の付着位置
情報と共に外部に出力される。なお出力形態としてはＣ
ＲＴ（陰極線管）デイスプレイへのマツプ表示等が用い
られる。The foreign matter information obtained by the main control system 100 from the photoelectric signal corresponding to the scattered light obtained as a result is the measuring position 32 of the scanning position of the laser beam L and the feeding position of the stage 4 at that time. It is output to the outside together with the foreign matter adhesion position information, which is obtained by measurement in step 1, for example, the X and Y coordinate values on the pellicle 1 and the reticle 3. The output format is C
Map display on an RT (cathode ray tube) display is used.
【００３２】続いて、ペリクル１及びレチクル３の表面
上の異物検査後に、載物台４をそれぞれ図３（Ａ）、
（Ｂ）の位置に移動して、光散乱物体２０からの散乱光
を受光する。この結果光散乱物体２０からの散乱光が光
電検出器７、８により光電変換される。この図３（Ａ）
は光散乱物体２０の面２０ＢにレーザビームＬが入射す
る載物台４の位置を示し、図３（Ｂ）は光散乱物体２０
の面２０ＡにレーザビームＬが入射する載物台４の位置
を示す。Subsequently, after the foreign matter on the surfaces of the pellicle 1 and the reticle 3 is inspected, the mounting table 4 is moved to the position shown in FIG.
Moving to the position of (B), the scattered light from the light scattering object 20 is received. As a result, the scattered light from the light scattering object 20 is photoelectrically converted by the photoelectric detectors 7 and 8. This Figure 3 (A)
Shows the position of the stage 4 on which the laser beam L is incident on the surface 20B of the light scattering object 20, and FIG.
The position of the stage 4 on which the laser beam L is incident on the surface 20A is shown.
【００３３】もし動作確認のため所定の位置すなわち図
３（Ａ）、（Ｂ）の位置で、光散乱物体２０からの散乱
光信号が得られなかつた場合には、レーザビームＬが入
射していないか又は光電検出器７、８が機能していない
かの何れかの事故であるとして、主制御系１００はデイ
スプレイへエラーを表示する。このエラー表示としては
例えば異物検査装置の外部の目で見えるところに配置し
たランプを点灯又は点滅するようになされている。If the scattered light signal from the light scattering object 20 is not obtained at a predetermined position for confirming the operation, that is, the positions shown in FIGS. 3A and 3B, the laser beam L is incident. The main control system 100 will display an error to the display as if there was an accident, either not or the photoelectric detectors 7, 8 were not functioning. As this error display, for example, a lamp arranged outside the foreign matter inspection apparatus where it is visible can be turned on or blinked.
【００３４】このようにすれば、異物検査装置の動作異
常を容易に判断でき、次の露光装置によりウエハへの転
写露光工程に移つて誤つて露光してしまうことを未然に
防止し得る。さらに図３（Ａ）、（Ｂ）の位置での動作
確認という一連の動作確認処理において、図３（Ａ）及
び図３（Ｂ）で両方とも、散乱物体２０からの散乱信号
が得られなければ、主制御系１００はレーザビームＬが
入射していないか又は２つの光電検出器７及び８が共に
異常であると判定する。By doing so, it is possible to easily judge the operation abnormality of the foreign matter inspection apparatus, and prevent the exposure apparatus from being erroneously exposed during the transfer exposure step for the wafer by the next exposure apparatus. Furthermore, in a series of operation confirmation processing of confirming the operation at the positions of FIGS. 3A and 3B, the scattering signal from the scattering object 20 must be obtained in both FIGS. 3A and 3B. For example, the main control system 100 determines that the laser beam L is not incident or that the two photoelectric detectors 7 and 8 are both abnormal.
【００３５】また図３（Ａ）では散乱信号が得られる
が、図３（Ｂ）では得られないような場合には光電検出
器７が異常であると判定することができ、逆に図３
（Ａ）で散乱信号が得られず、図３（Ｂ）で得られる場
合には光電検出器８が異常であると判定することがで
き、主制御系１００にこのような判定手段を設ければさ
らに詳細に異常箇所を分類して表示することができる。Further, in the case where the scattered signal is obtained in FIG. 3A but cannot be obtained in FIG. 3B, it is possible to determine that the photoelectric detector 7 is abnormal, and conversely, in FIG.
When the scattered signal is not obtained in (A) and is obtained in FIG. 3 (B), it can be determined that the photoelectric detector 8 is abnormal, and the main control system 100 is provided with such a determination means. For example, the abnormal part can be classified and displayed in more detail.
【００３６】以上の構成によれば、ペリクル１やレチク
ル３の被検査面とほぼ同一平面上に光散乱物体２０を配
置し、レーザビームＬによる光散乱物体２０からの散乱
光を、光電検出器７、８により検出して、光源３０及び
光電検出器７、８の異常動作を判定するようにしたこと
により、確実かつ必要に応じて光源３０及び光電検出器
７、８の動作を確認し得る異物検査装置を実現できる。According to the above configuration, the light scattering object 20 is arranged on the substantially same plane as the surface to be inspected of the pellicle 1 and the reticle 3, and the scattered light from the light scattering object 20 by the laser beam L is detected by the photoelectric detector. Since the abnormal operation of the light source 30 and the photoelectric detectors 7 and 8 is detected by detecting 7 and 8, the operations of the light source 30 and the photoelectric detectors 7 and 8 can be confirmed reliably and as needed. A foreign matter inspection device can be realized.
【００３７】（３）第３の実施例 図４は本発明による第２の実施例を示し、ペリクル１及
びレチクル３の横方向、すなわちレーザビームＬの走査
線の延長線上で、かつ載物台４の移動方向（矢印ａ）に
沿つて光散乱物体２１が設けられている。(3) Third Embodiment FIG. 4 shows a second embodiment according to the present invention, which is in the lateral direction of the pellicle 1 and the reticle 3, that is, on the extension line of the scanning line of the laser beam L and on the stage. The light scattering object 21 is provided along the moving direction of 4 (arrow a).
【００３８】また上述の第２の実施例と同様にペリクル
１はフレーム２を介してレチクル３に装着されて載物台
４に支持固定されている。載物台４は矢印ａ方向に移動
可能となされ、またレーザビームＬはペリクル１及びレ
チクル３に対して斜め方向から入射すると共に、光走査
手段（図示せず）によつてビーム走査され、これにより
それぞれペリクル１及びレチクル３の表面上に走査線Ｌ
B 、ＬA を形成する。As in the second embodiment, the pellicle 1 is mounted on the reticle 3 via the frame 2 and is supported and fixed on the stage 4. The stage 4 is movable in the direction of arrow a, and the laser beam L is incident on the pellicle 1 and the reticle 3 from an oblique direction and is scanned by an optical scanning means (not shown). Scan lines L on the surfaces of the pellicle 1 and the reticle 3 respectively.
B and LA are formed.
【００３９】この図４において受光レンズ、スリツト及
び光電検出器等でなる受光系は図示していないが、これ
らは図１及び図２について上述したと同様の配置及び構
成を有している。載物台４には光散乱物体２１が配置さ
れて、この面２１Ａはレチクル３の表面とほぼ同一平面
上に設けられ、また面２１Ｂはペリクル１の表面とほぼ
同一平面上に設けられている。Although the light receiving system including the light receiving lens, the slit, the photoelectric detector and the like is not shown in FIG. 4, these have the same arrangement and configuration as those described above with reference to FIGS. 1 and 2. A light-scattering object 21 is arranged on the stage 4, the surface 21A is provided on substantially the same plane as the surface of the reticle 3, and the surface 21B is provided on substantially the same plane as the surface of the pellicle 1. ..
【００４０】従つてレーザビームＬの走査範囲を光散乱
物体２１にまで広げることにより、走査線ＬA の延長線
上に面２１Ａ上の走査線ＬA1が形成され、走査線ＬB の
延長線上に面２１Ｂ上の走査線ＬB1が形成され、走査線
ＬA1、ＬB1は走査線ＬA 、ＬB と同様に受光スリツトを
介して光電検出器によつて受光可能とっされている。Accordingly, by expanding the scanning range of the laser beam L to the light scattering object 21, the scanning line LA1 on the surface 21A is formed on the extension line of the scanning line LA, and the surface 21B on the extension line of the scanning line LB. The scanning line LB1 is formed, and the scanning lines LA1 and LB1 can be received by the photoelectric detector through the light receiving slit similarly to the scanning lines LA and LB.
【００４１】以上の構成によれば、異物検査中のレーザ
ビームＬの走査と同時に光散乱物体２１からの散乱光に
応じた光電信号（散乱信号）を得ることができ、しかも
ペリクル１とほぼ同一平面でなる面２１Ｂからの散乱信
号とレチクル３とほぼ同一平面でなる面２１Ａからの散
乱信号が同時に得られるので、異物検査中にリアルタイ
ムで常時レーザビームＬ及び光電検出器７、８の動作を
確認し得る異物検査装置を実現できる。According to the above configuration, a photoelectric signal (scattering signal) corresponding to the scattered light from the light scattering object 21 can be obtained at the same time as the scanning of the laser beam L during the foreign matter inspection, and is almost the same as the pellicle 1. Since the scattered signal from the flat surface 21B and the scattered signal from the flat surface 21A substantially flush with the reticle 3 are obtained at the same time, the laser beam L and the photoelectric detectors 7 and 8 can always be operated in real time during the foreign substance inspection. It is possible to realize a foreign matter inspection device that can be confirmed.
【００４２】さらに上述の構成によれば、第２の実施例
について上述した判定動作と同様にして、レーザビーム
Ｌが入射していないのか、またはペリクル面受光系の動
作不良なのかレチクル面受光系の動作不良なのかの区別
して判定することを異物検査動作中に行うことが可能と
なり、リアルタイムで処理し得る異物検査装置を実現で
きる。Further, according to the above-described structure, similarly to the determination operation described above in the second embodiment, whether the laser beam L is not incident, or the operation of the pellicle surface light receiving system is defective, or the reticle surface light receiving system is performed. It is possible to determine whether the operation is defective or not during the foreign matter inspection operation, and it is possible to realize a foreign matter inspection apparatus capable of performing real-time processing.
【００４３】（４）他の実施例 （４−１）上述の実施例においては、光散乱手段として
曇ガラスや光拡散板等の光散乱物体を用いた場合につい
て述べたが、これに限らず、光を散乱するものであれば
何でも良く、例えばレモンスキンや加工の容易さを考慮
して金属の表面を粗く処理したものでも良く、さらに入
射するレーザビームの光を受光光軸方向に反射させるよ
うな角度をもたせた反射ミラー等を用いて直接レーザビ
ームをスリツトを通じて光電検出器に導くような構成と
しても上述の実施例と同様の効果を実現できる。(4) Other Embodiments (4-1) In the above embodiments, the case where a light scattering object such as a cloudy glass or a light diffusing plate is used as the light scattering means has been described, but the present invention is not limited to this. , Anything that scatters light may be used, such as a lemon skin or a metal surface that has been roughened in consideration of easiness of processing, and further reflects the incident laser beam light in the direction of the receiving optical axis. The same effect as that of the above-described embodiment can be realized even if the reflection mirror or the like having such an angle is used to directly guide the laser beam to the photoelectric detector through the slit.
【００４４】（４−２）上述の実施例においては、光照
射手段や光電検出手段の動作確認処理を異物検査後や、
異物検査と同時に実行する場合について述べたが、これ
に限らず、異物検査を実行する前やペリクル、レチクル
が載物台に載置されていない状態での定期点検として実
行するようにしても、上述の実施例と同様の効果を実現
できる。(4-2) In the above embodiment, the operation confirmation processing of the light irradiation means and the photoelectric detection means is performed after the foreign matter inspection,
Although the case where the foreign matter inspection is performed at the same time has been described, the present invention is not limited to this. Even if it is performed as a regular inspection before performing the foreign matter inspection, or when the pellicle and reticle are not placed on the stage, The same effect as that of the above-described embodiment can be realized.
【００４５】（４−３）上述の実施例においては、光照
射手段や光電検出手段が動作不良の場合、異物検査装置
の外側部の目で見えるところに配置したランプを点灯又
は点滅するようなエラー表示をする場合について述べた
が、これに限らずＣＲＴデイスプレイ上にエラー表示す
るようにしても良く、さらにＣＲＴデイスプレイ上での
異物検出表示を検査領域全面に亘つて異物が付着してい
ると表示するようにしても良い。(4-3) In the above embodiment, when the light irradiating means and the photoelectric detecting means are malfunctioning, the lamp arranged on the outer side of the foreign matter inspection apparatus, which is visible, is turned on or blinked. Although the error display is described, the error display is not limited to this, and the error display may be displayed on the CRT display. Furthermore, the foreign matter detection display on the CRT display indicates that the foreign matter adheres over the entire inspection area. It may be displayed.
【００４６】（４−４）上述の実施例においては、光散
乱手段は光を散乱するものであれば良いとした場合につ
いて述べたが、一般には光散乱物体からの散乱光信号は
異物信号に対して桁違いに大きい。これは本発明が提供
しようとするペリクル、レチクル上の異物検査装置が対
象とする異物サイズはサブミクロンからミクロンオーダ
であるため、レーザ照射によつて得られる異物散乱光が
著しく微弱であるのに対し、光散乱物体（例えばレモン
スキンや金属素地）から得られる散乱光量のほうは大き
いからである。(4-4) In the above embodiment, the case where the light scattering means is only required to scatter light has been described. However, in general, a scattered light signal from a light scattering object becomes a foreign matter signal. In contrast, it is orders of magnitude larger. This is because the size of the foreign matter targeted by the foreign matter inspection device on the pellicle and reticle, which is to be provided by the present invention, is on the order of submicron to micron, so the foreign matter scattered light obtained by laser irradiation is extremely weak. On the other hand, the amount of scattered light obtained from the light scattering object (for example, lemon skin or metal base) is larger.
【００４７】従つて上述の実施例においては、異物を検
出するために設定されている異物検出感度のもとでは、
光散乱物体からの光散乱信号は電気処理系での飽和レベ
ル（例えばプリアンプの飽和レベル）に達するのは必定
である。そこで光散乱物体からの光散乱信号が飽和レベ
ルに達しないように、光散乱物体の信号に基づいて動作
確認を行うときのみ検出感度を下げれば、装置の動作の
正常か異常かの判定だけではなくさらに細かい動作確認
が可能になる。Therefore, in the above-described embodiment, under the foreign matter detection sensitivity set for detecting the foreign matter,
It is inevitable that the light scattering signal from the light scattering object reaches the saturation level in the electrical processing system (for example, the saturation level of the preamplifier). Therefore, if the detection sensitivity is lowered only when confirming the operation based on the signal of the light-scattering object so that the light-scattering signal from the light-scattering object does not reach the saturation level, it is possible to determine whether the operation of the device is normal or abnormal. There is no need for more detailed operation confirmation.
【００４８】例えばプリアンプの飽和レベルが＋15ボル
トであつたとき、上述の実施例においては光散乱信号も
＋15ボルトになつてしまうが、光散乱物体に光が当たつ
ているときだけ検出感度（電気処理系の電流増幅率等）
を下げてプリアンプの出力信号が＋10ボルトになるよう
に変える。For example, when the saturation level of the preamplifier is +15 volts, the light scattering signal also reaches +15 volts in the above-mentioned embodiment, but the detection sensitivity (electricity is detected only when the light scattering object is exposed to light). Current gain of processing system, etc.)
Lower so that the output signal of the preamplifier is +10 volts.
【００４９】動作確認のたびに例えば光散乱信号のプリ
アンプ出力が 9.5〜10.5ボルトの間の値であるならば正
常と判断し、 9.5〜10.5ボルトの範囲外であるならば、
そのときの出力値に応じて、「検出感度低い」や「検出
感度高い」、あるいは警告表示（ワーニング表示）やエ
ラー表示といつたように程度に応じた細かい性能の把握
が可能となる。For each operation check, if the preamplifier output of the light scattering signal has a value between 9.5 and 10.5 volts, it is judged to be normal, and if it is outside the range of 9.5 and 10.5 volts,
Depending on the output value at that time, it is possible to grasp the detailed performance according to the degree such as "low detection sensitivity", "high detection sensitivity", or warning display (warning display) or error display.
【００５０】（４−５）上述の実施例においては、本発
明をレーザビームが被検査面上にラスター走査される異
物検査装置に適用した場合について述べたが、本発明は
これに限らず、例えば光を被検査面に一様に照射し、こ
れを検査対象線と共役な位置関係に配置されたラインセ
ンサ等で光電変換するような異物検査装置にも適用し得
る。(4-5) In the above-mentioned embodiments, the case where the present invention is applied to the foreign substance inspection device in which the laser beam is raster-scanned on the surface to be inspected has been described, but the present invention is not limited to this. For example, the present invention can be applied to a foreign matter inspection apparatus in which light is uniformly applied to a surface to be inspected and photoelectrically converted by a line sensor or the like arranged in a positional relationship conjugate with the inspection target line.
【００５１】（４−６）上述の実施例においては、被検
査対象をレチクル及びペリクルの表面とした場合につい
て述べたが、これに限らず、レチクルの裏面や、レチク
ルの両面に配されたペリクルの表面上の異物を検査する
ような場合にも広く適用できる。因に、レチクルの両面
にペリクルを配置した場合には、もう一方のペリクル面
についても各被検査面と同一平面上に光散乱物体を設け
るようにすれば、上述の実施例と同様の効果を実現でき
る。(4-6) In the above embodiment, the case where the objects to be inspected are the front surfaces of the reticle and the pellicle has been described, but the present invention is not limited to this, and the pellicles arranged on the back surface of the reticle or both surfaces of the reticle. It can also be widely applied to the case of inspecting foreign matter on the surface of the. Incidentally, when pellicles are arranged on both sides of the reticle, if the light-scattering object is provided on the same plane as each surface to be inspected on the other pellicle surface, the same effect as that of the above-described embodiment is obtained. realizable.
【００５２】（４−７）上述の実施例ではペリクル面上
の異物を検出する系と、レチクル面上の異物を検出する
系との２つの系を有する異物検査装置について述べた
が、本発明はこれに限らずどちらか一方のみの検出系を
有する装置の場合には、図１の光散乱物体のように、一
方の被検査面とほぼ同一平面上に光散乱手段を設けるよ
うにしても良い。(4-7) In the above embodiment, the foreign matter inspection apparatus having two systems, a system for detecting foreign matter on the pellicle surface and a system for detecting foreign matter on the reticle surface, has been described. Is not limited to this, and in the case of a device having only one of the detection systems, the light scattering means may be provided on substantially the same plane as one surface to be inspected, like the light scattering object in FIG. good.
【００５３】[0053]
【発明の効果】上述のように本発明によれば、被検査面
とほぼ同一平面上に光散乱手段を設置し、光照射手段に
よる光散乱手段からの散乱光を、光電検出手段により検
出して、光照射手段又は光電検出手段の少なくとも一方
の動作異常を判定するようにしたことにより、信頼性の
高い異物検査装置を実現できる。As described above, according to the present invention, the light scattering means is installed on substantially the same plane as the surface to be inspected, and the scattered light from the light scattering means by the light irradiation means is detected by the photoelectric detection means. By determining the operation abnormality of at least one of the light irradiation means and the photoelectric detection means, a highly reliable foreign matter inspection device can be realized.
【００５４】また異物検査前のみならず異物の検査中に
おいても動作異常を判定することが可能となり、さらに
信頼性の高い異物検査装置を実現できる。さらに被検査
面が複数存在する場合でも、それぞれの被検査面からの
散乱光を受光する光電検出手段の動作異常を個別に判定
でき、かくするにつきさらに一段と信頼性の高い異物検
査装置を実現できる。Further, it becomes possible to determine the operation abnormality not only before the foreign matter inspection but also during the foreign matter inspection, and it is possible to realize a highly reliable foreign matter inspection apparatus. Further, even when there are a plurality of surfaces to be inspected, it is possible to individually determine the operation abnormality of the photoelectric detection means that receives the scattered light from each surface to be inspected, and thus a more highly reliable foreign matter inspection device can be realized. ..
【図１】本発明の一実施例による異物検査装置の構成を
示す略線断面図である。FIG. 1 is a schematic cross-sectional view showing the structure of a foreign matter inspection apparatus according to an embodiment of the present invention.
【図２】本発明の他の実施例による異物検査装置の構成
を示す略線断面図である。FIG. 2 is a schematic cross-sectional view showing the structure of a foreign matter inspection apparatus according to another embodiment of the present invention.
【図３】その動作確認処理を行う場合の載物台の位置説
明に供する略線断面図である。FIG. 3 is a schematic cross-sectional view for explaining the position of the stage when the operation confirmation process is performed.
【図４】本発明のさらに他の実施例による異物検査装置
を示す略線斜視図である。FIG. 4 is a schematic perspective view showing a foreign matter inspection device according to still another embodiment of the present invention.
１……ペリクル、２……フレーム、３……レチクル、４
……載物台、５、６……受光レンズ、７、８……光電検
出器、９、１０……スリツト、１３、２０、２１……光
散乱物体、３０……光源、１００……主制御系、Ｌ……
レーザビーム。1 ... Pellicle, 2 ... Frame, 3 ... Reticle, 4
...... Delivery stage, 5,6 ...... Receiving lens, 7,8 ...... Photoelectric detector, 9, 10 ...... Slit, 13, 20, 21 ...... Light scattering object, 30 ...... Light source, 100 ...... Main Control system, L ...
Laser beam.
Claims (1)
と、前記被検査面上の被検査領域上に付着した異物から
の散乱光を受光する受光レンズ系と、前記受光レンズ系
に関して前記被検査領域に対してほぼ共役な位置に配置
され、前記受光レンズ系を通じて得られる前記異物から
の前記散乱光を受光する光電検出手段とを有する異物検
査装置において、 前記被検査面とほぼ同一平面上に設けられた光散乱手段
と、 前記光照射手段による前記光散乱手段からの散乱光を、
前記光電検出手段により検出し、前記光照射手段又は前
記光電検出手段の少なくとも一方の動作異常を判定する
判定手段とを具えたことを特徴とする異物検査装置。Claim: What is claimed is: 1. A light irradiating device for irradiating a surface to be inspected with inspection light, and a light receiving lens system for receiving scattered light from foreign matter adhering to an area to be inspected on the surface to be inspected. In the foreign matter inspection device, which is arranged at a position substantially conjugate to the inspected region with respect to the light receiving lens system, and photoelectric detection means for receiving the scattered light from the foreign matter obtained through the light receiving lens system, A light scattering means provided on substantially the same plane as the surface to be inspected, and scattered light from the light scattering means by the light irradiation means,
A foreign matter inspection apparatus comprising: a determination unit that detects the operation abnormality of at least one of the light irradiation unit and the photoelectric detection unit by the photoelectric detection unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20639391A JPH0527411A (en) | 1991-07-23 | 1991-07-23 | Foreign matter inspecting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20639391A JPH0527411A (en) | 1991-07-23 | 1991-07-23 | Foreign matter inspecting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0527411A true JPH0527411A (en) | 1993-02-05 |
Family
ID=16522611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20639391A Pending JPH0527411A (en) | 1991-07-23 | 1991-07-23 | Foreign matter inspecting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0527411A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007334212A (en) * | 2006-06-19 | 2007-12-27 | Lasertec Corp | Inspection method and device for photomask |
| KR20160088801A (en) * | 2015-01-16 | 2016-07-26 | 캐논 가부시끼가이샤 | Foreign matter checking apparatus, exposure apparatus and device manufacturing method |
-
1991
- 1991-07-23 JP JP20639391A patent/JPH0527411A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007334212A (en) * | 2006-06-19 | 2007-12-27 | Lasertec Corp | Inspection method and device for photomask |
| KR20160088801A (en) * | 2015-01-16 | 2016-07-26 | 캐논 가부시끼가이샤 | Foreign matter checking apparatus, exposure apparatus and device manufacturing method |
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