JPH05249340A - Coupling device for optical parts - Google Patents
Coupling device for optical partsInfo
- Publication number
- JPH05249340A JPH05249340A JP4949392A JP4949392A JPH05249340A JP H05249340 A JPH05249340 A JP H05249340A JP 4949392 A JP4949392 A JP 4949392A JP 4949392 A JP4949392 A JP 4949392A JP H05249340 A JPH05249340 A JP H05249340A
- Authority
- JP
- Japan
- Prior art keywords
- optical
- coupling
- optical waveguide
- laser
- guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は光通信分野における光導
波路を使用する光部品の結合装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coupling device for optical components using an optical waveguide in the field of optical communication.
【０００２】[0002]
【従来の技術】光導波路を使用した光部品の結合方法で
は、結合損失を抑制するために、それぞれの光部品およ
び光導波路の光軸を一致させる必要がある。このため、
従来における結合方法では、部品を微動させながら結合
損失が低くなるように調整し、紫外線硬化樹脂等により
部品を固定する。なお、光結合における従来技術の具体
的内容については、１９８９年電子情報通信学会春季全
国大会Ｎｏ．Ｃ−５１６に記載されている。2. Description of the Related Art In a method of coupling optical components using optical waveguides, it is necessary to match the optical axes of the optical components and the optical waveguides in order to suppress coupling loss. For this reason,
In the conventional bonding method, the components are finely moved and adjusted so that the coupling loss is reduced, and the components are fixed with an ultraviolet curable resin or the like. Regarding the specific contents of the conventional technology for optical coupling, the 1989 IEICE Spring National Convention No. It is described in C-516.
【０００３】[0003]
【発明が解決しようとする課題】光導波路を使用して対
となった光部品を結合させる場合、例えば、半導体レー
ザと光ファイバの結合においては、結合損失を抑制るた
めに、光導波路と半導体レーザおよび光ファイバの光軸
を一致させる調整が必要である。そのため、半導体レー
ザを発光させ、半導体レーザおよび光ファイバを上下左
右に微動させながら、結合損失が低くなるように調整す
ることが不可欠であり、この作業には多大な労力と時間
を要する。When coupling a pair of optical components by using an optical waveguide, for example, in coupling a semiconductor laser and an optical fiber, the optical waveguide and the semiconductor are combined in order to suppress coupling loss. Adjustments are required to align the optical axes of the laser and the optical fiber. Therefore, it is indispensable to make the semiconductor laser emit light and finely move the semiconductor laser and the optical fiber vertically and horizontally so that the coupling loss becomes low, and this work requires a lot of labor and time.
【０００４】本発明は以上の問題点に鑑み、光導波路お
よび光部品の光軸を無調整で合わせ、かつ、結合損失を
抑えた、効率の高い結合を行うことを目的とする。In view of the above problems, it is an object of the present invention to align the optical axes of the optical waveguide and the optical component without adjustment, and to perform highly efficient coupling with suppressed coupling loss.
【０００５】[0005]
【課題を解決するための手段】上記課題を解決するため
に、基板と一体形成した光導波路を挟んで、対となった
光部品設置用のガイド溝を同一基板上に形成し、ガイド
溝にそれぞれの光部品を配置することを特徴とする。In order to solve the above-mentioned problems, a guide groove for installing a pair of optical components is formed on the same substrate with an optical waveguide integrally formed with the substrate sandwiched between the guide grooves. The feature is that each optical component is arranged.
【０００６】[0006]
【作用】本発明により、光導波路が一体形成された基板
上に光結合すべき対の光部品用のガイド溝を精度高く構
成できるため、光部品をあらかじめ決められた設置位置
に確定できる。よって、部品を微動させながら調整する
ことなく、ガイド溝に光部品を挿入するだけで、光導波
路への光の入射角度および光部品の光軸を合わせること
ができる。According to the present invention, since the guide groove for a pair of optical components to be optically coupled can be formed with high accuracy on the substrate integrally formed with the optical waveguide, the optical component can be set at a predetermined installation position. Therefore, the angle of incidence of light on the optical waveguide and the optical axis of the optical component can be aligned simply by inserting the optical component into the guide groove without adjusting the component while finely moving it.
【０００７】[0007]
【実施例】図１は、光導波路を使用した半導体レーザと
光ファイバの結合装置の一実施例を示したものである。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an embodiment of a coupling device for a semiconductor laser and an optical fiber using an optical waveguide.
【０００８】シリコン基板１の中央部平面上に、光導波
路２０をこの基板１と一体に形成する。そして、光導波
路２０の光軸に合わせたレーザ用ガイド溝５と光ファイ
バ用ガイド溝４とを、光導波路２０を挟んで同一基板１
上に構成し、半導体レーザを設置したレーザ用ガイド６
と光ファイバ７をそれぞれのガイド溝５、４に配置する
（図１）。これにより、レーザ用ガイド６と光ファイバ
７の位置はそれぞれのガイド溝５、４により確定され、
かつ、光導波路２０は基板１に一体形成されているた
め、光導波路２０と半導体レーザの活性層６１および光
ファイバ７のコアとの精度の高い光軸合わせが、光部品
をガイド溝に挿入することだけで行うことができる。The optical waveguide 20 is formed integrally with the substrate 1 on the central plane of the silicon substrate 1. Then, the laser guide groove 5 and the optical fiber guide groove 4 aligned with the optical axis of the optical waveguide 20 are sandwiched between the optical waveguide 20 and the same substrate 1
Laser guide 6 configured as above and equipped with a semiconductor laser
And the optical fiber 7 are arranged in the respective guide grooves 5 and 4 (FIG. 1). As a result, the positions of the laser guide 6 and the optical fiber 7 are determined by the respective guide grooves 5, 4.
Moreover, since the optical waveguide 20 is integrally formed on the substrate 1, the optical component is inserted into the guide groove by highly accurate optical axis alignment between the optical waveguide 20 and the active layer 61 of the semiconductor laser and the core of the optical fiber 7. You can do just that.
【０００９】図２及至図４は、上記の光部品結合装置の
実施例の基板作製の工程の概略である。以下、図を参照
して説明する。なお、実際のプロセスではシリコンウェ
ハーを処理の一単位として、あたかも半導体ＩＣチップ
を製造するごとく、単一ウェハー上に多数のデバイスを
作製し、その後にダイシングにより個々のチップ（光結
合装置）に分割する。以下の説明では、便宜上、１個の
チップを処理単位としてプロセスを説明する。2 to 4 are schematic views of steps of manufacturing a substrate in the embodiment of the optical component coupling apparatus described above. Hereinafter, description will be given with reference to the drawings. In the actual process, a silicon wafer is used as a unit for processing, and a large number of devices are manufactured on a single wafer as if a semiconductor IC chip is manufactured, and then divided into individual chips (optical coupling device) by dicing. To do. In the following description, for convenience, the process will be described with one chip as a processing unit.
【００１０】まず、シリコン基板１（２ｍｍ×３０ｍ
ｍ）の平面上に、中央からほぼ半分の範囲をエッチング
法により表面処理（図２（ｂ））した後、光導波路層２
を堆積させる（図２（ｃ））。次に、フォトリソグラフ
ィによるパターン（図示せず）形成後、Ｃ2 Ｆ6 による
ドライエッチング（２０ｓｃｃｍ、２．０Ｐａ）を行
い、光導波路層２より光導波路２０を形成する（図２
（ｄ））。この光導波路２０の上にクラッド層３を堆積
させる（図３（ｅ））。その後、ＳＦ6 によるドライエ
ッチング（２０ｓｃｃｍ、５．０Ｐａ）により、幅０．
１２５ｍｍ、深さ０．１１２ｍｍの光ファイバ用ガイド
溝４を（図３（ｆ））、ついで、幅０．３ｍｍ、長さ
０．３ｍｍ、深さ０．０５ｍｍのレーザ用ガイド溝５と
を形成する（図３（ｇ））。この時、光導波路２０の光
軸と設置するレーザ用ガイド６および光ファイバ７との
光軸が一致するように、ガイド溝５、４は構成されてい
る。ここで、クラッド層３は光ファイブ用のガイド溝４
の一部を兼ねている。First, the silicon substrate 1 (2 mm × 30 m
After the surface treatment (FIG. 2 (b)) on the plane of (m), approximately half the area from the center is etched, the optical waveguide layer 2
Are deposited (FIG. 2C). Next, after forming a pattern (not shown) by photolithography, dry etching (20 sccm, 2.0 Pa) by C 2 F 6 is performed to form the optical waveguide 20 from the optical waveguide layer 2 (FIG. 2).
(D)). The cladding layer 3 is deposited on the optical waveguide 20 (FIG. 3 (e)). Then, by dry etching with SF 6 (20 sccm, 5.0 Pa), the width of 0.
An optical fiber guide groove 4 having a width of 125 mm and a depth of 0.112 mm is formed (FIG. 3 (f)), and then a laser guide groove 5 having a width of 0.3 mm, a length of 0.3 mm and a depth of 0.05 mm is formed. (FIG. 3 (g)). At this time, the guide grooves 5 and 4 are configured such that the optical axis of the optical waveguide 20 and the optical axes of the laser guide 6 and the optical fiber 7 to be installed coincide with each other. Here, the cladding layer 3 is a guide groove 4 for optical five.
Also serves as a part of.
【００１１】そして、レーザ用ガイド６を別途、次のよ
うに作製する。半導体レーザを有する光部品基板を、光
軸を中心に０．３ｍｍ幅の領域を保護し、高さ０．０５
ｍｍの段差をエッチング法により形成した後、０．３ｍ
ｍの長さに光軸と垂直にへき開し、これをレーザ用ガイ
ド６とする（図４（ｈ））。その後、このレーザ用ガイ
ド６と別に用意した光ファイバ７をそれぞれのガイド溝
５およびガイド溝４に設置し、半田および紫外線硬化樹
脂により固定する（図４（ｉ、ｊ））。Then, the laser guide 6 is separately manufactured as follows. An optical component substrate having a semiconductor laser is protected by a 0.3 mm wide area centered on the optical axis and has a height of 0.05 mm.
0.3m after forming a step of mm by etching method
It is cleaved to a length of m perpendicular to the optical axis, and this is used as a laser guide 6 (FIG. 4 (h)). Then, the optical fiber 7 prepared separately from the laser guide 6 is placed in each of the guide groove 5 and the guide groove 4 and fixed by solder and ultraviolet curable resin (FIG. 4 (i, j)).
【００１２】本工程によれば、光導波路２０と同一基板
１上にガイド溝４、５をエッチング法により構成するた
め、光軸のずれの誤差を小さくすることができる。これ
と合わせて、エッチング法により形成される光導波路２
０およびレーザ用ガイド６の寸法誤差が小さいので、極
めて効率の高い光結合が行うことができる。According to this process, since the guide grooves 4 and 5 are formed on the same substrate 1 as the optical waveguide 20 by the etching method, it is possible to reduce the error of the deviation of the optical axis. Together with this, the optical waveguide 2 formed by the etching method
Since the dimensional error between 0 and the laser guide 6 is small, extremely efficient optical coupling can be performed.
【００１３】本発明は前述の実施例に限らず様々な変形
が可能である。The present invention is not limited to the above-described embodiment, but various modifications can be made.
【００１４】例えば、対となる光部品の結合は一対一に
限らず、一対二をはじめ、複数対複数の光部品における
結合でも良く、例えば、分岐導波路や多モード道路結合
器等を前記光導波路２０中に構成した結合でも良い。さ
らにこれらと合わせ、基板と一体形成した光導波路２０
は単なる導波路に限らず、電気・音響・磁気・非線形・
熱の各光学効果を利用した導波形デバイス、例えば、位
相変調器や分岐スイッチを構成する導波形デバイスの機
能を持たせたものでも良い。また、光導波路の端面を丸
く加工し、レンズの作用を持たせても良い。For example, the coupling of the optical components forming a pair is not limited to one-to-one, but may be coupling in a plurality of plural optical components such as one-to-two coupling. The coupling configured in the waveguide 20 may be used. Further combined with these, the optical waveguide 20 integrally formed with the substrate
Is not limited to simple waveguides, but it can also be used for electrical, acoustic, magnetic, nonlinear,
A waveguide type device using each optical effect of heat, for example, a device having a function of a waveguide type device forming a phase modulator or a branch switch may be used. Further, the end face of the optical waveguide may be processed into a round shape so as to have a lens function.
【００１５】また、光部品も半導体レーザおよび光ファ
イバに限らず、例えば、光導波路と光ファイバ、半導体
レーザと光導波路を基板上で結合するものでも良い。Further, the optical parts are not limited to the semiconductor laser and the optical fiber, and for example, the optical waveguide and the optical fiber, or the semiconductor laser and the optical waveguide may be coupled on the substrate.
【００１６】また、レーザ用ガイド溝５はレーザ用ガイ
ド６よりも光軸方向に長く加工し、光導波路からの距離
を微調整するため、それぞれの光部品を光軸方向に移動
できるようにしても良い。Further, the laser guide groove 5 is processed to be longer than the laser guide 6 in the optical axis direction, and each optical component can be moved in the optical axis direction in order to finely adjust the distance from the optical waveguide. Is also good.
【００１７】実施例では、エッチング材として光導波路
の加工にＣ2 Ｆ6 （ドライ）、シリコン基板の加工にＳ
Ｆ6 （ドライ）を用いたが、エッチング材はこれに限ら
ず、例えば、ＨＦ（ウエット）およびＫＯＨ（ウェッ
ト）でも良い。また、ガイド溝４、５に配置する光部品
は光部品単体に限らず、実施例のように必要に応じて光
部品本体のガイドを作製し、そのガイドと光部品とを組
み合わせたものとしても良い。In the embodiment, C 2 F 6 (dry) is used as an etching material for processing an optical waveguide, and S is used for processing a silicon substrate.
Although F 6 (dry) is used, the etching material is not limited to this and may be, for example, HF (wet) or KOH (wet). Further, the optical component arranged in the guide grooves 4 and 5 is not limited to the optical component alone, but a guide of the optical component main body may be produced as necessary as in the embodiment, and the guide and the optical component may be combined. good.
【００１８】[0018]
【発明の効果】以上の通り、本発明によれば部品を微動
させて調整すること無く、結合損失を抑えた効率の高い
結合を行うことができる。また、機械的強度が高く、固
定後の位置ずれが生じにくいため結合効率の劣化を防
ぎ、高い信頼性を得ることができる。As described above, according to the present invention, it is possible to perform highly efficient coupling with suppressed coupling loss without finely adjusting the components for adjustment. Further, since the mechanical strength is high and the positional deviation after fixation is unlikely to occur, deterioration of the coupling efficiency can be prevented and high reliability can be obtained.
【図１】本発明の実施例の概略図である。FIG. 1 is a schematic diagram of an embodiment of the present invention.
【図２】本発明の実施例の基板作製の工程の概略図であ
る。FIG. 2 is a schematic view of a process of manufacturing a substrate according to an example of the present invention.
【図３】本発明の実施例の基板作製の工程の概略図であ
る。FIG. 3 is a schematic view of a process of manufacturing a substrate according to an example of the present invention.
【図４】本発明の実施例の基板作製の工程の概略図であ
る。FIG. 4 is a schematic view of a process of manufacturing a substrate according to an example of the present invention.
１…シリコン基板、２…光導波路層、２０…光導波路、
３…クラッド層、４…光ファイバ用ガイド溝、５…レー
ザ用ガイド溝、６…半導体レーザを有したレーザ用ガイ
ド、６１…半導体レーザの活性層、７…光ファイバ。1 ... Silicon substrate, 2 ... Optical waveguide layer, 20 ... Optical waveguide,
3 ... Clad layer, 4 ... Optical fiber guide groove, 5 ... Laser guide groove, 6 ... Laser guide having semiconductor laser, 61 ... Active layer of semiconductor laser, 7 ... Optical fiber.
Claims (1)
対となった光部品設置用のガイド溝を同一基板上に構成
し、前記ガイド溝にそれぞれの光部品を配置することを
特徴とする光部品の結合装置。1. An optical waveguide integrally formed with a substrate is sandwiched between
An optical component coupling device, characterized in that a pair of optical component installation guide grooves are formed on the same substrate, and each optical component is arranged in the guide groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4949392A JPH05249340A (en) | 1992-03-06 | 1992-03-06 | Coupling device for optical parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4949392A JPH05249340A (en) | 1992-03-06 | 1992-03-06 | Coupling device for optical parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05249340A true JPH05249340A (en) | 1993-09-28 |
Family
ID=12832679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4949392A Pending JPH05249340A (en) | 1992-03-06 | 1992-03-06 | Coupling device for optical parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05249340A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5905831A (en) * | 1995-06-30 | 1999-05-18 | The Whitaker Corporation | Passive alignment frame using monocrystalline material |
| US5981975A (en) * | 1998-02-27 | 1999-11-09 | The Whitaker Corporation | On-chip alignment fiducials for surface emitting devices |
| US6085007A (en) * | 1998-02-27 | 2000-07-04 | Jiang; Ching-Long | Passive alignment member for vertical surface emitting/detecting device |
| JP2004515063A (en) * | 2000-11-23 | 2004-05-20 | イルジン コーポレーション | Optical integrated circuit device having a convex portion, method of manufacturing the same, and transceiver module for optical communication manufactured using the optical integrated circuit device |
| FR2873454A1 (en) * | 2004-07-26 | 2006-01-27 | E Klo Sarl | Photoreceptor component, has waveguides interposed between photodiodes and optical fiber, where waveguides and photodiodes are formed on same substrate and each waveguide has end partially covering active surface of respective photodiode |
-
1992
- 1992-03-06 JP JP4949392A patent/JPH05249340A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5905831A (en) * | 1995-06-30 | 1999-05-18 | The Whitaker Corporation | Passive alignment frame using monocrystalline material |
| US5981975A (en) * | 1998-02-27 | 1999-11-09 | The Whitaker Corporation | On-chip alignment fiducials for surface emitting devices |
| US6085007A (en) * | 1998-02-27 | 2000-07-04 | Jiang; Ching-Long | Passive alignment member for vertical surface emitting/detecting device |
| JP2004515063A (en) * | 2000-11-23 | 2004-05-20 | イルジン コーポレーション | Optical integrated circuit device having a convex portion, method of manufacturing the same, and transceiver module for optical communication manufactured using the optical integrated circuit device |
| FR2873454A1 (en) * | 2004-07-26 | 2006-01-27 | E Klo Sarl | Photoreceptor component, has waveguides interposed between photodiodes and optical fiber, where waveguides and photodiodes are formed on same substrate and each waveguide has end partially covering active surface of respective photodiode |
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