JPH05243301A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPH05243301A
JPH05243301A JP4265092A JP4265092A JPH05243301A JP H05243301 A JPH05243301 A JP H05243301A JP 4265092 A JP4265092 A JP 4265092A JP 4265092 A JP4265092 A JP 4265092A JP H05243301 A JPH05243301 A JP H05243301A
Authority
JP
Japan
Prior art keywords
resin
cavity
supplied
powder
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4265092A
Other languages
Japanese (ja)
Other versions
JP2758769B2 (en
Inventor
Naoto Kimura
直人 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP4042650A priority Critical patent/JP2758769B2/en
Publication of JPH05243301A publication Critical patent/JPH05243301A/en
Application granted granted Critical
Publication of JP2758769B2 publication Critical patent/JP2758769B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent a resin void due to air entrainment when a semiconductor device is resin sealed by previously supplying cavity bottom where the void tends to be generated with powder resin or solid-state resin, melting and injecting the resin. CONSTITUTION:A bottom die which has a cavity 1, a gate 2 and a center pot 3 is set and the cavity 1 is supplied with epoxy powder resin 5 from a resin supplying nozzle 4. Then, a lead frame 7 mounted with a chip 6 on an island 8 is placed on the cavity 1. At that time, the powder resin 5 is melted by the heated die. A top die 9 is overlapped for clamping, pressure is applied on tablet resin 10 composed of the epoxy resin supplied in the center pot 3 and the resin 10 is melted and injected. Thus, a resin void due to air entrainment at the time of resin sealing is prevented.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は半導体装置の製造方法に
関し、特にプラスチックパッケージの封止方法に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing method, and more particularly to a plastic package sealing method.

【０００２】[0002]

【従来の技術】従来のプラスチックパッケージの封止方
法は、図４の断面図に示す様に、チップ（半導体素子）
６が搭載されたリードフレーム７を下金型のキャビティ
１上に載置し、上金型９を重ねて型締めし、この上下金
型で形成されるキャビティ内にセンタポット３で加熱加
圧された溶融樹脂をゲート２を経て注入することにより
封止を行っていた。2. Description of the Related Art A conventional plastic package encapsulation method is, as shown in a sectional view of FIG.
The lead frame 7 on which the 6 is mounted is placed on the cavity 1 of the lower mold, the upper mold 9 is overlaid and clamped, and the center pot 3 heats and pressurizes in the cavity formed by the upper and lower molds. The molten resin thus obtained is injected through the gate 2 for sealing.

【０００３】[0003]

【発明が解決しようとする課題】従来の半導体装置製造
方法では、前述のように下型のキャビティ１にリードフ
レーム７を載置後型締めし樹脂を注入しているため、こ
のリードフレームによる影響さらにゲート２の注入角度
の影響等により、キャビティに流入する樹脂の充填状態
が均一でなく、特に下型のキャビティ１の底面部にボイ
ド１６が発生するという問題点があった。In the conventional method for manufacturing a semiconductor device, as described above, the lead frame 7 is placed in the cavity 1 of the lower mold and then the mold is clamped to inject the resin. Further, due to the influence of the injection angle of the gate 2 and the like, the filling state of the resin flowing into the cavity is not uniform, and in particular, the void 16 is generated in the bottom surface of the lower mold cavity 1.

【０００４】[0004]

【課題を解決するための手段】本発明は、図１（ｃ）に
示すように、キャビティ１に粉末樹脂５を予め供給した
後溶融させ、リードフレーム７を載置して型締めし樹脂
を注入する。もしくは図２（ａ）に示すように、キャビ
ティ１に固形樹脂１２を予め供給した後溶融させ、リー
ドフレーム７を載置して型締めし樹脂を注入するという
製造方法である。According to the present invention, as shown in FIG. 1 (c), a powder resin 5 is preliminarily supplied to a cavity 1 and then melted, and a lead frame 7 is placed on the mold to clamp the resin. inject. Alternatively, as shown in FIG. 2A, the solid resin 12 is previously supplied to the cavity 1 and then melted, the lead frame 7 is placed, the mold is clamped, and the resin is injected.

【０００５】[0005]

【実施例】次に本発明について図面を参照して説明す
る。図１は本発明の第１の実施例を工程順に示す図で、
同図（ａ）〜（ｅ）はそれぞれ断面図である。同図
（ａ）は本実施例で使用する下金型をセットした状態を
示し、この金型にはキャビティ１，ゲート２，センタポ
ット３を有する。同図（ｂ）では、キャビティ１に樹脂
供給ノズル４からエポキシ樹脂の粉末樹脂５を供給する
状況を示している。同図（ｃ）は、アイランド８上にチ
ップ６を搭載したリードフレーム７をキャビティ１上に
載置した状態を示している。この時に粉末樹脂５は加熱
された金型により溶融状態にある。同図（ｄ）は上金型
９を重ねて型締めし、センタポット３に供給されたエポ
キシ樹脂からなるタブレット樹脂１０に圧力を加えて溶
融させ注入する状態を示す。同図（ｅ）は樹脂成形が完
了した状態を示す。The present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing a first embodiment of the present invention in the order of steps,
(A) to (e) of the same figure are sectional views. FIG. 3A shows a state where a lower mold used in this embodiment is set, and this mold has a cavity 1, a gate 2 and a center pot 3. FIG. 1B shows a state in which the epoxy resin powder resin 5 is supplied from the resin supply nozzle 4 to the cavity 1. FIG. 3C shows a state in which the lead frame 7 having the chip 6 mounted on the island 8 is mounted on the cavity 1. At this time, the powder resin 5 is in a molten state by the heated mold. FIG. 3D shows a state in which the upper mold 9 is overlapped and clamped, and the tablet resin 10 made of the epoxy resin supplied to the center pot 3 is pressed and melted to be injected. FIG. 6E shows a state where resin molding is completed.

【０００６】次に図２は第２の実施例を工程順に示す。
同図（ａ），（ｂ）はそれぞれ断面図である。まず、図
３の断面図に示すように、固形樹脂１２を使用する。固
形樹脂１２は、その密度が樹脂粗部分１３，樹脂中間部
１４および樹脂密部分１５の三層で構成される。固形層
の形成は圧力を変えることにより容易に形成できる。ま
ず、同図（ａ）に示すように、キャビティ１に固形樹脂
１２を供給し、リードフレーム７を載置し、センタポッ
ト３から樹脂を注入する。樹脂注入前に固形樹脂１２は
溶融状態にある。三層構造にしたのは溶融を促進するた
めである。同図（ｂ）は樹脂成形が完了した状態であ
る。Next, FIG. 2 shows a second embodiment in the order of steps.
FIGS. 3A and 3B are cross-sectional views, respectively. First, as shown in the sectional view of FIG. 3, the solid resin 12 is used. The solid resin 12 is composed of three layers having a density of a resin rough portion 13, a resin middle portion 14, and a resin dense portion 15. The solid layer can be easily formed by changing the pressure. First, as shown in FIG. 1A, the solid resin 12 is supplied to the cavity 1, the lead frame 7 is placed, and the resin is injected from the center pot 3. The solid resin 12 is in a molten state before the resin is injected. The three-layer structure is used to promote melting. FIG. 6B shows a state where resin molding is completed.

【０００７】[0007]

【発明の効果】以上説明したように本発明は、キャビテ
ィ下部のボイドが発生しやすい個所に予め粉末樹脂もし
くは固形樹脂を供給して溶融させておき、その後通常の
樹脂を注入するのでボイドの発生を回避できるという効
果がある。As described above, according to the present invention, the powder resin or the solid resin is preliminarily supplied and melted at the lower portion of the cavity where the void is likely to be generated, and then the normal resin is injected, so that the void is generated. There is an effect that can be avoided.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の第１実施例を工程順に示す図で、同図
（ａ）〜（ｅ）はそれぞれ断面図である。FIG. 1 is a view showing a first embodiment of the present invention in the order of steps, and FIGS. 1 (a) to (e) are sectional views.

【図２】本発明の第２実施例を工程順に示す図で、同図
（ａ），（ｂ）はそれぞれ断面図である。FIG. 2 is a view showing a second embodiment of the present invention in the order of steps, and FIGS. 2 (a) and 2 (b) are sectional views.

【図３】本発明の第２実施例に用いる固形樹脂の断面図
である。FIG. 3 is a sectional view of a solid resin used in the second embodiment of the present invention.

【図４】従来の製造方法を説明する断面図である。FIG. 4 is a cross-sectional view illustrating a conventional manufacturing method.

【符号の説明】[Explanation of symbols]

１ キャビティ ２ ゲート ３ センタポット ４ 樹脂供給ノズル ５ 粉末樹脂 ６ チップ ７ リードフレーム ８ アイランド ９ 上金型 １０ タブレット樹脂 １１ 成形樹脂 １２ 固形樹脂 １３ 樹脂粗部分 １４ 樹脂中間部 １５ 樹脂密部分 １６ ボイド 1 Cavity 2 Gate 3 Center Pot 4 Resin Supply Nozzle 5 Powder Resin 6 Chip 7 Lead Frame 8 Island 9 Upper Mold 10 Tablet Resin 11 Molding Resin 12 Solid Resin 13 Resin Rough Part 14 Resin Middle Part 15 Resin Dense Part 16 Void

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 半導体素子を搭載したリードフレームを
上下金型ではさんでキャビティに樹脂を注入する半導体
装置製造方法において、前記リードフレームの載置前に
キャビティ内に粉末樹脂もしくは固形樹脂を供給し、そ
の後キャビティ内に溶融樹脂を注入して樹脂成形を行う
ことを特徴とする半導体装置製造方法。1. A method for manufacturing a semiconductor device in which a lead frame having a semiconductor element mounted thereon is sandwiched between upper and lower molds to inject resin into a cavity, and powder resin or solid resin is supplied into the cavity before mounting the lead frame. Then, a method of manufacturing a semiconductor device, characterized by injecting molten resin into the cavity to perform resin molding.
JP4042650A 1992-02-28 1992-02-28 Semiconductor device manufacturing method Expired - Lifetime JP2758769B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4042650A JP2758769B2 (en) 1992-02-28 1992-02-28 Semiconductor device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4042650A JP2758769B2 (en) 1992-02-28 1992-02-28 Semiconductor device manufacturing method

Publications (2)

Publication Number Publication Date
JPH05243301A true JPH05243301A (en) 1993-09-21
JP2758769B2 JP2758769B2 (en) 1998-05-28

Family

ID=12641890

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4042650A Expired - Lifetime JP2758769B2 (en) 1992-02-28 1992-02-28 Semiconductor device manufacturing method

Country Status (1)

Country Link
JP (1) JP2758769B2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7638367B2 (en) 2006-02-17 2009-12-29 Fujitsu Microelectronics Limited Method of resin sealing electronic part
JP2010067852A (en) * 2008-09-11 2010-03-25 Sanyo Electric Co Ltd Method of manufacturing circuit device
JP2010067851A (en) * 2008-09-11 2010-03-25 Sanyo Electric Co Ltd Method of manufacturing circuit device
US7993092B2 (en) 2007-08-14 2011-08-09 Samsung Electronics Co., Ltd. Moving carrier for lead frame and method of moving lead frame using the moving carrier
JP2012004435A (en) * 2010-06-18 2012-01-05 On Semiconductor Trading Ltd Method for manufacturing circuit device and resin sealing device
JP2012146770A (en) * 2011-01-11 2012-08-02 Apic Yamada Corp Resin molding method and resin molding apparatus and supply handler
JP2013039693A (en) * 2011-08-12 2013-02-28 Apic Yamada Corp Resin supplying device, resin molding device, and resin supplying method
JP2013089668A (en) * 2011-10-14 2013-05-13 Apic Yamada Corp Resin sealing apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58138039A (en) * 1982-02-10 1983-08-16 Nec Home Electronics Ltd Manufacture of resin sealed type semiconductor device
JPH05102216A (en) * 1991-10-09 1993-04-23 Hitachi Ltd Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58138039A (en) * 1982-02-10 1983-08-16 Nec Home Electronics Ltd Manufacture of resin sealed type semiconductor device
JPH05102216A (en) * 1991-10-09 1993-04-23 Hitachi Ltd Semiconductor device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7638367B2 (en) 2006-02-17 2009-12-29 Fujitsu Microelectronics Limited Method of resin sealing electronic part
US7923303B2 (en) 2006-02-17 2011-04-12 Fujitsu Semiconductor Limited Method of resin sealing electronic part
US7993092B2 (en) 2007-08-14 2011-08-09 Samsung Electronics Co., Ltd. Moving carrier for lead frame and method of moving lead frame using the moving carrier
JP2010067852A (en) * 2008-09-11 2010-03-25 Sanyo Electric Co Ltd Method of manufacturing circuit device
JP2010067851A (en) * 2008-09-11 2010-03-25 Sanyo Electric Co Ltd Method of manufacturing circuit device
JP2012004435A (en) * 2010-06-18 2012-01-05 On Semiconductor Trading Ltd Method for manufacturing circuit device and resin sealing device
JP2012146770A (en) * 2011-01-11 2012-08-02 Apic Yamada Corp Resin molding method and resin molding apparatus and supply handler
JP2013039693A (en) * 2011-08-12 2013-02-28 Apic Yamada Corp Resin supplying device, resin molding device, and resin supplying method
JP2013089668A (en) * 2011-10-14 2013-05-13 Apic Yamada Corp Resin sealing apparatus

Also Published As

Publication number Publication date
JP2758769B2 (en) 1998-05-28

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A01 Written decision to grant a patent or to grant a registration (utility model)

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Effective date: 19980210