JPH05243301A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPH05243301A JPH05243301A JP4265092A JP4265092A JPH05243301A JP H05243301 A JPH05243301 A JP H05243301A JP 4265092 A JP4265092 A JP 4265092A JP 4265092 A JP4265092 A JP 4265092A JP H05243301 A JPH05243301 A JP H05243301A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- cavity
- supplied
- powder
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は半導体装置の製造方法に
関し、特にプラスチックパッケージの封止方法に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing method, and more particularly to a plastic package sealing method.
【0002】[0002]
【従来の技術】従来のプラスチックパッケージの封止方
法は、図4の断面図に示す様に、チップ(半導体素子)
6が搭載されたリードフレーム7を下金型のキャビティ
1上に載置し、上金型9を重ねて型締めし、この上下金
型で形成されるキャビティ内にセンタポット3で加熱加
圧された溶融樹脂をゲート2を経て注入することにより
封止を行っていた。2. Description of the Related Art A conventional plastic package encapsulation method is, as shown in a sectional view of FIG.
The lead frame 7 on which the 6 is mounted is placed on the cavity 1 of the lower mold, the upper mold 9 is overlaid and clamped, and the center pot 3 heats and pressurizes in the cavity formed by the upper and lower molds. The molten resin thus obtained is injected through the gate 2 for sealing.
【0003】[0003]
【発明が解決しようとする課題】従来の半導体装置製造
方法では、前述のように下型のキャビティ1にリードフ
レーム7を載置後型締めし樹脂を注入しているため、こ
のリードフレームによる影響さらにゲート2の注入角度
の影響等により、キャビティに流入する樹脂の充填状態
が均一でなく、特に下型のキャビティ1の底面部にボイ
ド16が発生するという問題点があった。In the conventional method for manufacturing a semiconductor device, as described above, the lead frame 7 is placed in the cavity 1 of the lower mold and then the mold is clamped to inject the resin. Further, due to the influence of the injection angle of the gate 2 and the like, the filling state of the resin flowing into the cavity is not uniform, and in particular, the void 16 is generated in the bottom surface of the lower mold cavity 1.
【0004】[0004]
【課題を解決するための手段】本発明は、図1(c)に
示すように、キャビティ1に粉末樹脂5を予め供給した
後溶融させ、リードフレーム7を載置して型締めし樹脂
を注入する。もしくは図2(a)に示すように、キャビ
ティ1に固形樹脂12を予め供給した後溶融させ、リー
ドフレーム7を載置して型締めし樹脂を注入するという
製造方法である。According to the present invention, as shown in FIG. 1 (c), a powder resin 5 is preliminarily supplied to a cavity 1 and then melted, and a lead frame 7 is placed on the mold to clamp the resin. inject. Alternatively, as shown in FIG. 2A, the solid resin 12 is previously supplied to the cavity 1 and then melted, the lead frame 7 is placed, the mold is clamped, and the resin is injected.
【0005】[0005]
【実施例】次に本発明について図面を参照して説明す
る。図1は本発明の第1の実施例を工程順に示す図で、
同図(a)〜(e)はそれぞれ断面図である。同図
(a)は本実施例で使用する下金型をセットした状態を
示し、この金型にはキャビティ1,ゲート2,センタポ
ット3を有する。同図(b)では、キャビティ1に樹脂
供給ノズル4からエポキシ樹脂の粉末樹脂5を供給する
状況を示している。同図(c)は、アイランド8上にチ
ップ6を搭載したリードフレーム7をキャビティ1上に
載置した状態を示している。この時に粉末樹脂5は加熱
された金型により溶融状態にある。同図(d)は上金型
9を重ねて型締めし、センタポット3に供給されたエポ
キシ樹脂からなるタブレット樹脂10に圧力を加えて溶
融させ注入する状態を示す。同図(e)は樹脂成形が完
了した状態を示す。The present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing a first embodiment of the present invention in the order of steps,
(A) to (e) of the same figure are sectional views. FIG. 3A shows a state where a lower mold used in this embodiment is set, and this mold has a cavity 1, a gate 2 and a center pot 3. FIG. 1B shows a state in which the epoxy resin powder resin 5 is supplied from the resin supply nozzle 4 to the cavity 1. FIG. 3C shows a state in which the lead frame 7 having the chip 6 mounted on the island 8 is mounted on the cavity 1. At this time, the powder resin 5 is in a molten state by the heated mold. FIG. 3D shows a state in which the upper mold 9 is overlapped and clamped, and the tablet resin 10 made of the epoxy resin supplied to the center pot 3 is pressed and melted to be injected. FIG. 6E shows a state where resin molding is completed.
【0006】次に図2は第2の実施例を工程順に示す。
同図(a),(b)はそれぞれ断面図である。まず、図
3の断面図に示すように、固形樹脂12を使用する。固
形樹脂12は、その密度が樹脂粗部分13,樹脂中間部
14および樹脂密部分15の三層で構成される。固形層
の形成は圧力を変えることにより容易に形成できる。ま
ず、同図(a)に示すように、キャビティ1に固形樹脂
12を供給し、リードフレーム7を載置し、センタポッ
ト3から樹脂を注入する。樹脂注入前に固形樹脂12は
溶融状態にある。三層構造にしたのは溶融を促進するた
めである。同図(b)は樹脂成形が完了した状態であ
る。Next, FIG. 2 shows a second embodiment in the order of steps.
FIGS. 3A and 3B are cross-sectional views, respectively. First, as shown in the sectional view of FIG. 3, the solid resin 12 is used. The solid resin 12 is composed of three layers having a density of a resin rough portion 13, a resin middle portion 14, and a resin dense portion 15. The solid layer can be easily formed by changing the pressure. First, as shown in FIG. 1A, the solid resin 12 is supplied to the cavity 1, the lead frame 7 is placed, and the resin is injected from the center pot 3. The solid resin 12 is in a molten state before the resin is injected. The three-layer structure is used to promote melting. FIG. 6B shows a state where resin molding is completed.
【0007】[0007]
【発明の効果】以上説明したように本発明は、キャビテ
ィ下部のボイドが発生しやすい個所に予め粉末樹脂もし
くは固形樹脂を供給して溶融させておき、その後通常の
樹脂を注入するのでボイドの発生を回避できるという効
果がある。As described above, according to the present invention, the powder resin or the solid resin is preliminarily supplied and melted at the lower portion of the cavity where the void is likely to be generated, and then the normal resin is injected, so that the void is generated. There is an effect that can be avoided.
【図1】本発明の第1実施例を工程順に示す図で、同図
(a)〜(e)はそれぞれ断面図である。FIG. 1 is a view showing a first embodiment of the present invention in the order of steps, and FIGS. 1 (a) to (e) are sectional views.
【図2】本発明の第2実施例を工程順に示す図で、同図
(a),(b)はそれぞれ断面図である。FIG. 2 is a view showing a second embodiment of the present invention in the order of steps, and FIGS. 2 (a) and 2 (b) are sectional views.
【図3】本発明の第2実施例に用いる固形樹脂の断面図
である。FIG. 3 is a sectional view of a solid resin used in the second embodiment of the present invention.
【図4】従来の製造方法を説明する断面図である。FIG. 4 is a cross-sectional view illustrating a conventional manufacturing method.
1 キャビティ 2 ゲート 3 センタポット 4 樹脂供給ノズル 5 粉末樹脂 6 チップ 7 リードフレーム 8 アイランド 9 上金型 10 タブレット樹脂 11 成形樹脂 12 固形樹脂 13 樹脂粗部分 14 樹脂中間部 15 樹脂密部分 16 ボイド 1 Cavity 2 Gate 3 Center Pot 4 Resin Supply Nozzle 5 Powder Resin 6 Chip 7 Lead Frame 8 Island 9 Upper Mold 10 Tablet Resin 11 Molding Resin 12 Solid Resin 13 Resin Rough Part 14 Resin Middle Part 15 Resin Dense Part 16 Void
Claims (1)
上下金型ではさんでキャビティに樹脂を注入する半導体
装置製造方法において、前記リードフレームの載置前に
キャビティ内に粉末樹脂もしくは固形樹脂を供給し、そ
の後キャビティ内に溶融樹脂を注入して樹脂成形を行う
ことを特徴とする半導体装置製造方法。1. A method for manufacturing a semiconductor device in which a lead frame having a semiconductor element mounted thereon is sandwiched between upper and lower molds to inject resin into a cavity, and powder resin or solid resin is supplied into the cavity before mounting the lead frame. Then, a method of manufacturing a semiconductor device, characterized by injecting molten resin into the cavity to perform resin molding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4042650A JP2758769B2 (en) | 1992-02-28 | 1992-02-28 | Semiconductor device manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4042650A JP2758769B2 (en) | 1992-02-28 | 1992-02-28 | Semiconductor device manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH05243301A true JPH05243301A (en) | 1993-09-21 |
JP2758769B2 JP2758769B2 (en) | 1998-05-28 |
Family
ID=12641890
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4042650A Expired - Lifetime JP2758769B2 (en) | 1992-02-28 | 1992-02-28 | Semiconductor device manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2758769B2 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7638367B2 (en) | 2006-02-17 | 2009-12-29 | Fujitsu Microelectronics Limited | Method of resin sealing electronic part |
JP2010067852A (en) * | 2008-09-11 | 2010-03-25 | Sanyo Electric Co Ltd | Method of manufacturing circuit device |
JP2010067851A (en) * | 2008-09-11 | 2010-03-25 | Sanyo Electric Co Ltd | Method of manufacturing circuit device |
US7993092B2 (en) | 2007-08-14 | 2011-08-09 | Samsung Electronics Co., Ltd. | Moving carrier for lead frame and method of moving lead frame using the moving carrier |
JP2012004435A (en) * | 2010-06-18 | 2012-01-05 | On Semiconductor Trading Ltd | Method for manufacturing circuit device and resin sealing device |
JP2012146770A (en) * | 2011-01-11 | 2012-08-02 | Apic Yamada Corp | Resin molding method and resin molding apparatus and supply handler |
JP2013039693A (en) * | 2011-08-12 | 2013-02-28 | Apic Yamada Corp | Resin supplying device, resin molding device, and resin supplying method |
JP2013089668A (en) * | 2011-10-14 | 2013-05-13 | Apic Yamada Corp | Resin sealing apparatus |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58138039A (en) * | 1982-02-10 | 1983-08-16 | Nec Home Electronics Ltd | Manufacture of resin sealed type semiconductor device |
JPH05102216A (en) * | 1991-10-09 | 1993-04-23 | Hitachi Ltd | Semiconductor device |
-
1992
- 1992-02-28 JP JP4042650A patent/JP2758769B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58138039A (en) * | 1982-02-10 | 1983-08-16 | Nec Home Electronics Ltd | Manufacture of resin sealed type semiconductor device |
JPH05102216A (en) * | 1991-10-09 | 1993-04-23 | Hitachi Ltd | Semiconductor device |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7638367B2 (en) | 2006-02-17 | 2009-12-29 | Fujitsu Microelectronics Limited | Method of resin sealing electronic part |
US7923303B2 (en) | 2006-02-17 | 2011-04-12 | Fujitsu Semiconductor Limited | Method of resin sealing electronic part |
US7993092B2 (en) | 2007-08-14 | 2011-08-09 | Samsung Electronics Co., Ltd. | Moving carrier for lead frame and method of moving lead frame using the moving carrier |
JP2010067852A (en) * | 2008-09-11 | 2010-03-25 | Sanyo Electric Co Ltd | Method of manufacturing circuit device |
JP2010067851A (en) * | 2008-09-11 | 2010-03-25 | Sanyo Electric Co Ltd | Method of manufacturing circuit device |
JP2012004435A (en) * | 2010-06-18 | 2012-01-05 | On Semiconductor Trading Ltd | Method for manufacturing circuit device and resin sealing device |
JP2012146770A (en) * | 2011-01-11 | 2012-08-02 | Apic Yamada Corp | Resin molding method and resin molding apparatus and supply handler |
JP2013039693A (en) * | 2011-08-12 | 2013-02-28 | Apic Yamada Corp | Resin supplying device, resin molding device, and resin supplying method |
JP2013089668A (en) * | 2011-10-14 | 2013-05-13 | Apic Yamada Corp | Resin sealing apparatus |
Also Published As
Publication number | Publication date |
---|---|
JP2758769B2 (en) | 1998-05-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19980210 |