JPH05241660A - Thermal deformation correcting method for electronic part loader - Google Patents
Thermal deformation correcting method for electronic part loaderInfo
- Publication number
- JPH05241660A JPH05241660A JP3088134A JP8813491A JPH05241660A JP H05241660 A JPH05241660 A JP H05241660A JP 3088134 A JP3088134 A JP 3088134A JP 8813491 A JP8813491 A JP 8813491A JP H05241660 A JPH05241660 A JP H05241660A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- adsorbing
- image
- calibration
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Control Of Position Or Direction (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はロボットの熱変形の補正
方法に係り、特に、電子部品装着機の装着ヘッドを搬送
するロボットの、構成部品の熱膨張に起因する変形の校
正方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of correcting thermal deformation of a robot, and more particularly to a method of calibrating deformation of a robot carrying a mounting head of an electronic component mounting machine due to thermal expansion of components.
【0002】[0002]
【従来の技術】従来、直交型または関節型等のロボット
の動作によって吸着装置を備えた装着ヘッドが移動して
電子部品をプリント基板上に装着する構造の電子部品装
着機では、以下のような手順によって電子部品を装着し
ていた。2. Description of the Related Art Conventionally, an electronic component mounting machine having a structure for mounting an electronic component on a printed circuit board by moving a mounting head equipped with a suction device by the operation of a robot such as an orthogonal type or an articulated type is as follows. Electronic parts were attached according to the procedure.
【0003】吸着装置が部品供給装置上から電子部品を
真空吸着し装着目標位置へ移動する経路の途中で、電子
部品装着機本体部に固定された電子部品認識用撮像装置
により電子部品を撮影して吸着装置に対する電子部品の
変位(第一の変位)を測定し、装着ヘッドを移動させた
後、装着ヘッドに搭載されたパターン用撮像装置により
プリント基板上に印刷された装着目標パターンを撮影し
てパターン用撮像装置に対する装着目標パターンの変位
(第二の変位)を測定し、制御装置が前記第二の変位か
ら装着目標パターンに対する吸着装置の変位(第三の変
位)を演算し、第一の変位及び第三の変位を基にして装
着時の装着ヘッド位置に補正を加える。An electronic component is imaged by an image pickup device for recognizing the electronic component fixed to the main body of the electronic component mounting machine in the middle of a path in which the suction device vacuum-sucks the electronic component from the component supply device and moves to the mounting target position. The displacement of the electronic component (first displacement) with respect to the suction device is measured, the mounting head is moved, and then the mounting target pattern printed on the printed circuit board is photographed by the pattern imaging device mounted on the mounting head. The displacement (second displacement) of the mounting target pattern with respect to the pattern imaging device, and the controller calculates the displacement (third displacement) of the suction device with respect to the mounting target pattern from the second displacement. Based on the displacement and the third displacement, the mounting head position at the time of mounting is corrected.
【0004】従来方法では、吸着装置により吸着された
電子部品を撮影する際に、電子部品認識用撮像装置によ
り吸着装置先端(即ちノズル)の画像を捉えることがで
きない。従って、ロボットの位置繰返し誤差の影響を直
接受ける吸着装置の正確な位置測定は不可能である。In the conventional method, when the electronic component sucked by the suction device is photographed, the image of the tip (that is, the nozzle) of the suction device cannot be captured by the image pickup device for recognizing the electronic component. Therefore, it is impossible to accurately measure the position of the suction device, which is directly affected by the position repeat error of the robot.
【0005】吸着装置先端がたとえ電子部品認識用画面
上の座標で原点位置から変位していたとしても、この変
位が恒常的二次元ベクトル量であれば、画面の原点位置
を校正することにより実質的不都合無しに装着動作が実
行できる。一般に従来方法では、予め自動運転に先立っ
て、検出時の所定位置において、部品を何も吸着してい
ない状態の吸着装置先端の画像を撮影し、先端の画像の
中心又は、吸着装置を自転させたときの先端の自転軸を
もって電子部品認識用撮像装置の出力画像の原点位置と
なしている。Even if the tip of the suction device is displaced from the origin position at the coordinates on the electronic component recognition screen, if the displacement is a constant two-dimensional vector amount, the origin position of the screen is calibrated to be substantially corrected. The mounting operation can be executed without any inconvenience. Generally, in the conventional method, prior to the automatic operation, an image of the tip of the suction device in the state where no component is sucked is photographed at a predetermined position at the time of detection, and the center of the image of the tip or the suction device is rotated. The axis of rotation of the tip at this time serves as the origin position of the output image of the electronic component recognition imaging device.
【0006】[0006]
【発明が解決しようとする課題】しかし、例えばロボッ
トの伝動・減速装置としてしばしば用いられているボー
ルねじが、駆動装置の発熱または摺動摩擦に起因して時
間とともに熱膨張し、比較的熱の伝わらない電子部品装
着機の他の構成部品に付設された座標系から見た、電子
部品撮像時の吸着装置位置が遷移してしまうような場合
には、電子部品認識用画像の原点となるべき位置も移動
してしまい、初期校正だけでは用をなさない。However, for example, a ball screw, which is often used as a transmission / deceleration device for a robot, thermally expands with time due to heat generation or sliding friction of a drive device, so that heat is relatively transferred. The position that should be the origin of the electronic component recognition image when the position of the suction device during electronic component imaging shifts, as seen from the coordinate system attached to other components of the electronic component mounting machine. Also moved, and the initial calibration alone is useless.
【0007】一旦、運転開始後の経過時間の関数として
画像の原点位置を校正しておき、以後の自動運転時に校
正された値を参照することも考えられるが、作業ごと、
即ち、プリント基板の種類ごとに運転条件は異なり、運
転に伴って発生する熱量も異なるのであまり実用的では
ない。It is possible to calibrate the origin position of the image once as a function of the elapsed time after the start of operation and refer to the calibrated value during the subsequent automatic operation.
That is, the operating conditions are different for each type of printed circuit board, and the amount of heat generated during the operation is also different, which is not very practical.
【0008】一方、一般に装置の環境温度の変化に応じ
た変形を補正する方法については、環境温度、即ち、室
温値を定期的に測定して帰還し校正位置を更新する方法
も可能であるが、電子部品装着機では主に摺動摩擦また
は駆動装置の発熱に起因するボールねじの線膨張の要因
が支配的となるので、環境温度の変化と線膨張との相関
は低く、環境温度を用いることはできない。なお、ボー
ルねじを用いない関節型ロボットでも伝動部の摺動摩擦
や駆動装置の発熱に起因して構成部品の変形が生じるの
で同様の問題が起こる。On the other hand, in general, as a method for correcting the deformation according to the change of the environmental temperature of the apparatus, a method of periodically measuring the environmental temperature, that is, the room temperature value and returning it to update the calibration position is also possible. In the electronic component mounting machine, the factor of linear expansion of the ball screw, which is mainly caused by sliding friction or heat generation of the driving device, is dominant, so the correlation between changes in environmental temperature and linear expansion is low, so use the environmental temperature. I can't. Even in an articulated robot that does not use a ball screw, the same problem occurs because the components are deformed due to the sliding friction of the transmission portion and the heat generation of the driving device.
【0009】応用機械工学,第28巻,4号,(198
7年),p98〜p103,「ボールねじの発熱と対応
策」にはボールねじの摩擦発熱量の抑制,冷却法等の対
策が述べられている。しかし、一旦、熱変形が発生した
場合には、適切な時期に適切な方法で校正をする方法が
最も確実な補正手段と考えられる。電子部品装着機で
は、電子部品撮像位置で電子部品用撮像装置を用いて視
覚的に校正するのが実用的かつ効率的である。Applied Mechanical Engineering, Volume 28, No. 4, (198
7 years), p98 to p103, "Ball screw heat generation and countermeasures", measures such as suppression of friction heat generation of the ball screw and cooling method are described. However, once thermal deformation has occurred, a method of performing calibration at an appropriate time with an appropriate method is considered to be the most reliable correction means. In an electronic component mounting machine, it is practical and efficient to visually calibrate using an electronic component imaging device at an electronic component imaging position.
【0010】また、ボールねじの線膨張の他に、環境温
度や、装着ヘッド等電子部品装着機の他の要素の影響
や、あるいは画像処理装置の電子回路に通電開始後の発
熱による電気的特性変化に起因する画面の原点ドリフト
にも一括して対応するためには校正の実施は不可欠であ
る。In addition to the linear expansion of the ball screw, the ambient temperature, the influence of other elements of the electronic component mounting machine such as the mounting head, or the electrical characteristics due to heat generation after the start of energization of the electronic circuit of the image processing apparatus. Calibration is indispensable to collectively deal with the origin drift of the screen due to changes.
【0011】本発明の目的は、ボールねじの熱膨張等に
起因する電子部品吸着位置認識誤差を補正して、プリン
ト基板上への電子部品の装着精度を長時間にわたって良
好に保つ方法を提供することにある。An object of the present invention is to provide a method of correcting an electronic component suction position recognition error caused by thermal expansion of a ball screw or the like to maintain good mounting accuracy of an electronic component on a printed circuit board for a long time. Especially.
【0012】[0012]
【課題を解決するための手段】前記目的を達成するため
に、本発明では電子部品装着機の制御装置に、部品認識
用撮像装置に対する吸着装置の位置を測定して位置偏差
を補正する位置校正手段を備え、自動運転動作開始時及
び動作中に予め設定されたタイミングで位置校正手段を
繰返し実行するものである。In order to achieve the above object, according to the present invention, a controller for an electronic component mounting machine is provided with a position calibration for measuring a position of a suction device with respect to a component recognition image pickup device and correcting a position deviation. The position calibration means is repeatedly executed at a preset timing at the start of the automatic operation and during the automatic operation.
【0013】[0013]
【作用】電子部品装着機が自動運転動作を開始する時及
び実行中に、位置校正手段に従いロボットが予め設定さ
れたタイミングで、本体部に固定された部品認識用撮像
装置の視野内に、何も吸着していない吸着装置、または
位置校正治具を装填した吸着装置を位置決めして、撮像
装置により吸着装置の停止位置を測定して、制御装置が
部品認識用視野内の原点位置データを更新する。更新さ
れた原点位置データにより装着位置を補正するものであ
る。When the electronic component mounting machine starts and executes the automatic operation operation, the robot recognizes what is in the visual field of the component recognition imaging device fixed to the main body at a preset timing according to the position calibration means. Position the suction device that is not sucked or the suction device that is loaded with the position calibration jig, measure the stop position of the suction device with the imaging device, and the controller updates the origin position data in the field of view for component recognition. To do. The mounting position is corrected based on the updated origin position data.
【0014】原点位置データの更新をするための予め設
定されたタイミングは、例えば、自動運転開始の直前
と、自動運転開始後一定周期で一定個数の電子部品の装
着を完了するまで一定周期で実行するものである。The preset timing for updating the origin position data is, for example, immediately before the start of the automatic operation and after the start of the automatic operation in a constant cycle until a fixed number of electronic components are completely mounted. To do.
【0015】[0015]
【実施例】以下に本発明の実施例を図面によって詳述す
る。Embodiments of the present invention will be described in detail below with reference to the drawings.
【0016】図2は本発明の各実施例を適用する電子部
品装着機の構成を示す斜視図である。図2を用いて電子
部品装着機の装着動作を説明する。XYロボット(二軸
直交型ロボット)1によって装着ヘッド2が水平面(X
Y平面)内を移動する。装着ヘッド2に設けられた吸着
装置12の先端部には交換可能な複数の吸着ノズル3の
内の一個が装填されている。装着ヘッド2を電子部品供
給装置4の上方に移動し、吸着装置12を降下させて電
子部品5を真空吸着する。ロボット1を移動させて、電
子部品装着機の本体に固定された撮像装置8の上方に吸
着装置12を位置決めして電子部品5の画像を撮影す
る。次に、装着ヘッド2に付設された撮像装置9がプリ
ント基板6の当初指令装着位置の上方に来るように、再
び、ロボット1を移動させて、装着目標パターン7の画
像を撮影し、画像処理装置14及び制御装置15が二枚
の画像のデータから位置補正量を演算し、補正された指
令装着位置の真上に吸着装置12が来るようにロボット
1を移動させる。吸着装置12を再び降下させて電子部
品5を装着目標パターン7の上に装着する。FIG. 2 is a perspective view showing the configuration of an electronic component mounting machine to which each embodiment of the present invention is applied. The mounting operation of the electronic component mounting machine will be described with reference to FIG. The mounting head 2 is moved by the XY robot (biaxial orthogonal robot) 1 to the horizontal plane (X
Move in the (Y plane). One of a plurality of replaceable suction nozzles 3 is loaded at the tip of the suction device 12 provided on the mounting head 2. The mounting head 2 is moved above the electronic component supply device 4, and the suction device 12 is lowered to vacuum-suck the electronic component 5. The robot 1 is moved to position the suction device 12 above the imaging device 8 fixed to the main body of the electronic component mounting machine, and an image of the electronic component 5 is captured. Next, the robot 1 is moved again so that the imaging device 9 attached to the mounting head 2 is located above the initial commanded mounting position on the printed circuit board 6, and an image of the mounting target pattern 7 is captured, and image processing is performed. The device 14 and the control device 15 calculate a position correction amount from the data of the two images, and move the robot 1 so that the suction device 12 is located right above the corrected command mounting position. The suction device 12 is lowered again to mount the electronic component 5 on the mounting target pattern 7.
【0017】図3はボールねじの熱変形によって画像の
原点位置が移動する様子を説明するものである。ボール
ねじ10を伝動・減速装置として用いた直交型ロボット
1では、運転開始後駆動装置11の発熱や摺動摩擦熱に
よりボールねじ10が次第に高温になり膨張する。ボー
ルねじ10の温度上昇と線膨張率に応じて、駆動装置1
1の一定回転角に対するロボット1の負荷移動距離が増
大する。FIG. 3 illustrates how the origin position of the image moves due to thermal deformation of the ball screw. In the orthogonal robot 1 that uses the ball screw 10 as a transmission / reduction device, the ball screw 10 gradually increases in temperature and expands after the start of operation due to heat generated by the drive device 11 and sliding friction heat. The drive device 1 is operated according to the temperature rise and the coefficient of linear expansion of the ball screw 10.
The load movement distance of the robot 1 for a constant rotation angle of 1 increases.
【0018】電子部品装着機では、吸着装置12の先端
部に装填された吸着ノズル3に吸着された電子部品5を
撮影する際とプリント基板6上に装着する際にXYロボ
ット1の位置精度が特に要求される。通常、装着位置で
は装着動作の度に、装着ヘッド2に付設された撮像装置
9でプリント基板6の画像を撮影して装着ヘッド2と装
着目標パターン7との間の(熱変形の影響を含めた)相
対位置を演算するので、熱変形の補正のためだけに繰返
し校正しておく必要は無い。しかし、電子部品撮影位置
では、電子部品装着機の本体に固定された撮像装置8の
座標系上で一定位置に繰返し位置決めされなければなら
ない。撮像装置8は熱変形の影響をほとんど受けず、装
着ヘッド2の停止位置は熱膨張により次第に移動してい
くので、吸着ノズル3の中心位置を適宜校正して原点位
置を更新する。In the electronic component mounting machine, the positional accuracy of the XY robot 1 is high when the electronic component 5 sucked by the suction nozzle 3 mounted on the tip of the suction device 12 is photographed and when it is mounted on the printed circuit board 6. Especially required. Normally, at the mounting position, an image of the printed circuit board 6 is taken by the image pickup device 9 attached to the mounting head 2 every time the mounting operation is performed, and the image between the mounting head 2 and the mounting target pattern 7 (including the influence of thermal deformation is included). Since the relative position is calculated, it is not necessary to calibrate repeatedly only for the correction of thermal deformation. However, at the electronic component photographing position, it must be repeatedly positioned at a fixed position on the coordinate system of the image pickup device 8 fixed to the main body of the electronic component mounting machine. Since the imaging device 8 is hardly affected by thermal deformation and the stop position of the mounting head 2 gradually moves due to thermal expansion, the center position of the suction nozzle 3 is appropriately calibrated to update the origin position.
【0019】図1に本発明の第一の実施例の運転スケジ
ュールを示す。図1において、横軸は時間を表してい
る。校正を行う時点を矢印で表す。自動運転開始後、一
定時間T0 が経過するまで一定周期T(<T0)ごとに
校正を実行する。例えば、T0=60分,T=15分と
して、時刻t=0,15,30,45,60分に合計5
回校正を実行する。FIG. 1 shows the operation schedule of the first embodiment of the present invention. In FIG. 1, the horizontal axis represents time. The arrow indicates the time of calibration. After the automatic operation is started, the calibration is executed every constant period T (<T 0 ) until the constant time T 0 elapses. For example, assuming that T 0 = 60 minutes and T = 15 minutes, a total of 5 at time t = 0, 15, 30, 45, 60 minutes.
Perform calibration once.
【0020】自動校正作業は以下の手順で行う。吸着装
置12には吸着ノズル3を装填し、吸着ノズル3には何
も吸着しない。あるいは他の方法として、吸着装置12
には吸着ノズル3に代えて一個の位置校正治具13を装
填する。位置校正治具13の底面は吸着ノズル3の先端
高さと同一の高さに置かれる。ロボット1を動作させて
吸着装置12を撮像装置8上方の視野内に位置決めす
る。円周を等分割する角度づつ吸着装置12を自転位置
決めさせて複数(円周分割数)回、例えば、90度づつ
四回、撮像装置8が吸着ノズル3(または位置校正治具
13)の画像を撮影して、各画像のシルエットの中心位
置座標を測定する。全測定値の平均値を算出してこれを
吸着ノズル3の回転中心位置座標とする。The automatic calibration work is performed in the following procedure. The adsorption device 12 is loaded with the adsorption nozzle 3, and nothing is adsorbed on the adsorption nozzle 3. Alternatively, as another method, the adsorption device 12
In place of the suction nozzle 3, one position calibration jig 13 is loaded. The bottom surface of the position calibration jig 13 is placed at the same height as the tip height of the suction nozzle 3. The robot 1 is operated to position the suction device 12 within the field of view above the imaging device 8. An image of the suction nozzle 3 (or the position calibration jig 13) is picked up by the imaging device 8 a plurality of times (circumferential division number) four times, for example, four times by rotating the suction device 12 by an angle that divides the circumference equally. Is photographed and the center position coordinates of the silhouette of each image are measured. The average value of all the measured values is calculated and used as the rotation center position coordinate of the suction nozzle 3.
【0021】本実施例によれば、ボールねじ10の熱変
形が過渡状態にあって校正の必要性が大きいと予想され
る期間だけ繰返し校正を実行し、ボールねじ10が定常
温度に達してその伸びが一定値に収束すると予想される
段階では校正により中断すること無く連続自動運転でき
るので、正確、かつ、効率的な校正が可能になるという
効果がある。また、画像処理装置14の電子回路に通電
開始後の発熱による電気的特性変化に起因する原点ドリ
フトが同時に発生する場合にも正確、かつ、効率的な校
正が可能になる。According to the present embodiment, the repetitive calibration is executed only during the period when the thermal deformation of the ball screw 10 is in the transient state and the necessity of the calibration is expected to be great, and the ball screw 10 reaches the steady temperature, At the stage where the elongation is expected to converge to a constant value, continuous automatic operation can be performed without interruption due to calibration, so that there is an effect that accurate and efficient calibration becomes possible. Further, even when origin drift due to a change in electrical characteristics due to heat generation after the start of energization simultaneously occurs in the electronic circuit of the image processing apparatus 14, accurate and efficient calibration becomes possible.
【0022】また、単一の位置校正治具を装填して校正
する方法によれば、各吸着ノズルの寸法誤差に影響され
ずにより再現性の高い高精度な校正が可能になる。Further, according to the method of loading with a single position calibration jig, calibration can be performed with high reproducibility and high accuracy without being affected by the dimensional error of each suction nozzle.
【0023】なお、自動運転開始後、一定時間T0 が経
過するまで一定周期Tごとに校正を実行する代わりに、
所定個数の電子部品の装着を完了するまで一定周期Tご
とに校正を実行する方法によってもほぼ同等の効果が得
られる。さらに、より実際的方法は、前回の校正時点か
ら時間Tが経過した後、次の基板への装着を開始する直
前に新たな校正を実行することも考えられる。It should be noted that, instead of executing calibration every fixed period T until a fixed time T 0 has elapsed after the start of automatic operation,
Almost the same effect can be obtained by a method in which calibration is executed at regular intervals T until the mounting of a predetermined number of electronic components is completed. Further, as a more practical method, it is conceivable that after the time T has passed from the time of the previous calibration, a new calibration is executed immediately before the mounting on the next substrate is started.
【0024】図4に本発明の第二の実施例の運転スケジ
ュールを示す。電子部品装着機が自動運転を開始する際
と、運転開始後一定枚数のプリント基板への装着を開始
するごと、または一定枚数のプリント基板への装着を終
了するごとに校正を実行する。自動運転動作の開始直前
と、N枚の各プリント基板への装着を終了後、次のN枚
の各プリント基板への装着を開始する直前に自動的に校
正作業を実行し、以後N枚のプリント基板装着ごとに校
正作業を繰り返す。FIG. 4 shows the operation schedule of the second embodiment of the present invention. The calibration is executed when the electronic component mounting machine starts the automatic operation, every time when the mounting on a fixed number of printed circuit boards is started after the operation is started, or when the mounting on the fixed number of printed circuit boards is completed. Immediately before the start of the automatic operation operation, and after the mounting on each of the N printed boards is completed, the calibration work is automatically performed immediately before the mounting on the next N printed boards is started. The calibration work is repeated every time the printed circuit board is mounted.
【0025】本実施例によれば、運転開始後のボールね
じの熱膨張に起因する変形に対応して正確な校正が可能
になり、ひいては電子部品の装着精度が向上する。According to this embodiment, it is possible to perform accurate calibration in response to the deformation of the ball screw due to the thermal expansion after the start of operation, and the mounting accuracy of electronic parts is improved.
【0026】なお、運転開始時の校正を一度実行してお
くことにより、以後も一定時間以上の休止期間を経た後
であれば運転開始時の温度条件が毎回ほぼ同一とみなせ
るので、この場合には自動運転開始ごとの校正は省略し
て自動運転途中のみ校正する方法も可能である。By executing the calibration at the start of operation once, the temperature conditions at the start of operation can be considered to be almost the same every time after the rest period of a certain time or more. It is also possible to omit the calibration every time the automatic operation starts and perform the calibration only during the automatic operation.
【0027】図5に本発明の第三の実施例の運転スケジ
ュールを示す。自動運転開始後一定個数の電子部品の装
着を完了するごとに、校正を実行する。本実施例によっ
ても第二の実施例とほぼ同様に正確な校正が可能になる
という効果がある。FIG. 5 shows the operation schedule of the third embodiment of the present invention. The calibration is executed every time the mounting of a certain number of electronic components is completed after the start of the automatic operation. The present embodiment also has the effect that accurate calibration can be performed almost as in the second embodiment.
【0028】また、対象プリント基板が大形で一枚のプ
リント基板への装着に要する時間が長い場合にもきめ細
かく位置の補正ができるという効果がある。Further, even when the target printed circuit board is large and the time required to mount it on one printed circuit board is long, the position can be finely corrected.
【0029】図6に本発明の第四の実施例の運転スケジ
ュールを示す。自動運転開始後、予め決められた一定時
間Tだけ経過するごとに、前記校正を実行する。本実施
例によっても第三の実施例とほぼ同様に正確な校正が可
能になる。FIG. 6 shows the operation schedule of the fourth embodiment of the present invention. After starting the automatic operation, the calibration is executed every time a predetermined constant time T elapses. According to this embodiment, accurate calibration can be performed almost as in the third embodiment.
【0030】[0030]
【発明の効果】本発明によれば、部品認識用視野内の原
点位置データを随時更新できるので、電子部品装着機の
構成部品の熱変形によって自動運転動作続行中に電子部
品認識時のロボットの停止位置が移動しても、電子部品
の吸着装置に対する相対位置を正しく測定できる。従っ
て、プリント基板上への電子部品の装着精度を起動直後
から長時間にわたって良好に保つことができる。According to the present invention, since the origin position data in the visual field for recognizing a component can be updated at any time, the robot of the robot at the time of recognizing the electronic component while continuing the automatic driving operation due to the thermal deformation of the components of the electronic component mounting machine can be updated. Even if the stop position moves, the relative position of the electronic component with respect to the suction device can be correctly measured. Therefore, the mounting accuracy of the electronic component on the printed circuit board can be kept good for a long time immediately after starting.
【図1】本発明の一実施例の運転スケジュールを示す説
明図。FIG. 1 is an explanatory diagram showing an operation schedule according to an embodiment of the present invention.
【図2】本発明の各実施例を適用する電子部品装着機の
構成を示す斜視図。FIG. 2 is a perspective view showing a configuration of an electronic component mounting machine to which each embodiment of the present invention is applied.
【図3】熱変形により画像原点位置の移動する様子を示
す説明図。FIG. 3 is an explanatory diagram showing a state in which an image origin position moves due to thermal deformation.
【図4】本発明の第二の実施例の運転スケジュール図。FIG. 4 is an operation schedule diagram of the second embodiment of the present invention.
【図5】本発明の第三の実施例の運転スケジュール図。FIG. 5 is an operation schedule diagram of the third embodiment of the present invention.
【図6】本発明の第四の実施例の運転スケジュールを示
す図。FIG. 6 is a diagram showing an operation schedule according to a fourth embodiment of the present invention.
1…XYロボット、2…装着ヘッド、3…吸着ノズル、
4…電子部品供給装置、5…電子部品、6…プリント基
板、7…装着目標パターン、8…撮像装置、9…撮像装
置、10…ボールねじ、11…駆動装置、12…吸着装
置、13…位置校正治具、14…画像処理装置、15…
制御装置。1 ... XY robot, 2 ... mounting head, 3 ... suction nozzle,
4 ... Electronic component supply device, 5 ... Electronic component, 6 ... Printed circuit board, 7 ... Mounting target pattern, 8 ... Imaging device, 9 ... Imaging device, 10 ... Ball screw, 11 ... Driving device, 12 ... Adsorption device, 13 ... Position calibration jig, 14 ... Image processing device, 15 ...
Control device.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 安食 直二 東京都千代田区神田駿河台四丁目6番地 株式会社日立製作所内 (72)発明者 酒井 昭彦 茨城県土浦市神立町502番地 株式会社日 立製作所機械研究所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor, Naoji Aji, 4-6 Kanda Surugadai, Chiyoda-ku, Tokyo, Hitachi, Ltd. Inside the mechanical laboratory
Claims (1)
装着ヘッドが移動して電子部品をプリント基板上に装着
する構造の電子部品装着機において、自動運転中の所定
の時点で前記ロボットが、本体部に固定された部品認識
用の撮像装置の視野内に、吸着装置を位置決めして、前
記撮像装置により前記吸着装置の停止位置を測定して、
測定結果に基づいて制御装置が部品認識用視野内の原点
位置データを更新することを特徴とする電子部品装着機
の熱変形の補正方法。1. An electronic component mounting machine having a structure in which a mounting head equipped with a suction device is moved by a robot operation to mount an electronic component on a printed circuit board, wherein the robot has a main body at a predetermined point during automatic operation. In the field of view of the imaging device for component recognition fixed to the part, the suction device is positioned, and the stop position of the suction device is measured by the imaging device,
A method for correcting thermal deformation of an electronic component mounting machine, characterized in that the control device updates the origin position data in the component recognition visual field based on the measurement result.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3088134A JPH05241660A (en) | 1991-04-19 | 1991-04-19 | Thermal deformation correcting method for electronic part loader |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3088134A JPH05241660A (en) | 1991-04-19 | 1991-04-19 | Thermal deformation correcting method for electronic part loader |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05241660A true JPH05241660A (en) | 1993-09-21 |
Family
ID=13934460
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3088134A Pending JPH05241660A (en) | 1991-04-19 | 1991-04-19 | Thermal deformation correcting method for electronic part loader |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05241660A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6807726B2 (en) | 2001-01-16 | 2004-10-26 | Fuji Machine Mfg. Co., Ltd. | Electric-component mounting system |
JP2010188423A (en) * | 2008-07-04 | 2010-09-02 | Smk:Kk | Method for controlling welding of workpiece on basis of zero point setting |
JPWO2016103413A1 (en) * | 2014-12-25 | 2017-09-28 | 富士機械製造株式会社 | Component mounter |
EP3410833A4 (en) * | 2016-01-25 | 2019-01-23 | Fuji Corporation | Component mounting apparatus |
EP3726950A4 (en) * | 2017-12-15 | 2020-11-25 | Fuji Corporation | Component mounting machine |
-
1991
- 1991-04-19 JP JP3088134A patent/JPH05241660A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6807726B2 (en) | 2001-01-16 | 2004-10-26 | Fuji Machine Mfg. Co., Ltd. | Electric-component mounting system |
JP2010188423A (en) * | 2008-07-04 | 2010-09-02 | Smk:Kk | Method for controlling welding of workpiece on basis of zero point setting |
JP4688183B2 (en) * | 2008-07-04 | 2011-05-25 | 株式会社エスエムケイ | Work welding management method based on zero point setting |
JPWO2016103413A1 (en) * | 2014-12-25 | 2017-09-28 | 富士機械製造株式会社 | Component mounter |
EP3410833A4 (en) * | 2016-01-25 | 2019-01-23 | Fuji Corporation | Component mounting apparatus |
EP3726950A4 (en) * | 2017-12-15 | 2020-11-25 | Fuji Corporation | Component mounting machine |
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