JPH05235575A - Electronic board cooling system - Google Patents
Electronic board cooling systemInfo
- Publication number
- JPH05235575A JPH05235575A JP3898892A JP3898892A JPH05235575A JP H05235575 A JPH05235575 A JP H05235575A JP 3898892 A JP3898892 A JP 3898892A JP 3898892 A JP3898892 A JP 3898892A JP H05235575 A JPH05235575 A JP H05235575A
- Authority
- JP
- Japan
- Prior art keywords
- electronic board
- cooling
- electronic
- cooling fan
- slots
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子基板冷却方式に関
し、特にスロットに挿入された電子基板の冷却に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic substrate cooling system, and more particularly to cooling an electronic substrate inserted in a slot.
【０００２】[0002]
【従来の技術】従来、この種の電子基板の冷却方式は、
電子基板のスロット挿入状態に関係なく全ての冷却ファ
ンを動作させている。2. Description of the Related Art Conventionally, this type of electronic board cooling system is
All cooling fans are operated regardless of the slot insertion state of the electronic board.
【０００３】[0003]
【発明が解決しようとする課題】上述した従来の電子基
板の冷却方式は、電子基板のスロット挿入状態に関係な
く全ての冷却ファンを動作させているため、電子基板の
挿入されていない冷却不要のスロットまで冷却し、無駄
な電力を消費し、冷却ファンの動作騒音も大きいという
欠点がある。In the above-described conventional electronic board cooling method, all the cooling fans are operated regardless of the slot insertion state of the electronic board. It has the drawbacks that it cools down to the slots, consumes unnecessary power, and causes a large operating noise of the cooling fan.
【０００４】本発明の目的は、電子基板を挿入したスロ
ットに対応する冷却ファンだけを自動的に動作させるこ
とにより、上記の欠点を解消し、無駄な電力消費を抑
え、冷却ファンの動作騒音を低く抑えることが出来る電
子基板冷却方式を提供することにある。An object of the present invention is to automatically operate only the cooling fan corresponding to the slot in which the electronic board is inserted, thereby eliminating the above-mentioned drawbacks, suppressing unnecessary power consumption, and reducing the operating noise of the cooling fan. An object is to provide an electronic substrate cooling method that can be kept low.
【０００５】[0005]
【課題を解決するための手段】本発明の電子基板冷却方
式は、複数の電子基板を挿入する複数のスロットと、複
数の電子基板を強制空冷する複数の冷却ファンとを有す
る電子機器システムの電子基板冷却方式において、複数
のスロットを複数のグループに分けその各グループに対
応して設置した複数の冷却ファンと、電子基板が挿入さ
れたスロットのグループに対応した冷却ファンだけを動
作させる手段とを有している。An electronic board cooling system of the present invention is an electronic equipment system having a plurality of slots for inserting a plurality of electronic boards and a plurality of cooling fans for forcibly cooling the plurality of electronic boards. In the board cooling method, a plurality of slots are divided into a plurality of groups and installed corresponding to each group, and a means for operating only the cooling fan corresponding to the group of slots into which the electronic board is inserted. Have
【０００６】[0006]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。Embodiments of the present invention will now be described with reference to the drawings.
【０００７】図１は本発明の一実施例の電子基板冷却方
式を説明するための電子機器の構成を示す斜視図であ
る。FIG. 1 is a perspective view showing the configuration of an electronic device for explaining an electronic substrate cooling system according to an embodiment of the present invention.
【０００８】図１において、ケージ１７は、スロット
４，５，６，７，８，９を持ち、各スロットには電子基
板１６が収納される。スロット４，５，６，７，８，９
には、それぞれスイッチ１０，１１，１２，１３，１
４，１５があり、各スロットに電子基板１６が挿入され
た場合、電子基板１６により個々のスイッチが押される
ことにより、スイッチ回路が閉じるようになっている。In FIG. 1, a cage 17 has slots 4, 5, 6, 7, 8, 9 and an electronic board 16 is housed in each slot. Slots 4, 5, 6, 7, 8, 9
Switches 10, 11, 12, 13, 1 respectively.
4 and 15, and when the electronic board 16 is inserted into each slot, each switch is pushed by the electronic board 16 to close the switch circuit.
【０００９】冷却ファン１は、スロット４，５に挿入さ
れた電子基板を冷却し、冷却ファン２はスロット６，７
に挿入された電子基板を冷却し、冷却ファン３はスロッ
ト８，９に挿入された電子基板を冷却する。また、冷却
ファン１はスイッチ１０，１１のどちらかが閉じた場合
に動作し、冷却ファン２はスイッチ１２，１３のどちら
かが閉じた場合に動作し、冷却ファン３はスイッチ１
４，１５のどちらかが閉じた場合に動作する。例えば、
電子基板１６をスロット４に挿入した場合、スイッチ１
０が押され回路が閉じて冷却ファン１が動作し、電子基
板１６が冷却される。冷却ファン２は、スロット６，７
に電子基板が挿入されていないため、スイッチ１２，１
３が開いており、動作しない。冷却ファン３は、スロッ
ト８，９に電子基板が挿入されていないため、スイッチ
１４，１５が開いており、動作しない。The cooling fan 1 cools the electronic boards inserted in the slots 4 and 5, and the cooling fan 2 cools the slots 6 and 7.
The cooling fan 3 cools the electronic board inserted into the slot 8 and the cooling board 3 cools the electronic board inserted into the slots 8 and 9. Further, the cooling fan 1 operates when either of the switches 10 and 11 is closed, the cooling fan 2 operates when either of the switches 12 and 13 is closed, and the cooling fan 3 is connected to the switch 1.
It operates when either 4 or 15 is closed. For example,
When the electronic board 16 is inserted into the slot 4, the switch 1
When 0 is pushed, the circuit is closed, the cooling fan 1 operates, and the electronic board 16 is cooled. The cooling fan 2 has slots 6 and 7.
Since the electronic board is not inserted in the switch 12,
3 is open and does not work. Since the electronic boards are not inserted into the slots 8 and 9, the cooling fan 3 does not operate because the switches 14 and 15 are open.
【００１０】このようにして電子基板が挿入されるスロ
ットに対応する冷却ファンを自動的に動作させる。In this way, the cooling fan corresponding to the slot into which the electronic board is inserted is automatically operated.
【００１１】図２は図１の電子機器の回路接続図であ
る。FIG. 2 is a circuit connection diagram of the electronic device of FIG.
【００１２】図２において、スイッチ１０，１１は、電
源と冷却ファン１の間に接続されており、スイッチ１０
またはスイッチ１１が閉じた場合に電流が冷却ファン１
に供給されて冷却ファン１が動作し、また、スイッチ１
２、１３は、電源と冷却ファン２の間に接続されてお
り、スイッチ１２またはスイッチ１３が閉じた場合に電
流が冷却ファン２に供給されて冷却ファン２が動作し、
スイッチ１４、１５は、電源と冷却ファン３の間に接続
されており、スイッチ１４またはスイッチ１５が閉じた
場合に電流が冷却ファン３に供給されて冷却ファン３が
動作する。そして、冷却ファン１，２，３は、すべて同
一のグランドに接続される。In FIG. 2, the switches 10 and 11 are connected between the power source and the cooling fan 1, and
Or when the switch 11 is closed, the electric current is the cooling fan 1
Is supplied to the cooling fan 1 to operate, and the switch 1
2 and 13 are connected between the power supply and the cooling fan 2, and when the switch 12 or the switch 13 is closed, current is supplied to the cooling fan 2 to operate the cooling fan 2.
The switches 14 and 15 are connected between the power supply and the cooling fan 3, and when the switch 14 or the switch 15 is closed, current is supplied to the cooling fan 3 to operate the cooling fan 3. The cooling fans 1, 2, 3 are all connected to the same ground.
【００１３】[0013]
【発明の効果】以上説明したように、本発明の電子基板
冷却方式は、電子基板を挿入したスロットに対応する冷
却ファンだけを自動的に動作させることにより、無駄な
電力消費を抑え、冷却ファンの動作騒音を低く抑えるこ
とが出来るという効果がある。As described above, according to the electronic board cooling system of the present invention, by automatically operating only the cooling fan corresponding to the slot in which the electronic board is inserted, wasteful power consumption is suppressed and the cooling fan is cooled. There is an effect that the operation noise of can be suppressed to a low level.
【図１】本発明の一実施例の電子基板冷却方式を説明す
るための電子機器の構成を示す斜視図である。FIG. 1 is a perspective view showing a configuration of an electronic device for explaining an electronic substrate cooling system according to an embodiment of the present invention.
【図２】図１の電子機器の回路接続図である。FIG. 2 is a circuit connection diagram of the electronic device of FIG.
１〜３ 冷却ファン ４〜９ スロット １０〜１５ スイッチ １６ 電子基板 １７ ケージ 1-3 Cooling fan 4-9 Slot 10-15 Switch 16 Electronic board 17 Cage
Claims (1)
トと、前記複数の電子基板を強制空冷する複数の冷却フ
ァンとを有する電子機器システムの電子基板冷却方式に
おいて、前記複数のスロットを複数のグループに分けそ
の各グループに対応して設置した複数の冷却ファンと、
前記電子基板が挿入されたスロットのグループに対応し
た冷却ファンだけを動作させる手段とを有することを特
徴とする電子基板冷却方式。1. An electronic board cooling system for an electronic device system, comprising: a plurality of slots for inserting a plurality of electronic boards; and a plurality of cooling fans for forcedly cooling the plurality of electronic boards. A plurality of cooling fans installed corresponding to each group divided into groups,
And a means for operating only a cooling fan corresponding to a group of slots into which the electronic board is inserted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3898892A JPH05235575A (en) | 1992-02-26 | 1992-02-26 | Electronic board cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3898892A JPH05235575A (en) | 1992-02-26 | 1992-02-26 | Electronic board cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05235575A true JPH05235575A (en) | 1993-09-10 |
Family
ID=12540526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3898892A Withdrawn JPH05235575A (en) | 1992-02-26 | 1992-02-26 | Electronic board cooling system |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05235575A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7563305B2 (en) | 2006-06-23 | 2009-07-21 | Angstrom Power Incorporated | Fluid enclosure and methods related thereto |
| US8372561B2 (en) | 2007-03-21 | 2013-02-12 | Societe Bic | Composite fluid storage unit with internal fluid distribution feature |
| US8372184B2 (en) | 2005-04-22 | 2013-02-12 | Societe Bic | Composite hydrogen storage material and methods related thereto |
| WO2016029430A1 (en) * | 2014-08-29 | 2016-03-03 | 华为技术有限公司 | Electronic product |
-
1992
- 1992-02-26 JP JP3898892A patent/JPH05235575A/en not_active Withdrawn
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8372184B2 (en) | 2005-04-22 | 2013-02-12 | Societe Bic | Composite hydrogen storage material and methods related thereto |
| US8734576B2 (en) | 2005-04-22 | 2014-05-27 | Societe Bic | Composite hydrogen storage material and methods related thereto |
| US7563305B2 (en) | 2006-06-23 | 2009-07-21 | Angstrom Power Incorporated | Fluid enclosure and methods related thereto |
| US8132667B2 (en) | 2006-06-23 | 2012-03-13 | SOCIéTé BIC | Fluid enclosure and methods related thereto |
| US8651269B2 (en) | 2006-06-23 | 2014-02-18 | Societe Bic | Fluid enclosure and methods related thereto |
| US8372561B2 (en) | 2007-03-21 | 2013-02-12 | Societe Bic | Composite fluid storage unit with internal fluid distribution feature |
| WO2016029430A1 (en) * | 2014-08-29 | 2016-03-03 | 华为技术有限公司 | Electronic product |
| CN105766072A (en) * | 2014-08-29 | 2016-07-13 | 华为技术有限公司 | Electronic product |
| CN105766072B (en) * | 2014-08-29 | 2017-11-24 | 华为技术有限公司 | A kind of electronic product |
| US10130005B2 (en) | 2014-08-29 | 2018-11-13 | Huawei Technologies Co., Ltd. | Electronic product |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990518 |