JPH05222566A - Production of starting sheet for electrolysis of copper - Google Patents
Production of starting sheet for electrolysis of copperInfo
- Publication number
- JPH05222566A JPH05222566A JP4057532A JP5753292A JPH05222566A JP H05222566 A JPH05222566 A JP H05222566A JP 4057532 A JP4057532 A JP 4057532A JP 5753292 A JP5753292 A JP 5753292A JP H05222566 A JPH05222566 A JP H05222566A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- plate
- mother
- electrolysis
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Manufacture And Refinement Of Metals (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、銅の電解精製におい
て、陰極板として用いられる銅種板の製造方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a copper seed plate used as a cathode plate in electrolytic refining of copper.
【０００２】[0002]
【従来の技術】銅の電解精製用の陰極板として用いられ
る銅の種板を製造する母板として、銅、チタン、ステン
レス等の材質のものが知られている。銅母板では、母板
と種板とが同材質となるため、重油、軽油、ワニス、石
鹸液等の剥離剤を塗布して使用されるが、二週間程度の
使用で種板が銅母板から剥離しにくくなるという問題が
ある。チタン母板は硬く傷がつきにくく、剥離剤は不要
であるが、高価であるという難点があり、ステンレス母
板は、チタン板より安価であるが、母板に電着させた種
板の剥離を行うと、母板表面に孔食により白色の変色が
発生し、変色の発生した母板を使用して種板を製造する
と、種板の電着不良を生じたり、剥離が困難となる問題
があった。2. Description of the Related Art As a mother plate for producing a copper seed plate used as a cathode plate for electrolytic refining of copper, materials such as copper, titanium and stainless are known. For copper mother board, the mother board and the seed board are made of the same material, so they are used after applying a release agent such as heavy oil, light oil, varnish, soap solution, etc. There is a problem that it becomes difficult to peel from the plate. Titanium mother plate is hard and scratch-resistant, and no peeling agent is required, but it has the drawback of being expensive.Stainless steel mother plate is cheaper than titanium plate, but peeling of seed plate electrodeposited on mother plate When performing, the white discoloration occurs due to pitting corrosion on the surface of the mother plate, and when a seed plate is manufactured using the mother plate with discoloration, the electrodeposition of the seed plate may occur or peeling may be difficult. was there.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、ステンレス
母板を用いて銅電解精製用の種板を製造するに当たり、
かかる問題を解決し、ステンレス母板からの種板の剥離
が容易で、良好な状態の種板が得られ、母板をそのまま
長期間使用できる銅電解用種板の製造方法を提供するこ
とを課題とする。DISCLOSURE OF THE INVENTION The present invention, in producing a seed plate for copper electrolytic refining using a stainless mother plate,
It is an object of the invention to provide a method for producing a seed plate for copper electrolysis, which solves such a problem, allows easy removal of the seed plate from the stainless steel base plate, obtains a seed plate in a good state, and can use the base plate as it is for a long period of time. It is an issue.
【０００４】[0004]
【課題を解決するための手段】本発明は、銅電解精製に
おける種板製造用ステンレス母板に、リン酸エステルナ
トリウム塩とノニオン系界面活性剤とを溶解した水溶液
を塗布して乾燥し銅種板を電着させる電解に供すること
にある。According to the present invention, a copper mother plate for producing a seed plate in electrolytic copper refining is coated with an aqueous solution of sodium phosphate ester and a nonionic surfactant and dried to form a copper seed plate. The purpose is to subject the plate to electrolysis.
【０００５】[0005]
【作用】本発明は、ステンレス母板を用いて銅種板を電
着させる際に生ずる上記の問題を解決するため、種々の
界面活性剤をステンレス母板に塗布して試験した結果、
リン酸エステルナトリウム塩とノニオン系界面活性剤と
を溶解した水溶液を塗布して乾燥し電解に供すると、ス
テンレス母板からの種板の剥離が容易で、良好な状態の
種板が得られ、母板をそのまま長期間使用できることを
見いだしたことにある。The present invention, in order to solve the above problems that occur when electrodepositing a copper seed plate using a stainless mother plate, various surfactants were applied to the stainless mother plate and tested.
When an aqueous solution in which a sodium phosphate ester and a nonionic surfactant are dissolved is applied and dried and subjected to electrolysis, the seed plate is easily peeled from the stainless steel mother plate, and a seed plate in a good state is obtained, It has been found that the mother board can be used as it is for a long time.
【０００６】その理由は明らかではないが、界面活性剤
としてのリン酸エステルナトリウム塩の有機陰イオンが
ステンレスへの銅の電着性を助け若干の防食効果を生
じ、ノニオン系界面活性剤は水中で電離せず無機塩の影
響を受けにくいため電解液中の硫酸によるステンレスの
腐食を防止するためではないかと考えられる。界面活性
剤としてのリン酸エステルナトリウム塩及びＨＬＢ１５
〜１８程度のノニオン系界面活性剤は一般に周知の市販
品を使用し、両者を容量で１：１を標準とする割合で使
用し、６０℃で１２時間放置後の水分率６５重量％程度
のものを用いた場合、容量で１％程度の水溶液で十分効
果がえられる。Although the reason for this is not clear, the organic anion of the sodium salt of phosphoric acid ester as a surfactant assists the electrodeposition of copper on stainless steel to produce a slight anticorrosion effect, and the nonionic surfactant is used in water. It is thought that this is to prevent corrosion of stainless steel by sulfuric acid in the electrolytic solution because it is not ionized and is not easily affected by inorganic salts. Phosphoric acid ester sodium salt and HLB15 as surfactant
About 18 to 18 nonionic surfactants are generally known commercially available products, both are used in a ratio of 1: 1 by volume as standard, and the moisture content after leaving at 60 ° C. for 12 hours is about 65% by weight. In the case of using one, an aqueous solution having a volume of about 1% is sufficiently effective.
【０００７】[0007]
実施例１ ステンレス母板として、厚さ３ｍｍ、縦１４０ｍｍ、横
１３０ｍｍのステンレス３１６Ｌの熱間圧延板を使用
し、＃３２０のサンドペーパーで湿式研磨した後、１容
量％の界面活性剤を溶解した水溶液をはけで塗布し、１
時間自然乾燥させた。このステンレス板１枚を陰極と
し、その両側に精製炉で得た厚さ３０ｍｍ、縦１５０ｍ
ｍ、横１６０ｍｍの粗銅板を陽極とし、電解槽内側寸
法、縦横各２５０ｍｍ、深さ３００ｍｍの試験槽内に配
置し、下記の電解条件で電解し、ステンレス母板に種板
を電着させた。その結果を表１に示す。Example 1 As a stainless steel base plate, a hot-rolled plate of stainless steel 316L having a thickness of 3 mm, a length of 140 mm, and a width of 130 mm was used. After wet-polishing with # 320 sandpaper, 1% by volume of a surfactant was dissolved. Apply the solution with a brush and apply 1
Allow to air dry for hours. One of these stainless steel plates was used as a cathode, and both sides had a thickness of 30 mm and a length of 150 m obtained in a refining furnace.
A crude copper plate having a size of m and a width of 160 mm was used as an anode, and was placed in a test tank having inner dimensions of 250 mm in length and width, 300 mm in depth, electrolysis was performed under the following electrolysis conditions, and a seed plate was electrodeposited on a stainless steel base plate. .. The results are shown in Table 1.
【０００８】 電解液 銅 ４６ｇ／ｌ 遊離硫酸 １９０ｇ／ｌ にかわ ８０ｇ／ｔｏｎ（電解銅量当たり） チオ尿素 ６０ｇ／ｔｏｎ（電解銅量当たり） 塩酸 ３０ｇ／ｌ 極間距離 １０５ｍｍ（陽極中心から陽極中心間） 電流密度 ２２０Ａ／ｍ2 液温 ６０℃ 電流効率 ９２％ 電解時間 ２２時間Electrolyte 46 g / l Free sulfuric acid 190 g / l glue 80 g / ton (per amount of electrolytic copper) Thiourea 60 g / ton (per amount of electrolytic copper) Hydrochloric acid 30 g / l Distance between electrodes 105 mm (between center of anode and center of anode) ) Current density 220A / m 2 Liquid temperature 60 ° C Current efficiency 92% Electrolysis time 22 hours
【０００９】 使用界面活性剤 ａ リン酸エステルナトリウム塩 とノニオン系界面活性剤１：１ 商品名コロミンＷ 花王株式会社製 （水分率６５.３重量％） ｂ アルキルリン酸カリウム 〃 エレクトロストリッハ゜ー 〃 （水分率２３.６重量％） ｃ 天然油脂系界面活性剤 〃 針状石鹸Ｎ 共栄油脂株式会社製 （水分率 ４.９重量％） ｄ スルホン酸アニオン界面活性剤 〃 エレカットC-008 竹本油脂株式会社製 （水分率７７.８重量％） ｅ アルキルベンゼンスルホン酸 ナトリウム 〃 エレカットS-412 竹本油脂株式会社製 （水分率 １.９重量％）Surfactant used a Phosphoric acid ester sodium salt and nonionic surfactant 1: 1 Trade name Coromin W Kao Corporation (water content 65.3% by weight) b Potassium alkyl phosphate 〃 Electrostriper 〃 (water 23.6% by weight) c Natural oil / fat surfactant 〃 Needle-shaped soap N Kyoei Oil & Fat Co., Ltd. (water content 4.9% by weight) d Sulfonic acid anion surfactant 〃 Elecat C-008 Takemoto Yushi Co., Ltd. (Moisture content 77.8% by weight) e Sodium alkylbenzene sulfonate 〃 Elecut S-412 Takemoto Yushi Co., Ltd. (Moisture content 1.9% by weight)
【００１０】[0010]
【表１】 使用界面活性剤 母板変色発生の有無 産出種板の外観 剥離力（ｋｇｆ） ａ 無 異常なし ０.９４ ｂ 有 電着不良 ０.３６ ｃ 有 異常なし ０.３７ ｄ 有 異常なし ０.４０ ｅ 有 異常なし ０.４８ 塗布せず 有 凹凸発生 ０.３６[Table 1] Surfactant used Presence or absence of discoloration of mother board Appearance of production seed board Peeling force (kgf) a No Abnormality 0.94 b Yes Electrodeposition failure 0.36 c Yes Abnormality 0.37 d Yes Abnormality 0.40 e Yes No abnormality 0.48 Not applied Yes Occurrence of unevenness 0.36
【００１１】剥離力は母板から種板を約１ｃｍ剥離して
おき、この剥離した部分にバネ秤を装着して垂直方向に
引っ張り、種板が母板から剥離する最大荷重を種板の剥
離力とした。リン酸エステルナトリウム塩とノニオン系
界面活性剤とを溶解した水溶液を塗布する本発明方法以
外では、すべての母板に白色の変色が観察された。本発
明方法では剥離力も０.９４ｋｇｆと高く電解中に種板
が母板より剥離するような不具合もなく、種板外観も異
常なく、良好であった。The peeling force is such that the seed plate is peeled off from the mother plate by about 1 cm, a spring scale is attached to this peeled portion and pulled in the vertical direction, and the maximum load at which the seed plate peels from the mother plate is peeled off. It was power. A white discoloration was observed on all the mother plates except for the method of the present invention in which an aqueous solution in which a sodium phosphate salt and a nonionic surfactant were dissolved was applied. In the method of the present invention, the peeling force was as high as 0.94 kgf, and there was no problem that the seed plate was peeled off from the mother plate during electrolysis, and the appearance of the seed plate was not abnormal and was good.
【００１２】実施例２ 電解槽として内側寸法、縦１４１０ｍｍ、横１３４５ｍ
ｍ、深さ２０２０ｍｍのものを、またステンレス母板と
して、厚さ３ｍｍ、縦１０７０ｍｍ、横１０５０ｍｍの
ものを、又アノード粗銅板として、厚さ３５ｍｍ、縦１
０５０ｍｍ、横１０３４ｍｍのものを用いた以外は実施
例１と同じ条件で、電解毎にリン酸エステルナトリウム
塩とノニオン系界面活性剤とを溶解した水溶液を塗布し
種板の製造を繰り返した。これをリン酸エステルナトリ
ウム塩とノニオン系界面活性剤とを溶解した水溶液を塗
布しない場合と比較してその結果を表２に示す。Example 2 As an electrolytic cell, inner dimensions, length 1410 mm, width 1345 m
m, depth 2020 mm, stainless steel base plate with thickness 3 mm, length 1070 mm, width 1050 mm, and anode crude copper plate with thickness 35 mm, length 1
The production of the seed plate was repeated under the same conditions as in Example 1 except that a 050 mm-width and a 1034 mm-width was used and an aqueous solution in which a sodium phosphate ester salt and a nonionic surfactant were dissolved was applied for each electrolysis. This is compared with the case where the aqueous solution in which the sodium phosphate ester salt and the nonionic surfactant are dissolved is not applied, and the results are shown in Table 2.
【００１３】[0013]
【表２】 通電回数 １０ ２０ ３０ ４０ ５０ ６０ ──────────────────────────────── 未 剥離力（kgf） ３.２ ４.４ ７.０ ４.５ ６.３ 剥離不可 塗 母板外観 異常 異常 異常 異常 白い変色 母板に銅 布 なし なし なし なし が発生 が固着 ────────────────────────────────── 剥離力（kgf） ４.７ ４.９ ５.２ ５.５ ４.８ ５.１ 塗 母板外観 異常 異常 異常 異常 異常 異常 布 なし なし なし なし なし なし ──────────────────────────────────[Table 2] Number of energizations 10 20 30 40 40 50 60 ──────────────────────────────── Not peeling force (kgf) 3.2 4.4 7.0 4.5 6.3 Peeling is not possible Appearance of coated base plate Abnormality Abnormality Abnormality Abnormal white discoloration Copper cloth is stuck to the mother board None None None None is stuck ──────────── ──────────────────────── Peeling force (kgf) 4.7 4.9 5.2 5.5 5.5 4.8 5.1 Coated base plate Appearance Abnormal Abnormal Abnormal Abnormal Abnormal Abnormal Abnormal Cloth None None None None None None ───────────────────────────────────
【００１４】表２の結果が示すように、本発明方法によ
れば６０回電解を行っても剥離力にほぼ変化なく、母板
外観に良好な結果が得られた。As shown in the results of Table 2, according to the method of the present invention, even if electrolysis was carried out 60 times, the peeling force was almost unchanged, and the mother board had a good appearance.
【００１５】[0015]
【発明の効果】本発明によれば、ステンレス母板からの
種板の剥離が容易で、良好な状態の種板が得られ、母板
をそのまま長期間使用できる。EFFECTS OF THE INVENTION According to the present invention, the seed plate can be easily peeled from the stainless mother plate, a seed plate in a good condition can be obtained, and the mother plate can be used as it is for a long time.
Claims (1)
ス母板に、リン酸エステルナトリウム塩とノニオン系界
面活性剤とを溶解した水溶液を塗布して乾燥し銅種板を
電着させることを特徴とする銅電解用種板の製造方法。1. A copper seed plate is electrodeposited by coating an aqueous solution of a sodium phosphate ester salt and a nonionic surfactant on a stainless steel base plate for producing a seed plate in electrolytic copper refining and drying the solution. And a method for producing a seed plate for copper electrolysis.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4057532A JPH05222566A (en) | 1992-02-10 | 1992-02-10 | Production of starting sheet for electrolysis of copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4057532A JPH05222566A (en) | 1992-02-10 | 1992-02-10 | Production of starting sheet for electrolysis of copper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05222566A true JPH05222566A (en) | 1993-08-31 |
Family
ID=13058364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4057532A Pending JPH05222566A (en) | 1992-02-10 | 1992-02-10 | Production of starting sheet for electrolysis of copper |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05222566A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1986000065A1 (en) * | 1984-06-11 | 1986-01-03 | Research Cottrell, Inc. | Process for treating flue gas with alkali injection and electron beam |
| GB2325673A (en) * | 1997-05-30 | 1998-12-02 | Fukuda Metal Foil Powder | Copper foil formed from electrolyte containing nitrogen-containing organic compound |
-
1992
- 1992-02-10 JP JP4057532A patent/JPH05222566A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1986000065A1 (en) * | 1984-06-11 | 1986-01-03 | Research Cottrell, Inc. | Process for treating flue gas with alkali injection and electron beam |
| GB2325673A (en) * | 1997-05-30 | 1998-12-02 | Fukuda Metal Foil Powder | Copper foil formed from electrolyte containing nitrogen-containing organic compound |
| US6231742B1 (en) | 1997-05-30 | 2001-05-15 | Fukuda Metal Foil & Powder Co., Ltd. | Electrolytic Copper foil and process for producing the same |
| GB2325673B (en) * | 1997-05-30 | 2002-04-10 | Fukuda Metal Foil Powder | Electrolytic copper foil and process for producing it |
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