JPH0521918A - Powder composition for forming conductive pattern for ceramic circuit board - Google Patents
Powder composition for forming conductive pattern for ceramic circuit boardInfo
- Publication number
- JPH0521918A JPH0521918A JP19701591A JP19701591A JPH0521918A JP H0521918 A JPH0521918 A JP H0521918A JP 19701591 A JP19701591 A JP 19701591A JP 19701591 A JP19701591 A JP 19701591A JP H0521918 A JPH0521918 A JP H0521918A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- conductive pattern
- pdo
- circuit board
- mixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Paints Or Removers (AREA)
- Conductive Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、セラミックス回路基板
用導電パタ−ン形成用粉末組成物に関し、詳細には、低
温焼成によってセラミックス回路基板を製造するにあた
り、セラミックグリ−ンシ−ト上に導電パタ−ンを形成
するためのペ−スト製造用粉末組成物に係るセラミック
ス回路基板用導電パタ−ン形成用粉末組成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a powder composition for forming a conductive pattern for a ceramic circuit board. More specifically, when a ceramic circuit board is manufactured by low temperature firing, a conductive material is formed on the ceramic green sheet. The present invention relates to a powder composition for forming a conductive pattern for a ceramic circuit board, which relates to a powder composition for producing a paste.
【０００２】[0002]
【従来の技術】従来、低温焼成により製造されるセラミ
ックス回路基板において、その表面配線及びスル−ホ−
ルを形成するために、電気抵抗の低いＡｇを主成分とす
る導電粉末が用いられている。例えば、特開昭６３−１
６６９７号公報には、導電粉末として「Ａｇ８５〜８０
重量％とＰｄ１５〜２０重量％の粉末混合物」又は「Ａ
ｇ５０〜９０重量％とＰｄ５０〜１０重量％の合金粉
末」を用いることについて記載されている。そして、該
導電粉末を有機ビヒクルに混合して導電体ペ−ストを調
製し、予め作製されたセラミックグリ−ンシ−トの表面
に、該導電体ペ−ストを所定の導電パタ−ンになるよう
に印刷し、焼成（８００〜１０００℃）する方法が開示
されている。なお、上記有機ビヒクルとしては、一般的
には、エチルセルロ−スをα−テルピネオ−ルに溶解し
たものが使用されている。2. Description of the Related Art Conventionally, in a ceramic circuit board manufactured by low temperature firing, its surface wiring and through hole
Conductive powder containing Ag as a main component, which has a low electric resistance, is used to form the resin. For example, JP-A-63-1
No. 6697 discloses "Ag85-80 as conductive powder.
% Powder mixture with 15-20% by weight of Pd "or" A
g50-90 wt% and Pd50-10 wt% alloy powder ". Then, the conductive powder is mixed with an organic vehicle to prepare a conductive paste, and the conductive paste is formed into a predetermined conductive pattern on the surface of a ceramic green sheet prepared in advance. Printing and firing (800 to 1000 ° C.) are disclosed. As the above-mentioned organic vehicle, one obtained by dissolving ethyl cellulose in α-terpineol is generally used.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記従
来法によって、導電パタ−ンを形成して得たセラミック
グリ−ンシ−トは、これを焼成すると、導電パタ−ン形
成用導電体とセラミックグリ−ンシ−トとは、後に詳記
するとおり、焼成収縮過程が異なることから、導電体の
一部が基板から剥離しやすいという問題点があった。However, the ceramic green sheet obtained by forming the conductive pattern by the above-mentioned conventional method, when the ceramic green sheet is fired, forms the conductive pattern forming conductor and the ceramic green. As described later in detail, since the firing shrinkage process is different from that of the sheet, there is a problem that a part of the conductor is easily separated from the substrate.
【０００４】そこで、本発明者等は、上記問題点を解消
する導電パタ−ン形成用導電体（導電体組成物）につい
て鋭意研究した結果、本発明を完成したものであって、
本発明は、セラミックス基板と導電パタ−ン（導電体）
とが焼成後に剥離しない導電体組成物に係るセラミック
ス回路基板用導電パタ−ン形成用粉末組成物を提供する
ことを目的とする。Therefore, the present inventors have completed the present invention as a result of earnest research on a conductor (conductor composition) for forming a conductive pattern which solves the above problems.
The present invention is directed to a ceramic substrate and a conductive pattern (conductor).
It is an object of the present invention to provide a powder composition for forming a conductive pattern for a ceramics circuit board, which is a conductor composition which does not peel off after firing.
【０００５】[0005]
【課題を解決するための手段】そして、本発明は、上記
目的を達成するため、導電体粉末として、所定割合のＡ
ｇ−ＰｄＯ混合粉末を使用する点にある。即ち、本発明
は、Ａｇ粉末６５〜９５重量部及びＰｄＯ粉末５〜３５
重量部を混合してなることを特徴とするセラミックス回
路基板用導電パタ−ン形成用粉末組成物である。In order to achieve the above object, the present invention provides a conductive powder containing a predetermined proportion of A.
The point is to use a g-PdO mixed powder. That is, the present invention provides 65 to 95 parts by weight of Ag powder and 5 to 35 PdO powder.
It is a powder composition for forming a conductive pattern for a ceramics circuit board, characterized by being mixed in parts by weight.
【０００６】[0006]
【作用】従来から用いられているＡｇ−Ｐｄ導電性粉末
は、セラミックス回路基板焼成時に、導電体として含有
されているＰｄが酸化され、体積膨張を起こし、その後
の熱処理により還元され、Ａｇ−Ｐｄからなる導電層を
形成する。その結果、導電層は、焼成に伴い一度膨張
し、その後収縮するという焼成収縮過程を示す。これに
対して、セラミックグリ−ンシ−トは、焼成に伴い収縮
し、焼結が完了するという焼成収縮過程を示す。この両
者の焼成収縮過程の違いが導電パタ−ン（導電体）の剥
離現象の原因であると考えられる。In the conventionally used Ag-Pd conductive powder, Pd contained as a conductor is oxidized during firing of the ceramic circuit board to cause volume expansion, and is reduced by the subsequent heat treatment to reduce Ag-Pd. To form a conductive layer. As a result, the conductive layer exhibits a baking shrinkage process in which it expands once and then shrinks as it is baked. On the other hand, the ceramic green sheet shows a firing shrinkage process in which it shrinks as it is fired and the sintering is completed. The difference in the firing shrinkage process between the two is considered to be the cause of the peeling phenomenon of the conductive pattern (conductor).
【０００７】そこで、本発明は、上記導電パタ−ンの収
縮焼結過程を制御するため、Ｐｄ源としてＰｄＯを用い
るものであり、これによって、セラミックス基板と導電
パタ−ン（導電体）とが焼成後に剥離しない作用が生
じ、優れたセラミックス回路基板が得られるものであ
る。Therefore, the present invention uses PdO as a Pd source in order to control the shrinking and sintering process of the conductive pattern, whereby the ceramic substrate and the conductive pattern (conductor) are separated from each other. The effect of not peeling after firing occurs, and an excellent ceramic circuit board is obtained.
【０００８】以下、本発明を詳細に説明すると、本発明
において、セラミックス回路基板製造用原料粉末として
は、アルミナ、ムライト又はコ−デュライトなどにＳｉ
Ｏ2−Ｂ2Ｏ3系ガラス、ＰｂＯ−ＳｉＯ2−ＡＩ2Ｏ3−Ｂ
2Ｏ3系ガラス又はＣａＯ−ＳｉＯ2−ＡＩ2Ｏ3−Ｂ2Ｏ3
系ガラス等を複合したものが好ましく、このような原料
粉末を使用することによって、セラミックス回路基板を
低温焼成により製造することができる。また、セラミッ
クグリ−ンシ−トとしては、上記記原料粉末に有機バイ
ンダ−及び溶剤を加えてスラリ−とし、通常のドクタ−
プレイド法等により作製することができる。The present invention will be described in detail below. In the present invention, as the raw material powder for producing a ceramic circuit board, alumina, mullite, cordurite or the like can be used.
O 2 -B 2 O 3 based glass, PbO-SiO 2 -AI 2 O 3 -B
2 O 3 based glass or CaO-SiO 2 -AI 2 O 3 -B 2 O 3
It is preferable to use a composite of system glass or the like, and by using such a raw material powder, a ceramic circuit board can be manufactured by low temperature firing. As a ceramic green sheet, an ordinary doctor is prepared by adding an organic binder and a solvent to the above raw material powder to prepare a slurry.
It can be produced by the plaid method or the like.
【０００９】本発明において、原料粉末であるＡｇ粉末
及びＰｄＯ粉末としては、導電体材料として通常使用さ
れる平均粒径０．３〜１０μｍ程度のものを用いること
ができる。特に、２μｍ以下のＡｇ粉末及びＰｄＯ粉末
の使用は、得られたＡｇ−ＰｄＯ粉末の混合が均一とな
り、導電パタ−ンの収縮が均一となることから、好まし
い。また、本発明で使用するＰｄＯは、Ｐｄを酸化雰囲
気中で２００〜８００℃の加熱処理により得ることがで
きるが、市販のＰｄＯを用いることもできる。このＡｇ
粉末とＰｄＯ粉末とを慣用手段で混合することにより、
目的とする導電パタ−ン形成用粉末組成物を製造する。In the present invention, as the raw material powder, Ag powder and PdO powder, those having an average particle size of about 0.3 to 10 μm, which are usually used as a conductor material, can be used. In particular, it is preferable to use Ag powder and PdO powder having a particle size of 2 μm or less, because the obtained Ag—PdO powder is uniformly mixed and the conductive pattern is uniformly shrunk. The PdO used in the present invention can be obtained by subjecting Pd to a heat treatment at 200 to 800 ° C. in an oxidizing atmosphere, but a commercially available PdO can also be used. This Ag
By mixing the powder and PdO powder by conventional means,
A target powder composition for forming a conductive pattern is manufactured.
【００１０】なお、本発明において、得られた導電パタ
−ンのハンダ濡れ性を改善するため、Ｃｒの酸化物又は
Ｍｎの酸化物を添加することもできる。添加するＣｒの
酸化物は、Ｃｒ2Ｏ3換算で５重量部以下であり、Ｍｎの
酸化物の場合は、ＭｎＯ2換算で３重量部以下が好まし
く、これを越える量を添加すると導電体の抵抗値が高く
なる傾向があり、好ましくない。In the present invention, an oxide of Cr or an oxide of Mn may be added in order to improve the solder wettability of the obtained conductive pattern. The Cr oxide to be added is 5 parts by weight or less in terms of Cr 2 O 3 , and in the case of Mn oxide, 3 parts by weight or less in terms of MnO 2 is preferable. The resistance tends to be high, which is not preferable.
【００１１】このようにして得られた導電パタ−ン形成
用粉末にビヒクルを加え、また、セラミックス基板との
密着性向上を目的として、少量のガラス成分を添加し、
例えば、３本ロ−ルミルなどの慣用の方法で混合し、セ
ラミックスグリ−ンシ−ト用導電性ペ−ストを調製す
る。このビヒクルとしては、種々の有機ビヒクルを使用
することができるが、エチルセルロ−スをα−テルピネ
オ−ルに溶解したものを使用するのが好ましい。そし
て、この導電性ペ−ストをセラミックスグリ−ンシ−ト
に所定形状で印刷した後、焼成してセラミックス回路基
板を作製する。A vehicle is added to the conductive pattern forming powder thus obtained, and a small amount of a glass component is added for the purpose of improving the adhesion to the ceramic substrate.
For example, the mixture is mixed by a conventional method such as a three roll mill to prepare a conductive paste for ceramic green sheets. As this vehicle, various organic vehicles can be used, but it is preferable to use a solution of ethyl cellulose dissolved in α-terpineol. Then, this conductive paste is printed on a ceramic green sheet in a predetermined shape and then fired to produce a ceramic circuit board.
【００１２】[0012]
【実施例】以下、本発明の実施例を比較例と共に挙げ、
本発明をより詳細に説明する。 （実施例１〜６）平均粒径１μｍのアルミナ粉末５０重
量％とＳｉＯ2−Ｂ2Ｏ3−ＰｂＯ系ガラス５０重量％を
混合し、この混合粉末にアクリル樹脂及び溶剤を加えて
スラリ−を作製した。このスラリ−をドクタ−ブレイド
装置で塗工し、厚さ０．５ｍｍの低温焼成セラミックス
回路基板用セラミックスグリ−ンシ−トを得た。EXAMPLES Examples of the present invention will be given below together with comparative examples.
The present invention will be described in more detail. Examples 1 to 6 50% by weight of alumina powder having an average particle size of 1 μm and 50% by weight of SiO 2 —B 2 O 3 —PbO glass were mixed, and an acrylic resin and a solvent were added to the mixed powder to prepare a slurry. It was made. This slurry was applied by a doctor blade device to obtain a ceramic green sheet for low temperature firing ceramic circuit boards having a thickness of 0.5 mm.
【００１３】一方、市販の平均粒径０．５μｍのＰｄ粉
末を３５０℃で２時間空気中で加熱し、ＰｄＯ粉末を製
造した。そして、このＰｄＯ粉末と市販の平均粒径１．
０μｍのＡｇ粉末とを乳鉢を用いて混合し、導電パタ−
ン形成用粉末を調製した（実施例１〜４）。また、この
混合粉末に、更に、Ｃｒ2Ｏ3を２重量部添加したもの
（実施例５）及びＭｎＯ2を３重量部添加したもの（実
施例６）も導電パタ−ン形成用粉末として使用した。そ
れらの混合量を表１に示した。次に、エチルセルロ−ス
をα−テルピネオ−ルに溶解してビヒクルを調製し、こ
のビヒクル中に上記混合粉末を３本ロ−ルミルで混合
し、導電性ペ−ストを調製した。この導電性ペ−ストを
前記したセラミックスグリ−ンシ−ト上に、幅１５０μ
ｍのパタ−ンをスクリ−ン印刷し、４００℃で４時間脱
バインダ−した後、８５０℃で焼成してセラミックス回
路基板を作製した。得られた基板上の導電パタ−ンの剥
離を目視により観察し、その結果を同じく表１に示し
た。On the other hand, a commercially available Pd powder having an average particle size of 0.5 μm was heated in air at 350 ° C. for 2 hours to produce a PdO powder. Then, this PdO powder and a commercially available average particle size of 1.
0 μm Ag powder was mixed using a mortar and the conductive pattern
A powder for forming a resin was prepared (Examples 1 to 4). Further, to this mixed powder, 2 parts by weight of Cr 2 O 3 (Example 5) and 3 parts by weight of MnO 2 (Example 6) were also used as the powder for forming the conductive pattern. did. The mixing amounts thereof are shown in Table 1. Next, ethyl cellulose was dissolved in α-terpineol to prepare a vehicle, and three mixed powders were mixed in this vehicle with a roll mill to prepare a conductive paste. A width of 150 μm was applied to the above-mentioned ceramic green sheet with the conductive paste.
A m-sized pattern was screen-printed, debindered at 400 ° C. for 4 hours, and then fired at 850 ° C. to produce a ceramic circuit board. The peeling of the conductive pattern on the obtained substrate was visually observed, and the results are also shown in Table 1.
【００１４】（比較例）また、比較のために、導電パタ
−ン形成用粉末として、Ａｇ粉末とＰｄ粉末の混合粉末
を用い、上記実施例と同様に導電ペ−ストを調製し、セ
ラミックス回路基板を作製した。 得られた基板上の導
電パタ−ンの剥離を目視により観察し、その結果を同じ
く表１に示した。Comparative Example For comparison, a mixed powder of Ag powder and Pd powder was used as a conductive pattern forming powder, and a conductive paste was prepared in the same manner as in the above-mentioned Examples to prepare a ceramic circuit. A substrate was produced. The peeling of the conductive pattern on the obtained substrate was visually observed, and the results are also shown in Table 1.
【００１５】[0015]
【表１】 [Table 1]
【００１６】表１から明らかなように、導電パタ−ン形
成用粉末として、Ａｇ粉末とＰｄＯ粉末との混合粉末を
用いた実施例１〜６は、いずれも剥離しないことが理解
できる。これに対して、Ａｇ粉末とＰｄ粉末の混合粉末
を用いた比較例では、目視観察の結果、明らかに剥離が
認められた。As is clear from Table 1, it is understood that Examples 1 to 6 using the mixed powder of Ag powder and PdO powder as the conductive pattern forming powder do not peel off. On the other hand, in the comparative example using the mixed powder of Ag powder and Pd powder, peeling was clearly observed as a result of visual observation.
【００１７】[0017]
【発明の効果】本発明は、以上詳記したとおり、導電パ
タ−ン形成用粉末として、Ａｇ粉末とＰｄＯ粉末の混合
粉末を用いるものであり、これによって、セラミックス
基板と導電パタ−ン（導電体）とが焼成後に剥離しない
セラミックス回路基板が得られる効果が生ずる。As described in detail above, the present invention uses a mixed powder of Ag powder and PdO powder as the conductive pattern forming powder, which allows the ceramic substrate and the conductive pattern (conductive pattern) to be formed. The effect is obtained that a ceramic circuit board that does not separate from the body after firing is obtained.
Claims (1)
末５〜３５重量部を混合してなることを特徴とするセラ
ミックス回路基板用導電パタ−ン形成用粉末組成物。Claim: What is claimed is: 1. A powder composition for forming a conductive pattern for a ceramic circuit board, which is obtained by mixing 65 to 95 parts by weight of Ag powder and 5 to 35 parts by weight of PdO powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19701591A JPH0521918A (en) | 1991-07-11 | 1991-07-11 | Powder composition for forming conductive pattern for ceramic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19701591A JPH0521918A (en) | 1991-07-11 | 1991-07-11 | Powder composition for forming conductive pattern for ceramic circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0521918A true JPH0521918A (en) | 1993-01-29 |
Family
ID=16367363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19701591A Pending JPH0521918A (en) | 1991-07-11 | 1991-07-11 | Powder composition for forming conductive pattern for ceramic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0521918A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02502916A (en) * | 1987-12-31 | 1990-09-13 | トロピックス・インコーポレイテッド | Synthesis of 1,2-dioxetanes and their intermediates |
| US5534423A (en) * | 1993-10-08 | 1996-07-09 | Regents Of The University Of Michigan | Methods of increasing rates of infection by directing motion of vectors |
| US5811274A (en) * | 1994-12-09 | 1998-09-22 | The Regents Of The University Of Michigan | Methods, compositions and apparatus for cell transfection |
-
1991
- 1991-07-11 JP JP19701591A patent/JPH0521918A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02502916A (en) * | 1987-12-31 | 1990-09-13 | トロピックス・インコーポレイテッド | Synthesis of 1,2-dioxetanes and their intermediates |
| US5534423A (en) * | 1993-10-08 | 1996-07-09 | Regents Of The University Of Michigan | Methods of increasing rates of infection by directing motion of vectors |
| US5811274A (en) * | 1994-12-09 | 1998-09-22 | The Regents Of The University Of Michigan | Methods, compositions and apparatus for cell transfection |
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