JPH05218690A - Component mounter - Google Patents
Component mounterInfo
- Publication number
- JPH05218690A JPH05218690A JP4022626A JP2262692A JPH05218690A JP H05218690 A JPH05218690 A JP H05218690A JP 4022626 A JP4022626 A JP 4022626A JP 2262692 A JP2262692 A JP 2262692A JP H05218690 A JPH05218690 A JP H05218690A
- Authority
- JP
- Japan
- Prior art keywords
- component
- mounting
- suction nozzle
- moving
- thickness dimension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】Detailed Description of the Invention
【０００１】[0001]
【産業上の利用分野】本発明は、吸着ノズルで部品を吸
着し、基板に対し相対的に水平移動して、基板上の所定
位置に装着する、部品装着装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus which suctions a component by a suction nozzle, horizontally moves it relative to a substrate, and mounts it at a predetermined position on the substrate.
【０００２】[0002]
【従来の技術】この種の部品装着装置において、吸着ノ
ズルで部品を吸着および基板上に装着する際、吸着ノズ
ルの上下移動を短時間で行うことが望ましい。特開平２
−２２４３００号公報では、吸着ノズル高さと電子部品
の厚さ情報に基づいて、部品毎に吸着ノズルを高速で移
動させる距離を変化させ、部品に到達する前の低速移動
距離を一定として、吸着動作時間の短縮を図っている。2. Description of the Related Art In a component mounting apparatus of this type, when a component is suctioned by a suction nozzle and mounted on a substrate, it is desirable to move the suction nozzle up and down in a short time. JP-A-2
In Japanese Patent Laid-Open No. 224300, the suction operation is performed by changing the distance at which the suction nozzle is moved at high speed for each component based on the height of the suction nozzle and the thickness information of the electronic component, and keeping the low-speed moving distance before reaching the component constant. We are trying to reduce the time.
【０００３】[0003]
【発明が解決しようとする課題】このような従来例で
も、ある程度、吸着ノズルの部品吸着及び装着動作時間
を短縮できるが、本発明は、さらに動作時間の短縮を進
めようとするものである。Even in such a conventional example, the component suction and mounting operation time of the suction nozzle can be shortened to some extent, but the present invention intends to further shorten the operation time.
【０００４】[0004]
【課題を解決するための手段】本発明では、装着する部
品の厚さ寸法を装着順に記憶するメモリと、部品を装着
すべき基板に対し、吸着ノズルを相対的に昇降させる昇
降装置を設ける。このメモリの記憶寸法に基き、装着順
序毎に、部品を保持した吸着ノズルの基板上移動高度
を、すでに装着された部品の最大の厚さ寸法と、まだ装
着されていない部品の最大の厚さ寸法あるいは装着しよ
うとする部品の厚さ寸法に、前者の部品の頭上を後者の
部品が通過し得る所定のクリアランス寸法とを加えたも
のとする。さらに、装着順序毎に、部品を装着した後の
吸着ノズルの基板上移動高度を、すでに装着された部品
の最大の厚さ寸法と次に装着しようとする部品の高さ寸
法のいずれか大きい方と、その部品の頭上を吸着ノズル
下端が通過し得る所定のクリアランス寸法とを加えたも
のとし、両移動高度によって昇降装置の動作を制御す
る。また、前記メモリに装着順序毎の吸着ノズルの水平
移動経路を記憶させ、両移動高度を、移動経路下の装着
済み部品の最大の厚さ寸法に対応させる。According to the present invention, a memory for storing the thickness dimensions of components to be mounted in the mounting order and a lifting device for moving the suction nozzle up and down relative to the substrate on which the components are mounted are provided. Based on the memory size of this memory, the moving height of the suction nozzle that holds the component on the board is determined by the maximum thickness dimension of the component already mounted and the maximum thickness of the component not yet mounted, for each mounting order. The dimension or the thickness dimension of the component to be mounted is added with a predetermined clearance dimension over which the latter component can pass over the former component. Further, for each mounting order, the suction nozzle moving height on the substrate after mounting the component is the larger of the maximum thickness dimension of the component already mounted and the height dimension of the component to be mounted next. And a predetermined clearance dimension that allows the lower end of the suction nozzle to pass over the head of the component, and the operation of the lifting device is controlled by both moving altitudes. Further, the horizontal movement path of the suction nozzle for each mounting order is stored in the memory, and both movement heights are made to correspond to the maximum thickness dimension of the mounted components under the movement path.
【０００５】[0005]
【作用】吸着ノズルを、部品吸着ないし部品装着後に、
その都度初期位置に戻さず、すでに基板上に装着された
部品と、吸着保持している部品あるいは吸着ノズル先端
とが衝突しない最小の距離だけ引き上げて、水平移動さ
せることができる。[Function] After the suction nozzle is attached or mounted,
Instead of returning to the initial position each time, the component already mounted on the substrate and the component held by suction or the tip of the suction nozzle can be pulled up by a minimum distance and horizontally moved.
【０００６】[0006]
【実施例】本発明部品装着装置の一実施例について、図
に基づき説明する。図１は本発明の部品装着装置の一実
施例を示す概略図で、１は部品装着ヘッド、Ａは部品、
Ｐは部品Ａを装着すべき基板である。部品装着ヘッド１
は下端に吸着ノズル２を有し、アーム３に支持されて基
板Ｐと相対的に３次元の移動を行うが、その機構は本発
明の主旨ではないので詳細説明を省略する。４は前述の
相対的３次元移動の一環として、部品装着ヘッド１を昇
降させる昇降装置、５はその制御部である。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the component mounting apparatus of the present invention will be described with reference to the drawings. FIG. 1 is a schematic view showing an embodiment of a component mounting apparatus of the present invention, 1 is a component mounting head, A is a component,
P is a substrate on which the component A is to be mounted. Component mounting head 1
Has a suction nozzle 2 at its lower end and is supported by an arm 3 to move three-dimensionally relative to the substrate P, but its mechanism is not the gist of the present invention, and therefore detailed description thereof is omitted. Reference numeral 4 is an elevating device for elevating the component mounting head 1 as a part of the relative three-dimensional movement described above, and 5 is a control unit thereof.
【０００７】制御部５は、メモリ５１、移動高度算出手
段５２を内蔵しており、メモリ５１には、あらかじめ、
部品装着順に各部品の厚さ寸法を記憶させている。移動
高度算出手段５２は、メモリ５１の記憶している厚さ寸
法に基づいて、装着順序毎に、部品を吸着保持した際と
部品を装着した後の、基板から吸着ノズル下面までの最
適な移動高度ｓ、Ｓを各々算出する。すなわち、図１に
よれば、すでに基板Ｐ上に装着された部品群Ａ1、Ａ2、
Ａ3の内厚さが最大の部品Ａ1の寸法ｔ1と、装着のため
に吸着ノズル２に保持された部品Ａ4の厚さ寸法ｔ4に、
前者の部品の頭上を後者の部品が通過し得る所定のクリ
アランス寸法ｃとを加えたものを、部品Ａ4に関する最
適移動高度ｓ4とする。他の装着順の部品についても同
じ要領で、部品を吸着保持した際の最適移動高度ｓを算
出し、算出結果を自身に記憶しておく。この時、吸着ノ
ズル２に保持された部品Ａ4の厚さ寸法ｔ4に代えて、ま
だ装着されていない部品群の内厚さが最も大きい寸法と
してもよい。The control unit 5 has a memory 51 and a moving altitude calculating means 52 built-in.
The thickness dimension of each component is stored in the order of component mounting. Based on the thickness dimension stored in the memory 51, the moving height calculating means 52 performs the optimum movement from the substrate to the lower surface of the suction nozzle for each mounting order when the component is suction-held and after the component is mounted. The altitudes s and S are calculated respectively. That is, according to FIG. 1, the component groups A1, A2 already mounted on the substrate P,
The dimension t1 of the component A1 having the maximum inner thickness of A3 and the thickness t4 of the component A4 held by the suction nozzle 2 for mounting are
An optimum moving height s4 for the part A4 is obtained by adding a predetermined clearance dimension c over which the latter part can pass over the former part. In the same manner for the components in other mounting orders, the optimum moving height s when the components are sucked and held is calculated, and the calculation result is stored in itself. At this time, instead of the thickness t4 of the component A4 held by the suction nozzle 2, the inner thickness of the component group not yet mounted may be the largest.
【０００８】また、図２のように、部品Ａ4を装着した
後の吸着ノズル２の移動高度Ｓ4は、すでに基板Ｐ上に
装着された部品群の内厚さが最大の部品Ａ1の寸法ｔ1
と、次に装着しようとする部品Ａ5の厚さ寸法ｔ5とを比
較し、大きい方ｔ1と、その部品Ａ1の頭上を吸着ノズル
下端が通過し得る所定のクリアランス寸法とを加えたも
のである。このＳ4を、部品Ａ4の未吸着時最適移動高度
とし、他の装着順の部品についても同じ要領で、部品未
吸着時の最適移動高度を算出して、結果を移動高度算出
手段５２に記憶しておく。この時、部品供給部６の部品
載置面は、基板Ｐ上面と同一高さにあるものとする。Further, as shown in FIG. 2, the moving height S4 of the suction nozzle 2 after mounting the component A4 is the dimension t1 of the component A1 having the maximum inner thickness of the component group already mounted on the substrate P.
And the thickness dimension t5 of the component A5 to be mounted next is compared, and the larger dimension t1 and a predetermined clearance dimension through which the lower end of the suction nozzle can pass above the component A1 are added. This S4 is set as the optimum moving height of the part A4 when not picked up, and the optimum moving height when the parts are not picked up is calculated in the same manner for other parts in the mounting order, and the result is stored in the moving height calculation means 52. Keep it. At this time, the component mounting surface of the component supply unit 6 is assumed to be at the same height as the upper surface of the substrate P.
【０００９】あるいは、メモリ５１に、あらかじめ、部
品装着順に吸着ノズルの水平移動経路を記憶させてお
き、前述した各最適移動高度を、移動経路下にある部品
の最大の厚さ寸法に対応させてもよい。Alternatively, the horizontal movement path of the suction nozzle is stored in advance in the memory 51 in the order in which the parts are mounted, and each optimum movement height described above is made to correspond to the maximum thickness dimension of the part under the movement path. Good.
【００１０】そして、制御部５は、移動高度算出手段５
２の算出結果に基づいて、装着順序毎の最適移動高度ｓ
と未吸着時最適移動高度Ｓに対応すべく、昇降装置４の
動作を制御する。Then, the control unit 5 uses the moving altitude calculation means 5
Based on the calculation result of 2, the optimum moving altitude s for each mounting order
Then, the operation of the elevating device 4 is controlled so as to correspond to the optimum moving height S during non-adsorption.
【００１１】本実施例の部品装着装置の動作について説
明する。部品を装着しようとする基板Ｐが、図示しない
基板位置決め機構によって保持されると、まず、制御部
５は、部品装着ヘッド１を部品供給部６の上に水平移動
させ、昇降装置４を下降させて第１番目に装着する部品
Ａ1を吸着する。 そして、移動高度算出手段に記憶され
た部品Ａ1に関する最適移動高度（第１番目の場合、装
着済みの部品がないため、クリアランスｃと厚さ寸法ｔ
1を加えたもの）だけ部品装着ヘッド１を引き上げ、基
板Ｐ上の所定位置に水平移動して装着する。The operation of the component mounting apparatus of this embodiment will be described. When the board P on which the component is to be mounted is held by the board positioning mechanism (not shown), first, the control unit 5 horizontally moves the component mounting head 1 onto the component supply unit 6 and lowers the lifting device 4. And sucks the first mounted component A1. Then, the optimum moving altitude for the component A1 stored in the moving altitude calculating means (in the first case, since there is no mounted component, the clearance c and the thickness t)
The component mounting head 1 is pulled up only by 1) and horizontally moved to a predetermined position on the substrate P to mount it.
【００１２】次に、第４番目の部品Ａ4を装着する場合
について述べる。図１のように、吸着ノズル２が部品Ａ
4を吸着した後、部品装着ヘッド１は、制御部５と昇降
装置４によって、すでに基板上に装着された部品の内最
も厚さの大きい部品Ａ1の寸法ｔ1、吸着している部品Ａ
4の厚さ寸法ｔ4、所定のクリアランスｃを加えた最適移
動高度ｓ4だけ引き上げられる。そのままの状態で部品
装着ヘッド１を水平移動させ、基板上の所定位置に部品
Ａ4を装着する。Next, the case where the fourth component A4 is mounted will be described. As shown in FIG. 1, the suction nozzle 2 has a component A.
After sucking 4, the component mounting head 1 uses the control unit 5 and the lifting device 4 to measure the dimension t1 of the thickest component A1 among the components already mounted on the substrate,
The optimum moving height s4 including the thickness t4 of 4 and the predetermined clearance c is raised. In this state, the component mounting head 1 is horizontally moved to mount the component A4 at a predetermined position on the board.
【００１３】そして、部品装着ヘッドが部品Ａ4を装着
した後、図２のように、制御部５と昇降装置４によっ
て、すでに基板上に装着された部品の内最も厚さの大き
い部品Ａ1と次に装着しようとする部品Ａ5とで、厚さの
大きいほうの寸法ｔ1と、所定のクリアランスｃを加え
た未吸着時の最適移動高度Ｓ4だけ引き上げられる。そ
のままの状態で部品装着ヘッド１を水平移動させ、部品
供給部６の部品Ａ5の真上に停止させる。上記動作を装
着順序毎に繰り返す。本実施例では、吸着ノズルの水平
移動経路に関係なく最適移動高度を算出する場合につい
て述べたが、移動経路に対応する場合は、装着済み部品
の最大の厚さ寸法を取り出すときに、吸着ノズル移動経
路下にある部品のみに限定して取り出せばよく、その他
は同様である。After the component mounting head mounts the component A4, as shown in FIG. 2, the control unit 5 and the elevating / lowering device 4 move the component A1 having the largest thickness and the next component A1 among the components already mounted on the substrate. With the component A5 to be mounted on, the dimension t1 having the larger thickness and the optimum moving height S4 at the time of non-suction including the predetermined clearance c are raised. In this state, the component mounting head 1 is moved horizontally and stopped right above the component A5 of the component supply unit 6. The above operation is repeated for each mounting order. In the present embodiment, the case where the optimum moving height is calculated regardless of the horizontal movement path of the suction nozzle has been described. However, when the optimum movement height is calculated, when the maximum thickness dimension of the mounted component is taken out, the suction nozzle It is sufficient to take out only the parts under the movement path, and the other parts are the same.
【００１４】[0014]
【発明の効果】このように本発明の部品装着装置によ
り、吸着ノズルを、部品吸着ないし部品装着後に、すで
に基板上に装着された部品と、吸着保持している部品あ
るいは吸着ノズル先端とが衝突しない最小の距離だけ引
き上げて水平移動させるため、吸着ノズルの不必要な上
下移動時間をなくすことができる。従って、部品装着時
間の短縮に効果がある。As described above, according to the component mounting apparatus of the present invention, after the component suction or the component mounting of the suction nozzle, the component already mounted on the substrate collides with the component held by suction or the tip of the suction nozzle. Since it is pulled up a minimum distance and moved horizontally, it is possible to eliminate unnecessary vertical movement time of the suction nozzle. Therefore, it is effective in reducing the component mounting time.
【図１】本発明部品装着装置の一実施例の構成を示す概
略図である。FIG. 1 is a schematic diagram showing a configuration of an embodiment of a component mounting device of the present invention.
【図２】同じく実施例における、動作を示す説明図であ
る。FIG. 2 is an explanatory diagram showing an operation in the same example.
１ 部品装着ヘッド ２ 吸着ノズル ３ アーム ４ 昇降装置 ５ 制御部 ５１ メモリ ５２ 移動高度算出手段 ６ 部品供給部 Ａ 部品 Ｐ 基板 DESCRIPTION OF SYMBOLS 1 Component mounting head 2 Suction nozzle 3 Arm 4 Lifting device 5 Control unit 51 Memory 52 Moving altitude calculation means 6 Component supply unit A Component P Substrate
Claims (4)
対し相対的に水平移動して、基板上の所定位置に装着す
る装置であって、 装着する部品の厚さ寸法を装着順に記憶するメモリと、 部品を装着すべき基板に対し、前記吸着ノズルを相対的
に昇降させる昇降装置と、 前記メモリの記憶寸法に基き装着順序毎に、部品を保持
した吸着ノズルの基板上移動高度を、すでに装着された
部品の最大の厚さ寸法、まだ装着されていない部品の最
大の厚さ寸法及び、前者の部品の頭上を後者の部品が通
過し得る所定のクリアランス寸法とを加えたものとす
る、移動高度算出手段と、 装着順序と前記移動高度算出手段の算出結果に基づい
て、前記昇降装置の動作を制御する制御部とを備えるこ
とを特徴とする部品装着装置。1. A device for adsorbing and holding a component by a suction nozzle, horizontally moving relative to the substrate, and mounting the component at a predetermined position on the substrate, wherein the thickness dimension of the component to be mounted is stored in the mounting order. A memory, an elevating device that raises and lowers the suction nozzle relative to the board on which the component is to be mounted, and a movement height of the suction nozzle that holds the component on the board for each mounting order based on the memory size of the memory. The maximum thickness dimension of already mounted components, the maximum thickness dimension of components not yet mounted, and the predetermined clearance dimension over which the former component can pass over the former component. A component mounting apparatus comprising: a moving altitude calculating unit; and a control unit that controls an operation of the lifting device based on a mounting order and a calculation result of the moving altitude calculating unit.
相対的に水平移動して、基板上の所定位置に装着する装
置であって、 装着する部品の厚さ寸法を装着順に記憶するメモリと、 部品を装着すべき基板に対し、前記吸着ノズルを相対的
に昇降させる昇降装置と、 前記メモリの記憶寸法に基き装着順序毎に、部品を保持
した吸着ノズルの基板上移動高度を、すでに装着された
部品の最大の厚さ寸法、装着しようとする部品の厚さ寸
法及び、前者の部品の頭上を後者の部品が通過し得る所
定のクリアランス寸法とを加えたものとする、移動高度
算出手段と、 装着順序と前記移動高度算出手段の算出結果に基づい
て、前記昇降装置の動作を制御する制御部とを備えるこ
とを特徴とする部品装着装置。2. A device for picking up a component by a suction nozzle, horizontally moving relative to the substrate, and mounting the component at a predetermined position on the substrate, the memory storing the thickness dimension of the component to be mounted in the mounting order. An elevating device for moving the suction nozzle up and down relative to the board on which the component is to be mounted, and the movement height of the suction nozzle holding the component on the substrate for each mounting order based on the memory size of the memory. Moving altitude calculation, which is the sum of the maximum thickness dimension of the mounted component, the thickness dimension of the component to be mounted, and the predetermined clearance dimension over which the latter component can pass over the former component. A component mounting apparatus comprising: a means and a control unit that controls the operation of the lifting device based on a mounting order and a calculation result of the moving height calculation means.
着装置であって、その移動高度算出手段に下記の機能を
付与した部品装着装置。前記メモリの記憶寸法に基き装
着順序毎に、部品を装着した後の吸着ノズルの基板上移
動高度を、すでに装着された部品の最大の厚さ寸法と次
に装着しようとする部品の高さ寸法のいずれか大きい方
と、大きい方の部品の頭上を吸着ノズル下端が通過し得
る所定のクリアランス寸法とを加えたものとする、未吸
着時移動高度算出機能。3. The component mounting apparatus according to claim 1 or 2, wherein the moving altitude calculating means is provided with the following functions. Based on the memory size of the memory, for each mounting order, the moving height of the suction nozzle on the substrate after mounting the component, the maximum thickness dimension of the component already mounted and the height dimension of the component to be mounted next Whichever is larger, and a predetermined clearance dimension that allows the lower end of the suction nozzle to pass over the larger part.
部品装着装置であって、そのメモリと移動高度算出手段
にそれぞれ下記の機能を付与した部品装着装置。部品装
着順に吸着ノズルの水平移動経路を記憶する移動経路記
憶機能。前記移動高度算出手段および未吸着時移動高度
算出機能の記述における、「すでに装着された部品の最
大の厚さ寸法」を、「前記水平移動経路下にすでに装着
された部品の最大の厚さ寸法」とする、経路別移動高度
算出機能。4. The component mounting apparatus according to claim 1, claim 2, or claim 3, wherein the memory and moving altitude calculating means are provided with the following functions. A movement path storage function that stores the horizontal movement path of the suction nozzle in the order of component mounting. In the description of the moving height calculating means and the non-sucking moving height calculating function, "the maximum thickness dimension of the component already mounted" is defined as "the maximum thickness dimension of the component already mounted on the horizontal movement path." The travel altitude calculation function for each route.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4022626A JP2983741B2 (en) | 1992-02-07 | 1992-02-07 | Component mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4022626A JP2983741B2 (en) | 1992-02-07 | 1992-02-07 | Component mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05218690A true JPH05218690A (en) | 1993-08-27 |
| JP2983741B2 JP2983741B2 (en) | 1999-11-29 |
Family
ID=12088042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4022626A Expired - Lifetime JP2983741B2 (en) | 1992-02-07 | 1992-02-07 | Component mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2983741B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11261297A (en) * | 1998-03-16 | 1999-09-24 | Matsushita Electric Ind Co Ltd | Electronic component mounting method and its equipment |
| JP2001196793A (en) * | 2000-01-17 | 2001-07-19 | Matsushita Electric Ind Co Ltd | Method and machine for mounting electronic component |
| KR100635351B1 (en) * | 1996-01-26 | 2007-11-02 | 마쯔시다덴기산교 가부시키가이샤 | How to install electronic parts |
| JPWO2015173947A1 (en) * | 2014-05-16 | 2017-04-20 | 富士機械製造株式会社 | Optimization device |
-
1992
- 1992-02-07 JP JP4022626A patent/JP2983741B2/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100635351B1 (en) * | 1996-01-26 | 2007-11-02 | 마쯔시다덴기산교 가부시키가이샤 | How to install electronic parts |
| JPH11261297A (en) * | 1998-03-16 | 1999-09-24 | Matsushita Electric Ind Co Ltd | Electronic component mounting method and its equipment |
| JP2001196793A (en) * | 2000-01-17 | 2001-07-19 | Matsushita Electric Ind Co Ltd | Method and machine for mounting electronic component |
| JP4678906B2 (en) * | 2000-01-17 | 2011-04-27 | パナソニック株式会社 | Electronic component mounting method |
| JPWO2015173947A1 (en) * | 2014-05-16 | 2017-04-20 | 富士機械製造株式会社 | Optimization device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2983741B2 (en) | 1999-11-29 |
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