JPH05218180A - Substrate holding device - Google Patents

Abstract

PURPOSE:To prevent an external force from being produced, which force might deform a substrate, by holding the upper and lower surfaces of the substrate with an elastic body including gas therein to ensure holding of the substrate and fixation of the position of the same. CONSTITUTION:There are provided a substrate 1 to be held, a frame 2 fixed to an exposure device and a measurement device, etc., an upper elastic holding member 3 for holding the substrate 1, and a lower elastic holding member 4. A drawing (a) illustrates a state of the substrate 1 where the substrate 1 is fixed between the upper and lower elastic holding members 4 into which compressed air or inactive gas is introduced for expansion thereof. Further, a drawing (b) illustrates a state of the substrate 1 where the substrate 1 is removed from between the upper and lower elastic members 3, 4 which are shrunk by degassing the compressed air or inactive gas therein. Hereby, accuracy is prevented from being lowered owing to deformation of the substrate 1 upon the same being attracted and fixed, and mismatching is removed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は半導体装置製造工程など
で使用される露光装置、検査測定装置などのマスク、レ
チクル等の基板を保持して処理、測定を行う装置の基板
の保持と位置の固定を行う構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for holding and processing a substrate such as an exposure apparatus used in a semiconductor device manufacturing process, a mask such as an inspection / measuring apparatus, a reticle and the like for processing and measurement. Regarding the structure for fixing.

【０００２】[0002]

【従来の技術】図２に従来の方法によるマスク、レチク
ル等の基板の保持と位置の固定を行う構造例の断面模式
図を示す。2. Description of the Related Art FIG. 2 is a schematic sectional view of an example of a structure for holding a substrate such as a mask and a reticle and fixing the position by a conventional method.

【０００３】図中１は保持される基板を示し、２に示す
フレーム上に設けられた吸着パッド５に真空吸着されて
固定される方式をとる。In the figure, reference numeral 1 denotes a substrate to be held, which is of a system in which it is vacuum-sucked and fixed to a suction pad 5 provided on a frame shown in FIG.

【０００４】基板の固定、離脱は、吸着パッドの真空を
印加、停止することによって行われる。The substrate is fixed and released by applying and stopping the vacuum of the suction pad.

【０００５】上記方式に於いては、基板面の焦点位置は
吸着パッドの位置によって一義的に定まる為、焦点位置
を移動するためにはフレーム自体を上下する必要があ
り、さらに基板のレベリングを行う場合には吸着パッド
自体を加工する必要がある。In the above method, since the focal position of the substrate surface is uniquely determined by the position of the suction pad, it is necessary to move the frame itself up and down in order to move the focal position. Further, the substrate is leveled. In some cases, the suction pad itself needs to be processed.

【０００６】[0006]

【発明が解決しようとする課題】しかし従来の方式によ
る吸着固定方式は吸着パッド部または基板のわずかな変
形、誤差、キズ、異物の付着等により、基板が吸着され
た時基板端部に曲げモーメントが作用し基板の大きな変
形が起きる。However, in the conventional suction-fixing method, when the board is sucked due to a slight deformation, an error, a scratch, or a foreign substance adhering to the suction pad or the board, a bending moment is applied to the end of the board. Causes a large deformation of the substrate.

【０００７】上記のような基板の変形が生ずると基板上
のパターン測定精度の低下、合わせずれが発生すると言
う問題が生ずる。When the substrate is deformed as described above, there arises a problem that the accuracy of pattern measurement on the substrate is lowered and misalignment occurs.

【０００８】さらに基板及び吸着パッドに微少な傾きが
生じた場合にはその修正が非常に困難である。Further, when a slight inclination occurs on the substrate and the suction pad, it is very difficult to correct it.

【０００９】[0009]

【課題を解決するための手段】本発明はかかる問題点を
解決するためになされた物であり従来の吸着パツドに基
板を吸着する方法に代え、基板の上下面を気体を内包し
た弾性体により挟み込む事により基板の保持と位置の固
定を行う構造をとり基板を変形させる外力の発生を防止
する。SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and instead of a conventional method of adsorbing a substrate on an adsorption pad, an elastic body containing gas in the upper and lower surfaces of the substrate is used. By sandwiching the structure, a structure for holding the substrate and fixing the position is adopted to prevent generation of external force that deforms the substrate.

【００１０】さらに基板の上下面を保持している弾性保
持体の内圧を制御する事により、保持面の微少な高さの
調整を行うことにより焦点位置、傾きの修正を行う。Further, by controlling the internal pressure of the elastic holding body holding the upper and lower surfaces of the substrate, the focus position and the inclination are corrected by adjusting the fine height of the holding surface.

【００１１】[0011]

【実施例】図１（ａ）（ｂ）に本発明の方式を取った基
板保持装置の基板保持部の断面構造模式図を示す。1 (a) and 1 (b) are schematic cross-sectional structural views of a substrate holding portion of a substrate holding device adopting the method of the present invention.

【００１２】図中１に保持されるべき基板を示し、２に
露光装置、測定装置等に固定されているフレーム、３に
基板を保持するための上部弾性保持体、４に下部弾性保
持体を示す。In the figure, 1 shows a substrate to be held, 2 is a frame fixed to an exposure device, a measuring device, etc., 3 is an upper elastic holder for holding the substrate, and 4 is a lower elastic holder. Show.

【００１３】上記弾性保持体は内部が空洞状態になって
おり、外部より気体を封入し、さらに必要に応じて、各
弾性保持体個々の内部封入圧力を精密に制御できる圧力
コントローラーを備えている。The elastic holder has a hollow inside, is filled with gas from the outside, and is further equipped with a pressure controller capable of precisely controlling the internal filling pressure of each elastic holder, if necessary. ..

【００１４】６は基板の保持位置を設定するための位置
センサーを示す。Reference numeral 6 denotes a position sensor for setting the holding position of the substrate.

【００１５】図１（ａ）は上下弾性保持体内部に圧縮空
気または不活性ガス等を注入し膨張した上下弾性保持体
間に基板を固定した状態を示す。FIG. 1 (a) shows a state in which a substrate is fixed between the upper and lower elastic holders that have been expanded by injecting compressed air or an inert gas into the upper and lower elastic holders.

【００１６】図１（ｂ）は上下弾性保持体内部の圧縮空
気または不活性ガス等を抜き収縮した上下弾性保持体間
から基板が離脱した状態を示す。FIG. 1 (b) shows a state in which the substrate is separated from between the upper and lower elastic holders that have been compressed and compressed by extracting compressed air or inert gas inside the upper and lower elastic holders.

【００１７】以下、基板の保持、固定、離脱の手順にし
たがつて、本装置の詳細な説明を行う。The apparatus will be described in detail below in accordance with the procedure for holding, fixing and releasing the substrate.

【００１８】まず図１（ｂ）の状態（上下弾性保持体内
部の圧縮空気または不活性ガス等を抜き収縮した状態）
で基板を所要の位置に挿入し、ＸＹ方向の位置決めを行
った後、上下弾性保持体内部に圧縮空気または不活性ガ
ス等を注入し膨張した上下弾性保持体間に基板を固定す
る。（図１（ａ）の状態）さらに、６に示す基板の位置
センサーにより基板のＺ軸方向の位置検出が行われ、上
下弾性保持体の上下の圧力を制御することにより基板の
レベリング及びフォーカス位置の精密な設定を行う。First, the state of FIG. 1B (a state in which compressed air or an inert gas inside the upper and lower elastic holders is extracted and contracted)
After inserting the substrate into a desired position and positioning it in the XY directions, the substrate is fixed between the expanded and contracted upper and lower elastic holders by injecting compressed air or inert gas into the upper and lower elastic holders. (State of FIG. 1A) Further, the position sensor of the substrate shown in 6 detects the position of the substrate in the Z-axis direction, and the upper and lower pressures of the upper and lower elastic holders are controlled to level and focus the substrate. Make precise settings for.

【００１９】基板の保持、高さの調整が終了した状態で
露光、測定などの処理が実施されるが、常に基板高さの
モニターが位置センサーによってなされており必要に応
じて上下弾性保持体の上下の圧力を制御し、調整がなさ
れる。Although processing such as exposure and measurement is carried out in a state where the substrate is held and the height is adjusted, the substrate height is constantly monitored by the position sensor, and if necessary, the upper and lower elastic holders are held. Adjustments are made by controlling the pressure above and below.

【００２０】[0020]

【発明の効果】上記本発明による基板固定方式をとった
露光装置、座標測定装置で処理、測定を行った結果、基
板を吸着固定するときの変形による精度の低下、合わせ
ずれの発生を従来の方式によるものに比較して半減する
ことができた。As described above, as a result of processing and measurement by the exposure apparatus and the coordinate measuring apparatus using the substrate fixing method according to the present invention, there is a decrease in accuracy due to deformation when the substrate is sucked and fixed, and a misalignment occurs. It was possible to halve it compared with the method.

【００２１】さらに基板の保持方式が従来の吸着パッド
に固定する方式に比較して基板自体にキズ等を生ずるこ
ともなく、ゴミの発生も少ないなどの付随的な効果も非
常に大きいことが明かとなった。Further, as compared with the conventional method of fixing the substrate to the suction pad, the substrate holding method does not cause scratches or the like on the substrate itself, and it is clear that ancillary effects such as generation of dust are very large. It became

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の方式を取った基板保持装置の基板保持
部の断面構造模式図。FIG. 1 is a schematic cross-sectional structure diagram of a substrate holding portion of a substrate holding device adopting the method of the present invention.

【図２】従来の方法によるマスク、レチクル等の基板の
保持と位置の固定を行う構造例の断面模式図。FIG. 2 is a schematic cross-sectional view of a structural example in which a substrate such as a mask and a reticle is held and its position is fixed by a conventional method.

【符号の説明】[Explanation of symbols]

１ 基板 ２ フレーム ３ 上部弾性保持体 ４ 下部弾性保持体 ５ 吸着パッド ６ 基板位置センサー 1 substrate 2 frame 3 upper elastic retainer 4 lower elastic retainer 5 suction pad 6 substrate position sensor

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】半導体装置製造工程などで使用される露光
装置、検査測定装置などで、マスク、レチクル等の基板
を保持して処理、測定を行う装置に於いて、気体を内包
した弾性体により上下両面より挟み込む事により基板の
保持と位置の固定を行う機構を有する事を特徴とする基
板保持装置。1. An exposure apparatus used in a semiconductor device manufacturing process, an inspection measurement apparatus, etc., which performs processing and measurement while holding a substrate such as a mask and a reticle, and using an elastic body containing a gas. A substrate holding device having a mechanism for holding a substrate and fixing the position by sandwiching the substrate from both upper and lower sides. 【請求項２】請求項１記載の基板保持装置に於いて気体
を内包した弾性体の上下の圧力を制御することにより基
板のレベリング及びフォーカス位置の設定を行う機構を
有することを特徴とする基板保持装置。2. The substrate holding device according to claim 1, further comprising a mechanism for leveling the substrate and setting a focus position by controlling the upper and lower pressures of an elastic body containing a gas. Holding device.