JPH05195279A - Air penetrative electrocasting mold and its production - Google Patents
Air penetrative electrocasting mold and its productionInfo
- Publication number
- JPH05195279A JPH05195279A JP1134592A JP1134592A JPH05195279A JP H05195279 A JPH05195279 A JP H05195279A JP 1134592 A JP1134592 A JP 1134592A JP 1134592 A JP1134592 A JP 1134592A JP H05195279 A JPH05195279 A JP H05195279A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- electroformed
- mold
- porous layer
- porous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、電鋳金型とその製造
方法に関し、特に、プラスチックの成形型に好適な通気
性電鋳金型とその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroformed mold and a method for manufacturing the same, and more particularly to an air-permeable electroformed mold suitable for a plastic mold and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】ブロー成形、真空成形などに用いられる
電鋳金型には、成形用材料であるパリソンあるいは加熱
したシートから発生するガスや型内の空気を抜く微細な
孔が多数設けられている。これらの孔は、金型を作成し
た後に微細なドリルなどで機械的にあけるか、あるいは
型自体を多孔質体として電気鋳造するなどして電気化学
的にあけられている。2. Description of the Related Art Electroforming molds used for blow molding, vacuum forming, and the like are provided with a large number of fine holes for removing gas generated from a parison as a molding material or a heated sheet and air in the mold. .. These holes are formed electrochemically by forming a mold and then mechanically opening it with a fine drill, or by electroforming the mold itself as a porous body.
【０００３】しかし、プラスチックの成形時に金型にか
かる圧力に耐えなくてはならないので、型としては相当
な肉厚となり、前者の方法では孔を明けることが難しく
コスト、日数がかかりすぎていた。後者の方法では、電
気化学的に行うので使用時の成形圧力に耐える肉厚にす
るためには相当の日数を必要とし、またその過程で当初
にはあいていた孔が閉塞してしまうなどの問題点があっ
た。However, since the pressure applied to the mold at the time of molding the plastic must be endured, the mold has a considerable thickness, and it is difficult to form a hole by the former method, and it takes too much time and cost. Since the latter method is performed electrochemically, it takes a considerable number of days to make the wall thick enough to withstand the molding pressure during use. There was a problem.
【０００４】[0004]
【発明が解決しようとする課題】よって、この発明は、
従来の通気性電鋳金型にかかるコスト・製作日数の過剰
さおよび連通孔の明けにくさ等の問題点を解消した通気
性電鋳金型およびその製造方法を提供することを目的と
する。Therefore, the present invention is
An object of the present invention is to provide a breathable electroformed mold and a method for producing the same, which solves the problems of the cost, the excessive number of manufacturing days, the difficulty of opening the communication hole, and the like in the conventional breathable electroformed mold.
【０００５】[0005]
【課題を解決するための手段】この発明によれば、前述
した目的を達成するために、電鋳体の第１層を薄く電着
させ、次いで、あるいはそのような電着層を設けずに最
初から、多孔質層を連続して電着することにより、表裏
貫通する連通孔の生成および作成を容易にし、一方、電
着層自体が薄いために不足する強度を補強すべく裏面か
らエポキシなどの樹脂などで補強する際に、流体を連通
孔から流出させておくことで、もともとの連通孔を確保
しながら、樹脂充填層などの補強用充填層にも引続いて
あらたに連通孔を形成できるようにするのである。According to the invention, in order to achieve the above-mentioned object, the first layer of the electroformed body is electrodeposited thinly and then, or alternatively, without such an electrodeposited layer. From the beginning, by continuously electrodepositing the porous layer, it is easy to create and create communicating holes that penetrate the front and back, while the electrodeposited layer itself is thin, so that the backside is reinforced with epoxy to reinforce the insufficient strength. When reinforcing with resin etc., by letting the fluid flow out from the communication hole, the original communication hole is secured and a new communication hole is continuously formed in the reinforcing filling layer such as the resin filling layer. Make it possible.
【０００６】ここに、この発明は、より具体的には、薄
く電着させた第１電鋳層と、その上に連続して電着させ
た多孔質層の第２電鋳層とから成る電鋳体に、表裏貫通
する連通孔を設け、それらの連通孔に流体を流しなが
ら、例えば、多孔質層の側でない電鋳体の面に、その端
が密着する箱のような流体溜めを設け、その流体溜めに
流体（例：圧縮空気）を供給しながら、充填材、例えば
固形物のチップなどを混入したエポキシ樹脂などを電鋳
体の多孔質層の側に充填・積層することにより、連通孔
を塞ぐことなく電鋳体を補強し、両者を一体として形成
した通気性電鋳金型とその製造方法である。More specifically, the present invention comprises a thin electro-deposited first electroformed layer and a second electro-formed layer of a porous layer continuously electrodeposited thereon. The electroformed body is provided with communication holes penetrating the front and back, and while flowing a fluid through these communication holes, for example, a surface of the electroformed body not on the side of the porous layer is provided with a fluid reservoir such as a box whose ends are in close contact with each other. By providing a fluid (eg, compressed air) to the fluid reservoir and filling / stacking a filling material, for example, epoxy resin mixed with solid chips, on the porous layer side of the electroformed body. A gas-permeable electroformed mold in which an electroformed body is reinforced without blocking the communication hole and both are integrally formed, and a method for manufacturing the same.
【０００７】別の面からは、この発明は、表裏貫通する
連通孔を設けた電鋳体の連通孔に流体を供給しながら、
例えば一方の側の孔の径を他方の側の孔の径より大きく
した多孔質の電鋳体の金型の面に、つまり孔の径が小さ
い側に例えばその端が密着する流体溜め（例：箱）を設
け、その流体溜めに流体（例：圧縮空気）を供給しなが
ら、固形物のチップなどを混入したエポキシ樹脂などを
該電鋳体の反対の側に充填・積層することにより、連通
孔を塞ぐことなく電鋳体を補強し、両者を一体として成
形した通気性電鋳金型とその製造方法である。From another aspect, according to the present invention, while supplying a fluid to a communication hole of an electroformed body having a communication hole penetrating the front and back sides,
For example, on the surface of the die of a porous electroformed body in which the diameter of the hole on one side is made larger than the diameter of the hole on the other side, that is, on the side where the diameter of the hole is small : A box is provided, and while supplying a fluid (eg, compressed air) to the fluid reservoir, by filling and laminating an epoxy resin mixed with solid chips on the opposite side of the electroformed body, The gas-permeable electroformed mold is obtained by reinforcing the electroformed body without blocking the communication hole and integrally molding the both, and a method for manufacturing the same.
【０００８】[0008]
【作用】以下、添付図面を参照しながら、この発明の構
成を作用と共に説明する。The structure of the present invention will be described below with reference to the accompanying drawings.
【０００９】この発明にかかる通気性電鋳金型の用途は
特に限定されない。例えば前述のプラスチック成形用の
金型、など所望の金型に使用し得る。また、各電鋳層を
構成する金属も限定されるものではなく、ニッケルなど
電気鋳造が可能なものならば如何なる金属でも使用でき
る。The use of the breathable electroformed mold according to the present invention is not particularly limited. For example, it can be used in a desired mold such as the above-mentioned mold for molding plastic. The metal forming each electroformed layer is not limited, and any metal that can be electroformed, such as nickel, can be used.
【００１０】この発明により電鋳金型を製造するに当た
っては、まず、所望の形状を有する基体を用意する。こ
の基体を構成する材料は特に限定されるものではない
が、後述するように、この基体は鋳造される電鋳体から
剥離するものであるから、再使用を意図しない限り安価
な材料、例えばエポキシ樹脂、ポリエステル樹脂、フェ
ノール樹脂、尿素樹脂など容易に所定の形状に付形でき
るプラスチックが好便に使用できる。In manufacturing an electroforming mold according to the present invention, first, a substrate having a desired shape is prepared. The material constituting the base is not particularly limited, but as will be described later, since the base is separated from the electroformed body to be cast, an inexpensive material such as epoxy is used unless it is intended to be reused. Resin, polyester resin, phenol resin, urea resin, and other plastics that can be easily shaped into a predetermined shape can be conveniently used.
【００１１】この基体は、例えば、自動車のドアトリム
など所定の表面形状に、製品モデルの反転型などを利用
し、エポキシ樹脂などによって複製される。この基体を
構成するエポキシ樹脂は、本来的に絶縁体であることか
ら、その転写予定表面に銀鏡反応などで連続する被膜状
の導電層を形成する。This substrate is duplicated with an epoxy resin or the like on a predetermined surface shape such as a door trim of an automobile by using an inverted type of a product model. Since the epoxy resin that constitutes this substrate is an insulator by nature, a continuous film-like conductive layer is formed on the surface to be transferred by silver mirror reaction or the like.
【００１２】次に、この基体を所定の電解液からなる電
鋳浴に入れ、電鋳を行う。電鋳体の電着厚さが所定の厚
さになったと判断したら（以下、このときまでに得られ
る電鋳層を第１電鋳層という）、例えば後述するような
多孔質層電鋳用の電鋳浴へ入れ換えるなどして、多孔質
層の電鋳層（以下、第２電鋳層という）を電着させる。
多孔質層の電鋳層が所定の厚さ、形状になったと判断し
たら電鋳浴から出し、基体から電着した電鋳体をその形
状を損なわないように注意して剥ぎ取る。Next, this substrate is placed in an electroforming bath made of a predetermined electrolytic solution to perform electroforming. When it is judged that the electrodeposited thickness of the electroformed body has reached a predetermined thickness (hereinafter, the electroformed layer obtained up to this point is referred to as the first electroformed layer), for example, for porous layer electroforming as described below. The electroformed layer of the porous layer (hereinafter referred to as the second electroformed layer) is electrodeposited by, for example, replacing the electroformed bath.
When it is judged that the electroformed layer of the porous layer has a predetermined thickness and shape, it is taken out from the electroforming bath, and the electroformed body electrodeposited from the substrate is carefully peeled off so as not to impair the shape.
【００１３】なお、電鋳作業において、基体表面に被膜
状の導電層を形成した後に特開昭50−141540号公報に開
示されている方法などにより、導電層の上に電鋳体が多
孔質層となるような処理をした後に電鋳浴にいれてもよ
く、その場合には前述の第１電鋳層は形成されず、多孔
質層の第２電鋳層のみとなる。In the electroforming process, after forming a film-like conductive layer on the surface of the substrate, a porous electroformed body is formed on the conductive layer by a method disclosed in JP-A-50-141540. It may be placed in an electroforming bath after being treated to form a layer, in which case the above-mentioned first electroformed layer is not formed and only the second electroformed layer of the porous layer is formed.
【００１４】また第２電鋳層を形成するのに多孔質層電
鋳用の電鋳浴に移し替えずに同一の電鋳浴で多孔質層の
電鋳を行ってもよい。第２電鋳層が所定の厚さになった
ところで電鋳体を電鋳浴から取り出し、基体から取り外
して電鋳体を得る。このようにして出来上がった電鋳体
の必要な箇所にドリルなどで孔明けを行い、電鋳体の表
裏を貫通した連通孔を設ける。孔明けの作業は第１電鋳
層を薄く形成してある場合、従来技術によるよりもはる
かに容易にできることは言うまでもない。もちろん、多
孔質層のみである場合は改めて連通孔を明ける必要はな
い。In order to form the second electroformed layer, the porous layer may be electroformed in the same electroforming bath without being transferred to the electroforming bath for electroforming the porous layer. When the second electroformed layer has a predetermined thickness, the electroformed body is taken out of the electroforming bath and removed from the base body to obtain an electroformed body. A hole or the like is drilled at a required portion of the electroformed body thus formed to provide communication holes penetrating the front and back of the electroformed body. It goes without saying that the drilling operation can be done much easier than with the prior art if the first electroformed layer is made thin. Of course, when only the porous layer is used, it is not necessary to reopen the communication hole.
【００１５】次いで、孔を明けた電鋳体の多孔質層の面
に樹脂層などの補強用の充填層を設けるのであるが、図
１に示すように、補強用樹脂の充填・積層作業は、電鋳
体の基体から剥離した面10 (以下、金型面という) にそ
の端が密着する流体溜めである空気箱12を設け、電鋳体
14とこの空気箱12との接着面16をシールした後その空気
箱12に圧縮空気などの流体を供給し、予めこの電鋳体14
に設けた連通孔より矢印方向に圧縮空気を吹き出させな
がら、好ましくはアルミニウムチップなどを混入したエ
ポキシ樹脂などの強化用充填材を該電鋳体の多孔質の面
(以下、裏面という) に充填・積層する。流体としては
場合によってはチッ素ガスなどであってもよい。Next, a reinforcing filling layer such as a resin layer is provided on the surface of the porous layer of the electroformed body having holes, and as shown in FIG. 1, the filling and laminating work of the reinforcing resin is performed. The surface of the electroformed body separated from the base body (hereinafter referred to as the mold surface) is provided with an air box 12 which is a fluid reservoir whose end is in close contact with the electroformed body.
After sealing the adhesive surface 16 between the air box 12 and the air box 12, a fluid such as compressed air is supplied to the air box 12, and the electroformed body 14 is previously formed.
While blowing out compressed air in the direction of the arrow from the communication hole provided in, the reinforcing surface of the electroformed body is preferably filled with a reinforcing filler such as an epoxy resin mixed with an aluminum chip or the like.
Fill and stack (hereinafter referred to as the back surface). Depending on the case, the fluid may be nitrogen gas or the like.
【００１６】樹脂はアルミニウムチップなどの表面に付
着し、チップの働きにより空間を作りながら硬化する。
硬化の過程において、チップの表面に付着し過剰になっ
た樹脂は電鋳体の上に溜まるが、予め電鋳体に明けられ
た連通孔から圧縮空気が吹き出しているので連通孔は詰
まることなく電鋳体の製品面から樹脂層の表面まで貫通
した孔を保持・形成しつつ硬化する。The resin adheres to the surface of an aluminum chip or the like and is cured by the function of the chip while forming a space.
During the curing process, excess resin that adheres to the surface of the chip accumulates on the electroformed body, but compressed air is blown out from the communication hole that was opened in the electroformed body in advance, so the communication hole does not become blocked. It cures while holding and forming holes that penetrate from the product surface of the electroformed product to the surface of the resin layer.
【００１７】樹脂はその重みで多孔質電鋳層の中に流れ
込み、空気の流れ出している孔は残すものの電鋳体を包
み込んで硬化するために、アンカー効果により電鋳体と
樹脂とは強固に接合され、一体化されて補強層を形成す
る。充填材としては、その他セメントなどを使用しても
よい。図２は、このようにして得られた電鋳金型20の一
部の断面を模式的に示す。The resin flows into the porous electroformed layer due to its weight, and the holes in which air is flowing out are left, but the electroformed body is wrapped and cured, so that the electroformed body and the resin are firmly fixed by the anchor effect. Bonded and integrated to form a reinforcing layer. Other fillers such as cement may be used. FIG. 2 schematically shows a cross section of a part of the electroformed mold 20 thus obtained.
【００１８】第１電鋳層21上には多孔質層の第２電鋳層
22が設けられており、この第１電鋳層21には補強用充填
層24の充填に先立って連通孔26が多数設けられ、この連
通孔26は補強用充填層24にも引続いて貫通して設けら
れ、表裏を貫通している。なお、図示例では補強用充填
層24には樹脂層28とアルミニウムチップ30とが充填され
ているが、これは樹脂層だけであってもよい。A second electroformed layer of a porous layer is formed on the first electroformed layer 21.
22 is provided, and the first electroformed layer 21 is provided with a large number of communication holes 26 prior to the filling of the reinforcing filling layer 24, and the communicating holes 26 also penetrate the reinforcing filling layer 24. It is provided and penetrates the front and back. In the illustrated example, the reinforcing filling layer 24 is filled with the resin layer 28 and the aluminum chip 30, but this may be only the resin layer.
【００１９】[0019]
【実施例】次に、この発明をその実施例によってさらに
具体的に説明する。ただし、この発明は実施例によって
何ら限定されるものではない。Next, the present invention will be described more specifically by way of its examples. However, the present invention is not limited to the embodiments.
【００２０】実施例１ エポキシ樹脂により、自動車用ドアトリムの形状を有す
る基体を製作した。その上に銀鏡反応により、銀の薄膜
からなる導電層を形成した。これを陰極とする一方、陽
極としてニッケル板を使用し、次に記す組成のニッケル
電鋳浴で電鋳を行った。 電鋳液: スルファミン酸ニッケル 300〜600 g/
l 塩化ニッケル ５〜10 g/l 硼酸 30〜40 g/l 応力減少剤 微量 pH ３〜４ 電流密度 0.5〜1.0 A/dm2 上記で２日間電着後、この電鋳浴へポリテトラフルオロ
エチレン微粒子を懸濁させ、1.0 A/dm2 の電流密度で４
日間多孔質電鋳体の電着を行った。Example 1 A substrate having the shape of an automobile door trim was manufactured from an epoxy resin. A conductive layer made of a thin film of silver was formed on it by a silver mirror reaction. While using this as a cathode, a nickel plate was used as an anode, and electroforming was performed in a nickel electroforming bath having the composition described below. Electroforming fluid: Nickel sulfamate 300-600 g /
l Nickel chloride 5-10 g / l Boric acid 30-40 g / l Stress reducer Trace amount pH 3-4 Current density 0.5-1.0 A / dm 2 After electrodeposition for 2 days at the above, polytetrafluoroethylene was added to this electroforming bath. Suspend the fine particles and apply a current density of 1.0 A / dm 2 to 4
Electrodeposition of the porous electroformed body was performed for a day.
【００２１】製造された電鋳体は、第１電鋳層の厚さが
0.2 〜0.5 mm、多孔質電鋳層である第２電鋳層の厚さが
２〜３mmであった。次いで、図１に示すようにして、電
鋳体の外周部分を全周にわたって乗せることができる大
きさの木製の空気箱を作り、この電鋳体の金型面を下に
してこの空気箱の上に乗せた。電鋳体の金型面とそれに
接する箱の上端を粘土あるいは市販のシール剤などによ
りシールし、さらに適当な方法で固定した後に、空気箱
内に約２kg/cm2の圧縮空気を供給した。The produced electroformed body has a thickness of the first electroformed layer.
The thickness of the second electroformed layer, which is a porous electroformed layer, was 0.2 to 0.5 mm and 2 to 3 mm. Next, as shown in FIG. 1, a wooden air box of a size that allows the outer peripheral portion of the electroformed body to be placed over the entire circumference is made, and the mold surface of the electroformed body is faced down to I put it on top. The mold surface of the electroformed body and the upper end of the box in contact with it were sealed with clay or a commercially available sealant, and after fixing by an appropriate method, compressed air of about 2 kg / cm 2 was supplied into the air box.
【００２２】シールした部分からの圧縮空気の漏れがな
く、且つ電鋳体に形成した連通孔から圧縮空気が出てく
ることを確認した後、固形物のチップを混入した樹脂を
多孔質電鋳体の上に裏面から充填・積層した。空気箱に
は木箱を、固形物のチップにはアルミニウムのチップ
を、樹脂にはエポキシ樹脂を使用したが、これらに限ら
ず他の同等のものを使用できることは言うまでもない。
なお、チップの大きさは直径約２mm、長さ８〜10mmのも
のを使用した。After confirming that the compressed air does not leak from the sealed portion and the compressed air comes out from the communicating hole formed in the electroformed body, the resin mixed with the solid chips is porous electroformed. It was filled and laminated from the back on the body. Although the wooden box was used for the air box, the aluminum chip was used for the solid chips, and the epoxy resin was used for the resin, it goes without saying that other equivalents can be used.
The tip used had a diameter of about 2 mm and a length of 8 to 10 mm.
【００２３】得られた補強済の電鋳金型は、樹脂層と電
鋳層との密着力は十分であり、第１電鋳層の連通孔に引
続いて補強材の充填時に形成された表裏に貫通した所定
の連通孔も確保でき、さらに、金型全体の強度も何らバ
ックアップ手段を設けることなく、そのまま金型支持装
置に装着できる程であった。The reinforced electroformed mold thus obtained has a sufficient adhesion between the resin layer and the electroformed layer, and the front and back surfaces formed during the filling of the reinforcing material following the communication holes of the first electroformed layer. It was possible to secure a predetermined communication hole penetrating to the mold, and the strength of the mold as a whole could be directly attached to the mold supporting device without providing any backup means.
【００２４】比較例１ 電鋳体に多孔質電鋳層を設けなかった以外は、実施例と
同様に行った。この場合、電鋳体と樹脂との貫通孔はで
きたが、電鋳体に多孔質層がないのでアンカー効果が得
られないため、電鋳体と樹脂との接合が不十分であり、
容易に電鋳体と樹脂層とが剥がれてしまった。Comparative Example 1 The procedure of Example 1 was repeated except that the electroformed body was not provided with a porous electroformed layer. In this case, through-holes were formed between the electroformed body and the resin, but since the anchor effect cannot be obtained because the electroformed body does not have a porous layer, the joining between the electroformed body and the resin is insufficient,
The electroformed body and the resin layer were easily peeled off.
【００２５】比較例２ 樹脂を充填する場合に、圧縮空気を通さずにその他は実
施例と同様に行った。この場合、電鋳体と樹脂層との表
裏を貫通する貫通孔はほとんど得られなかった。そのた
め、通気性金型として使用することができなかった。機
械的に孔を設けても、充分な強度を持つ樹脂層は相当に
厚く、そこで電鋳体の連孔と同数の孔を明けることは至
難の技であって、到底実用的とは言えなかった。Comparative Example 2 The same procedure as in Example 1 was carried out except that compressed air was not passed when the resin was filled. In this case, almost no through holes penetrating the front and back of the electroformed body and the resin layer were obtained. Therefore, it could not be used as a breathable mold. Even if holes are mechanically formed, the resin layer having sufficient strength is considerably thick, and it is a difficult technique to open the same number of holes as the continuous holes of the electroformed body, and it is not practical at all. It was
【００２６】[0026]
【発明の効果】この発明は、以上詳述したように、通気
性電鋳金型の製造を、従来法の如くに貫通孔を設けるの
に多大なコスト日数をかけることなく、きわめて簡単な
手段、手法で製造可能とするものであり、工程的に優れ
るものである。その実用上の意義は大きい。As described in detail above, the present invention is an extremely simple means for manufacturing a gas permeable electroformed mold without spending a great number of days for forming a through hole as in the conventional method. It can be manufactured by a method and is excellent in process. Its practical significance is great.
【図１】この発明にかかる方法の１例の説明図である。FIG. 1 is an explanatory diagram of an example of a method according to the present invention.
【図２】この発明にかかる通気性電鋳金型の一部断面の
模式的説明図である。FIG. 2 is a schematic explanatory view of a partial cross section of a gas permeable electroformed mold according to the present invention.
Claims (4)
鋳層と、その上に連続して電着させた多孔質層の第２電
鋳層と、該多孔質層の側に設けられた補強用充填層とか
ら成る電鋳体であって、第１電鋳層の連通孔に引続いて
補強材の充填時に形成された、表裏貫通する連通孔を設
けたことを特徴とする通気性電鋳金型。1. A thin electro-deposited first electroformed layer constituting a die surface, a second electro-formed layer of a porous layer continuously electrodeposited thereon, and a side of the porous layer. An electroformed body comprising a reinforcing filling layer provided in the first electroforming layer, characterized in that a communication hole penetrating through the front and back is formed subsequent to the communication hole of the first electroformed layer when the reinforcing material is filled. Breathable electroformed mold to be.
層と、該多孔質層の金型面と反対の側に設けた補強用充
填層とから成る電鋳体であって、多孔質層の連通孔に引
続いて補強材の充填時に形成された、表裏貫通する連通
孔を設けたことを特徴とする通気性電鋳金型。2. An electroformed body comprising a porous layer having communication holes forming a mold surface and a reinforcing filling layer provided on the side of the porous layer opposite to the mold surface, wherein An air-permeable electroformed mold, characterized in that, following the communication holes of the quality layer, communication holes penetrating the front and back are formed when the reinforcing material is filled.
連続して電着させた多孔質層の第２電鋳層とから成る電
鋳体に、表裏貫通する連通孔を設け、該電鋳体の金型面
の側から流体を供給しながら、前記多孔質層の側に補強
用充填層を形成することを特徴とする通気性電鋳金型の
製造方法。3. An electroformed body comprising a thin electro-deposited first electro-formed layer and a second electro-formed layer of a porous layer which is continuously electro-deposited thereon, and has communication holes penetrating the front and back sides. A method for producing a gas permeable electroformed mold, comprising providing a reinforcing filling layer on the side of the porous layer while providing a fluid from the mold surface side of the electroformed body.
ら成る電鋳体に、該電鋳体の金型面の側から流体を供給
しながら、その反対の側に補強用充填層を形成すること
を特徴とする通気性電鋳金型の製造方法。4. A reinforcing filling layer is formed on the opposite side of an electroformed body composed of a porous layer having communication holes penetrating through the front and back sides while supplying fluid from the die surface side of the electroformed body. A method for manufacturing a breathable electroformed mold, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1134592A JP2913978B2 (en) | 1992-01-24 | 1992-01-24 | Breathable electroformed mold and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1134592A JP2913978B2 (en) | 1992-01-24 | 1992-01-24 | Breathable electroformed mold and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05195279A true JPH05195279A (en) | 1993-08-03 |
| JP2913978B2 JP2913978B2 (en) | 1999-06-28 |
Family
ID=11775451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1134592A Expired - Fee Related JP2913978B2 (en) | 1992-01-24 | 1992-01-24 | Breathable electroformed mold and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2913978B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5728284A (en) * | 1996-01-09 | 1998-03-17 | Ktx Co., Ltd. | Process for manufacturing a porous electroformed shell |
| WO2002043942A1 (en) * | 2000-11-30 | 2002-06-06 | Ceram Research Limited | Injection mould having a porous surface and method of using it |
| WO2008037501A3 (en) * | 2006-09-29 | 2008-10-30 | Faurecia Innenraum Sys Gmbh | Method for applying a nickel layer with fluoropolymer particles |
-
1992
- 1992-01-24 JP JP1134592A patent/JP2913978B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5728284A (en) * | 1996-01-09 | 1998-03-17 | Ktx Co., Ltd. | Process for manufacturing a porous electroformed shell |
| WO2002043942A1 (en) * | 2000-11-30 | 2002-06-06 | Ceram Research Limited | Injection mould having a porous surface and method of using it |
| WO2008037501A3 (en) * | 2006-09-29 | 2008-10-30 | Faurecia Innenraum Sys Gmbh | Method for applying a nickel layer with fluoropolymer particles |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2913978B2 (en) | 1999-06-28 |
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