JPH0518708Y2 - - Google Patents
Info
- Publication number
- JPH0518708Y2 JPH0518708Y2 JP1986055691U JP5569186U JPH0518708Y2 JP H0518708 Y2 JPH0518708 Y2 JP H0518708Y2 JP 1986055691 U JP1986055691 U JP 1986055691U JP 5569186 U JP5569186 U JP 5569186U JP H0518708 Y2 JPH0518708 Y2 JP H0518708Y2
- Authority
- JP
- Japan
- Prior art keywords
- tab
- printed circuit
- circuit board
- electrode pad
- rigid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000012360 testing method Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 description 10
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 239000000523 sample Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 229920006351 engineering plastic Polymers 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000737 Duralumin Inorganic materials 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920012287 polyphenylene sulfone Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Description
【考案の詳細な説明】
［産業上の利用分野］
本考案はタブ（TAB−）IC試験用治具、特に
は各種TAB−ICに適用できる汎用性に優れた治
具に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a tab (TAB-) IC testing jig, particularly to a highly versatile jig that can be applied to various TAB-ICs.
［従来の技術と問題点］
近年、市場におけるIC、LSI等の半導体装置の
高密度実装・軽薄小型化の要請により、TAB
（Tape Automated Bonding）と呼ばれるICキ
ヤリヤ方式が実用化されている。[Conventional technology and problems] In recent years, due to demands for high-density packaging and miniaturization of semiconductor devices such as ICs and LSIs in the market, TAB
An IC carrier method called (Tape Automated Bonding) has been put into practical use.
これは、主としてポリイミドフイルムからなる
テープ状絶縁フイルムと、該フイルムに形成され
た銅箔からエツチングによつて作られたリードフ
レームを使うもので、上記フイルムにコマ送りの
孔が形成され、フイルムの送りと位置合せが自動
化できる点に特徴がある。 This uses a tape-shaped insulating film mainly made of polyimide film and a lead frame made by etching from the copper foil formed on the film. Holes for frame-by-frame feeding are formed in the film, and the film is The feature is that feeding and alignment can be automated.
このTAB方式のICキヤリアは、100〜500にも
のぼる端子を一括してボンデイングでき、またパ
ツケージングとしては、パツシベーシヨン膜によ
つて保護されたICチツプそのものを実装するた
めに低背化が図れるという利点から、液晶テレビ
ジヨン用ドライバーや、一眼レフカメラ、ICカ
ード等、超小型機器用のICキヤリアとして普及
すると考えられている。 This TAB type IC carrier can bond as many as 100 to 500 terminals at once, and also has a low profile because it mounts the IC chip itself, which is protected by a bonding film. Because of its advantages, it is thought that it will become popular as an IC carrier for ultra-small devices such as drivers for LCD televisions, single-lens reflex cameras, and IC cards.
このようなTAB式ICキヤリアは、従来バネ式
ピンプローブによつて品質チエツクやバーンイン
試験が行われている。しかし、これによると、
１）バネ式ピンプローブはそれ自体高価なもので
あるため、装置そのものが高価なものとなる、
２）プローブの直径が最大1.5mm程度あるためプ
ローブの配置密度が限られ、ひいてはTAB式IC
キヤリアの設計をも制約する、３）プローブの先
端は鋭角であるために検査対象の配線パターンを
傷つけてしまう、４）プローブは固定盤に嵌合固
定されるが、固定盤に設けられる嵌合用穴部の位
置精度や高い寸法安定性が求められるばかりか、
バーンイン試験に供される場合には耐熱性をも合
せて要求されるが、検査対象品種毎に高価なバネ
式ピンプローブ治具を揃えなければならない等の
不利がある。 Conventionally, quality checks and burn-in tests are performed on such TAB type IC carriers using spring type pin probes. However, according to this
1) Since the spring type pin probe itself is expensive, the device itself is expensive.
2) The maximum diameter of the probe is about 1.5 mm, which limits the placement density of the probe, which may lead to a TAB type IC.
3) The tip of the probe is at an acute angle and will damage the wiring pattern being inspected. 4) The probe is fitted and fixed to a fixed plate, but the fitting plate provided on the fixed plate is Not only is positional accuracy and high dimensional stability of the hole required,
When subjected to burn-in tests, heat resistance is also required, but there are disadvantages such as the need to prepare expensive spring-type pin probe jigs for each product to be tested.
これに対し、LCC、PLCC、FP、SOP、MF等
のフラツトパツケージICのバーンイン試験装置
として、従来公知のソケツトバーインボードが
TAB−ICについても適用できると考えられるが、
これによるとTAB−ICはプラスチツク等によつ
てパツケーシングされているわけではないので、
プリント基板と電気的接続をとるために押圧する
部分を電極パツド部分に限定しなければならない
という不利を生じる。 In contrast, conventional socket burn-in boards are used as burn-in test equipment for flat package ICs such as LCCs, PLCCs, FPs, SOPs, and MFs.
It is thought that it can also be applied to TAB-IC, but
According to this, TAB-IC is not packaged with plastic etc.
A disadvantage arises in that the portion pressed to establish electrical connection with the printed circuit board must be limited to the electrode pad portion.
また、従来公知のソケツトレス方式によつて、
押圧部分を限定するためには、ICとプリント基
板を上下両面より挟持加圧するための剛性盤体に
凸状部を設けて実現できるが、その方式によれ
ば、TAB−IC電極パツドと同形状の加工を施
すことはコストアツプを招くし、逆に電極パツド
部分を含む一定面積を押圧することは電極パツド
部分に押圧力を集中させることができないため、
TAB−IC電極パツドとプリント基板の十分な接
続の信頼性を得るためには大きな押圧力と大型の
剛性盤体が必要となる、この方式によると異品
種ICに対して汎用性がなくなる、TAB−IC、
プリント基板および剛性盤体の三つを位置合せし
なければならないが、試験装置の使用開始直後は
正確な位置合せがなされても、基板の着脱を多数
回繰り返すと、位置決め穴や、位置決めピンが摩
耗して正確な位置合わせができなくなる、バー
ンイン試験に使用する場合は、剛性盤体とプリン
ト基板およびTAB−IC基材フイルムの熱膨張率
の違いによつて不要部分に押圧力がかかつてしま
い、隣接電極とのリークや、TABICが可撓性フ
イルム上に電極を形成している関係から微細パタ
ーンを破損してしまう、等の不利がある。 In addition, by the conventionally known socketless method,
In order to limit the pressing area, it can be achieved by providing a convex part on the rigid board that holds and presses the IC and printed circuit board from both the upper and lower sides, but according to that method, the shape is the same as that of the TAB-IC electrode pad. Processing increases costs, and conversely, pressing a fixed area that includes the electrode pad makes it impossible to concentrate the pressing force on the electrode pad.
In order to obtain sufficient connection reliability between the TAB-IC electrode pad and the printed circuit board, a large pressing force and a large rigid board are required.This method lacks versatility for different types of ICs. −IC,
The three parts, the printed circuit board and the rigid board, must be aligned, but even if the alignment is accurate immediately after starting to use the test equipment, if the board is attached and detached many times, the locating holes and locating pins may become loose. When used for burn-in tests, where accurate positioning becomes impossible due to wear, pressure may be applied to unnecessary areas due to the difference in thermal expansion coefficient between the rigid board, printed circuit board, and TAB-IC base film. However, there are disadvantages such as leakage with adjacent electrodes and damage to fine patterns because TABIC forms electrodes on a flexible film.
［問題点を解決するための手段］
本考案者らは前記従来の欠点に鑑み、その解決
する方法について種々検討した結果、TAB−IC
の電極パツドと同等のパターンで凸状部を有する
板材（以下押圧板と略称する。）を用いることに
より、異品種ICに対して、上記押圧板のみを
交換すればよいので、剛性盤体の汎用性に優れ、
単にTAB−IC、プリント基板、凸状部を有す
る押圧板を位置合わせし、剛性盤体で加圧挟持す
るだけのため、寸法精度を必要としないため、コ
ストダウンが図れる、位置決め穴、ピンが摩耗
して正確な位置決めができなくなつた場合でも、
プリント基板と前記押圧板のみを交換すればよ
い、押圧板の材質をプリント基板と同じものに
した場合には、バーンイン試験に使用した場合で
も、熱膨張率が同じであるために隣接電極とのリ
ークや、TAB−ICの配線パターンを破壊すると
いう心配がない、剛性盤体による加圧力を、
TAB−IC電極パターン部分に集中させることが
できるので、剛性盤体を小型軽量のものとするこ
とができる、等の利点を見出し、この押圧板、位
置決め方法、剛性盤体の種類、形状などについて
研究を進めた結果、本考案を完成した。すなわ
ち、本考案はTAB−ICを直接または異方導電性
シートを介してプリント基板上に載せ、TAB−
ICの電極パツドと同等もしくはより小さいパタ
ーンを凸状部として下面に有する板材をTAB−
IC上に対向させて積載し、プリント基板の下面
および板材の上面をそれぞれ剛性盤体で挟持して
加圧し、該タブICの電極パツドと該プリント基
板のパターン電極を電気的に接続するようにした
ことを特徴とするものである。[Means for solving the problems] In view of the above-mentioned conventional drawbacks, the present inventors investigated various ways to solve the problems, and as a result, TAB-IC
By using a plate material (hereinafter referred to as a pressure plate) that has convex portions in the same pattern as the electrode pads, it is only necessary to replace the pressure plate for different types of ICs. Excellent versatility,
Because the TAB-IC, printed circuit board, and pressing plate with convex parts are simply aligned and clamped under pressure between rigid plates, dimensional accuracy is not required, reducing costs and eliminating the need for positioning holes and pins. Even if it becomes worn out and accurate positioning is no longer possible,
Only the printed circuit board and the pressure plate need to be replaced. If the pressure plate is made of the same material as the printed circuit board, even when used for a burn-in test, the coefficient of thermal expansion is the same, so there is no difference between the adjacent electrodes. There is no need to worry about leaks or damaging the TAB-IC wiring pattern, and the pressure applied by the rigid board is
We found advantages such as the ability to make the rigid plate smaller and lighter because the TAB-IC electrodes can be concentrated in the pattern area, and we have developed information on this press plate, positioning method, type and shape of the rigid plate, etc. As a result of research, the present invention was completed. In other words, the present invention mounts the TAB-IC on a printed circuit board either directly or via an anisotropic conductive sheet.
TAB-
The tab IC is stacked facing each other on the IC, and the lower surface of the printed circuit board and the upper surface of the board are sandwiched and pressurized by rigid disk bodies, respectively, and the electrode pads of the tab IC and the pattern electrodes of the printed circuit board are electrically connected. It is characterized by the fact that
本考案はこのように新規かつ実用的に優れた
TAB−IC試験用治具（バーンイン試験、バーン
イン試験前後に行われる特性評価試験等用）を提
供するものである。 This invention is novel and has practical advantages.
We provide TAB-IC test jigs (for burn-in tests, characteristic evaluation tests conducted before and after burn-in tests, etc.).
つぎに本考案のTAB−IC試験用治具を添付の
図面に基いて更に詳しく説明する。 Next, the TAB-IC test jig of the present invention will be explained in more detail based on the attached drawings.
第１図は本考案のTAB−IC試験治具の使用状
態を示す縦断面図、第２図はTAB−ICの平面図
の一例を示す図、第３図は配置状態を説明するた
めの斜視図、第４図は本考案の他の実施例におけ
るTAB−ICを二列併走状に試験するための治具
の縦断面図である。 Fig. 1 is a longitudinal cross-sectional view showing how the TAB-IC test jig of the present invention is used, Fig. 2 is a diagram showing an example of a plan view of TAB-IC, and Fig. 3 is a perspective view to explain the arrangement state. FIG. 4 is a longitudinal cross-sectional view of a jig for testing TAB-IC in two parallel rows according to another embodiment of the present invention.
本考案の治具は下側剛性盤体１と、上側剛性盤
体２が蝶番部３で開閉自在に相互に係合されてお
り、これらは蝶番部３の反対側のラツチ４でフツ
クされる。 In the jig of the present invention, a lower rigid plate 1 and an upper rigid plate 2 are engaged with each other at a hinge part 3 so as to be openable and closable, and these are hooked by a latch 4 on the opposite side of the hinge part 3. .
この剛性盤体１，２は鋼鉄、ステンレス綱、ア
ルミニウム、ジユラルミン（高力アルミニウム合
金）などの金属や耐熱性エンジニアリングプラス
チツクで成形され、これらのうちでも高温雰囲気
下で連続的に曲げ応力が加えられたときの耐クリ
ープ性にすぐれ、導通信頼性を得るための十分な
押圧力を長期にわたつて保持することのできる金
属とするのが好適である。 The rigid disk bodies 1 and 2 are made of metals such as steel, stainless steel, aluminum, and duralumin (high-strength aluminum alloy), or heat-resistant engineering plastics. It is preferable to use a metal that has excellent creep resistance when exposed to heat and can maintain a sufficient pressing force for a long period of time to obtain continuity reliability.
前記下側剛性盤体１上には、銅張ガラス布ポリ
イミド積層板や銅張ガラス布エポキシ樹脂積層板
などで作られた耐熱性プリント基板５が下側剛性
盤体１上の突起１′に嵌合して固定される。該基
板５上にはTAB−IC８の絶縁フイルムに設けら
れたフイルム送り用穴１１，１１や後述の押圧板
１０に設けられた位置決め孔に係合してプリント
基板５と位置合わせするためのピン６，６が形成
されている。該ピンは金属材料の他、例えばポリ
アミノビスマレイミド（PABM）、ビスマレイミ
ドトリアジン樹脂（BTレジン）、ポリアミドイ
ミド樹脂、ポリオキシベンゾイル樹脂、ポリアリ
レート樹脂、ポリサルホン樹脂、ポリエーテルス
ルホン樹脂、ポリフエニレンサルフアイド樹脂
（PPS）などのような耐熱性エンジニアリングプ
ラスチツクで形成される。 On the lower rigid board 1, a heat-resistant printed circuit board 5 made of a copper-clad glass cloth polyimide laminate, a copper-clad glass cloth epoxy resin laminate, etc. is attached to the protrusion 1' on the lower rigid board 1. They are fitted and fixed. On the board 5 are pins for aligning with the printed circuit board 5 by engaging with film feeding holes 11, 11 provided in the insulating film of the TAB-IC 8 and positioning holes provided in the pressing plate 10, which will be described later. 6,6 are formed. In addition to metal materials, the pins may be made of polyamino bismaleimide (PABM), bismaleimide triazine resin (BT resin), polyamideimide resin, polyoxybenzoyl resin, polyarylate resin, polysulfone resin, polyethersulfone resin, polyphenylene sulfone resin, etc. It is made of heat-resistant engineering plastics such as polyester resin (PPS).
次に、前記位置決めピン６，６には、必要に応
じて用いられる異方導電ゴムシート７が、ついで
TAB−IC８が、さらには押圧板１０がそれぞれ
に形成された孔を利用して位置決めした後、順次
嵌挿し積載される。 Next, an anisotropically conductive rubber sheet 7 is attached to the positioning pins 6, 6, if necessary.
After the TAB-ICs 8 and the press plates 10 are positioned using the holes formed in each, they are sequentially inserted and stacked.
なお、この異方導電ゴムシートとしては、耐熱
性の絶縁マトリツクス中に導電性繊維をシートの
厚み方向に配向配列してなるもの、導電性ゴムシ
ートと絶縁性ゴムシートとを互いにその接合面が
平行になるように交互多重に積層一体化してなる
ブロツク体を積層面に直角な方向に切り出してシ
ート状としたもの、あるいは導電性粒子をこれよ
り粒径の大きい絶縁性粒子とともに分散配合して
異方性をもたせたものなどが例示される。 The anisotropically conductive rubber sheet may be one in which conductive fibers are oriented in the thickness direction of the sheet in a heat-resistant insulating matrix, or a sheet in which a conductive rubber sheet and an insulating rubber sheet are bonded to each other so that their joint surfaces are aligned. A sheet made by cutting out a block made by laminating alternately multiple layers in parallel in a direction perpendicular to the laminated plane, or a sheet made by dispersing and blending conductive particles with insulating particles having a larger particle size. Examples include those with anisotropy.
上記異方導電ゴムシートはTAB−ICの電極パ
ツド１３と上記プリント基板のパターン電極１４
の大きさが相違する場合には確実な導通が得られ
るので好適に使用される。 The above anisotropic conductive rubber sheet is the electrode pad 13 of TAB-IC and the pattern electrode 14 of the above printed circuit board.
When the sizes of the two are different, reliable conduction can be obtained, so it is preferably used.
またTAB−IC８の位置決めピンへの嵌挿はフ
イルムを送り用穴１１，１１を利用して行なわれ
る。 Further, the TAB-IC 8 is inserted into the positioning pin by using the film feeding holes 11, 11.
押圧板１０は、好ましくは前記プリント基板と
同質の板材が用いられ、該押圧板上にはTAB−
ICの電極パツドと同等の凸状部１２が形成され、
上記積載に際しては凸状部１２が形成された面が
TAB−IC側に向けて載置される。 The pressing plate 10 is preferably made of the same material as the printed circuit board, and a TAB-
A convex portion 12 equivalent to the electrode pad of an IC is formed,
During the above-mentioned loading, the surface on which the convex portion 12 is formed is
It is placed facing the TAB-IC side.
凸状部１２は、TAB−ICの電極パツドより大
きいと押圧力をこれに集中することができないの
で、前記電極パツド１３と同等もしくはより小さ
いことが肝要である。また凸状部１２は、プリン
ト基板と同質の銅張積層板を、プリント基板製造
工程と同様の方法により、TAB−ICの電極パツ
ドと同等のパターンを残して銅箔をエツチングす
ることにより、簡便かつ精度よく形成することで
きる。 If the convex portion 12 is larger than the electrode pad of the TAB-IC, the pressing force cannot be concentrated on it, so it is important that the convex portion 12 is equal to or smaller than the electrode pad 13. The convex portion 12 can be easily formed by etching the copper foil of a copper-clad laminate of the same quality as the printed circuit board using a method similar to the printed circuit board manufacturing process, leaving a pattern similar to the electrode pads of the TAB-IC. Moreover, it can be formed with high precision.
また、本考案では剛性盤体によるプリント基板
およびTAB−ICの挟持を効果的に行うために、
上側と下側の剛性盤体１，２の対向面側に好まし
くは、ゴムパツクング９が配置される。該パツキ
ングはプリント基板、TAB−IC、異方導電性ゴ
ムシートの厚み公差や、押圧板、剛性盤体の成形
公差、反りなどを吸収して、TAB−ICをプリン
ト基板に押しつける働きをする。 In addition, in this invention, in order to effectively hold the printed circuit board and TAB-IC by the rigid board,
Preferably, rubber packings 9 are arranged on opposing surfaces of the upper and lower rigid plates 1, 2. The packing functions to absorb thickness tolerances of the printed circuit board, TAB-IC, anisotropically conductive rubber sheet, molding tolerances of the press plate, rigid disk, warping, etc., and press the TAB-IC against the printed circuit board.
次に本考案の実施例をあげるが、これは本考案
を限定するものではない。 Next, examples of the present invention will be given, but these are not intended to limit the present invention.
［実施例］
第３図に例示するようなTAB−IC８の1Chip
に対して２個の位置決めピン６，６を有する巾
120mm×長さ150mmのピストン基板５を製作した。
この基板にはTAB−ICが4Chip分搭載される。
ついで位置決めピンよりも小さな穴あけ加工を施
した異方導電性ゴムシート（信越ポリマー社製イ
ンターコネクターMAFタイプ）を位置決めピン
に係合して載置し、更にTAB−ICの4Chipカツ
ト品を位置決めピンによつて位置決めして載置し
た。更に、押圧板として銅箔厚み70μmの銅張績
層板をTAB−IC８の電極パツドよりも0.1mmだけ
小さいパターンとなるようにエツチングして板材
１０を得て凸状部をTAB−IC側に向けて積載し
た。つぎに、上記プリント基板のTAB−IC電極
部に相当する位置に応力１Kgｆが発生するように
厚み設計したシリコーンパツキング、GA−40
（信越ポリマー社製商品名）を４個接着した２枚
の剛性盤体をプリント基板の巾（120mm）方向に
梁りわたして前述の耐熱製エンジニアリングプラ
スチツクで成形したラツチで上記したプリント基
板を挟持させたところ、TAB−ICとプリント基
板は接触抵抗50mΩ以下の状態で100％電気的接
続が行なわれることが確認された。この操作は
150℃で96時間放置を10回繰り返しても変化がな
かつた。[Example] 1 chip of TAB-IC8 as illustrated in Fig. 3
Width with two positioning pins 6, 6 for
A piston board 5 of 120 mm x 150 mm in length was manufactured.
This board is equipped with 4 TAB-IC chips.
Next, an anisotropic conductive rubber sheet (interconnector MAF type manufactured by Shin-Etsu Polymer Co., Ltd.) with holes smaller than the locating pin is engaged and placed on the locating pin, and then a 4-chip cut product of TAB-IC is placed on the locating pin. It was positioned and placed. Furthermore, a copper clad laminate with a copper foil thickness of 70 μm was etched as a pressing plate so that the pattern was 0.1 mm smaller than the electrode pad of TAB-IC8 to obtain plate material 10, and the convex part was placed on the TAB-IC side. It was loaded towards. Next, we used silicone packing, GA-40, whose thickness was designed to generate a stress of 1 Kgf at the position corresponding to the TAB-IC electrode part of the printed circuit board.
(Product name manufactured by Shin-Etsu Polymer Co., Ltd.) Two rigid plates with four pieces glued together are stretched across the width (120 mm) of the printed circuit board, and the printed circuit board is held between the latches made of the heat-resistant engineering plastic mentioned above. It was confirmed that 100% electrical connection was made between the TAB-IC and the printed circuit board with a contact resistance of 50 mΩ or less. This operation
There was no change even after 10 repetitions of leaving it at 150°C for 96 hours.
第１図は本考案のTAB−IC試験治具の模式的
部分縦断面図、第２図はTAB−ICの一例の平面
図である。第３図は実施例におけるプリント基
板、異方導電性シート、TAB−IC、押圧板が位
置合わせされる様子を示す。第４図は本考案の他
の実施例を示す部分断面図である。
１，２……剛性盤体、５……プリント基板、７
……異方導電性シート、８……タブIC、１０…
…板材、１２……凸状部、１３……タブICの電
極パツド、１４……プリント基板のパターン電
極。
FIG. 1 is a schematic partial vertical sectional view of the TAB-IC test jig of the present invention, and FIG. 2 is a plan view of an example of the TAB-IC. FIG. 3 shows how the printed circuit board, anisotropically conductive sheet, TAB-IC, and press plate are aligned in the example. FIG. 4 is a partial sectional view showing another embodiment of the present invention. 1, 2... Rigid board, 5... Printed circuit board, 7
...Anisotropic conductive sheet, 8...Tab IC, 10...
... Plate material, 12 ... Convex portion, 13 ... Electrode pad of tab IC, 14 ... Pattern electrode of printed circuit board.
Claims (1)
してプリント基板上に載せ、タブICの電極パ
ツドと同等もしくはより小さいパターンを凸状
部として下面に有する板材をタブICに対向さ
せて積載し、プリント基板の下面および板材の
上面をそれぞれ剛性盤体で挟持して加圧し、該
タブICの電極パツドと該プリント基板のパタ
ーン電極を電気的に接続するようにしたことを
特徴とするタブIC試験用治具。 ２ タブICの電極パツドと同等もしくは、より
小さいパターンを凸状部として下面に有する板
材が、銅張積層板をエツチングして作られたも
のであることを特徴とする実用新案登録請求の
範囲第１項に記載のタブIC試験用治具。[Claims for Utility Model Registration] 1. A tab IC is a plate material that is mounted on a printed circuit board directly or via an anisotropic conductive sheet, and has a convex pattern on the bottom surface that is equal to or smaller than the electrode pad of the tab IC. The tab IC was stacked facing the IC, and the lower surface of the printed circuit board and the upper surface of the plate material were sandwiched and pressurized between rigid disk bodies, thereby electrically connecting the electrode pads of the tab IC and the pattern electrodes of the printed circuit board. A tab IC test jig characterized by: 2 Utility model registration claim No. 1 characterized in that the plate material having a convex pattern on the lower surface that is equal to or smaller than the electrode pad of a tab IC is made by etching a copper-clad laminate. Tab IC test jig described in Section 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986055691U JPH0518708Y2 (en) | 1986-04-14 | 1986-04-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986055691U JPH0518708Y2 (en) | 1986-04-14 | 1986-04-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62167176U JPS62167176U (en) | 1987-10-23 |
| JPH0518708Y2 true JPH0518708Y2 (en) | 1993-05-18 |
Family
ID=30883824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986055691U Expired - Lifetime JPH0518708Y2 (en) | 1986-04-14 | 1986-04-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0518708Y2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2522335B2 (en) * | 1987-12-18 | 1996-08-07 | 日本合成ゴム株式会社 | Integrated circuit component testing equipment |
| JP2936569B2 (en) * | 1988-12-07 | 1999-08-23 | 日本電気株式会社 | Sorting device |
| US4986760A (en) * | 1989-05-19 | 1991-01-22 | Minnesota Mining And Manufacturing Company | Socket for tab burn-in and test |
| JP2716663B2 (en) * | 1993-09-21 | 1998-02-18 | マイクロン・テクノロジー・インコーポレイテッド | Semiconductor die testing equipment |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS601574A (en) * | 1983-06-20 | 1985-01-07 | Ibiden Co Ltd | Jig circuit board for inspection of printed circuit board |
-
1986
- 1986-04-14 JP JP1986055691U patent/JPH0518708Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS601574A (en) * | 1983-06-20 | 1985-01-07 | Ibiden Co Ltd | Jig circuit board for inspection of printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62167176U (en) | 1987-10-23 |
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