JPH05182856A - Manufacture of chip component - Google Patents
Manufacture of chip componentInfo
- Publication number
- JPH05182856A JPH05182856A JP36145091A JP36145091A JPH05182856A JP H05182856 A JPH05182856 A JP H05182856A JP 36145091 A JP36145091 A JP 36145091A JP 36145091 A JP36145091 A JP 36145091A JP H05182856 A JPH05182856 A JP H05182856A
- Authority
- JP
- Japan
- Prior art keywords
- plating solution
- eroded
- protective layer
- chip component
- ceramic capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Ceramic Capacitors (AREA)
Abstract
Description
【発明の詳細な説明】
【０００１】
【産業上の利用分野】 本発明は、積層セラミックコン
デンサ等のチップ部品等の製造方法に関するものであ
る。
【０００２】
【従来の技術】 従来、コンデンサ等のチップ状部品
（以下、素子という）は、例えば、形成された積層セラ
ミックコンデンサ未焼成シートに内部電極シートを交互
に露出するように積層、焼成し、更に内部電極が露出し
た端面に外部電極を塗布、焼付けし、更に、外部電極の
半田付け性や、喰われ性を向上させるために、外部電極
にニッケルメッキ、半田メッキを施した素子が提案され
ている。
【０００３】
【発明が解決しようとする課題】 素子の外部電極が塗
布された両端部の上層にメッキを行なう場合、素子を構
成する材料によっては、メッキ液により外部の保護層が
浸食され素子の絶縁性や耐湿性などの特性が低下する
【０００４】
【課題を解決するための手段】 上記の欠点を解決する
ために本発明は、積層セラミックコンデンサ等の保護層
を十分に取り、メッキ液に侵食された部分を削除し、素
子の信頼性を向上させる。
【０００５】
【実施例】
【図１】は、メッキ液に侵食される部分を考慮し、更
に、メッキ液が、内部電極部分に浸透しないような厚さ
の保護層を持つように設計した素子。
【図２】は、外部電極を形成した図である。
【図３】は、外部電極を形成した時の断面図。
【図４】は、メッキ液に侵食された部分を削除し所定の
製品に仕上げた時の図。
【０００６】
【発明の効果】 この発明は、以上説明したように積層
セラミックコンデンサ等の保護層を十分に厚く取り、メ
ッキ液に侵食された部分を削除することによって、素子
としての絶縁性や耐湿性において、信頼性の高いものか
得られた。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing chip parts such as a monolithic ceramic capacitor. 2. Description of the Related Art Conventionally, a chip-shaped component (hereinafter, referred to as an element) such as a capacitor is laminated and fired, for example, so that internal electrode sheets are alternately exposed on a formed laminated ceramic capacitor unfired sheet. In addition, an external electrode is applied and baked on the end surface where the internal electrode is exposed, and a nickel plated or solder plated element is proposed for the external electrode in order to improve the solderability and erosion of the external electrode. Has been done. When plating the upper layers of both ends of the device where the external electrodes of the device are applied, the external protective layer may be eroded by the plating solution depending on the material of the device. In order to solve the above-mentioned drawbacks, the present invention sufficiently removes a protective layer such as a monolithic ceramic capacitor and uses a plating solution as a plating solution. The eroded portion is removed and the reliability of the device is improved. [FIG. 1] FIG. 1 shows an element designed in consideration of a portion eroded by a plating liquid, and further having a protective layer having a thickness such that the plating liquid does not penetrate into an internal electrode portion. . FIG. 2 is a diagram in which external electrodes are formed. FIG. 3 is a cross-sectional view when an external electrode is formed. FIG. 4 is a diagram when a portion which has been eroded by a plating solution is deleted and a predetermined product is finished. As described above, according to the present invention, the protective layer of a laminated ceramic capacitor or the like is made sufficiently thick and the portion corroded by the plating solution is removed, so that the insulation and moisture resistance of the element are reduced. In terms of sex, it was obtained that it was highly reliable.
【図面の簡単な説明】
【図１】 メッキ液に侵食される部分を考慮し、更に、
メッキ液が、素子内部に浸透しないような厚さの保護層
を持つように設計した素子。
【図２】 外部電極を形成した図
【図３】 外部電極を形成したときの断面図
【図４】 メッキ液に侵食された部分を削除し所定の製
品に仕上げた時の図
【符号の説明】
１ 保護層の中のメッキ液に侵食される部分
２ 保護層
３ 実際の製品部分
４ 内部電極
５ 外部電極
６ 銀電極
７ ニッケルメッキ
８ 半田メッキBRIEF DESCRIPTION OF THE DRAWINGS [FIG. 1] Considering a portion eroded by a plating solution,
An element designed to have a protective layer with a thickness that prevents the plating solution from penetrating inside the element. [FIG. 2] A diagram with external electrodes formed [FIG. 3] A cross-sectional view with external electrodes formed [FIG. 4] A diagram when parts that have been eroded by the plating solution have been deleted to finish the product into a specified product [Description of symbols] 1) A part of the protective layer that is eroded by the plating solution 2 Protective layer 3 Actual product part 4 Internal electrode 5 External electrode 6 Silver electrode 7 Nickel plating 8 Solder plating
Claims (1)
部品の外部電極の形成工程で、外部電極をメッキすると
きに、メッキ液に侵食された部分を削除する工程を含む
チップ部品の製造方法。What is claimed is: 1. A method of forming an external electrode of a chip component such as a monolithic ceramic capacitor, which comprises a step of removing a portion corroded by a plating solution when the external electrode is plated. Production method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36145091A JPH05182856A (en) | 1991-12-26 | 1991-12-26 | Manufacture of chip component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36145091A JPH05182856A (en) | 1991-12-26 | 1991-12-26 | Manufacture of chip component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05182856A true JPH05182856A (en) | 1993-07-23 |
Family
ID=18473637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP36145091A Pending JPH05182856A (en) | 1991-12-26 | 1991-12-26 | Manufacture of chip component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05182856A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120320493A1 (en) * | 2011-06-16 | 2012-12-20 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic component and manufacturing method thereof |
-
1991
- 1991-12-26 JP JP36145091A patent/JPH05182856A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120320493A1 (en) * | 2011-06-16 | 2012-12-20 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic component and manufacturing method thereof |
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