JPH05175177A - Method for cutting brittle material - Google Patents

Method for cutting brittle material

Info

Publication number
JPH05175177A
JPH05175177A JP33903791A JP33903791A JPH05175177A JP H05175177 A JPH05175177 A JP H05175177A JP 33903791 A JP33903791 A JP 33903791A JP 33903791 A JP33903791 A JP 33903791A JP H05175177 A JPH05175177 A JP H05175177A
Authority
JP
Japan
Prior art keywords
brittle material
material body
wire
cutting
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP33903791A
Other languages
Japanese (ja)
Inventor
Masayuki Sakai
雅之 酒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP33903791A priority Critical patent/JPH05175177A/en
Publication of JPH05175177A publication Critical patent/JPH05175177A/en
Withdrawn legal-status Critical Current

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  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE:To cut a brittle material along an inclined or cylindrical surface against the cutting direction of the material. CONSTITUTION:At the time of cutting a brittle material body 1 with wires 2 put around three rotary rollers 3, 4, and 5 by raising the body 1, the rollers 4 and 5 are made slidable in their length directions and the body 1 is raised against the wires 2 and, at the same time, at least one of the rollers 4 and 5 is moved in its length direction and at least part of the cut surface of the body 1 is inclined from the raising direction of the body 1. Or, the body 1 is fixed on a stage and raised against the wires 2 and, at the same time, the body 1 is moved or swung in the length direction of the body 1 so that at least part of the cut face of the body 1 can become an inclined or cylindrical surface against the raising direction of the body 1.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、走行するワイヤに研磨
剤を滴下しながら酸化物単結晶等の脆性材料体を板状に
切断する方法、特に、切断面を屈曲させたり湾曲させる
ことのできる切断方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of cutting a brittle material body such as an oxide single crystal into a plate shape while dropping an abrasive on a running wire, and more particularly, to bending or curving the cut surface. Regarding the cutting method that can be done.

【0002】[0002]

【従来の技術】現在、シリコン(Si)やニオブ酸リチュー
ム(LiNbO3)およびタンタル酸リチューム (LiTbO3) 等の
機能材料を用いた小形部品の用途が拡大している。この
ような脆性材料を薄板に切断(スライス)するには、従
来、ドーナツ形状のダイヤモンドカッター,ワイヤ(ピ
アノ線)または鋼製カッターと例えば炭化シリコンや酸
化アルミニウム等の研磨剤を組み合わせた切断方法が用
いられているが、それら従来の切断方法は脆性材料をス
テージに固定し、そのステージがカッターに向けて直線
運動するため、切断面は平面である。
2. Description of the Related Art Currently, the applications of small parts using functional materials such as silicon (Si), lithium niobate (LiNbO 3 ) and lithium tantalate (LiTbO 3 ) are expanding. In order to cut (slice) such a brittle material into a thin plate, conventionally, a cutting method in which a donut-shaped diamond cutter, a wire (piano wire) or a steel cutter is combined with an abrasive such as silicon carbide or aluminum oxide is used. Although used, these conventional cutting methods fix the brittle material to the stage, and the stage moves linearly toward the cutter, so that the cutting surface is flat.

【0003】[0003]

【発明が解決しようとする課題】最近は圧電振動素子等
において、素子基体材料の特性をより効果的に利用する
ため、円弧状に反ったり,断面くの字形の異形基体が望
まれるようになった。しかしながら、ワイヤ等を使用す
る従来の切断方法ではかかる要望に応えられないという
問題点があった。
Recently, in a piezoelectric vibrating element or the like, in order to more effectively utilize the characteristics of the element substrate material, a deformed substrate having an arcuate shape or a V-shaped cross section has been desired. It was However, there is a problem that the conventional cutting method using a wire or the like cannot meet the demand.

【0004】[0004]

【課題を解決するための手段】図1は本発明方法の基本
構成の説明図であり、図中において1は切断しようとす
る脆性材料体、2は矢印方向に走行するワイヤ(ピアノ
線)、3,4,5はワイヤ2を掛け渡した回転ローラであ
る。ワイヤ2を張設せしめ,ワイヤ2の走行速度と同一
周速で回転するローラ3,4,5には、ワイヤ2を掛け渡す
ための溝(図示せず)が形成されている。
FIG. 1 is an explanatory view of the basic constitution of the method of the present invention, in which 1 is a brittle material to be cut, 2 is a wire (piano wire) running in the arrow direction, Reference numerals 3, 4 and 5 are rotary rollers around which the wire 2 is stretched. Grooves (not shown) for spanning the wire 2 are formed in the rollers 3, 4, 5 which stretch the wire 2 and rotate at the same peripheral speed as the traveling speed of the wire 2.

【0005】図1(イ) において、ローラ3が回転するだ
けであるのに対し、ローラ4と5はその長さ方向に摺動
可能にする。そこで、ローラ3,4,5は回転させるだけと
し、ワイヤ2を走行せしめると共にワイヤ2(脆性材料
体1の上面)に研磨剤(図示せず)を滴下し、脆性材料
体1を上昇させると脆性材料体1は、その長さ方向に直
角な複数個の板状に切断される。
In FIG. 1 (a), the roller 3 only rotates, while the rollers 4 and 5 are slidable in the longitudinal direction. Therefore, when the rollers 3, 4, 5 are simply rotated, the wire 2 is made to travel, and an abrasive (not shown) is dropped on the wire 2 (the upper surface of the brittle material body 1) to raise the brittle material body 1. The brittle material body 1 is cut into a plurality of plate shapes that are perpendicular to the length direction.

【0006】次いで、ローラ3が回転しローラ4と5は
回転すると共に前進(または後退)するようにし、ワイ
ヤ2を走行せしめると共に脆性材料体1の上面に研磨剤
(図示せず)を滴下し、脆性材料体1を上昇させると脆
性材料体1は、その長さ方向に対し傾斜する複数個の板
状に切断される。
Next, the roller 3 is rotated and the rollers 4 and 5 are rotated and moved forward (or backward) so that the wire 2 is made to travel and an abrasive (not shown) is dropped on the upper surface of the brittle material body 1. When the brittle material body 1 is raised, the brittle material body 1 is cut into a plurality of plate shapes that are inclined with respect to the length direction.

【0007】さらに、ローラ3,4,5が回転する状態で脆
性材料体1の切断を開始し、切断途中でローラ4と5を
前進(または後退)するようにすれば、脆性材料体1は
その長さ方向に途中で屈曲するく字形断面の板状に切断
される。
Further, if the cutting of the brittle material body 1 is started with the rollers 3, 4, 5 rotating and the rollers 4 and 5 are advanced (or retracted) during the cutting, the brittle material body 1 is It is cut into a plate shape with a V-shaped cross section that bends partway along its length.

【0008】図1(ロ) において、ワイヤ2を走行せしめ
るローラ3,4,5が回転し、切断のため上昇する脆性材料
体1は、脆性材料体1の長さ方向に摺動可能、かつ、脆
性材料体1の長さ方向に揺動可能とする。
In FIG. 1B, the brittle material body 1 which is rotated by the rollers 3, 4, 5 for moving the wire 2 and rises for cutting is slidable in the longitudinal direction of the brittle material body 1, and The brittle material body 1 can be swung in the length direction.

【0009】そこで、ローラ3,4,5を回転せしめワイヤ
2を走行せしめると共に、ワイヤ2(脆性材料体1の上
面)に研磨剤(図示せず)を滴下し、脆性材料体1を単
に上昇せしめると脆性材料体1は、その長さ方向に直角
な複数個の板状に切断される。
Therefore, the rollers 3, 4, 5 are rotated to cause the wire 2 to travel, and an abrasive (not shown) is dropped on the wire 2 (the upper surface of the brittle material body 1) to simply raise the brittle material body 1. When squeezed, the brittle material body 1 is cut into a plurality of plate shapes perpendicular to the length direction.

【0010】次いで、脆性材料体1を上昇させると共
に、脆性材料体1を前進(または後退)せしめながら切
断すると脆性材料体1は、その長さ方向に対し傾斜する
複数個の板状に切断され、脆性材料体1を前進を切断途
中から開始すれば、脆性材料体1はその長さ方向に途中
で屈曲するく字形断面の板状に切断される。
Next, when the brittle material body 1 is lifted and cut while advancing (or retreating) the brittle material body 1, the brittle material body 1 is cut into a plurality of plate shapes inclined with respect to its length direction. If the forward movement of the brittle material body 1 is started in the middle of cutting, the brittle material body 1 is cut into a plate shape having a V-shaped cross section that bends in the lengthwise direction.

【0011】さらに、脆性材料体1を上昇させると共
に、脆性材料体1をその長さ方向に回動(所望方向への
揺動)させながら切断すると脆性材料体1は、その長さ
方向に対し湾曲した円筒面に切断され、脆性材料体1の
回動を切断途中から開始すれば、脆性材料体1はその長
さ方向に途中から円筒状に湾曲する。
Further, when the brittle material body 1 is lifted and cut while rotating the brittle material body 1 in the length direction (oscillation in a desired direction), the brittle material body 1 is moved in the length direction. If the brittle material body 1 is cut into a curved cylindrical surface and the rotation of the brittle material body 1 is started in the middle of cutting, the brittle material body 1 is curved in the longitudinal direction into a cylindrical shape from the middle.

【0012】[0012]

【作用】上記手段によれば、切断のため上昇する脆性材
料体に対し走行するワイヤを、脆性材料体の長さ方向へ
直線的に動かすまたは、脆性材料体を上昇せしめると同
時に脆性材料体をその長さ方向へ直線的に動かすことに
より、脆性材料体の切断面は脆性材料体の上昇方向(切
断方向)に対し傾斜せしめることができる。また、脆性
材料体を上昇せしめると同時に脆性材料体をその長さ方
向へ回動させることにより、脆性材料体の切断面を円筒
面にすることが可能になる。
According to the above means, the wire running against the rising brittle material body for cutting is moved linearly in the length direction of the brittle material body, or the brittle material body is raised and at the same time the brittle material body is raised. By linearly moving in the length direction, the cut surface of the brittle material body can be inclined with respect to the rising direction (cutting direction) of the brittle material body. Further, by raising the brittle material body and rotating the brittle material body in its length direction, it becomes possible to make the cut surface of the brittle material body a cylindrical surface.

【0013】その結果、圧電振動素子等において素子基
体材料の特性は、従来より効果的に利用できるようにな
る。
As a result, the characteristics of the element substrate material in the piezoelectric vibrating element and the like can be utilized more effectively than before.

【0014】[0014]

【実施例】図2は本発明の第1の実施例に係わる装置の
要部構成とその動作を説明するための図、図3は本発明
の第2の実施例に係わる装置の要部構成とその動作を説
明するための図、図4は本発明方法により切断した脆性
材料板の実施例を示す斜視図である。なお、図4におい
て一点鎖線では脆性材料体の長さ方向に直角に切断した
脆性材料板を示す。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 2 is a diagram for explaining a main part structure of a device according to a first embodiment of the present invention and its operation, and FIG. 3 is a main part structure of a device according to a second embodiment of the present invention. And FIG. 4 is a perspective view showing an embodiment of a brittle material plate cut by the method of the present invention. In FIG. 4, the alternate long and short dash line indicates the brittle material plate cut at right angles to the length direction of the brittle material body.

【0015】図2において、ローラ駆動機構部6より回
転ローラ3〜5が突出し、ローラ3が回転するだけであ
るのに対し、ローラ4と5は回転かつその長さ方向に摺
動可能である。脆性材料体1はステージ7に固定し、ス
テージ7を装着したテーブル8は従来のそれと同様に上
下動する。
In FIG. 2, the rotating rollers 3 to 5 project from the roller drive mechanism 6 and only the roller 3 rotates, whereas the rollers 4 and 5 are rotatable and slidable in the longitudinal direction thereof. . The brittle material body 1 is fixed to the stage 7, and the table 8 on which the stage 7 is mounted moves up and down as in the conventional case.

【0016】従って、ローラ4と5を摺動させることな
くテーブル8を上昇せしめ、脆性材料体1を、例えば4
mm/Hの速度で走行するワイヤ2と、研磨剤(例えばSi
Cの微細粉末を油で溶いたもの)を使用し切断すれば、
従来のワイヤ切断装置と同様に、ワイヤ2を走行せしめ
脆性材料体1の上面に研磨剤を滴下すれば、脆性材料体
1はその長さ方向に対し直角に切断される。
Therefore, the table 8 is raised without sliding the rollers 4 and 5, and the brittle material body 1, for example, 4
The wire 2 traveling at a speed of mm / H and an abrasive (for example, Si
If a fine powder of C is melted with oil) and cut,
Similar to the conventional wire cutting device, when the wire 2 is made to travel and the abrasive is dropped on the upper surface of the brittle material body 1, the brittle material body 1 is cut at a right angle to its length direction.

【0017】しかし、ワイヤ2を走行せしめると共に、
ローラ4と5を後退(または前進)せしめると図4(イ)
に示す如く、脆性材料体1より切断した脆性材料板31
は、脆性材料体1の長さ方向に直角な脆性材料板30に対
し、脆性材料体1の長さ方向に角度αだけ傾斜した形状
になる。
However, as the wire 2 is run,
When the rollers 4 and 5 are moved backwards (or forwards), Fig. 4 (a)
As shown in, the brittle material plate 31 cut from the brittle material body 1
Has a shape inclined with respect to the brittle material plate 30 perpendicular to the length direction of the brittle material body 1 by an angle α in the length direction of the brittle material body 1.

【0018】次いで、ローラ4と5の後退(または前
進)を脆性材料体1の切断途中で開始すれば、図4(ロ)
に示す如く、脆性材料体1より切断した脆性材料板32
は、その中間部から下方部分が、脆性材料板30に対し角
度βだけ傾斜した形状になる。
Next, if the backward movement (or forward movement) of the rollers 4 and 5 is started while the brittle material body 1 is being cut, FIG.
As shown in, the brittle material plate 32 cut from the brittle material body 1
Has a shape in which the lower part from the middle part is inclined with respect to the brittle material plate 30 by an angle β.

【0019】さらに、ローラ5のみ脆性材料体1の切断
途中で開始すれば、図4(ハ) に示す如く、脆性材料体1
より切断した脆性材料板33は、その中間部から下方の一
部分が傾斜した形状になる。
Further, if only the roller 5 is started during the cutting of the brittle material body 1, as shown in FIG.
The cut brittle material plate 33 has a shape in which a portion below the intermediate portion is inclined.

【0020】図3において、脆性材料体1を固定したス
テージ7はゴニオメータ10に装着する。ゴニオメータ10
は、パルスモータ11によって上下動する可動台12と、パ
ルスモータ13によって脆性材料体1の長さ方向に摺動す
る可動台14と、パルスモータ15によって脆性材料体1の
長さ方向に回動する可動テーブル16を具えてなる。
In FIG. 3, the stage 7 to which the brittle material body 1 is fixed is mounted on the goniometer 10. Goniometer 10
Is a movable table 12 that moves up and down by a pulse motor 11, a movable table 14 that slides in the longitudinal direction of the brittle material body 1 by a pulse motor 13, and a rotation in the longitudinal direction of the brittle material body 1 by a pulse motor 15. It is equipped with a movable table 16.

【0021】可動台16の下面は凸の円筒面であるのに対
し、可動台14の上面は凹の円筒面であり、パルスモータ
15を駆動したとき可動テーブル16の円筒面は、可動台14
の円筒面に反って揺動可能である。
The lower surface of the movable table 16 is a convex cylindrical surface, while the upper surface of the movable table 14 is a concave cylindrical surface.
When driven 15, the cylindrical surface of the movable table 16
It can be swung against the cylindrical surface of.

【0022】そこで、ローラ3〜5を回転させると共に
ステージ7を上昇せしめ、脆性材料体1を、例えば4mm
/Hの速度で走行するワイヤ2と、研磨剤(例えばSi C
の微細粉末を油で溶いたもの)を使用し切断すれば、従
来のワイヤ切断装置と同様に、ワイヤ2を走行せしめ脆
性材料体1の上面に研磨剤を滴下すれば、脆性材料体1
はその長さ方向に対し直角に切断される。
Therefore, the rollers 3 to 5 are rotated, and the stage 7 is raised to move the brittle material body 1 to, for example, 4 mm.
Wire 2 running at a speed of / H and an abrasive (eg SiC
If a fine powder of the above is melted with oil) and cut, the wire 2 is made to travel and an abrasive is dropped on the upper surface of the brittle material body 1 as in the conventional wire cutting device.
Is cut at right angles to its length.

【0023】次いで、ステージ7を上昇せしめると共に
パルスモータ13によって可動台14を(または前進)させ
ると、脆性材料体1より脆性材料板31または32が切断形
成されるようになる。
Next, when the stage 7 is raised and the movable table 14 is moved (or moved forward) by the pulse motor 13, the brittle material plate 31 or 32 is cut and formed from the brittle material body 1.

【0024】さらに、ステージ7を上昇せしめると共に
パルスモータ15によって可動台16を回動させると、例え
ば図4(ニ) に示す如く脆性材料体1より切断した脆性材
料板34は、脆性材料体1の長さ方向に直角な脆性材料板
30に対し、脆性材料体1の長さ方向に湾曲する円筒形状
となり、可動台16の揺動(所望方向への回動)操作を切
断途中で開始すれば図4(ホ) に示す脆性材料板35のよう
に、中間部から下方が円筒形状となる。
When the stage 7 is further raised and the movable table 16 is rotated by the pulse motor 15, the brittle material plate 34 cut from the brittle material body 1 as shown in FIG. Brittle material plate perpendicular to the length direction of
On the other hand, the brittle material body 1 has a cylindrical shape that curves in the lengthwise direction, and if the swinging (moving in a desired direction) operation of the movable table 16 is started during cutting, the brittle material shown in FIG. Like the plate 35, the lower part from the middle part has a cylindrical shape.

【0025】[0025]

【発明の効果】以上説明したように本発明方法によれ
ば、脆性材料体の切断に際し切断面は、切断方向に傾斜
面としたり円筒面にすることが可能となり、圧電振動素
子等において素子基体材料の特性を、従来より効果的に
利用できるようにした効果を有する。
As described above, according to the method of the present invention, when cutting a brittle material body, the cutting surface can be an inclined surface or a cylindrical surface in the cutting direction. It has an effect that the characteristics of the material can be utilized more effectively than ever before.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明方法の基本構成の説明図である。FIG. 1 is an explanatory diagram of a basic configuration of a method of the present invention.

【図2】 本発明の第1の実施例に係わる装置の要部構
成とその動作を説明するための図である。
FIG. 2 is a diagram for explaining a main part configuration and an operation of the device according to the first exemplary embodiment of the present invention.

【図3】 本発明の第2の実施例に係わる装置の要部構
成とその動作を説明するための図である。
FIG. 3 is a diagram for explaining a main part configuration and an operation of an apparatus according to a second exemplary embodiment of the present invention.

【図4】 本発明方法により切断した脆性材料板の実施
例を示す斜視図である。
FIG. 4 is a perspective view showing an embodiment of a brittle material plate cut by the method of the present invention.

【符号の説明】[Explanation of symbols]

1はワイヤを用いて切断する脆性材料体 2は脆性材料体を切断するワイヤ 3,4,5はワイヤを掛け渡して走行せしめる回転ローラ 7は脆性材料体を固定するステージ 16はステージを装着する可動テーブル 1 is a brittle material body that is cut using a wire 2 is a wire that cuts a brittle material body 3,4,5 is a rotating roller that runs across the wire 7 is a rotating roller 7 that fixes the brittle material body 16 is a stage Movable table

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 3本の回転ローラ(3,4,5) に掛け渡して
張設したワイヤ(2)を走行せしめ、該ワイヤ(2) に研磨
剤を滴下すると共に該ワイヤ(2) に向けて脆性材料体
(1) を上昇せしめることによって該脆性材料体(1) を切
断するのに際し、該脆性材料体(1) に対向する一対の該
回転ローラ(4,5) をその長さ方向に摺動可能とし、該一
対の回転ローラ(4,5) の少なくとも一方をその長さ方向
に摺動せしめ、該脆性材料体(1) の切断面の少なくとも
一部分を該脆性材料体(1) の上昇方向に対し傾斜面にす
ることを特徴とする脆性材料の切断方法。
1. A wire (2) stretched around three rotating rollers (3,4,5) is made to run, and an abrasive is dropped onto the wire (2) and the wire (2) is also dropped. Brittle material body
When the brittle material body (1) is cut by elevating (1), the pair of rotary rollers (4,5) facing the brittle material body (1) can slide in the longitudinal direction. At least one of the pair of rotating rollers (4,5) is slid in the longitudinal direction, and at least a part of the cut surface of the brittle material body (1) is moved in the rising direction of the brittle material body (1). A method for cutting a brittle material, which is characterized by forming an inclined surface.
【請求項2】 走行するワイヤ(2) に研磨剤を滴下しな
がら切断する脆性材料体(1) をステージ(7) に固定し、
該ワイヤ(2) に向けて上下動し,該ワイヤ(2) の走行方
向にほぼ直交する前後動が可能な可動テーブル(16)に該
ステージ(7)を装着し、該可動テーブル(16)の上昇動と
前後動との組み合わせによって、該脆性材料体(1) の切
断面の少なくとも一部分を該脆性材料体(1) の上昇方向
に対し傾斜面にすることを特徴とする脆性材料の切断方
法。
2. A brittle material body (1) for cutting while dropping an abrasive on a traveling wire (2) is fixed to a stage (7),
The stage (7) is mounted on a movable table (16) that moves up and down toward the wire (2) and can move back and forth substantially perpendicular to the traveling direction of the wire (2), and the movable table (16) Cutting of the brittle material, characterized in that at least a part of the cutting surface of the brittle material body (1) is inclined by the rising motion of the Method.
【請求項3】 走行するワイヤ(2) に研磨剤を滴下しな
がら切断する脆性材料体(1) をステージ(7) に固定し、
該ワイヤ(2) に向けて上下動し,該ワイヤ(2) の走行方
向にほぼ直交する方向に揺動可能な可動テーブル(16)に
該ステージ(7) を装着し、該可動テーブル(16)の上昇動
と所望方向への揺動との組み合わせによって、該脆性材
料体(1) の切断面の少なくとも一部分を円筒面にするこ
とを特徴とする脆性材料の切断方法。
3. A brittle material body (1) to be cut while dropping an abrasive on a traveling wire (2) is fixed to a stage (7),
The stage (7) is mounted on a movable table (16) that moves up and down toward the wire (2) and can swing in a direction substantially orthogonal to the traveling direction of the wire (2). A method for cutting a brittle material, characterized in that at least a part of the cut surface of the brittle material body (1) is made into a cylindrical surface by a combination of the ascending movement of (1) and a swing in a desired direction.
【請求項4】 走行するワイヤ(2) に研磨剤を滴下しな
がら切断する脆性材料体(1) をステージ(7) に固定し、
該ワイヤ(2) に向けて上下動し,該ワイヤ(2) の走行方
向にほぼ直交する前後動が可能であり,該前後動方向に
揺動可能な可動テーブル(16)に該ステージ(7) を装着
し、該可動テーブル(16)の上昇動と前後動または該可動
テーブル(16)の上昇動と所望方向への揺動との組み合わ
せによって、該脆性材料体(1) の切断面の少なくとも一
部分を該脆性材料体(1) の上昇方向に対して傾斜面にま
たは円筒面にすることを特徴とする脆性材料の切断方
法。
4. A brittle material body (1) for cutting while dropping an abrasive on a traveling wire (2) is fixed to a stage (7),
The stage (7) is mounted on a movable table (16) that moves up and down toward the wire (2) and can move back and forth substantially orthogonal to the running direction of the wire (2). ) Is attached to the cut surface of the brittle material body (1) by a combination of upward movement and forward / backward movement of the movable table (16) or upward movement of the movable table (16) and swing in a desired direction. A method for cutting a brittle material, characterized in that at least a part of the brittle material body (1) is inclined or cylindrical with respect to a rising direction.
JP33903791A 1991-12-20 1991-12-20 Method for cutting brittle material Withdrawn JPH05175177A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33903791A JPH05175177A (en) 1991-12-20 1991-12-20 Method for cutting brittle material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33903791A JPH05175177A (en) 1991-12-20 1991-12-20 Method for cutting brittle material

Publications (1)

Publication Number Publication Date
JPH05175177A true JPH05175177A (en) 1993-07-13

Family

ID=18323676

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33903791A Withdrawn JPH05175177A (en) 1991-12-20 1991-12-20 Method for cutting brittle material

Country Status (1)

Country Link
JP (1) JPH05175177A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004306250A (en) * 2003-04-01 2004-11-04 Hct Shaping Systems Sa Wire type slicing method and device
CN108788740A (en) * 2018-05-07 2018-11-13 巢湖市海风门窗有限公司 The positional dissection edging device of section steel cutting
CN108858388A (en) * 2018-05-07 2018-11-23 巢湖市海风门窗有限公司 The positional dissection cleaning device of section steel cutting
CN108890032A (en) * 2018-05-07 2018-11-27 巢湖市海风门窗有限公司 The cutting cleaning device of section steel cutting

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004306250A (en) * 2003-04-01 2004-11-04 Hct Shaping Systems Sa Wire type slicing method and device
JP4602679B2 (en) * 2003-04-01 2010-12-22 アプライド マテリアルズ スウィッツァランド ソシエテ アノニム Wire-type sawing method and apparatus
CN108788740A (en) * 2018-05-07 2018-11-13 巢湖市海风门窗有限公司 The positional dissection edging device of section steel cutting
CN108858388A (en) * 2018-05-07 2018-11-23 巢湖市海风门窗有限公司 The positional dissection cleaning device of section steel cutting
CN108890032A (en) * 2018-05-07 2018-11-27 巢湖市海风门窗有限公司 The cutting cleaning device of section steel cutting

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