JPH05174890A - Joining structure - Google Patents
Joining structureInfo
- Publication number
- JPH05174890A JPH05174890A JP4139626A JP13962692A JPH05174890A JP H05174890 A JPH05174890 A JP H05174890A JP 4139626 A JP4139626 A JP 4139626A JP 13962692 A JP13962692 A JP 13962692A JP H05174890 A JPH05174890 A JP H05174890A
- Authority
- JP
- Japan
- Prior art keywords
- electrode terminals
- conductive particles
- insulating coating
- electrode
- electrode terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Liquid Crystal (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】この発明は一対の基板に形成され
た一方の電極端子と他方の電極端子とを接合する接合構
造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a joining structure for joining one electrode terminal and the other electrode terminal formed on a pair of substrates.
【0002】[0002]
【従来の技術】従来、文字、図形、画像等の情報を表示
する表示装置として、例えば、図4に示す液晶表示装置
が知られている。この液晶表示装置は液晶表示パネル1
に半導体ユニット2を接合し、この半導体ユニット2で
液晶表示パネル1を駆動し、所要の情報を表示する。そ
して、液晶表示パネル1は上下一対の透明ガラス基板3
a、3bの対向面にITO(Indium Tin Oxide )等よ
りなる透明な電極を形成し、その間に液晶を封入すると
ともに、透明ガラス基板3a、3bの各端部が側方へ突
出し、この突出部に多数の接続用の電極端子4が形成さ
れている。また、半導体ユニット2はポリイミド等より
なる可撓性を有するフィルム基板5にIC、LSI等の
半導体チップ6を搭載しこのフィルム基板5の周縁に多
数の接続用の電極端子7がパターン形成されている。そ
して、液晶表示パネル1と半導体ユニット2とは、図5
に示すように接合されている。即ち、フィルム基板5に
形成されている電極端子7と透明ガラス基板3bに形成
されている電極端子4とが重なるように対向させ、その
間に異方性コネクター8を介在させて、接合している。
この異方性コネクター8は絶縁性を有する接着剤9に金
属粒子10を混入したものである。したがって、接合時
には、対向する電極端4と7との間に、金属粒子10が
挾まれ、この金属粒子10を介して、対向する電極端子
4と7とが導通するが、隣接する電極端子4、4及び
7、7間では導通せず、絶縁性が保持される。2. Description of the Related Art Conventionally, for example, a liquid crystal display device shown in FIG. 4 has been known as a display device for displaying information such as characters, figures and images. This liquid crystal display device has a liquid crystal display panel 1.
The semiconductor unit 2 is bonded to the semiconductor unit 2 and the liquid crystal display panel 1 is driven by this semiconductor unit 2 to display required information. The liquid crystal display panel 1 includes a pair of upper and lower transparent glass substrates 3
A transparent electrode made of ITO (Indium Tin Oxide) or the like is formed on the opposing surfaces of a and 3b, liquid crystal is enclosed between them, and each end of the transparent glass substrates 3a and 3b is projected laterally. A large number of electrode terminals 4 for connection are formed on. The semiconductor unit 2 has a flexible film substrate 5 made of polyimide or the like on which a semiconductor chip 6 such as an IC or LSI is mounted, and a large number of electrode terminals 7 for connection are patterned on the periphery of the film substrate 5. There is. The liquid crystal display panel 1 and the semiconductor unit 2 are shown in FIG.
It is joined as shown in. That is, the electrode terminal 7 formed on the film substrate 5 and the electrode terminal 4 formed on the transparent glass substrate 3b are opposed to each other so as to overlap with each other, and the anisotropic connector 8 is interposed therebetween to join them. ..
The anisotropic connector 8 is made by mixing an insulating adhesive 9 with metal particles 10. Therefore, at the time of bonding, the metal particles 10 are sandwiched between the opposing electrode ends 4 and 7, and the opposing electrode terminals 4 and 7 are conducted through the metal particles 10, but the adjacent electrode terminals 4 There is no conduction between 4 and 7 and 7, and the insulating property is maintained.
【0003】[0003]
【発明が解決しようとする課題】しかしながら、前記の
ような接合構造において、隣接する電極端子7、7及び
4、4をファインピッチ化(細密度化)するのに対応さ
せるため、異方性コネクター8の金属粒子10の数を多
くすると、対向する電極端子7と4の間の導通性は保た
れるが、隣接する電極端子7、7及び4、4間の絶縁性
が悪くなり、逆に、金属粒子10の数を少なくすると、
隣接する電極端子7、7及び4、4間の絶縁性はよくな
るが、対向する電極端子7と4との間の導通性が悪くな
る。そのため、このような接合構造では、隣接する電極
端子7、7及び4、4をファインピッチ化することが困
難であるという欠点があった。この発明は前記した事情
に鑑みてなされたもので、その目的とする処は、互いに
対向する電極端子間に確実かつ良好に導通させることが
できるとともに、電極端子のファインピッチ化を可能に
する接合構造を提供することにある。However, in the joint structure as described above, in order to deal with fine pitch (fine density) of the adjacent electrode terminals 7, 7 and 4, 4, the anisotropic connector is used. When the number of the metal particles 10 of 8 is increased, the electrical conductivity between the opposing electrode terminals 7 and 4 is maintained, but the insulating property between the adjacent electrode terminals 7, 7 and 4, 4 deteriorates, and conversely. , When the number of metal particles 10 is reduced,
The insulating property between the adjacent electrode terminals 7, 7 and 4, 4 is improved, but the electrical conductivity between the opposing electrode terminals 7 and 4 is deteriorated. Therefore, such a joint structure has a drawback that it is difficult to make the adjacent electrode terminals 7, 7 and 4, 4 fine pitched. The present invention has been made in view of the above-mentioned circumstances, and a purpose of the present invention is to provide a joint that can reliably and satisfactorily conduct electrical conduction between electrode terminals that face each other and that enables fine pitch of the electrode terminals. To provide the structure.
【0004】[0004]
【課題を解決するための手段】請求項1に記載の発明
は、熱溶融型の絶縁性接着剤中に導電粒子を混入してな
る異方性コネクターを、対向配置された電極端子間に介
在させて接合する接合構造において、少なくとも一方の
前記電極端子の表面を絶縁被膜で覆い、熱圧着時に前記
異方性コネクターの導電粒子が前記絶縁被膜を突き破っ
て、前記電極端子を導通させることを特徴とする。請求
項2に記載の発明は、熱溶融型の絶縁性接着剤中に導電
粒子を混入してなる異方性コネクターを、対向配置され
た電極端子間に介在させて接合する接合構造において、
前記導電粒子の表面全体を酸化絶縁被膜で覆い、熱圧着
時に酸化絶縁被膜が破られて前記電極端子が前記導電粒
子で導通されることを特徴とする。請求項3に記載の発
明は、熱溶融型の絶縁性接着剤中に導電粒子を混入して
なる異方性コネクターを、対向配置された電極端子間に
介在させて接合する接合構造において、前記導電粒子の
表面全体を熱可塑性樹脂が含まれる材料からなる絶縁被
膜で覆い、熱圧着時に前記絶縁被膜が破られて前記電極
端子が前記導電粒子で導通されることを特徴とする。According to a first aspect of the present invention, an anisotropic connector formed by mixing conductive particles in a heat-melting type insulating adhesive is interposed between electrode terminals arranged opposite to each other. In the joining structure for joining by joining, the surface of at least one of the electrode terminals is covered with an insulating coating, and the conductive particles of the anisotropic connector break through the insulating coating during thermocompression bonding to electrically connect the electrode terminals. And According to a second aspect of the present invention, there is provided a joint structure in which an anisotropic connector formed by mixing conductive particles into a heat-melting type insulating adhesive is interposed between electrode terminals arranged opposite to each other, and is joined.
The entire surface of the conductive particles is covered with an oxide insulating film, and the oxide insulating film is broken during thermocompression bonding so that the electrode terminals are electrically connected by the conductive particles. According to a third aspect of the present invention, there is provided a joint structure in which an anisotropic connector formed by mixing conductive particles in a heat-melting type insulating adhesive is interposed between electrode terminals arranged to face each other and is joined. The entire surface of the conductive particles is covered with an insulating coating made of a material containing a thermoplastic resin, the insulating coating is broken during thermocompression bonding, and the electrode terminals are electrically connected by the conductive particles.
【0005】[0005]
【実施例】以下、図1及び図2を参照して、この発明の
第1実施例を説明する。従来技術の項で示した図4及び
図5に記した部材と同構成及び作用を有する部材には同
符号を付すとともに、説明の重複を省く。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIGS. Members having the same configurations and functions as the members shown in FIGS. 4 and 5 shown in the section of the prior art are denoted by the same reference numerals, and duplicate description is omitted.
【0006】液晶表示パネル1の電極端子4は前記した
従来例と同様にITO等よりなり、その厚さが極めて薄
く形成されている。The electrode terminal 4 of the liquid crystal display panel 1 is made of ITO or the like as in the above-mentioned conventional example, and is formed to be extremely thin.
【0007】また、半導体ユニット2の電極端子7は銅
箔等をエッチングすることにより形成され、その厚さは
上述した液晶表示パネル1の電極端子4よりも極めて厚
く形成されており、その表面にディップ方式等によっ
て、熱硬化エポキシ樹脂等の絶縁被膜11が10μm程
度の厚さに形成されている。The electrode terminal 7 of the semiconductor unit 2 is formed by etching copper foil or the like, and the thickness thereof is much thicker than that of the electrode terminal 4 of the liquid crystal display panel 1 described above. An insulating coating 11 of thermosetting epoxy resin or the like is formed to a thickness of about 10 μm by a dip method or the like.
【0008】また、この電極端子4、7間に介在する異
方性コネクター12は絶縁性被膜11の厚さよりも大き
い直径のNi等よりなる硬い金属粒子10を絶縁性を有
する接着剤9に混入したものである。そして、電極端子
7、4とは、その間に異方性コネクター12を介して熱
圧着により接合されている。Further, the anisotropic connector 12 interposed between the electrode terminals 4 and 7 mixes hard metal particles 10 made of Ni or the like having a diameter larger than the thickness of the insulating coating 11 into the adhesive 9 having an insulating property. It was done. The electrode terminals 7 and 4 are joined by thermocompression bonding via the anisotropic connector 12 therebetween.
【0009】かくして、電極端子4、7が熱圧着によっ
て接合される際、電極端子4、7に挾まれた硬い金属粒
子10が電極端子7の表面の絶縁被膜11を突き破っ
て、電極端子4、7に夫々圧接し、電極端子4と7とを
導通する。一方、隣接する電極端子7、7間において
は、熱圧着の際に、金属粒子10が電極端子7の側面の
絶縁被膜11を突き破ることがないので、仮に隣接する
電極端子7、7間において、金属粒子10が相互に接触
し合って、金属粒子10同士が導通したとしても、隣接
する電極端子7、7間の絶縁性は確保される。このた
め、電極端子4、7のファインピッチ化が可能となる。
この場合、液晶表示パネル1の電極端子4はその厚さが
極めて薄いので、異方性コネクター12の金属粒子10
により隣接する電極端子4、4は導通することはない
が、この電極端子4、4の厚さが厚くなった場合には、
この表面にも上述した半導体ユニット2の電極端子7と
同様に絶縁被膜を施してもよい。Thus, when the electrode terminals 4, 7 are joined by thermocompression bonding, the hard metal particles 10 sandwiched between the electrode terminals 4, 7 pierce the insulating coating 11 on the surface of the electrode terminal 7, and 7 are pressed against each other to electrically connect the electrode terminals 4 and 7. On the other hand, between the adjacent electrode terminals 7, 7, since the metal particles 10 do not break through the insulating coating film 11 on the side surface of the electrode terminal 7 during thermocompression bonding, between the adjacent electrode terminals 7, 7, Even if the metal particles 10 are in contact with each other and the metal particles 10 are electrically connected to each other, the insulating property between the adjacent electrode terminals 7 is ensured. Therefore, the fine pitch of the electrode terminals 4 and 7 can be achieved.
In this case, since the electrode terminals 4 of the liquid crystal display panel 1 are extremely thin, the metal particles 10 of the anisotropic connector 12 are
Therefore, the adjacent electrode terminals 4 and 4 do not become conductive, but when the thickness of the electrode terminals 4 and 4 increases,
An insulating coating may be applied to this surface similarly to the electrode terminal 7 of the semiconductor unit 2 described above.
【0010】次に、図3を参照して、この発明の第2実
施例を説明する。図中、同じ構成・作用を有する部材に
は同符号を付し、説明の重複を省く。この実施例におい
ては、異方性コネクター13が絶縁性を有する接着剤9
とこの接着剤9内に混入された表面に絶縁被膜14を施
した金属粒子10とにより構成されている。Next, a second embodiment of the present invention will be described with reference to FIG. In the drawings, members having the same configuration and action are denoted by the same reference numerals, and duplicate description is omitted. In this embodiment, the anisotropic connector 13 has an insulating adhesive 9
And the metal particles 10 having the surface coated with the insulating coating 14 mixed in the adhesive 9.
【0011】この金属粒子10は半田粒子よりなり、こ
の金属粒子10の表面に酸化被膜よりなる絶縁被膜14
が施されている。The metal particles 10 are solder particles, and the surface of the metal particles 10 is an insulating film 14 made of an oxide film.
Has been applied.
【0012】そして、透明ガラス基板3bの上面及びこ
の上面に形成された電極端子4の表面に薄くフラックス
(界面活性剤)を塗布したものと、フィルム基板5及び
この裏面に形成された電極端子7とを絶縁被膜14を施
した金属粒子10を混入した接着剤9を介して、アライ
メントし、フィルム基板5の上面をヒータチップで押圧
することによって、透明ガラス基板3bの電極端子4と
フィルム基板5の電極端子7とが接合される。Then, thin transparent flux (surfactant) is applied to the upper surface of the transparent glass substrate 3b and the surface of the electrode terminal 4 formed on the upper surface, and the film substrate 5 and the electrode terminal 7 formed on the rear surface thereof. Are aligned through an adhesive 9 mixed with metal particles 10 coated with an insulating coating 14, and the upper surface of the film substrate 5 is pressed by a heater chip, whereby the electrode terminals 4 of the transparent glass substrate 3b and the film substrate 5 are aligned. And the electrode terminal 7 of are joined.
【0013】かくして、対向する電極端子4と7との間
において、酸化被膜からなる絶縁被膜14が温度とフラ
ックスとの効果で、破られて、金属粒子10が電極端子
4、7に接するとともに融着し、電極端子4と7とが導
通する。一方、隣接する電極端子4及び7は夫々の間に
おいては、熱圧着の際に、絶縁被膜14が破れないの
で、絶縁性が確保できる。Thus, between the opposing electrode terminals 4 and 7, the insulating coating 14 made of an oxide coating is broken by the effect of temperature and flux, and the metal particles 10 contact the electrode terminals 4 and 7 and melt. Then, the electrode terminals 4 and 7 are electrically connected. On the other hand, between the adjacent electrode terminals 4 and 7, since the insulating coating 14 is not broken during thermocompression bonding, the insulating property can be secured.
【0014】従って、電極端子4、7のファインピッチ
化が可能になる効果がある。なお、金属粒子10の表面
にディップ方式等により熱可塑性樹脂等よりなる絶縁被
膜14を形成してもよい。Therefore, there is an effect that the fine pitch of the electrode terminals 4 and 7 can be achieved. The insulating coating 14 made of thermoplastic resin or the like may be formed on the surface of the metal particles 10 by a dipping method or the like.
【0015】[0015]
【発明の効果】以上詳細に説明したように、請求項1〜
3に記載の発明によれば、一対の前記基板に形成された
対向する電極端子間において、対向する一対の前記電極
端子を確実かつ良好に通電させることができるととも
に、隣接する電極端子間においては、それ等の間の導通
を確実に防止でき、これにより、前記電極端子のファイ
ンピッチ化ができる効果がある。As described in detail above, the first to third aspects are described.
According to the invention described in 3, between the pair of opposing electrode terminals formed on the pair of substrates, the pair of opposing electrode terminals can be surely and satisfactorily energized, and between the adjacent electrode terminals, Further, there is an effect that it is possible to surely prevent conduction between them, and thereby to make the pitch of the electrode terminals finer.
【図1】この発明の第1実施例の縦断面図FIG. 1 is a vertical sectional view of a first embodiment of the present invention.
【図2】半導体ユニットの電極端子部分の縦断面図FIG. 2 is a vertical sectional view of an electrode terminal portion of a semiconductor unit.
【図3】第2実施例の縦断面図FIG. 3 is a vertical sectional view of a second embodiment.
【図4】従来の接合構造の平面図FIG. 4 is a plan view of a conventional joining structure.
【図5】その接合部の縦断面図FIG. 5 is a vertical sectional view of the joint portion.
3b、5 基板 4、7 電極端子 8、12、13 異方性コネクター 9 接着剤 10 金属粒子(導電粒子) 11、14 絶縁被膜 3b, 5 substrate 4, 7 electrode terminal 8, 12, 13 anisotropic connector 9 adhesive 10 metal particle (conductive particle) 11, 14 insulating film
Claims (3)
混入してなる異方性コネクターを、対向配置された電極
端子間に介在させて接合する接合構造において、 少なくとも一方の前記電極端子の表面を絶縁被膜で覆
い、熱圧着時に前記異方性コネクターの導電粒子が前記
絶縁被膜を突き破って、前記電極端子を導通させること
を特徴とする接合構造。1. A joint structure in which an anisotropic connector made by mixing conductive particles in a heat-melting type insulating adhesive is interposed between electrode terminals arranged opposite to each other, and at least one of the electrodes is provided. A bonding structure in which the surface of the terminal is covered with an insulating coating, and the conductive particles of the anisotropic connector penetrate through the insulating coating during thermocompression bonding to conduct the electrode terminal.
混入してなる異方性コネクターを、対向配置された電極
端子間に介在させて接合する接合構造において、 前記導電粒子の表面全体を酸化絶縁被膜で覆い、熱圧着
時に酸化絶縁被膜が破られて前記電極端子が前記導電粒
子で導通されることを特徴とする接合構造。2. A joint structure in which an anisotropic connector made by mixing conductive particles in a heat-melting type insulating adhesive is interposed between opposed electrode terminals to be bonded, and the surface of the conductive particles is provided. A joint structure characterized in that the whole is covered with an oxide insulating coating, and the oxide insulating coating is broken during thermocompression bonding so that the electrode terminals are conducted by the conductive particles.
混入してなる異方性コネクターを、対向配置された電極
端子間に介在させて接合する接合構造において、 前記導電粒子の表面全体を熱可塑性樹脂が含まれる材料
からなる絶縁被膜で覆い、熱圧着時に前記絶縁被膜が破
られて前記電極端子が前記導電粒子で導通されることを
特徴とする接合構造。3. A bonding structure in which an anisotropic connector made by mixing conductive particles in a heat-melting type insulating adhesive is interposed between electrode terminals arranged opposite to each other and bonded, the surface of the conductive particles. A joint structure characterized in that the whole is covered with an insulating coating made of a material containing a thermoplastic resin, and the insulating coating is broken during thermocompression bonding so that the electrode terminals are conducted by the conductive particles.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4139626A JPH0775177B2 (en) | 1992-05-06 | 1992-05-06 | Junction structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4139626A JPH0775177B2 (en) | 1992-05-06 | 1992-05-06 | Junction structure |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH05174890A true JPH05174890A (en) | 1993-07-13 |
JPH0775177B2 JPH0775177B2 (en) | 1995-08-09 |
Family
ID=15249665
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4139626A Expired - Lifetime JPH0775177B2 (en) | 1992-05-06 | 1992-05-06 | Junction structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0775177B2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000058205A1 (en) * | 1999-03-31 | 2000-10-05 | Seiko Epson Corporation | Narrow-pitch connector, electrostatic actuator, piezoelectric actuator, ink-jet head, ink-jet printer, micromachine, liquid crystal panel, and electronic apparatus |
WO2000058204A1 (en) * | 1999-03-31 | 2000-10-05 | Seiko Epson Corporation | Narrow-pitch connector, pitch converter, micromachine, piezoelectric actuator, electrostatic actuator, ink-jet head, ink-jet printer, liquid crystal device, and electronic apparatus |
JP2002116455A (en) * | 2000-08-01 | 2002-04-19 | Kyodo Printing Co Ltd | Liquid crystal display device, electrode substrate for the same device and method of manufacturing the same device |
JP2006339163A (en) * | 2006-06-08 | 2006-12-14 | Hitachi Chem Co Ltd | Connection method of electrode |
JP2008147181A (en) * | 2007-11-19 | 2008-06-26 | Hitachi Chem Co Ltd | Connection structure of electrode |
WO2012005318A1 (en) * | 2010-07-08 | 2012-01-12 | ソニーケミカル&インフォメーションデバイス株式会社 | Solar cell module and method for manufacturing solar cell module |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5545159U (en) * | 1978-09-20 | 1980-03-24 | ||
JPS61195568A (en) * | 1985-02-25 | 1986-08-29 | 松下電器産業株式会社 | Film connector |
JPS6240183A (en) * | 1985-08-15 | 1987-02-21 | ソニー株式会社 | Link sheet |
-
1992
- 1992-05-06 JP JP4139626A patent/JPH0775177B2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5545159U (en) * | 1978-09-20 | 1980-03-24 | ||
JPS61195568A (en) * | 1985-02-25 | 1986-08-29 | 松下電器産業株式会社 | Film connector |
JPS6240183A (en) * | 1985-08-15 | 1987-02-21 | ソニー株式会社 | Link sheet |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000058205A1 (en) * | 1999-03-31 | 2000-10-05 | Seiko Epson Corporation | Narrow-pitch connector, electrostatic actuator, piezoelectric actuator, ink-jet head, ink-jet printer, micromachine, liquid crystal panel, and electronic apparatus |
WO2000058204A1 (en) * | 1999-03-31 | 2000-10-05 | Seiko Epson Corporation | Narrow-pitch connector, pitch converter, micromachine, piezoelectric actuator, electrostatic actuator, ink-jet head, ink-jet printer, liquid crystal device, and electronic apparatus |
US6577370B1 (en) | 1999-03-31 | 2003-06-10 | Seiko Epson Corporation | Narrow-pitch connector, pitch converter, micromachine, piezoelectric actuator, electrostatic actuator, ink-jet head, ink-jet printer, liquid crystal device, and electronic apparatus |
US6601947B1 (en) | 1999-03-31 | 2003-08-05 | Seiko Epson Corporation | Narrow-pitch connector, electrostatic actuator, piezoelectric actuator, ink-jet head, ink-jet printer, micromachine, liquid crystal panel, and electronic apparatus |
CN1298612C (en) * | 1999-03-31 | 2007-02-07 | 精工爱普生株式会社 | Narrow-pitch connector, electrostatic actuator, piezoelectric actuator, ink-jet head, ink-jet printer, micromachine, liquid crystal panel, and electronic apparatus |
JP2002116455A (en) * | 2000-08-01 | 2002-04-19 | Kyodo Printing Co Ltd | Liquid crystal display device, electrode substrate for the same device and method of manufacturing the same device |
JP2006339163A (en) * | 2006-06-08 | 2006-12-14 | Hitachi Chem Co Ltd | Connection method of electrode |
JP2008147181A (en) * | 2007-11-19 | 2008-06-26 | Hitachi Chem Co Ltd | Connection structure of electrode |
WO2012005318A1 (en) * | 2010-07-08 | 2012-01-12 | ソニーケミカル&インフォメーションデバイス株式会社 | Solar cell module and method for manufacturing solar cell module |
JP2012019078A (en) * | 2010-07-08 | 2012-01-26 | Sony Chemical & Information Device Corp | Solar cell module, method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
JPH0775177B2 (en) | 1995-08-09 |
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