JPH05171073A - Conductive paste - Google Patents
Conductive pasteInfo
- Publication number
- JPH05171073A JPH05171073A JP35520591A JP35520591A JPH05171073A JP H05171073 A JPH05171073 A JP H05171073A JP 35520591 A JP35520591 A JP 35520591A JP 35520591 A JP35520591 A JP 35520591A JP H05171073 A JPH05171073 A JP H05171073A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- conductive paste
- parts
- low
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Paints Or Removers (AREA)
- Die Bonding (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体装置のアッセン
ブリーや各種部品類の接着等に使用される導電性ペース
トに関し、接着性、高速硬化に優れるとともに、半導体
チップの大型化と表面実装に対応した特性を有するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive paste used for assembling semiconductor devices and adhering various parts. It has excellent adhesiveness and high-speed curing, and is compatible with large-sized semiconductor chips and surface mounting. It has the characteristics described above.
【０００２】[0002]
【従来の技術】リードフレーム上の所定部分にＩＣ、Ｌ
ＳＩ等の半導体チップを接続する工程は、素子の長期信
頼性に影響を与える重要な工程の一つである。従来から
この接続方法として、半導体チップのシリコン面をリー
ドフレーム上の金メッキ面に加圧圧着するというＡu −
Ｓi 共晶法が主流であった。しかし、近年の貴金属、特
に金の高騰を契機として樹脂封止型半導体装置はＡu −
Ｓi 共晶法から、半田を使用する方法、導電性ペースト
を使用する方法等に急速に移行しつつある。2. Description of the Related Art ICs and Ls are mounted on a predetermined portion of a lead frame.
The process of connecting semiconductor chips such as SI is one of the important processes that affect the long-term reliability of the device. Conventionally, as this connection method, the silicon surface of the semiconductor chip is pressure-bonded to the gold-plated surface on the lead frame by Au-
The Si eutectic method was the mainstream. However, in recent years, the price of precious metals, especially gold, has spurred Au-
There is a rapid transition from the Si eutectic method to the method using solder, the method using conductive paste, and the like.
【０００３】しかし、半田を使用する方法は一部実用化
されているが半田や半田ボールが飛散して電極等に付着
し、腐食断線の原因となることが指摘されている。一
方、導電性ペーストを使用する方法では、通常、銀粉末
を配合したエポキシ樹脂が用いられ、約10年前から一部
実用化されて来たが、信頼性面でＡu −Ｓi 共晶法に比
較して満足すべきものが得られなかった。導電性ペース
トを使用する場合は、半田法に比べて耐熱性に優れる等
の長所を有しているが、その反面、樹脂や硬化剤が半導
体素子接着用として作られたものでないため、ボイドの
発生や、耐湿性、耐加水分解性に劣り、アルミニウム電
極の腐食を促進し、断線不良の原因となることが多く、
素子の信頼性はＡu −Ｓi 共晶法に比較して劣ってい
た。また、導電性ペーストを使用する場合は、半田法や
Ａu −Ｓi 共晶法に比較してその接合時間も長時間を要
し、オーブンによる熱硬化であるため生産ラインからオ
ーブンに投入するというバッチ方式となり、生産性に劣
るという欠点があった。更に最近のＩＣ、ＬＳＩやＬＥ
Ｄ等の半導体チップの大型化や銅系等各種フレームの出
現に伴い、チップクラックの発生や接着力の低下がおこ
り、問題となっていた。However, although some methods using solder have been put to practical use, it has been pointed out that solder or solder balls scatter and adhere to electrodes or the like, which causes corrosion breakage. On the other hand, in the method using the conductive paste, an epoxy resin mixed with silver powder is usually used, and it has been partially put into practical use for about 10 years. However, in terms of reliability, the Au-Si eutectic method is used. By comparison, nothing was satisfactory. When a conductive paste is used, it has advantages such as excellent heat resistance compared to the solder method, but on the other hand, since the resin and the curing agent are not made for bonding semiconductor elements, voids Occurrence, inferior moisture resistance, hydrolysis resistance, promotes corrosion of aluminum electrodes, and often causes disconnection failure,
The reliability of the device was inferior to that of the Au-Si eutectic method. In addition, when using a conductive paste, the bonding time is longer than that of the solder method or Au-Si eutectic method, and since it is thermosetting in the oven, it is put in the oven from the production line. However, this method has a drawback that it is inferior in productivity. More recent IC, LSI and LE
With the increase in the size of semiconductor chips such as D and the advent of various types of frames such as copper, chip cracks have occurred and adhesive strength has decreased, which has been a problem.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、上記の事情
に鑑みてなされたもので、接着性、低温高速硬化に優
れ、ボイドの発生がなく、アルミニウム電極の腐食によ
る断線不良や反りが少なく、生産性が高く原価低減に寄
与し、半導体チップの大型化に対応した信頼性の高い導
電性ペーストを提供しようとするものである。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances and is excellent in adhesiveness, low-temperature and high-speed curing, does not generate voids, and has less disconnection defects and warpage due to corrosion of aluminum electrodes. The present invention aims to provide a highly reliable conductive paste that has high productivity, contributes to cost reduction, and is compatible with the increase in size of semiconductor chips.
【０００５】[0005]
【課題を解決するための手段】本発明者は、上記の目的
を達成しようと鋭意研究を重ねた結果、後述する組成の
ペーストが、上記の目的を達成できることを見いだし、
本発明を完成したものである。Means for Solving the Problems As a result of intensive studies to achieve the above object, the present inventor has found that a paste having a composition described below can achieve the above object.
The present invention has been completed.
【０００６】即ち、本発明は、 （Ａ）次の（a ）及び（b ）からなる変性樹脂 （a ）低粘度液状エポキシ樹脂 （b ）一般式That is, the present invention provides (A) a modified resin comprising the following (a) and (b) (a) a low-viscosity liquid epoxy resin (b) a general formula
【０００７】[0007]
【化２】 （但し、n は整数を表す。）で示されるアラルキルフェ
ノール樹脂、 （Ｂ）イミダゾール触媒、および （Ｃ）導電性粉末 を必須成分としてなることを特徴とする導電性ペースト
である。[Chemical 2] (However, n is an integer.) An aralkylphenol resin, (B) an imidazole catalyst, and (C) a conductive powder are essential components.
【０００８】以下、本発明を詳細に説明する。The present invention will be described in detail below.
【０００９】本発明に用いる（Ａ）変性樹脂は、（a ）
低粘度液状エポキシ樹脂と（b ）前記一般式で示される
アラルキルフェノール樹脂を溶解又は加熱反応したもの
である。The modified resin (A) used in the present invention is (a)
A low-viscosity liquid epoxy resin and (b) an aralkylphenol resin represented by the above general formula dissolved or heated to react.
【００１０】ここで用いる（a ）低熱度液状エポキシ樹
脂としては、例えば、β−（3,4-エポキシシクロヘキシ
ル）エチルトリメトキシシラン、γ−グリシドキシプロ
ピルトリメトキシシラン、γ−グリシドキシプロピルメ
チルジエトキシシラン等のシラン系モノマー、ビスフェ
ノール型低粘度液状エポキシ樹脂、脂環式低粘度液状エ
ポキシ樹脂、グリシジルエーテル型エポキシ樹脂、グリ
シジルエステル型エポキシ樹脂等が挙げられ、これらは
単独もしくは2 種以上混合して使用することができる。The low heat liquid epoxy resin (a) used here includes, for example, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane and γ-glycidoxypropyl. Examples include silane-based monomers such as methyldiethoxysilane, bisphenol-type low-viscosity liquid epoxy resin, alicyclic low-viscosity liquid epoxy resin, glycidyl ether-type epoxy resin, glycidyl ester-type epoxy resin, etc., which may be used alone or in combination of two or more. It can be mixed and used.
【００１１】また、変性樹脂の他の成分である（b ）前
記一般式で示されるアラルキルフェノール樹脂として
は、例えば、ミレックスＸＬ−２２５（三井東圧化学社
製商品名、水酸基当量約170g／eq）等が挙げられる。
（a ）の低粘度液状エポキシ樹脂と（b ）のアラルキル
フェノール樹脂との配合割合は、重量比で95／5 〜50／
50の範囲であることが望ましい。アラルキルフェノール
樹脂の配合量が 5重量部未満では、十分な硬化速度、機
械的強度が得られず、また50部を超えると機械的強度が
低下し好ましくない。（a ）の低粘度液状エポキシ樹脂
と（b ）のアラルキルフェノール樹脂とを加熱反応させ
て変性樹脂をつくる際、溶剤に溶解させて使用すれば作
業性を高めることができる。その溶剤類としては、ジオ
キサン、ヘキサノン、酢酸セロソルブ、エチルセロソル
ブ、ブチルセロソルブ、ブチルセロソルブアセテート、
ブチルカルビトールアセテート、イソホロン等が挙げら
れ、これらは単独又は2 種以上混合して使用することが
できる。Further, (b) an aralkylphenol resin represented by the above general formula, which is another component of the modified resin, is, for example, Milex XL-225 (trade name, manufactured by Mitsui Toatsu Chemicals, hydroxyl equivalent is about 170 g / eq). ) And the like.
The mixing ratio of the low-viscosity liquid epoxy resin (a) and the aralkylphenol resin (b) is 95/5 to 50 / by weight.
A range of 50 is desirable. If the compounding amount of the aralkylphenol resin is less than 5 parts by weight, sufficient curing speed and mechanical strength cannot be obtained, and if it exceeds 50 parts, the mechanical strength decreases, which is not preferable. When the low-viscosity liquid epoxy resin (a) and the aralkylphenol resin (b) are heated and reacted to form a modified resin, the workability can be improved by dissolving the resin in a solvent before use. As the solvent, dioxane, hexanone, cellosolve acetate, ethyl cellosolve, butyl cellosolve, butyl cellosolve acetate,
Examples thereof include butyl carbitol acetate and isophorone, which can be used alone or in combination of two or more kinds.
【００１２】本発明に用いる（Ｂ）イミダゾール系触媒
としては、例えば具体的なものとして、２ＭＺ、２Ｅ４
ＭＺ、Ｃ11Ｚ、Ｃ17Ｚ、２ＰＺ、２Ｐ４ＭＺ、２ＭＺ−
ＣＮ、２Ｅ４ＭＺ−ＣＮ、Ｃ11Ｚ−ＣＮ、Ｃ17Ｚ−Ｃ
Ｎ、１Ｂ２ＭＺ、２ＭＺ−ＣＮＳ、２Ｐ４ＢＨＺ、２Ｍ
Ａ、２ＭＡ−ＯＫ（四国化成工業社製、商品名）等が挙
げられ、これらは単独又は2 種以上混合して使用するこ
とができる、イミダゾール系触媒の配合割合は、（a ）
の低粘度液状エポキシ樹脂に対して 0.1〜8 重量％配合
することが望ましい。配合量が 0.1重量％未満では触媒
効果が低く、また8重量％を超えるとポットライフ等の
経時変化をまねきやすく好ましくない。Specific examples of the (B) imidazole catalyst used in the present invention include 2MZ, 2E4.
MZ, C 11 Z, C 17 Z, 2PZ, 2P4MZ, 2MZ-
CN, 2E4MZ-CN, C 11 Z-CN, C 17 Z-C
N, 1B2MZ, 2MZ-CNS, 2P4BHZ, 2M
A, 2MA-OK (trade name, manufactured by Shikoku Kasei Kogyo Co., Ltd.) and the like can be used, and these can be used alone or in combination of two or more kinds. The mixing ratio of the imidazole-based catalyst is (a).
It is desirable to add 0.1 to 8% by weight to the low viscosity liquid epoxy resin. If the amount is less than 0.1% by weight, the catalytic effect is low, and if it exceeds 8% by weight, changes over time such as pot life are likely to occur, which is not preferable.
【００１３】本発明に用いる（Ｃ）導電性粉末として
は、銀粉末、銅粉末、ニッケル粉末等の金属粉末、表面
に金属層を有する粉末等が挙げられ、導電性粉末の形状
等に特に制限はないが、中でも球状のものが好んで使用
される。これらは単独又は2 種以上混合して使用するこ
とができる。これらの導電性粉末は、いずれも平均粒径
で50μm 以下であることが望ましい。平均粒径が50μm
を超えると、導電性が不安定となり好ましくない。バイ
ンダーとなる変性樹脂と導電性粉末との配合割合は、重
量比で30／70〜10／90であることが望ましい。導電性粉
末が、70重量部未満であると満足な導電性が得られず、
また90重量部を超えると作業性や密着性が低下し好まし
くない。Examples of the (C) conductive powder used in the present invention include metal powders such as silver powder, copper powder and nickel powder, and powders having a metal layer on the surface thereof. The shape of the conductive powder is not particularly limited. However, spherical ones are preferably used. These may be used alone or in combination of two or more. It is desirable that all of these conductive powders have an average particle size of 50 μm or less. Average particle size is 50 μm
If it exceeds, the conductivity becomes unstable, which is not preferable. The modified resin as the binder and the conductive powder are preferably mixed in a weight ratio of 30/70 to 10/90. If the conductive powder is less than 70 parts by weight, satisfactory conductivity cannot be obtained,
Further, when it exceeds 90 parts by weight, workability and adhesion are deteriorated, which is not preferable.
【００１４】本発明の導電性ペーストは、上述した各成
分即ち、変性樹脂、イミダゾール触媒、および導電性粉
末を必須成分とするが、本発明の目的に反しない範囲に
おいて、また必要に応じて、消泡剤やカップリング剤、
分散剤その他の添加剤を加えることができる。The conductive paste of the present invention contains the above-mentioned components, that is, the modified resin, the imidazole catalyst, and the conductive powder as essential components, but within the range not deviating from the object of the present invention, and if necessary, Antifoam or coupling agent,
Dispersants and other additives can be added.
【００１５】本発明の導電性ペーストは、これらの各成
分を配合し、例えば三本ロールによる混合処理を行い、
容易に製造することができる。こうして導電性ペースト
は、所定の場所にディスペンサー、スクリーン印刷、ピ
ン転写法等により塗布した後、数秒から数十時間後、半
導体チップ等を載せ、 100〜200 ℃といった比較的低温
で数十秒から数分間ヒーターブロック上で加熱硬化させ
て使用する。またオーブンで 150〜200 ℃，数分間加熱
硬化させて使用することもできる。The conductive paste of the present invention is prepared by blending these respective components and performing a mixing treatment with, for example, a triple roll,
It can be easily manufactured. In this way, the conductive paste is applied at a predetermined place by a dispenser, screen printing, pin transfer method, etc., and after several seconds to several tens of hours, a semiconductor chip etc. is placed, and at a relatively low temperature of 100 to 200 ° C, from several tens of seconds. Heat cure on a heater block for several minutes before use. It can also be used by heating and curing in an oven at 150 to 200 ° C for several minutes.
【００１６】[0016]
【作用】本発明は、低粘度液状エポキシ樹脂をアラルキ
ルフェノール樹脂で変性した樹脂を使用することによっ
て、硬化速度を高め、十分な接着強度をもたせ、かつ従
来から必要な特性を保持させたものである。The present invention uses a resin obtained by modifying a low-viscosity liquid epoxy resin with an aralkylphenol resin to increase the curing rate, provide sufficient adhesive strength, and retain the properties required conventionally. is there.
【００１７】[0017]
【実施例】次に本発明を実施例によって説明するが、本
発明はこれらの実施例よって限定されるものではない。
実施例において「部」とは特に説明のない限り「重量
部」を意味する。EXAMPLES The present invention will now be described with reference to examples, but the present invention is not limited to these examples.
In the examples, "parts" means "parts by weight" unless otherwise specified.
【００１８】実施例１ 低粘度液状エポキシ樹脂ＹＬ９８０（油化シェルエポキ
シ社製、商品名）15.8部とアラルキルフェノール樹脂ミ
レックスＸＬ−２２５（三井東圧化学社製、商品名）10
部とをブチルセロソルブアセテート15部で 100℃，1 時
間で溶解反応させ粘稠な褐色の変性樹脂を得た。この変
性樹脂20部にイミダゾール触媒の２Ｅ４ＭＺ（四国化成
工業社製、商品名） 0.2部及び銀粉末77部を混合し、さ
らに三本ロールで混練して導電性ペーストを製造した。Example 1 15.8 parts of low-viscosity liquid epoxy resin YL980 (produced by Yuka Shell Epoxy Co., Ltd.) and aralkylphenol resin Milex XL-225 (produced by Mitsui Toatsu Chemical Co., Ltd.) 10
And 15 parts of butyl cellosolve acetate were dissolved and reacted at 100 ° C for 1 hour to obtain a viscous brown modified resin. 20 parts of this modified resin was mixed with 0.2 part of 2E4MZ of imidazole catalyst (trade name, manufactured by Shikoku Chemicals Co., Ltd.) and 77 parts of silver powder, and further kneaded with a three-roll mill to produce a conductive paste.
【００１９】実施例２ 低粘度液状エポキシ樹脂ＹＬ９８３（油化シェルエポキ
シ社製、商品名）17部とアラルキルフェノール樹脂ミレ
ックスＸＬ−２２５（三井東圧化学社製、商品名）10部
とを、ブチルカルビトールアセテート18部で 100℃，1
時間の溶解反応をさせ、粘稠な褐色の変性樹脂を得た。
この変性樹脂20部にイミダゾール触媒のＣ17Ｚ（四国化
成工業社製、商品名） 0.4部及び銀粉末78部を混合し、
さらに三本ロールで混練して導電性ペーストを製造し
た。Example 2 17 parts of low-viscosity liquid epoxy resin YL983 (produced by Yuka Shell Epoxy Co., Ltd., trade name) and 10 parts of aralkylphenol resin Milex XL-225 (produced by Mitsui Toatsu Chemical Co., Ltd. trade name) were mixed with butyl. Carbitol acetate 18 parts at 100 ℃, 1
A dissolution reaction was carried out for a time to obtain a viscous brown modified resin.
20 parts of this modified resin was mixed with 0.4 part of imidazole catalyst C 17 Z (trade name, manufactured by Shikoku Chemicals Co., Ltd.) and 78 parts of silver powder,
Further, the mixture was kneaded with a triple roll to produce a conductive paste.
【００２０】実施例３ 低粘度液状エポキシ樹脂エピコート８２８（油化シェル
エポキシ社製、商品名）20部とアラルキルフェノール樹
脂ミレックスＸＬ−２２５（三井東圧化学社製、商品
名）15部とを、ジエチレングリコールジエチルエーテル
19部で60℃，1 時間の溶解反応をさせ、粘稠な褐色の変
性樹脂を得た。この変性樹脂18部にイミダゾール触媒の
２Ｅ４ＭＺ−ＣＮ（四国化成工業社製、商品名） 0.3部
及び銀粉末82部を混合し、さらに三本ロールで混練して
導電性ペーストを製造した。Example 3 20 parts of low-viscosity liquid epoxy resin Epicoat 828 (produced by Yuka Shell Epoxy Co., Ltd., trade name) and 15 parts of aralkylphenol resin Milex XL-225 (produced by Mitsui Toatsu Chemical Co., Ltd. trade name), Diethylene glycol diethyl ether
The solution was dissolved in 19 parts at 60 ° C for 1 hour to obtain a viscous brown modified resin. 18 parts of this modified resin was mixed with 0.3 part of 2E4MZ-CN (trade name, manufactured by Shikoku Kasei Kogyo Co., Ltd.), which is an imidazole catalyst, and 82 parts of silver powder, and the mixture was kneaded with a three-roll mill to produce a conductive paste.
【００２１】比較例 市販のエポキシ樹脂ベースの速硬化型半導体用導電性ペ
ーストを入手した。Comparative Example A commercially available epoxy resin-based conductive paste for rapid curing type semiconductor was obtained.
【００２２】実施例１〜３および比較例の導電性ペース
トを用いて、半導体チップとリードフレームとを表１に
示した半導体チップ接着条件で接着し、ヒートブロック
を用いて 200℃，30秒間加熱硬化させて、半導体チップ
とリードフレームとを接合して半導体装置を得た。これ
らの半導体装置について接着強度、ボイドの発生、導電
性、半導体チップの反り試験を行った。その結果を表１
に示したがいずれも本発明が優れており、本発明の顕著
な効果が認められた。Using the conductive pastes of Examples 1 to 3 and Comparative Example, a semiconductor chip and a lead frame were bonded under the semiconductor chip bonding conditions shown in Table 1, and heated at 200 ° C. for 30 seconds using a heat block. After curing, the semiconductor chip and the lead frame were joined to obtain a semiconductor device. These semiconductor devices were tested for adhesive strength, generation of voids, conductivity, and warpage of semiconductor chips. The results are shown in Table 1.
However, the present invention is excellent, and the remarkable effects of the present invention were recognized.
【００２３】接着強度の試験は、銀メッキを施した銅系
のリードフレーム上に 2.0mm× 2.0mmのシリコンチップ
を接着し、25℃、 280℃における接着強度をプッシュプ
ルゲージを用いて測定した。ボイドの有無は、シリコン
チップをリードフレーム上から剥がして、チップ裏面の
ボイドの発生状況を目視した。導電性は、体積抵抗率計
で測定した。また、チップの反り試験は、硬化後のチッ
プ表面を表面粗さ計で測定し、チップ中央部と端部との
距離の差で示した。The adhesive strength test was carried out by bonding a 2.0 mm × 2.0 mm silicon chip on a silver-plated copper-based lead frame and measuring the adhesive strength at 25 ° C. and 280 ° C. using a push-pull gauge. .. For the presence or absence of voids, the silicon chip was peeled off from the lead frame, and the state of void formation on the back surface of the chip was visually observed. The conductivity was measured with a volume resistivity meter. In the chip warp test, the surface of the chip after curing was measured with a surface roughness meter, and the difference was shown in the distance between the center part and the end part of the chip.
【００２４】[0024]
【表１】 [Table 1]
【００２５】[0025]
【発明の効果】以上の説明および表１から明らかなよう
に、本発明の導電性ペーストは、ヒートブロック等の高
速硬化においてもボイドの発生がなく、大型チップの反
りもなく接着性に優れたものである。低温高速硬化がで
きるため生産性が高く、コストダウンにも寄与し、かつ
半導体チップの大型化に対応した信頼性の高いものであ
る。As is apparent from the above description and Table 1, the conductive paste of the present invention has no voids even in high-speed curing such as a heat block and has excellent adhesiveness without warping of large chips. It is a thing. Since it can be cured at low temperature and high speed, it has high productivity, contributes to cost reduction, and has high reliability corresponding to the increase in size of semiconductor chips.
Claims (1)
性樹脂 （a ）低粘度液状エポキシ樹脂 （b ）一般式 【化１】 （但し、n は整数を表す。）で示されるアラルキルフェ
ノール樹脂、 （Ｂ）イミダゾール触媒、および （Ｃ）導電性粉末 を必須成分としてなることを特徴とする導電性ペース
ト。1. A modified resin comprising (A) the following (a) and (b) (a) a low-viscosity liquid epoxy resin (b) a general formula: (However, n is an integer.) An aralkylphenol resin, (B) an imidazole catalyst, and (C) a conductive powder, which are essential components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35520591A JPH05171073A (en) | 1991-12-20 | 1991-12-20 | Conductive paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35520591A JPH05171073A (en) | 1991-12-20 | 1991-12-20 | Conductive paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05171073A true JPH05171073A (en) | 1993-07-09 |
Family
ID=18442561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35520591A Pending JPH05171073A (en) | 1991-12-20 | 1991-12-20 | Conductive paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05171073A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008187189A (en) * | 2000-02-15 | 2008-08-14 | Hitachi Chem Co Ltd | Adhesive composition, method for manufacturing the same, adhesive film using the same, substrate for mounting semiconductor, and semiconductor device |
| CN111448670A (en) * | 2017-12-06 | 2020-07-24 | 纳美仕有限公司 | Conductive paste |
-
1991
- 1991-12-20 JP JP35520591A patent/JPH05171073A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008187189A (en) * | 2000-02-15 | 2008-08-14 | Hitachi Chem Co Ltd | Adhesive composition, method for manufacturing the same, adhesive film using the same, substrate for mounting semiconductor, and semiconductor device |
| JP2008193105A (en) * | 2000-02-15 | 2008-08-21 | Hitachi Chem Co Ltd | Adhesive composition, manufacturing method thereof, adhesive film using the same, substrate for loading semiconductor, and semiconductor device |
| US7947779B2 (en) * | 2000-02-15 | 2011-05-24 | Hitachi Chemical Company, Ltd. | Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer |
| US8119737B2 (en) | 2000-02-15 | 2012-02-21 | Hitachi Chemical Company, Ltd. | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device |
| CN111448670A (en) * | 2017-12-06 | 2020-07-24 | 纳美仕有限公司 | Conductive paste |
| EP3723139A4 (en) * | 2017-12-06 | 2021-08-18 | Namics Corporation | Electrically conductive paste |
| US11466170B2 (en) | 2017-12-06 | 2022-10-11 | Namics Corporation | Conductive paste |
| CN111448670B (en) * | 2017-12-06 | 2023-09-12 | 纳美仕有限公司 | conductive paste |
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