JPH05167098A - Photocoupler - Google Patents

Abstract

PURPOSE:To eliminate disconnections of soldering which are caused by oscillations, etc., and eliminate malfunctions caused by an outer packaging case contacted with soldering, by covering a primary molding material with a light shielding and conductive secondary molding material except for a through path for an object to be sensed, and by contacting the secondary molding material only with the grounding terminal of a conductive wiring part. CONSTITUTION:A photo-coupler for sensing in a contactless way whether such an object 11 to be sensed as a ball for a game machine, PACHINKO, exists in a through path 12 or not. In the photo coupler, light emitting and receiving elements 14, 15 are so mounted on a conductive wiring part 13 having a grounding terminal 21 as to face each other sandwiching the through path 12 between them, and they are covered with a transparent and electrically insulating primary molding material 16, and further, the primary molding material 16 is covered except for the through path 12 with a light shielding and conductive secondary molding material 18. The conductive wiring part 13 is provided with the grounding terminal 21, a power supply inputting terminal 22 and an output terminal 23. Since the conductive secondary molding material 18 is electrically connected with the GND terminal 21, the static electricity generated on the surface of the photo-coupler is grounded immediately.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、パチンコ球等の被検出
物を検出する光結合装置の改良に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of an optical coupling device for detecting an object to be detected such as a pachinko ball.

【０００２】[0002]

【従来の技術】図４〜９は従来のパチンコ玉検出用の光
結合装置（フオトインタラプタ）である。2. Description of the Related Art FIGS. 4 to 9 show a conventional optical coupling device (photo interrupter) for detecting a pachinko ball.

【０００３】図中、１は発光素子、２ａ，２ｂは光学的
特性を得るためのオプテイカルガイド、３は被検出物た
る球体が通過する通過孔、４は受光素子、５は配線基
板、６はチツプ部品、７はＧＮＤ端子、８は出力端子、
９は電源入力端子、１０ａは導電性樹脂からなる外装ケ
ース、１０ｂは絶縁性裏蓋である。In the figure, 1 is a light emitting element, 2a and 2b are optical guides for obtaining optical characteristics, 3 is a passage hole through which a sphere as an object to be detected passes, 4 is a light receiving element, 5 is a wiring board, and 6 Is a chip part, 7 is a GND terminal, 8 is an output terminal,
Reference numeral 9 is a power input terminal, 10a is an outer case made of a conductive resin, and 10b is an insulating back cover.

【０００４】そして、図示の如く、両素子１，４および
チツプ部品６は、配線基板５に半田付けによつて結線さ
れた後、導電性外装ケース１０ａと絶縁性裏蓋１０ｂに
て密閉され、オプテイカルガイド２ａ，２ｂにて通過孔
３を挟んで発光素子１の光を受光素子４へ導くことによ
り光学的に結合されている。Then, as shown in the figure, the two elements 1, 4 and the chip component 6 are connected to the wiring board 5 by soldering, and then sealed by a conductive outer case 10a and an insulating back cover 10b. The light of the light emitting element 1 is optically coupled by guiding the light of the light emitting element 1 to the light receiving element 4 with the passage hole 3 interposed between the optical guides 2a and 2b.

【０００５】ここで、静電気対策として、図７〜９の如
く、受発光両素子のＧＮＤ端子７と導電性の外装ケース
１０ａとを接触させ、外部からの静電気をＧＮＤ端子７
を通じてアースさせていた。Here, as a countermeasure against static electricity, as shown in FIGS. 7 to 9, the GND terminals 7 of both the light receiving and emitting elements and the conductive outer case 10a are brought into contact with each other to prevent static electricity from the outside from coming into contact with the GND terminal 7.
It was grounded through.

【０００６】すなわち、配線基板５のＧＮＤ端子７に挿
入孔１０ｄを形成し、導電性の外装ケース１０ａに同材
料を用いて突起部１０ｃを一体成形し、ケース１０ａに
基板５をセツトする時に突起部１０ｃとＧＮＤ端子７と
を接触させて電気的導通を持たせていた。That is, the insertion hole 10d is formed in the GND terminal 7 of the wiring board 5, and the projection 10c is integrally formed on the conductive outer case 10a by using the same material. The projection 10c is formed when the board 5 is set on the case 10a. The portion 10c and the GND terminal 7 are brought into contact with each other to provide electrical continuity.

【０００７】[0007]

【発明が解決しようとする課題】従来の光結合装置で
は、素子１，４等の半田付け後、外装ケース１０ａ内に
収納するが、振動等により半田が断線することがあつ
た。また、半田が所望の位置からずれた場合に、導電性
の外装ケース１０ａが半田あるいは半田ボール等に接触
し、ここから外装ケース１０ａの静電気が流れ出てしま
い、光結合装置が誤動作したり、各素子１，４等が破壊
したりすることがあつた。このため、半田のケース１０
ａへの接触状態等、完全な半田付が行われているか否か
の確認を常に必要とし、作業管理にも手間がかかつてい
た。In the conventional optical coupling device, the elements 1 and 4 are soldered and then housed in the outer case 10a. However, the solder may be broken due to vibration or the like. Further, when the solder is displaced from the desired position, the conductive outer case 10a comes into contact with the solder, the solder ball, or the like, and the static electricity of the outer case 10a flows out of the conductive outer case 10a. The elements 1 and 4 may be destroyed. Therefore, the solder case 10
It was always necessary to check whether or not complete soldering was performed, such as the state of contact with a, and work management was also laborious.

【０００８】また、受発光両素子１，４およびチツプ部
品６を配線基板５に半田付けしていたが、配線基板５が
高価なため、全体としてのコスト低減の限界となつてい
た。Further, although the light emitting / receiving elements 1 and 4 and the chip component 6 are soldered to the wiring board 5, the wiring board 5 is expensive, so that it is a limit of cost reduction as a whole.

【０００９】さらに、図６の如く、配線基板５の配線が
複雑であつたため、両素子１，４の光学的位置決めを行
うオプテイカルガイド２ａ，２ｂの形状も複雑となり、
このことから受発光両素子１，４の光学的位置決めをか
なり精度よく行わないと、両素子１，４間の光学的結合
が達成できなかつた。したがつて、両素子１，４を挿入
してこれらを位置決めするための治具型を用いなければ
ならず、作業に手間取る要因となつていた。Further, as shown in FIG. 6, since the wiring of the wiring board 5 is complicated, the shapes of the optical guides 2a and 2b for optically positioning the both elements 1 and 4 are also complicated,
For this reason, the optical coupling between the light emitting and receiving elements 1 and 4 cannot be achieved unless the optical positioning of the light receiving and emitting elements 1 and 4 is performed with high accuracy. Therefore, it is necessary to use a jig die for inserting both the elements 1 and 4 and positioning them, which is a factor that takes a lot of work.

【００１０】本発明は、上記課題に鑑み、信頼性を向上
でき、配線基板を省略し得、かつ組立作業の容易な光結
合装置の提供を目的とする。In view of the above problems, it is an object of the present invention to provide an optical coupling device which can improve reliability, omit a wiring board, and can be easily assembled.

【００１１】[0011]

【課題を解決するための手段】本発明請求項１による課
題解決手段は、図１〜３の如く、被検出物１１の通過路
１２内での有無を無接点で検出するものであつて、接地
端子２１を有する導電配線部１３に、発光素子１４およ
び受光素子１５が通過路１２を挟んで光学的に結合する
よう搭載され、これらに透光性かつ電気的絶縁性を有す
る一次モールド体１６が被覆され、該一次モールド体１
６に前記被検出物１１の通過路１２を除いて遮光性かつ
導電性を有する二次モールド体１８が被覆され、該二次
モールド体１８は、前記導電配線部１３のうち接地端子
２１のみに接触されたものである。The means for solving the problems according to the first aspect of the present invention is to detect the presence or absence of the object 11 to be detected in the passage 12 without contact, as shown in FIGS. A light-emitting element 14 and a light-receiving element 15 are mounted on a conductive wiring portion 13 having a ground terminal 21 so as to be optically coupled with the passage 12 interposed therebetween, and a primary molded body 16 having a light-transmitting property and an electrical insulating property is mounted on them. Is covered with the primary mold body 1
6 is covered with a secondary mold body 18 having a light-shielding property and conductivity except for the passage 12 of the object to be detected 11, and the secondary mold body 18 covers only the ground terminal 21 of the conductive wiring portion 13. It has been contacted.

【００１２】本発明請求項２による課題解決手段は、請
求項１記載の導電配線部１３はリードフレームからなる
ものである。According to a second aspect of the present invention, the conductive wiring portion 13 according to the first aspect comprises a lead frame.

【００１３】本発明請求項３による課題解決手段は、請
求項２記載の光結合装置において、リードフレームは同
一平面上に配線形成され、該リードフレーム上に、発光
素子１４および受光素子１５がその受発光面を上方に向
けて搭載され、一次モールド体１６の各素子１４，１５
に対応する上面に、発光素子１４からの光を受光素子１
５へ反射させて導光する傾斜反射面３１ａ，３１ｂが形
成されたものである。According to a third aspect of the present invention, in the optical coupling device according to the second aspect, the lead frame is formed on the same plane, and the light emitting element 14 and the light receiving element 15 are formed on the lead frame. Each of the elements 14, 15 of the primary mold body 16 is mounted with the light receiving and emitting surface facing upward.
The light from the light emitting element 14 is received by the light receiving element 1 on the upper surface corresponding to
5, inclined reflection surfaces 31a and 31b for reflecting and guiding the light to the No. 5 are formed.

【００１４】[0014]

【作用】上記請求項１による課題解決手段において、二
次モールド体１８の表面に静電気が発生した場合、この
静電気を接地端子２１から逃がす。ここで、光結合装置
の内部を、電気的絶縁性を有する一次モールド体１６に
より被覆しているため、振動等による半田の断線や、外
装ケースと半田との接触による誤動作がなくなる。When static electricity is generated on the surface of the secondary molded body 18, the static electricity is released from the ground terminal 21 in the means for solving the problems according to the first aspect. Here, since the inside of the optical coupling device is covered with the primary mold body 16 having an electrically insulating property, the disconnection of the solder due to vibration or the like and the malfunction due to the contact between the outer case and the solder are eliminated.

【００１５】請求項２，３では、リードフレーム上に両
素子１４，１５をダイボンドすることにより、高価な配
線基板を用いずに結線し、その後、一次モールド体１６
の各素子１４，１５に対応する上面に傾斜反射面３１
ａ，３１ｂを形成して、受発光間の光学的結合を確保す
る。In the second and third aspects, both elements 14 and 15 are die-bonded on the lead frame to connect them without using an expensive wiring board, and then the primary mold body 16 is used.
The inclined reflection surface 31 is provided on the upper surface corresponding to each of the elements 14 and 15.
By forming a and 31b, the optical coupling between the light receiving and the light emitting is secured.

【００１６】[0016]

【実施例】図１は本発明の一実施例を示す光結合装置の
斜視図、図２は導電配線部に受発光両素子が搭載された
状態を示す平面図、図３は一次モールド体が被覆された
状態を示す斜視図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a perspective view of an optical coupling device showing an embodiment of the present invention, FIG. 2 is a plan view showing a state in which both light emitting and receiving elements are mounted on a conductive wiring portion, and FIG. It is a perspective view showing the state where it was covered.

【００１７】図１の如く、本実施例の光結合装置（透過
型フオトインタラプタ）は、パチンコ球等の被検出物１
１の通過路１２内での有無を無接点で検出するものであ
つて、接地端子２１を有する導電配線部１３に、発光素
子１４および受光素子１５が通過路１２を挟んで光学的
に結合するよう搭載され、これらに透光性かつ電気的絶
縁性を有する一次モールド体１６が被覆され、該一次モ
ールド体１６に前記被検出物１１の通過路１２を除いて
遮光性かつ導電性を有する二次モールド体１８が被覆さ
れたものである。As shown in FIG. 1, the optical coupling device (transmission type photo interrupter) of this embodiment is used for detecting an object 1 such as a pachinko ball.
The presence or absence of 1 in the passage 12 is contactlessly detected, and the light emitting element 14 and the light receiving element 15 are optically coupled to the conductive wiring portion 13 having the ground terminal 21 with the passage 12 interposed therebetween. And a primary mold body 16 having a light-transmitting property and an electrical insulating property is coated thereon, and the primary mold body 16 has a light-shielding property and a conductive property except for the passage 12 of the detection object 11. The next mold body 18 is covered.

【００１８】前記導電配線部１３は、図２の如く、接地
端子２１（以下ＧＮＤ端子という）と、電源入力端子２
２と、出力端子２３とを備えており、これらは、外郭部
がタイバーで同一平面上に連結された金属製リードフレ
ームとして、所定の回路設計に基づき一体成形され、一
次モールド体１６および二次モールド体１８のモールド
後、タイバーを切断され分離される。As shown in FIG. 2, the conductive wiring portion 13 has a ground terminal 21 (hereinafter referred to as a GND terminal) and a power input terminal 2
2 and an output terminal 23, which are integrally molded based on a predetermined circuit design as a metal lead frame whose outer portion is connected on the same plane by a tie bar, and which are integrally molded together with the primary mold body 16 and the secondary mold body. After the molding body 18 is molded, the tie bar is cut and separated.

【００１９】このうち、前記ＧＮＤ端子２１の先端部に
は、図２の如く、受光素子１５を搭載する搭載片２４が
形成されている。前記電源入力端子２２は略Ｙ字形に形
成され、そのうちの一端部に発光素子１４を搭載する搭
載片２５が形成されている。また、他端部は受光素子１
５に結線される。該電源入力端子２２と出力端子２３と
の間には、チツプ部品２７が架橋される。Of these, a mounting piece 24 for mounting the light receiving element 15 is formed at the tip of the GND terminal 21, as shown in FIG. The power input terminal 22 is formed in a substantially Y shape, and a mounting piece 25 for mounting the light emitting element 14 is formed at one end thereof. The other end is the light receiving element 1.
Connected to 5. A chip part 27 is bridged between the power input terminal 22 and the output terminal 23.

【００２０】なお、図２中、２９は発光素子１４と受光
素子１５とを結線する結線リードである。In FIG. 2, reference numeral 29 is a connection lead for connecting the light emitting element 14 and the light receiving element 15.

【００２１】前記発光素子１４は例えば発光ダイオード
（ＬＥＤ）が、受光素子１５は例えばフオトトランジス
タやフオトトライアツク等が夫々使用される。これら
は、発光面および受光面を上方に向けるよう、各搭載片
２４，２５に直接ダイボンドされる。For example, a light emitting diode (LED) is used as the light emitting element 14, and a phototransistor or a phototriac is used as the light receiving element 15, respectively. These are directly die-bonded to the mounting pieces 24 and 25 so that the light emitting surface and the light receiving surface face upward.

【００２２】前記一次モールド体１６は例えば透光性エ
ポキシ樹脂が使用され、図３の如く、各端子２１〜２３
の先端部を外部に突出して引出しするよう金型インサー
ト成形される。該一次モールド体１６の発光素子１４お
よび受光素子１５に対応する上面は、上方に向かって４
５°の角度をもつて傾斜され、光路１７を形成するため
のプリズム状の傾斜反射面（オプテイカルガイド）３１
ａ，３１ｂとされている。これらは、通過路１２を挟ん
で対向配置される。該傾斜反射面３１ａ，３１ｂは、受
発光素子１４，１５の位置決め精度が多少悪くても、そ
の光学的結合特性に支障を来さないよう、各素子１４，
１５に比べて十分大きく形成されている。The primary mold body 16 is made of a translucent epoxy resin, for example, and as shown in FIG.
The mold is insert-molded so that the tip of the is projected to the outside and pulled out. The upper surface of the primary mold body 16 corresponding to the light emitting element 14 and the light receiving element 15 is 4 upwards.
A prism-shaped inclined reflecting surface (optical guide) 31 for forming an optical path 17 which is inclined at an angle of 5 °
a and 31b. These are opposed to each other with the passage 12 interposed therebetween. The inclined reflecting surfaces 31a and 31b prevent the optical coupling characteristics from being affected even if the positioning accuracy of the light emitting and receiving elements 14 and 15 is somewhat poor.
It is formed to be sufficiently larger than 15.

【００２３】そして、該一次モールド体１６のＧＮＤ端
子２１の引出し部には、図３に示すように、前記二次モ
ールド体１８がＧＮＤ端子２１に直接接触するよう充填
される切欠３３が形成されている。As shown in FIG. 3, a notch 33 is formed in the lead-out portion of the GND terminal 21 of the primary mold body 16 so that the secondary mold body 18 is in direct contact with the GND terminal 21. ing.

【００２４】前記二次モールド体１８は、導電性を確保
するため、例えばフイラーとして微細な金属粉が混入さ
れた遮光性のエポキシ樹脂が使用され、図１の如く、中
央部に通過路１２を有する板状に金型インサート成形さ
れる。In order to ensure conductivity, the secondary mold body 18 uses, for example, a light-shielding epoxy resin mixed with fine metal powder as a filler. As shown in FIG. 1, the passage 12 is formed at the center. The mold is insert-molded into a plate shape.

【００２５】該二次モールド体１８は、前記切欠３３に
充填されてＧＮＤ端子２１に電気的に接続されるが、電
源入力端子２２と出力端子２３には非接触状態となるよ
う、該両端子２２，２３の外部引出し面３４を回避して
モールドされる。なお、この外部引出し面３４からの外
乱光の進入を防止すべく、この面３４に黒色インク等を
塗布しておいてもよい。The secondary molded body 18 is filled in the notch 33 and electrically connected to the GND terminal 21, but the power input terminal 22 and the output terminal 23 are not in contact with each other. It is molded while avoiding the external drawing surfaces 34 of 22 and 23. It should be noted that black ink or the like may be applied to this surface 34 in order to prevent the entry of ambient light from the external extraction surface 34.

【００２６】また、図１中、３５の部分は、前記一次モ
ールド体１６の傾斜反射面３１ａ，３１ｂを露出させる
よう切り欠かれている。これは、傾斜反射面３１ａ，３
１ｂを二次モールド体１８で覆うと反射率が低下するの
で、これを防止するためである。ただし、二次モールド
体１８として反射率の高い材質を用いる場合は、３５の
部分を覆つてもよいことはいうまでもない。Further, in FIG. 1, a portion 35 is cut out so as to expose the inclined reflection surfaces 31a and 31b of the primary mold body 16. This is the inclined reflecting surfaces 31a, 3
This is because if the 1b is covered with the secondary mold body 18, the reflectance is lowered, and this is prevented. However, when a material having a high reflectance is used as the secondary mold body 18, it goes without saying that the portion 35 may be covered.

【００２７】なお、図２中、３６はボンデイングワイヤ
である。In FIG. 2, reference numeral 36 is a bonding wire.

【００２８】上記構成の光結合装置は、次のように組み
立てられる。まず、外郭部がタイバーにて連結されたリ
ードフレームとしての導電配線部１３上に、発光素子１
４、受光素子１５およびチツプ部品２７をダイボンドす
る。The optical coupling device having the above structure is assembled as follows. First, the light emitting element 1 is formed on the conductive wiring portion 13 as a lead frame whose outer portion is connected by a tie bar.
4. The light receiving element 15 and the chip component 27 are die-bonded.

【００２９】次に、ボンデイングワイヤ３６で結線した
後、透光性エポキシ樹脂で一次モールド体１６を形成す
る。この際、一次モールド体１６の発光素子１４および
受光素子１５に対応する上面に傾斜反射面３１ａ，３１
ｂを形成し、また、ＧＮＤ端子２１の引出し部に切欠３
３を形成しておく。Next, after connecting with a bonding wire 36, a primary mold body 16 is formed with a translucent epoxy resin. At this time, the inclined reflection surfaces 31a, 31 are formed on the upper surfaces of the primary mold body 16 corresponding to the light emitting element 14 and the light receiving element 15.
b, and the notch 3 is formed in the lead-out portion of the GND terminal 21.
Form 3.

【００３０】そして、一次モールド体１６の周囲を二次
モールド体１８でモールドする。この際、二次モールド
体１８を切欠３３に充填し、ＧＮＤ端子２１に電気的に
接続する。Then, the periphery of the primary mold body 16 is molded with the secondary mold body 18. At this time, the secondary mold body 18 is filled in the notch 33 and electrically connected to the GND terminal 21.

【００３１】最後に、導電配線部１３の外郭部のタイバ
ーを切断して、光結合装置は完成する。Finally, the tie bar of the outer portion of the conductive wiring portion 13 is cut to complete the optical coupling device.

【００３２】このように、本実施例の製造工程では、素
子１４，１５等をリードフレームとしての導電配線部１
３に直接搭載して作成できるため、従来用いていた高価
な配線基板を省略でき、光結合装置全体としてのコスト
低減を図り得る。As described above, in the manufacturing process of this embodiment, the conductive wiring portion 1 is used as the lead frame for the elements 14, 15 and the like.
Since it can be directly mounted on the substrate 3, the expensive wiring board used conventionally can be omitted, and the cost of the entire optical coupling device can be reduced.

【００３３】また、受発光両素子１４，１５等をリード
フレームの所定位置に併置するようダイボンドした後、
一次モールド体１６の傾斜反射面３１ａ，３１ｂにて両
者の光学的位置決めを行うので、両素子１４，１５の位
置精度が多少悪くても、受発光間の位置決めを容易に行
い得る。したがつて、従来のように、位置決め用の治具
型等を用いる必要がなくなり、作業を簡素化できる。After die-bonding the light-receiving and light-emitting elements 14 and 15 so as to be juxtaposed at predetermined positions on the lead frame,
Since the optical positioning of the primary mold body 16 and the inclined reflective surfaces 31a and 31b of the primary mold body 16 is performed, even if the positional accuracy of the elements 14 and 15 is somewhat poor, the positioning between the light receiving and emitting can be easily performed. Therefore, unlike the conventional case, it is not necessary to use a jig for positioning or the like, and the work can be simplified.

【００３４】また、完成後の光結合装置において、図１
の如く、電源入力端子２２に電源を入力し、発光素子１
４を発光させると、通過路１２中の光路１７を光が通過
し、受光素子１５にて受光する。そして、受光素子１５
は光電変換出力を出力端子２３に出力する。In the completed optical coupling device, as shown in FIG.
Power is input to the power input terminal 22 as shown in FIG.
When 4 is made to emit light, the light passes through the optical path 17 in the passage 12 and is received by the light receiving element 15. Then, the light receiving element 15
Outputs the photoelectric conversion output to the output terminal 23.

【００３５】ここで、被検出物１１が通過路１２を通過
すると、光路１７が遮られ、受光素子１５からの出力が
停止する。これにより、被検出物１１の通過路１２での
通過状態を検出する。Here, when the object 11 to be detected passes through the passage 12, the optical path 17 is blocked and the output from the light receiving element 15 is stopped. As a result, the passing state of the detection object 11 on the passage 12 is detected.

【００３６】このとき、光結合装置の表面に静電気が発
生することがある。特に、チツプ部品２７の半田付時に
半田ボールができた場合、ここに放電が生ずると発光素
子１４および受光素子１５が破壊しやすくなる。At this time, static electricity may be generated on the surface of the optical coupling device. In particular, when a solder ball is formed during soldering of the chip component 27, the light emitting element 14 and the light receiving element 15 are easily broken when a discharge is generated there.

【００３７】しかし、本実施例では、導電性の二次モー
ルド体１８をＧＮＤ端子２１に電気的に接続しているの
で、光結合装置の表面に発生した静電気を即座にアース
することにより、受発光両素子１４，１５の破壊を防止
することができる。However, in this embodiment, since the conductive secondary mold body 18 is electrically connected to the GND terminal 21, static electricity generated on the surface of the optical coupling device is immediately grounded to receive the static electricity. It is possible to prevent the light emitting elements 14 and 15 from being destroyed.

【００３８】また、予め一次、二次モールドされた光結
合装置を一部品として外部機器に組み込むことができる
ため、完成後に、振動によつて半田が断線したり、外装
ケースとしての二次モールド体１８と半田とが接触して
誤動作あるいは素子破壊するのを防止できる。Further, since the optical coupling device that has been primary and secondary molded in advance can be incorporated into an external device as one component, after completion, the solder is broken due to vibration, or the secondary molded body as an outer case is formed. It is possible to prevent malfunction or device destruction due to contact between 18 and the solder.

【００３９】なお、本発明は、上記実施例に限定される
ものではなく、本発明の範囲内で上記実施例に多くの修
正および変更を加え得ることは勿論である。The present invention is not limited to the above embodiment, and it goes without saying that many modifications and changes can be made to the above embodiment within the scope of the present invention.

【００４０】[0040]

【発明の効果】以上の説明から明らかな通り、本発明請
求項１によると、光結合装置の内部を絶縁性の一次モー
ルド体で被覆保護しているので、信頼性のある内部回路
を構成でき、さらに二次モールド体の表面に静電気が起
きても、これ自体導電性であり、かつ接地端子と接触し
ているため、接地端子を通じて確実にアースでき、素子
の破壊を防止できる。As is apparent from the above description, according to claim 1 of the present invention, since the inside of the optical coupling device is covered and protected by the insulating primary mold body, a reliable internal circuit can be constructed. Further, even if static electricity occurs on the surface of the secondary mold body, since it is electrically conductive and is in contact with the ground terminal, it can be surely grounded through the ground terminal and damage to the element can be prevented.

【００４１】請求項２によると、導電配線部としてリー
ドフレームを用いているので、従来用いていた高価な配
線基板を省略でき、光結合装置全体としてのコスト低減
を図り得る。According to the second aspect, since the lead frame is used as the conductive wiring portion, the expensive wiring board conventionally used can be omitted, and the cost of the entire optical coupling device can be reduced.

【００４２】請求項３によると、リードフレームを同一
平面上に配線形成し、この上に両素子を上向けに搭載
し、一次モールド体の各素子に対応する上面に傾斜反射
面を形成しているので、両素子の位置決めを厳密に考慮
する必要がなくなり、素子位置決め用の治具等も必要な
くなり、素子搭載時の作業を簡素化できるといつた優れ
た効果を有する。According to the third aspect of the present invention, the lead frame is formed on the same plane by wiring, both elements are mounted on the lead frame, and the inclined reflection surface is formed on the upper surface corresponding to each element of the primary mold body. Therefore, it is not necessary to strictly consider the positioning of both elements, a jig for element positioning is not required, and it is possible to simplify the work when mounting the elements, which has an excellent effect.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例を示す光結合装置の斜視図FIG. 1 is a perspective view of an optical coupling device showing an embodiment of the present invention.

【図２】導電配線部に受発光両素子が搭載された状態を
示す平面図FIG. 2 is a plan view showing a state in which both light receiving and emitting elements are mounted on a conductive wiring portion.

【図３】一次モールド体が被覆された状態を示す斜視図FIG. 3 is a perspective view showing a state in which the primary mold body is covered.

【図４】従来の光結合装置の平面図FIG. 4 is a plan view of a conventional optical coupling device.

【図５】従来の光結合装置の縦断面図FIG. 5 is a vertical sectional view of a conventional optical coupling device.

【図６】従来の光結合装置の横断面図FIG. 6 is a cross-sectional view of a conventional optical coupling device.

【図７】従来の光結合装置の外装ケースの一部拡大斜視
図FIG. 7 is a partially enlarged perspective view of an outer case of a conventional optical coupling device.

【図８】従来の光結合装置の配線基板の一部拡大斜視図FIG. 8 is a partially enlarged perspective view of a wiring board of a conventional optical coupling device.

【図９】従来の光結合装置の外装ケースに配線基板を組
み込んだ状態を示す一部拡大斜視図FIG. 9 is a partially enlarged perspective view showing a state in which a wiring board is incorporated in an outer case of a conventional optical coupling device.

【符号の説明】[Explanation of symbols]

１１ 被検出物 １２ 通過路 １３ 導電配線部 １４ 発光素子 １５ 受光素子 １６ 一次モールド体 １７ 光路 １８ 二次モールド体 ２１ 接地端子 ３１ａ，３１ｂ 傾斜反射面 11 Detected Object 12 Passage Path 13 Conductive Wiring Section 14 Light-Emitting Element 15 Light-Receiving Element 16 Primary Molded Body 17 Optical Path 18 Secondary Molded Body 21 Ground Terminal 31a, 31b Inclined Reflecting Surface

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】 被検出物の通過路内での有無を無接点で
検出するものであつて、接地端子を有する導電配線部
に、発光素子および受光素子が通過路を挟んで光学的に
結合するよう搭載され、これらに透光性かつ電気的絶縁
性を有する一次モールド体が被覆され、該一次モールド
体に前記被検出物の通過路を除いて遮光性かつ導電性を
有する二次モールド体が被覆され、該二次モールド体
は、前記導電配線部のうち接地端子のみに接触されたこ
とを特徴とする光結合装置。1. A contactless detection of the presence or absence of an object to be detected in a passage, wherein a light emitting element and a light receiving element are optically coupled to a conductive wiring portion having a ground terminal with the passage being interposed therebetween. And a primary mold body having a light-transmitting property and an electrical insulating property is coated thereon, and the primary mold body has a light-shielding and conductive secondary mold body except for the passage of the object to be detected. And the secondary mold body is brought into contact with only the ground terminal of the conductive wiring portion. 【請求項２】 請求項１記載の導電配線部はリードフレ
ームからなることを特徴とする光結合装置。2. The optical coupling device according to claim 1, wherein the conductive wiring portion comprises a lead frame. 【請求項３】 請求項２記載の光結合装置において、リ
ードフレームは同一平面上に配線形成され、該リードフ
レーム上に、発光素子および受光素子がその受発光面を
上方に向けて搭載され、一次モールド体の各素子に対応
する上面に、発光素子からの光を受光素子へ反射させて
導光する傾斜反射面が形成されたことを特徴とする光結
合装置。3. The optical coupling device according to claim 2, wherein the lead frame is wired on the same plane, and the light emitting element and the light receiving element are mounted on the lead frame with their light receiving and emitting surfaces facing upward. An optical coupling device, wherein an inclined reflection surface that reflects and guides light from a light emitting element to a light receiving element is formed on an upper surface corresponding to each element of the primary mold body.