JPH05162722A - Emboss forming device - Google Patents

Emboss forming device

Info

Publication number
JPH05162722A
JPH05162722A JP3325976A JP32597691A JPH05162722A JP H05162722 A JPH05162722 A JP H05162722A JP 3325976 A JP3325976 A JP 3325976A JP 32597691 A JP32597691 A JP 32597691A JP H05162722 A JPH05162722 A JP H05162722A
Authority
JP
Japan
Prior art keywords
female
gear
male
flat portion
embossed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3325976A
Other languages
Japanese (ja)
Inventor
Masaaki Momotome
留 公 明 百
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP3325976A priority Critical patent/JPH05162722A/en
Publication of JPH05162722A publication Critical patent/JPH05162722A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • B29C51/18Thermoforming apparatus
    • B29C51/20Thermoforming apparatus having movable moulds or mould parts
    • B29C51/22Thermoforming apparatus having movable moulds or mould parts rotatable about an axis
    • B29C51/225Thermoforming apparatus having movable moulds or mould parts rotatable about an axis mounted on a vacuum drum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • B29C51/08Deep drawing or matched-mould forming, i.e. using mechanical means only
    • B29C51/082Deep drawing or matched-mould forming, i.e. using mechanical means only by shaping between complementary mould parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Containers And Plastic Fillers For Packaging (AREA)
  • Packages (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To form embossed parts and flange parts on a sheet plate with favorable precision. CONSTITUTION:An emboss forming device 10 is equipped with a female die gear 11 and a male die gear 12. The female die gear 11 has a female die flat part 21 and a recessed part 22. The male die gear 12 has a male die flat part 23, which forms a first clearance with the female flat part 21, and a protruding part 24 which forms a second clearance with the recessed part 22.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はIC等の電子部品を包装
して搬送する電子部品搬送体の底材を製造するために用
いるエンボス成形装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an embossing apparatus used for manufacturing a bottom material for an electronic parts carrier for packaging and carrying electronic parts such as ICs.

【0002】[0002]

【従来の技術】従来、IC等の電子部品を多数包装して
搬送する合成樹脂製の電子部品搬送体が知られている。
この電子部品搬送体は、IC等の電子部品を収納する底
材と、底材を覆う平板状蓋材とを備えている。
2. Description of the Related Art Conventionally, there has been known a synthetic resin electronic component carrier for packaging and transporting a large number of electronic components such as ICs.
This electronic component carrier is provided with a bottom member that accommodates electronic components such as ICs, and a flat lid member that covers the bottom member.

【0003】このような電子部品搬送体について、図9
および図10により簡単に説明する。図9および図10
において、電子部品搬送体70は、IC等の電子部品7
7を収納する底材71と、底材71を覆う蓋材75とを
備えている。また底材71は電子部品収納用のエンボス
部72と、エンボス部72上端開口のフランジ部73と
からなり、蓋材75はこのフランジ部73にヒートシー
ルされるようになっている。エンボス部72は、単列で
連続して設けられており、各エンボス部72は上端開口
のフランジ部73によって互いに連結されている。
FIG. 9 shows such an electronic component carrier.
A brief description will be given with reference to FIG. 9 and 10
In the electronic component carrier 70, the electronic component 7 such as an IC
A bottom material 71 for housing 7 and a lid material 75 for covering the bottom material 71 are provided. The bottom member 71 is composed of an embossed portion 72 for housing electronic components and a flange portion 73 at the upper end opening of the embossed portion 72, and the lid member 75 is heat-sealed to the flange portion 73. The embossed portions 72 are continuously provided in a single row, and the embossed portions 72 are connected to each other by a flange portion 73 having an upper end opening.

【0004】このうち、底材71は例えば塩化ビニル製
シート板を真空または圧空成形して形成され、一方、蓋
材は合成樹脂製の積層シートからなっている。またフラ
ンジ部73には、エンボス部72に隣接して複数のパン
チ孔74が連続して設けられている。このパンチ孔74
は、底材71移送用のものである。
Of these, the bottom material 71 is formed by vacuum or pressure forming a vinyl chloride sheet plate, for example, while the lid material is a laminated sheet made of synthetic resin. Further, a plurality of punch holes 74 are continuously provided in the flange portion 73 adjacent to the embossed portion 72. This punch hole 74
Is for transferring the bottom material 71.

【0005】シート板にエンボス部を成形する方法とし
て、従来、例えば図5に示す方法が知られている。図5
において、シート巻体41から繰り出されたシート板4
0は、加熱装置42によって加熱され、エンボス成形装
置43に送られる。エンボス成形装置43は、成形雌型
43aと成形雄型43bとからなり、シート板40にエ
ンボス部45を成形するようになっている。
As a method of forming an embossed portion on a sheet plate, a method shown in FIG. 5, for example, has been conventionally known. Figure 5
The sheet plate 4 unrolled from the sheet winding body 41
0 is heated by the heating device 42 and sent to the embossing device 43. The embossing molding device 43 includes a molding female die 43a and a molding male die 43b, and is configured to mold the embossed portion 45 on the sheet plate 40.

【0006】近年、電子部品の極小化が進み、これに対
応してエンボス部も小型化し、またエンボス部間のピッ
チも狭くなる傾向にある。
In recent years, miniaturization of electronic parts has progressed, and in response to this miniaturization, the embossed portions are also downsized, and the pitch between the embossed portions tends to be narrowed.

【0007】エンボス部の小型化に伴い、エンボス成形
装置43を小型化する必要がある。この場合、とりわけ
成形雌型43aの溝部47間の間隔aが狭くなり、また
両側の溝部47と外端との間の間隔bは、一般に通常b
=2/3aとなっているため、bは更に狭くなる。この
ため、成形雌型43aは間隔b部分で強度が低下すると
いう問題が生じる。
As the size of the embossed portion is reduced, it is necessary to reduce the size of the embossing molding device 43. In this case, in particular, the distance a between the groove portions 47 of the female molding die 43a becomes narrower, and the distance b between the groove portions 47 on both sides and the outer end is generally b.
Since b = 2 / 3a, b is further narrowed. Therefore, the molding female die 43a has a problem that its strength is reduced at the interval b.

【0008】他方、シート板にエンボス部を成形する方
法として、図6乃至図8に示す方法が知られている。図
6において、シート巻体51から繰り出されたシート板
50は、加熱ドラム52によって加熱され、エンボス成
形装置53に送られる。エンボス成形装置53は、図7
に示すように円筒状の真空ドラム60を有している。真
空ドラム60の外周には複数の凸部61が連続して設け
られており、各凸部61の間には凹部62が形成されて
いる。また真空ドラム60には、シート板50を吸引す
る真空孔63が形成されている。
On the other hand, a method shown in FIGS. 6 to 8 is known as a method for forming an embossed portion on a sheet plate. In FIG. 6, the sheet plate 50 unrolled from the sheet winding body 51 is heated by the heating drum 52 and sent to the embossing molding device 53. The embossing molding device 53 is shown in FIG.
As shown in FIG. 3, it has a cylindrical vacuum drum 60. A plurality of convex portions 61 are continuously provided on the outer circumference of the vacuum drum 60, and concave portions 62 are formed between the respective convex portions 61. Further, the vacuum drum 60 is formed with a vacuum hole 63 for sucking the sheet plate 50.

【0009】しかしながら、真空ドラム60を有するエ
ンボス成形装置53の場合、エンボス部の小型化に伴っ
て凸部61の幅cが狭くなると、例えば図8に示すよう
に幅の広い凸部61a(図8(a))から幅の狭い凸部
61b(図8(b))へ変化すると、精度良く成形する
ことができなくなる場合がある。すなわち、図8(b)
に示すように、凸部61bの上方に隙間64を形成した
状態でエンボス部が成形されることがあり、図8(c)
に示すような理想的な形状とならないことがある。
However, in the case of the embossing molding device 53 having the vacuum drum 60, when the width c of the convex portion 61 becomes narrower as the embossed portion becomes smaller, for example, as shown in FIG. 8 (a)) to a narrower convex portion 61b (FIG. 8 (b)), it may not be possible to perform accurate molding. That is, FIG. 8B
As shown in FIG. 8, the embossed portion may be formed with the gap 64 formed above the convex portion 61b, as shown in FIG.
It may not be an ideal shape as shown in.

【0010】[0010]

【発明が解決しようとする課題】上述のように、従来シ
ート板にエンボス部を成形する方法として、成形雌型4
3aと成形雄型43bからなるエンボス成形装置43に
よってエンボス部を加工成形する方法がある(図5)。
しかしながら、この成形方法の場合、エンボス部の小型
化に伴ってエンボス成形装置43、とりわけ成形雌型4
3aの強度が低下することがある。
As described above, as a conventional method for forming an embossed portion on a sheet plate, a forming female die 4 is used.
There is a method of processing and molding the embossed portion by the embossing molding device 43 composed of 3a and the molding male die 43b (FIG. 5).
However, in the case of this molding method, as the size of the embossed portion is reduced, the embossing molding device 43, especially the molding female die 4 is formed.
The strength of 3a may decrease.

【0011】他方、真空ドラム60を有するエンボス成
形装置53によってエンボス部を加工成形する方法があ
る(図6乃至図8)。しかしながら、この成形方法の場
合、エンボス部の小型化に伴って精度良く成形すること
ができないことがある。
On the other hand, there is a method of processing and molding the embossed portion by the embossing device 53 having the vacuum drum 60 (FIGS. 6 to 8). However, in the case of this molding method, it may not be possible to carry out molding with high precision as the embossed portion becomes smaller.

【0012】本発明は、このような点を考慮してなされ
たものであり、エンボス部を小型化した場合でも精度良
くエンボス部を加工成形することができるエンボス成形
装置を提供することを目的とする。
The present invention has been made in view of the above points, and an object of the present invention is to provide an embossing molding device capable of accurately forming an embossed portion even when the embossed portion is downsized. To do.

【0013】[0013]

【課題を解決するための手段】本発明は、円周状の雌型
平坦部と、この雌型平坦部に所定間隔をおいて形成され
た複数の凹部とを有する雌型歯車と、前記雌型平坦部と
の間で所定の第1クリアランスを形成する円周状の雄型
平坦部と、この雄型平坦部に所定間隔をおいて形成され
るとともに、前記凹部内に所定の第2クリアランスを形
成しながら侵入する複数の凸部とを有する雄型歯車を備
えたことを特徴とするエンボス成形装置である。
According to the present invention, there is provided a female gear having a circumferential female flat portion and a plurality of recesses formed in the female flat portion at predetermined intervals, and the female gear. A circumferential male flat portion that forms a predetermined first clearance with the die flat portion, and a predetermined second clearance that is formed in the male flat portion at a predetermined interval and is formed in the recess. The embossing molding apparatus is provided with a male gear having a plurality of convex portions that enter while forming the.

【0014】[0014]

【作用】送られてくるシート板は、雌型平坦部と雄型平
坦部との間で押圧されて第1クリアランスと同一厚さの
フランジ部が成形され、凸部と凹部との間で押圧されて
第2クリアランスと同一厚さのエンボス部が成形され
る。
The sheet plate sent is pressed between the female flat portion and the male flat portion to form a flange portion having the same thickness as the first clearance, and pressed between the convex portion and the concave portion. Thus, the embossed portion having the same thickness as the second clearance is formed.

【0015】[0015]

【実施例】以下、図面を参照して本発明の実施例につい
て説明する。図1乃至図4は、本発明によるエンボス成
形装置の一実施例を示す図である。まず、図2によりエ
ンボス成形装置の概略について説明する。図2におい
て、シート巻体15から繰り出されたシート板20がヒ
ータ13により加熱され、エンボス成形装置10に送ら
れるようになっている。
Embodiments of the present invention will be described below with reference to the drawings. 1 to 4 are views showing an embodiment of an embossing apparatus according to the present invention. First, the outline of the embossing apparatus will be described with reference to FIG. In FIG. 2, the sheet plate 20 fed from the sheet winding body 15 is heated by the heater 13 and sent to the embossing apparatus 10.

【0016】シート板20は塩化ビニル製、ポリプロピ
レン製、またはポリスチレン製となっている。例えばシ
ート板20をポリプロピレン製とした場合、材料のMF
R(Melt Flow Rate)は0.8〜3.0となっているこ
とが好ましい。このうち、好ましくは、MFRは1.0
〜1.5となっている。
The seat plate 20 is made of vinyl chloride, polypropylene, or polystyrene. For example, when the sheet plate 20 is made of polypropylene, the material MF is
R (Melt Flow Rate) is preferably 0.8 to 3.0. Of these, the MFR is preferably 1.0
It is ~ 1.5.

【0017】またシート板20の加熱温度は、シート板
20の軟化点以下、例えば80〜150℃となってお
り、好ましくは100〜130℃となっている。
The heating temperature of the sheet plate 20 is not higher than the softening point of the sheet plate 20, for example, 80 to 150 ° C., preferably 100 to 130 ° C.

【0018】次に、エンボス成形装置について説明す
る。図2に示すようにエンボス成形装置10はインボリ
ュートタイプの雌型歯車11および雄型歯車12からな
っている。このうち、雌型歯車11は図1(a)に示す
ように、円周状の雌型平坦部21と、雌型平坦部21に
円周方向に所定間隔をおいて形成された複数の凹部22
とを有している。他方、雄型歯車12は図1(b)に示
すように、円周状の雄型平坦部23と、雄型平坦部23
に所定間隔をおいて形成された複数の凸部24とを有し
ている。
Next, the embossing apparatus will be described. As shown in FIG. 2, the embossing apparatus 10 comprises an involute type female gear 11 and a male gear 12. Among them, the female gear 11 is, as shown in FIG. 1A, a circumferential female flat portion 21 and a plurality of concave portions formed in the female flat portion 21 at predetermined intervals in the circumferential direction. 22
And have. On the other hand, as shown in FIG. 1B, the male gear 12 has a circular male flat portion 23 and a male flat portion 23.
And a plurality of convex portions 24 formed at predetermined intervals.

【0019】図3に示すように、雄型歯車12の凸部2
4は雌型歯車11の凹部22内に侵入するようになって
おり、この凸部24と凹部22との間でシート板20に
エンボス部72(図10参照)を成形するようになって
いる。凸部24と凹部22との間には、第2所定のクリ
アランスLが形成されており、この第2クリアランスL
はシート板20の厚さ×(1/5 〜1/2 )となっている。
そして、この第2クリアランスLが成形後のエンボス部
72の厚さとなる。また、雌型平坦部21と雄型平坦部
23との間にも所定の第1クリアランスが形成され、こ
の雌型平坦部21と雄型平坦部23との間でシート板2
0が押圧され、第1クリアランスと同一厚のフランジ部
73(図10参照)が成形されるようになっている。
As shown in FIG. 3, the convex portion 2 of the male gear 12 is
Reference numeral 4 is adapted to penetrate into the concave portion 22 of the female gear 11, and an embossed portion 72 (see FIG. 10) is formed on the seat plate 20 between the convex portion 24 and the concave portion 22. .. A second predetermined clearance L is formed between the convex portion 24 and the concave portion 22, and the second clearance L
Is the thickness of the seat plate 20 × (1/5 to 1/2).
Then, the second clearance L becomes the thickness of the embossed portion 72 after molding. A predetermined first clearance is also formed between the female flat portion 21 and the male flat portion 23, and the seat plate 2 is provided between the female flat portion 21 and the male flat portion 23.
0 is pressed, and a flange portion 73 (see FIG. 10) having the same thickness as the first clearance is formed.

【0020】例えば、シート板20の厚みが0.3m/m
の場合は、エンボス部72の厚みを定める第2クリアラ
ンスLはシート板20の厚さ×(1/3 〜1/2 )の値、す
なわち0.1〜0.15m/m となっている。
For example, the thickness of the sheet plate 20 is 0.3 m / m
In this case, the second clearance L that determines the thickness of the embossed portion 72 is a value of the thickness of the seat plate 20 x (1/3 to 1/2), that is, 0.1 to 0.15 m / m.

【0021】なお、図4に示すように雌型歯車11は雌
型用駆動歯車31により駆動されるようになっており、
また雄型歯車12は雄型用駆動歯車32により駆動され
るようになっている。図4において、図示しない駆動部
から雌型用駆動歯車31に伝達された駆動力は、雌型歯
車11に直接伝達され、同時に雌型用駆動歯車31から
雄型用駆動歯車32に伝達される。そしてその後雄型用
駆動歯車32から雄型歯車12に駆動力が伝達されるよ
うになっている。このように、雌型歯車11と雄型歯車
12は、別々の駆動機構、すなわち雌型用駆動歯車31
および雄型用駆動歯車32とにより独立して駆動され
る。
As shown in FIG. 4, the female gear 11 is driven by a female drive gear 31.
The male gear 12 is driven by a male drive gear 32. In FIG. 4, the driving force transmitted from the drive unit (not shown) to the female drive gear 31 is directly transmitted to the female gear 11, and at the same time, transmitted from the female drive gear 31 to the male drive gear 32. . Then, after that, the driving force is transmitted from the male drive gear 32 to the male gear 12. As described above, the female gear 11 and the male gear 12 are provided as separate drive mechanisms, that is, the female drive gear 31.
And driven by the male drive gear 32 independently.

【0022】次にこのような構成からなる実施例の作用
について説明する。図2において、シート巻体15から
繰り出されたシート板20はヒータ13によって加熱さ
れ、エンボス成形装置10に送られる。エンボス成形装
置10において、図3に示すように、まずシート板20
は雌型平坦部21と雄型平坦部23との間で押圧され、
フランジ部73が成形される。同時に、雌型歯車11の
凹部22と雄型歯車12の凸部24との間でエンボス部
72が成形される。このようにしてフランジ部73とエ
ンボス部72とが成形された底材は、エンボス成形装置
10から排出される。
Next, the operation of the embodiment having such a configuration will be described. In FIG. 2, the sheet plate 20 unrolled from the sheet roll 15 is heated by the heater 13 and sent to the embossing apparatus 10. In the embossing apparatus 10, as shown in FIG.
Is pressed between the female flat portion 21 and the male flat portion 23,
The flange portion 73 is molded. At the same time, the embossed portion 72 is formed between the concave portion 22 of the female gear 11 and the convex portion 24 of the male gear 12. The bottom material having the flange portion 73 and the embossed portion 72 thus formed is discharged from the embossing molding device 10.

【0023】本実施例によれば、雌型歯車11の凹部2
2と雄型歯車12の凸部24との間でエンボス部72を
成形するとともに、雌型平坦部21と雄型平坦部23と
の間でフランジ部73を成形するので、精度良く成形す
ることができる。また、雌型歯車11および雄型歯車1
2は、いずれも歯車構造となっているので、従来のよう
な成形雌型43aの両端における強度低下という問題は
生じない。 (具体例)次に本発明の具体例について説明する。 シート板20として以下の材料を用いた。 ・ポリプロピレン製(チッ素HT0014) ・MFR 1.5 またヒータ13による加熱温度を120℃とした。 本具体例によれば、精度良くエンボス部とフランジ部を
シート板に成形することができた。
According to this embodiment, the concave portion 2 of the female gear 11 is
2 is formed between the convex portion 24 of the male gear 12 and the embossed portion 72, and the flange portion 73 is formed between the female flat portion 21 and the male flat portion 23. You can Further, the female gear 11 and the male gear 1
Since No. 2 has a gear structure, the problem of strength reduction at both ends of the female molding die 43a unlike the conventional case does not occur. (Specific Example) Next, a specific example of the present invention will be described. The following materials were used as the sheet plate 20. -Polypropylene (Nitrogen HT0014) -MFR 1.5 The heating temperature by the heater 13 was 120 ° C. According to this example, the embossed portion and the flange portion could be accurately formed on the sheet plate.

【0024】[0024]

【発明の効果】以上説明したように、本発明によれば、
雌型歯車の凹部と雄型歯車の凸部との間でエンボス部を
成形するとともに、雌型平坦部と雄型平坦部との間でフ
ランジ部を成形するので、シート板にエンボス部とフラ
ンジ部を精度良く成形することができる。また、雌型歯
車と雄型歯車は、いずれも歯車構造となっているので、
エンボス部間のピッチを狭くした場合でも従来のような
両端部における強度低下という問題は生じない。
As described above, according to the present invention,
Since the embossed portion is formed between the concave portion of the female gear and the convex portion of the male gear and the flange portion is formed between the female flat portion and the male flat portion, the embossed portion and the flange are formed on the sheet plate. The portion can be molded with high precision. Also, since the female gear and the male gear both have a gear structure,
Even if the pitch between the embossed portions is narrowed, the problem of strength reduction at both ends unlike the conventional case does not occur.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明によるエンボス成形装置の一実施例を構
成する雌型歯車と雄型歯車を示す概略斜視図。
FIG. 1 is a schematic perspective view showing a female gear and a male gear that constitute an embodiment of an embossing apparatus according to the present invention.

【図2】エンボス成形装置およびヒータを示す概略図。FIG. 2 is a schematic view showing an embossing molding device and a heater.

【図3】雌型歯車と雄型歯車の係合状態を示す側面図。FIG. 3 is a side view showing an engaged state of a female gear and a male gear.

【図4】雌型歯車と雄型歯車の駆動機構を示す概略図。FIG. 4 is a schematic view showing a drive mechanism for a female gear and a male gear.

【図5】従来のエンボス成形装置の概略図。FIG. 5 is a schematic view of a conventional embossing molding device.

【図6】従来のエンボス成形装置の概略図。FIG. 6 is a schematic view of a conventional embossing molding device.

【図7】図6に示すエンボス成形装置の拡大図。7 is an enlarged view of the embossing apparatus shown in FIG.

【図8】図6に示すエンボス成形装置による成形状態を
示す図。
8 is a view showing a molding state by the embossing molding device shown in FIG.

【図9】一般の電子部品搬送体を示す斜視図。FIG. 9 is a perspective view showing a general electronic component carrier.

【図10】図9のX−X線断面図。10 is a cross-sectional view taken along line XX of FIG.

【符号の説明】 10 エンボス成形装置 11 雌型歯車 12 雄型歯車 20 シート板 21 雌型平坦部 22 凹部 23 雄型平坦部 24 凸部[Explanation of Codes] 10 Embossing Molding Device 11 Female Gear 12 Male Gear 20 Seat Plate 21 Female Flat Part 22 Recess 23 Male Flat Part 24 Convex

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】円周状の雌型平坦部と、この雌型平坦部に
所定間隔をおいて形成された複数の凹部とを有する雌型
歯車と、前記雌型平坦部との間で所定の第1クリアラン
スを形成する円周状の雄型平坦部と、この雄型平坦部に
所定間隔をおいて形成されるとともに、前記凹部内に所
定の第2クリアランスを形成しながら侵入する複数の凸
部とを有する雄型歯車を備えたことを特徴とするエンボ
ス成形装置。
1. A female gear having a circular female flat portion and a plurality of recesses formed in the female flat portion at predetermined intervals, and a predetermined distance between the female flat portion. A circumferential male flat portion that forms the first clearance, and a plurality of male flat portions that are formed at predetermined intervals in the male flat portion and that enter the concave portion while forming a predetermined second clearance. An embossing molding apparatus comprising a male gear having a convex portion.
JP3325976A 1991-12-10 1991-12-10 Emboss forming device Pending JPH05162722A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3325976A JPH05162722A (en) 1991-12-10 1991-12-10 Emboss forming device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3325976A JPH05162722A (en) 1991-12-10 1991-12-10 Emboss forming device

Publications (1)

Publication Number Publication Date
JPH05162722A true JPH05162722A (en) 1993-06-29

Family

ID=18182697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3325976A Pending JPH05162722A (en) 1991-12-10 1991-12-10 Emboss forming device

Country Status (1)

Country Link
JP (1) JPH05162722A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08309850A (en) * 1995-05-15 1996-11-26 Solvay & Cie Manufacturing method for thermoplastic film with crimp,film manufactured by its method,and application and product of this film
JP2007268886A (en) * 2006-03-31 2007-10-18 Dainippon Printing Co Ltd Embossing device, combination of embossing molds, embossing method, and sheet-like base material
JP2010005881A (en) * 2008-06-26 2010-01-14 Tsukatani Hamono Seisakusho:Kk Flexible die

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02194926A (en) * 1989-01-25 1990-08-01 Dainippon Printing Co Ltd Manufacture of plastic film with precision embossing
JPH0321427A (en) * 1989-06-19 1991-01-30 Murata Mfg Co Ltd Device for forming embossed tape

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02194926A (en) * 1989-01-25 1990-08-01 Dainippon Printing Co Ltd Manufacture of plastic film with precision embossing
JPH0321427A (en) * 1989-06-19 1991-01-30 Murata Mfg Co Ltd Device for forming embossed tape

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08309850A (en) * 1995-05-15 1996-11-26 Solvay & Cie Manufacturing method for thermoplastic film with crimp,film manufactured by its method,and application and product of this film
JP2007268886A (en) * 2006-03-31 2007-10-18 Dainippon Printing Co Ltd Embossing device, combination of embossing molds, embossing method, and sheet-like base material
JP2010005881A (en) * 2008-06-26 2010-01-14 Tsukatani Hamono Seisakusho:Kk Flexible die

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